As shown in
Dielectric 102 includes electrode 106 and electrode 112. Dielectric 104 comprises electrode 108 and electrode 114. Electrodes 106 and 112 are buried within dielectric 102 and electrodes 108 and 114 are buried within dielectric 104. In this example, and to induce droplet 110 to move right toward electrodes 112 and 114, electrodes 106 and 108 are coupled to an electrical return path 116 and are electrically isolated from electrodes 112 and 114, and electrodes 112 and 114 are coupled to voltage source 126. Alternatively, to induce droplet 110 to move left toward electrodes 106 and 108, electrodes 112 and 114 can be coupled to an isolated electrical return path and electrodes 106 and 108 can be coupled to a voltage source.
In this example, switch 100 includes electrical contacts 118, 122, and 124 positioned on surface 103 of dielectric 102. In this example, contact 118 can be referred to as an input, and contacts 122 and 124 can be referred to as outputs. As shown in
As shown in
Upon application of an electrical potential via voltage source 126, a new contact angle between droplet 110 and surfaces 103 and 105 is defined thus altering the profile of droplet 110 so that r1 is not equal to r2. If r1 is not equal to r2, then the pressure, P, on droplet 110 changes and movement is imparted to the droplet causing the droplet to translate across surfaces 103 and 105.
In operation, all control lines leading to the electrode pairs are driven by off-chip drivers, and these drivers should be tri-state devices, with the drivers in the high impedance state when the liquid metal is not being toggled, as this will minimize RF leakage through the control line. Also, each control line should have a high sheet resistance on the die, also to minimize RF leakage. However, it should be ensured that the RC time constant of the control line should be much shorter in duration than the overall switching time, such that the RC time constant is not a significant contributor to the switching time.
To toggle a SPDT device from state A to state B, the electrode pair that is mostly not covered by the liquid metal is activated, with the other pair left floating (tied to high impedance with, for example, a tri-state driver). The active pair (for device A in
With the appropriate microfluidic architecture, and choice of applied bias, only the application of bias +V and −V on either the left pair or right pair will lead to actuation. That is, no matter the state if the fluid, if the applied bias is across one of the electrodes on the right (say input line 3), and one of the electrodes on the left (say input line 1 or input line 2), actuation (switching) will not occur. The liquid metal slug may deform somewhat in response to the applied voltages, but the existing input to output connection will not be broken, and a new connection will not occur.
Four control lines can control three individual EWOD devices (devices A, B, and C shown in
As an example, if the droplet were to be at the right in device A (
Assume now that device C has its input connected to output 1 (droplet to the left) and it is desired to switch device C. Then input leads 2 and 3 would be activated. Only device C would switch because in devices A and B activation of the 2, 3 inputs applies bias to opposite throw positions.
The mathematical formula relating the number of individually controllable switches N, to the number of control lines n, is just the possible pair combinations of n control liens, divided by two (two pairs are required for each device). That is:
where N is the number of controllable devices, and n is the number of control lines. A chart of this expression in terms of the devices shown in
One possible drawback: the sharing of control lines between devices may lead to RF coupling between devices, and may be particularly problematic at high frequencies, even with a high sheet resistance used for the control lines. If ultimate RF performance is required, control lines may not be sharable. This is not an issue for low frequency devices.
Another possible drawback: if the number of control lines is reduced using the expression above, the devices can only be switched sequentially; groups of switches cannot be switched simultaneously. This will slow the reconfiguration of switching networks. It may be that some intermediate reduction of control lines is employed, providing some degree of simultaneous switching of multiple devices. In some applications, devices will always switch together—the tip and ring in a telephone copper pair, for example. In this case independence is not required. The choice of the level of reduction of control lines will be application specific.
It should be noted that other physical electrode configurations are possible, but that still can be seen as electrode pairs, with a left pair and a right pair, with each electrode in a pair have about the same area.
Note that while not shown in
This sort of control strategy can work with other switching architectures (e.g., SP3T, SP4T, etc.), provided the correct microfluidic architecture is chosen, along with the appropriate bias voltages and the appropriate formulas relating the number of switches to the minimum number of control lines.
The electrode pairs are situated side-by-side in the floor of the microfluidic channel, but this disclosure is also relevant to electrode pairs configured top and bottom (in the roof and floor of the microfluidic channel, as seen in other electrowetting devices. This disclosure is also relevant to electrowetting structures where the liquid is in direct electrical contact with one of the electrodes in a pair, with the other electrode buried under a dielectric. Other electrode configurations are possible, as are other multi-throw switches.
Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
The present application is related to commonly assigned U.S. patent application Ser. No. 10/996,823, filed on Nov. 24, 2004, published as 2006/0108209, May 25, 2006, entitled “LIQUID METAL SWITCH EMPLOYING ELECTROWETTING FOR ACTUATION AND ARCHITECTURES FOR IMPLEMENTING SAME”, which application is hereby incorporated by reference herein.