Claims
- 1. A method of separating a target material comprising the steps of:a. flowing a bulk sample comprising target material and contaminant material through a microdevice; b. exerting a dielectrophoretic force upon said bulk sample within the microdevice to selectively separate said target material from said contaminant material, said target material adhering to a dielectric outer layer of an electrode contained in said microdevice, and said dielectric outer layer having a thickness of less than about 2000 angstroms.
- 2. The method of claim 1 where said target material is selected from the group consisting of DNA, spores, bacteria, and polystyrene beads.
- 3. The method of claim 2 wherein said spores comprise Bacillus globigii spores, and said bacteria comprose Erwinia herbicola bacteria.
- 4. A microfluidic DNA sample preparation method including the steps of:(a) separating DNA by dielectrophoretic forces from a bulk sample containing DNA and other materials, said DNA adhering to a dielectric outer layer of thickness less than 1000 angstroms of an electrode exerting said dielectrophoretic forces, and (b) concentrating said DNA from said other materials in said bulk sample to form an extracted DNA.
- 5. The microfluidic DNA sample preparation method of claim 4, wherein said separating step (a) is performed using dielectrophoresis (DEP) to selectively capture said DNA up to 25 microns above said outer layer of said electrode at frequencies below 1000 Hz.
- 6. A microfluidic DNA sample preparation device comprising:a. a glass wafer substrate; b. an interdigitated electrode set patterned on said glass wafer substrate, said electrode set comprising electrodes having a dielectric outer layer of thickness less than 1000 angstroms; c. means for applying an alternating voltage to said interdigitated electrode set; d. Separation means having a thickness of about 10 to about 15 microns placed over said electrode set; and e. an additional wafer substrate placed over said separation means, and wherein a first orifice for fluid access, and a second orifice for fluid access is contained on said first substrate and/or on said additional wafer substrate.
- 7. The device of claim 6 wherein said first orifice is positioned perpendicularly to the interdigitations of said electrode set, and electrode set is capable of collecting a target portion of DNA on said dielectric outer layer of said electrode.
- 8. An electrode set comprising:a. a left electrode set; b. a right electrode set; and c. an electrical connection to each of the two electrode sets; wherein the two electrode sets form an interdigitated pattern of about 10 to 150 micron widths and spaces and comprise electrodes constructed to apply alternating current (AC), said electrodes comprising a dielectric outer layer of thickness less than about 2000 angstroms.
- 9. The electrode set of claim 8 wherein said electrodes further comprise:a. a glass wafer substrate; b. a first conductive layer placed on a top surface of the glass wafer substrate; c. a second conductive layer placed on the first conductive layer; and d. a thin layer of said dielectric outer layer placed on the second conductive layer.
- 10. The method of claim 1 wherein said target material adhering on said dielectric outer layer for a predetermined interval.
- 11. The method of claim 10 wherein said target material comprises DNA.
- 12. The method of claim 4 further comprising (c) adding a polymerase chain replication (PCR) master mix to said extracted DNA.
- 13. The method of claim 12 wherein said other materials are selected from the group consisting of proteins, RNA, and interference sources of PCR.
- 14. The set of claim 9 wherein said dielectric is selected from the group consisting of silicon nitride, silicon carbide, paralene, Teflon, and silicon oxide.
- 15. The set of claim 8 wherein said dielectric outer layer has a dielectric constant of at least 50.
- 16. The method of claim 4 wherein said DNA adhering on said dielectric outer layer for a predetermined interval.
- 17. The method of claim 1 wherein said dielectric outer layer has a thickness of about 300 to about 500 angstroms.
- 18. The method of claim 4 wherein said dielectric outer layer has a thickness of about 300 to about 500 angstroms.
- 19. The device of claim 6 wherein said dielectric outer layer has a thickness of about 300 to about 500 angstroms.
- 20. The set of claim 8 wherein said dielectric outer layer has a thickness of about 300 to about 500 angstroms.
CROSS REFERENCE TO RELATED APPLICATIONS
This invention claims the benefit of a priority date of Apr. 7, 1999 based on a U.S. provisional patent application No. 60/128,127, entitled “Applications of Dielectrophoresis to DNA Sample Preparation.”
Government Interests
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.
US Referenced Citations (13)
Provisional Applications (1)
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Number |
Date |
Country |
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60/128127 |
Apr 1999 |
US |