The invention relates to U.S. patent application Ser. No. 09/039,707, filed Mar. 16, 1998 entitled “Micromechanical Calorimetric Sensor” and to U.S. patent application Ser. No. 09/042,601, filed Mar. 16, 1998 entitled, “Micromechanical Potentiometric Sensors” the specifications of which are incorporated herein by reference.
The United States Government has certain rights in this invention pursuant to contracts number DE-AC05-96OR22464 and DE-AC05-84OR21400, between the U.S. Department of Energy and Lockheed Martin Energy Research Corporation.
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