Patent Grant
10022733
The present technology relates generally to fluid nozzle apparatuses, and more particularly, but not by limitation, to micro-fluidic nozzle apparatuses that include one or more micro-fluidic nozzle panels having a plurality of micro-fluidic nozzles that deliver a fluid that transfers in laminar or streamlined flow.
According to some embodiments, the present disclosure is directed to a micro-fluidic nozzle apparatus, comprising: (a) a base comprising a sidewall that forms a lower plenum chamber; and (b) a micro-fluidic nozzle panel disposed above the base to enclose the lower plenum chamber, the micro-fluidic nozzle panel comprising a plurality of micro-fluidic nozzles, each of the plurality of micro-fluidic nozzles comprising a fluid output orifice for outputting a fluid.
According to some embodiments, the present disclosure is directed to a micro-fluidic nozzle apparatus, comprising: (a) a base comprising a sidewall that forms a lower plenum chamber; (b) a first micro-fluidic nozzle panel disposed above the base to enclose the lower plenum chamber, the first micro-fluidic nozzle panel comprising a first plurality of conical micro-fluidic nozzles, each of the first plurality of conical micro-fluidic nozzles comprising a fluid output orifice for outputting a fluid; (c) a first spacer plenum riser that surrounds around a periphery of the first micro-fluidic nozzle panel; and (d) an orifice plate that comprises a plurality of apertures that align with the first plurality of conical micro-fluidic nozzles, the orifice plate mounted to the spacer plenum riser to form a riser plenum chamber.
Certain embodiments of the present technology are illustrated by the accompanying figures. It will be understood that the figures are not necessarily to scale and that details not necessary for an understanding of the technology or that render other details difficult to perceive may be omitted. It will be understood that the technology is not necessarily limited to the particular embodiments illustrated herein.
While this technology is susceptible of embodiment in many different forms, there is shown in the drawings and will herein be described in detail several specific embodiments with the understanding that the present disclosure is to be considered as an exemplification of the principles of the technology and is not intended to limit the technology to the embodiments illustrated.
It will be understood that like or analogous elements and/or components, referred to herein, may be identified throughout the drawings with like reference characters. It will be further understood that several of the figures are merely schematic representations of the present technology. As such, some of the components may have been distorted from their actual scale for pictorial clarity.
It is often desirable to atomize fluids or fluids having suspended solids. For example: application of paint or other fluids to a surface, dispensing of a liquid in particle form, the dispensing of a liquid with particles; each benefit from atomization of fluids. With most of these applications, it is common to have only one, or a few, atomizing nozzles. To deliver or process any significant quantity of fluid, high pressure is often required. With high pressure and high flow rates, the flow in and around the nozzle is turbulent type flow. Turbulent flow makes the control of atomization of the fluid difficult.
The present disclosure provides micro-fluidic nozzle apparatuses that are capable of provide varying degrees (e.g., low to high) of volumetric fluid flow without producing turbulence within the fluid. The micro-fluidic nozzle apparatuses deliver fluid(s) having a laminar flow type.
One of ordinary skill in the art will appreciate that metals, plastics, ceramics, and or many other materials could be used in the fabrication of the micro-fluidic nozzle apparatus components. Nickel is utilized in some embodiments for fabrication of micro-fluidic nozzle panels, as will be discussed below. Electroplating nickel is a cost effective way to manufacture this type of part from a tool.
The micro-fluidic nozzle panel 118 encloses the lower plenum chamber 112 and provides a lower bounding surface for the riser plenum chamber 114.
Referring now to
The micro-fluidic nozzles of a row are linked with cross ribs, such as cross rib 122. The cross ribs increase structural strength of micro-fluidic nozzle panel 118 and reduce deflection caused by a pressure differential between the lower plenum chamber 112 and riser plenum chamber 114.
While some embodiments include rows of micro-fluidic nozzles, the micro-fluidic nozzles can be arranged in any pattern (e.g., arrangement and/or inter-nozzle spacing) desired.
It will be understood that the lower plenum chamber 112 supplies micro-fluidic nozzles of the micro-fluidic nozzle panel 118 with a single input from the input 108. By supplying the lower plenum chamber 112 with one input all of the fluid pressures at the micro-fluidic nozzles are substantially equal. To achieve this effect with conventional systems, regulators would most likely be required.
A riser 124 is placed on a periphery of the micro-fluidic nozzle panel 118 and the orifice plate 106 is placed onto the riser 124 to enclose the riser plenum chamber 114. The riser plenum chamber 114 receives fluid from the input 110 (see
In
In
Fluid pressure within each of the plenums can be controlled by nozzle diameter (e.g., diameter of fluid output orifices) and/or flowrate of the fluid. This can be used to control a phase of the fluids either inside the plenums or when the fluid exits the apparatus 100.
It will be understood that the fluid that is delivered to the lower plenum chamber 112 would more than likely be a different fluid type from the fluid that is delivered to the riser plenum chamber 114.
The fluid flow from either the annular rings or the fluid output orifices can be a continuous flow or most often droplets could be formed at the orifices/rings, the surface tension of the two fluids effects droplet formation. The flow rate would be engineered for the specific task of the apparatus 100.
In some instances, a temperature of either fluid (fluid in lower or riser plenum) can be controlled to the function of the apparatus 100. In a first example, pressure within the lower plenum chamber 112 can be designed so that hot water remains liquid within the lower plenum chamber 112. When the water exits the micro-fluidic nozzles the pressure lowers. This lower pressure would promote vaporization. Liquid from the riser plenum chamber 114 could be used to enhance or retard the vaporization.
In another example, a fluid with particles within the lower plenum chamber 112 could be separated from the particles by elevating a temperature of the fluid and particles and at the lower plenum chamber 112. When the fluid and particles exit the micro-fluidic nozzles the water would vaporize more freely. Having the riser plenum chamber 114 supplied with hot air would further promote vaporization of water and therefore dry the particles.
One of ordinary skill in the art will appreciate that any number of combinations of fluids, flow rates pressures, nozzle and/or annular ring diameters, and temperatures or fluid phases can be used to create many suitable processes with the disclosed apparatus.
A secondary fluid in the riser plenum chamber 114 can be at an elevated temperature to cause some or all of a liquid as the primary fluid in the lower plenum chamber 112 to vaporize as it exits the fluid output orifices.
Conversely, fluid exiting all or part of the atomizing system could be at a low enough temperature that vapor in a gas would condense on the surface of the atomized fluid. A secondary fluid exiting the riser plenum chamber 114 can be at a reduced temperature to cause all or some of the liquid exiting the lower plenum chamber 112 to solidify.
Liquid or solids created by the microfluidic nozzles can be combined with a third fluid (liquid or gas) after they exit the nozzle system.
A tertiary plenum chamber 140 is formed between the micro-fluidic nozzle panel 118 and the second micro-fluidic nozzle panel 134. A third input or interface (not shown) provides a pathway or inlet for fluid (in some instances a third fluid type) into the tertiary plenum chamber 140. Fluid within the tertiary plenum chamber 140 exits an annular orifice formed by the spacing of the fluid output orifice 128 of the micro-fluidic nozzle 120 and a fluidic output orifice 142 of the micro-fluidic nozzle 136.
In one instance a sidewall of the micro-fluidic nozzle 136 has an angle ϕ that is greater relative to a central axis X than an angle θ of the micro-fluidic nozzle 120, forming a cone within a cone configuration. The fluid exiting the tertiary plenum chamber 140 also has a laminar flow.
To be sure, additional micro-fluidic nozzle panels can be incorporated as desired.
Gravity can be used to augment the atomization process. It could be used to create force on selected fluids and or particles as they are atomized.
An electric field can be used to augment the atomization process, in some embodiments. The apparatus can also be engineered to apply a charge to the particles or fluid being atomized. This charge can be used to drive them to another charged surface. An example would be when paint is atomized and applied to a surface. In one embodiment, the atomization nozzles can be charged with an electric current. When droplets are output from the atomization nozzles the charge is transferred to the droplets. A target surface, such as a vehicle, carries an opposing charge to that of the droplets. Thus, the droplets are attracted to the oppositely charge target surface.
Vibration can also be used to augment the release the removal of droplets from the atomization nozzles. In
Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” or “according to one embodiment” (or other phrases having similar import) at various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Furthermore, depending on the context of discussion herein, a singular term may include its plural forms and a plural term may include its singular form. Similarly, a hyphenated term (e.g., “on-demand”) may be occasionally interchangeably used with its non-hyphenated version (e.g., “on demand”), a capitalized entry (e.g., “Bolt”) may be interchangeably used with its non-capitalized version (e.g., “bolt”), a plural term may be indicated with or without an apostrophe (e.g., PE's or PEs), and an italicized term (e.g., “N+1”) may be interchangeably used with its non-italicized version (e.g., “N+1”). Such occasional interchangeable uses shall not be considered inconsistent with each other.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is noted at the outset that the terms “coupled,” “connected”, “connecting,” “mechanically connected,” etc., are used interchangeably herein to generally refer to the condition of being mechanically/physically connected. If any disclosures are incorporated herein by reference and such incorporated disclosures conflict in part and/or in whole with the present disclosure, then to the extent of conflict, and/or broader disclosure, and/or broader definition of terms, the present disclosure controls. If such incorporated disclosures conflict in part and/or in whole with one another, then to the extent of conflict, the later-dated disclosure controls.
The terminology used herein can imply direct or indirect, full or partial, temporary or permanent, immediate or delayed, synchronous or asynchronous, action or inaction. For example, when an element is referred to as being “on,” “connected” or “coupled” to another element, then the element can be directly on, connected or coupled to the other element and/or intervening elements may be present, including indirect and/or direct variants. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not necessarily be limited by such terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be necessarily limiting of the disclosure. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “includes” and/or “comprising,” “including” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Example embodiments of the present disclosure are described herein with reference to illustrations of idealized embodiments (and intermediate structures) of the present disclosure. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the example embodiments of the present disclosure should not be construed as necessarily limited to the particular shapes of regions illustrated herein, but are to include deviations in shapes that result, for example, from manufacturing.
Any and/or all elements, as disclosed herein, can be formed from a same, structurally continuous piece, such as being unitary, and/or be separately manufactured and/or connected, such as being an assembly and/or modules. Any and/or all elements, as disclosed herein, can be manufactured via any manufacturing processes, whether additive manufacturing, subtractive manufacturing and/or other any other types of manufacturing. For example, some manufacturing processes include three dimensional (3D) printing, laser cutting, computer numerical control (CNC) routing, milling, pressing, stamping, extrusion, vacuum forming, hydroforming, injection molding, lithography and/or others.
Any and/or all elements, as disclosed herein, can include, whether partially and/or fully, a solid, including a metal, a mineral, a ceramic, an amorphous solid, such as glass, a glass ceramic, an organic solid, such as wood and/or a polymer, such as rubber, a composite material, a semiconductor, a nano-material, a biomaterial and/or any combinations thereof. Any and/or all elements, as disclosed herein, can include, whether partially and/or fully, a coating, including an informational coating, such as ink, an adhesive coating, a melt-adhesive coating, such as vacuum seal and/or heat seal, a release coating, such as tape liner, a low surface energy coating, an optical coating, such as for tint, color, hue, saturation, tone, shade, transparency, translucency, non-transparency, luminescence, anti-reflection and/or holographic, a photo-sensitive coating, an electronic and/or thermal property coating, such as for passivity, insulation, resistance or conduction, a magnetic coating, a water-resistant and/or waterproof coating, a scent coating and/or any combinations thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized and/or overly formal sense unless expressly so defined herein.
Furthermore, relative terms such as “below,” “lower,” “above,” and “upper” may be used herein to describe one element's relationship to another element as illustrated in the accompanying drawings. Such relative terms are intended to encompass different orientations of illustrated technologies in addition to the orientation depicted in the accompanying drawings. For example, if a device in the accompanying drawings is turned over, then the elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. Therefore, the example terms “below” and “lower” can, therefore, encompass both an orientation of above and below.
Additionally, components described as being “first” or “second” can be interchanged with one another in their respective numbering unless clearly contradicted by the teachings herein.
While various embodiments have been described above, it should be understood that they have been presented by way of example only, and not limitation. The descriptions are not intended to limit the scope of the technology to the particular forms set forth herein. Thus, the breadth and scope of a preferred embodiment should not be limited by any of the above-described exemplary embodiments. It should be understood that the above description is illustrative and not restrictive. To the contrary, the present descriptions are intended to cover such alternatives, modifications, and equivalents as may be included within the spirit and scope of the technology as defined by the appended claims and otherwise appreciated by one of ordinary skill in the art. The scope of the technology should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims along with their full scope of equivalents.
The application claims the benefit and priority of U.S. Provisional Application Ser. No. 62/285,836, filed on Nov. 10, 2015, which is incorporated by reference herein in its entirety, including all references and appendices cited therein.
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| Number | Date | Country | |
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| 20170128961 A1 | May 2017 | US |
| Number | Date | Country | |
|---|---|---|---|
| 62285836 | Nov 2015 | US |
