1. Field of the Invention
The present invention concerns a microphone module for a hearing device. As used herein, a hearing device means any sound-outputting device (in particular a hearing aid, a headset, headphones and the like) that can be worn in or on the ear or on the head.
2. Description of the Prior Art
Hearing aids are wearable hearing devices that serve to assist the hard of hearing. In order to accommodate numerous individual needs, different structural shapes of hearing devices are provided, such as behind-the-ear hearing devices (BtE), hearing devices with external earpiece (RIC: receiver in the canal) and in-the-ear hearing devices (ItE), as well as concha hearing devices or canal hearing devices, for example (ITE, CIC). The hearing devices listed as examples are worn on the outer ear or in the auditory canal. Moreover, however, bone conduction hearing devices, implantable or vibro-tactile hearing devices are available on the market. The stimulation of the damaged hearing thereby ensues either mechanically or electrically.
Hearing aids have the basic components of an input transducer, an amplifier and an output transducer. The input transducer is normally a sound receiver (for example a microphone) and/or an electromagnetic receiver (for example an induction coil). The output transducer is most often realized as an electroacoustic transducer (for example miniature speaker) or as an electromechanical transducer (for example bone conduction earpiece). The amplifier is typically integrated into a signal processing unit. This basic design is shown in
Since amplifications of 80 dB and more are required in certain hearing devices, the structure-borne sound and feedback suppression at the microphones is one of the main problems in satisfying these high demands. In principle, the transfer of that structure-borne sound directly from an earpiece installed in the hearing device housing to the microphone or, respectively, microphones that are likewise integrated into the hearing device housing should be avoided. If such feedback is too high, either the amplification must be reduced or appropriate damping measures must be provided.
Conventional, damping measures have most often been only to enclose and support the microphones in a resilient receptacle. The microphones supported in this way are clamped against the housing and/or its internal module support (frame) by an interference fit. Only a slight damping of the structure-borne sound is achieved by such a mounting of the microphones.
An object of the present invention is to better damp the structure-borne sound in hearing devices with high amplification.
According to the invention, the above object is achieved by a microphone module for a hearing device that has a module housing that is not part of the housing of the hearing device, a microphone including a microphone housing that is located in the module housing, an inductive receiver located in the module housing, and a mounting device that elastically (resiliently) supports the module housing in the housing of the hearing device. A receiver module decoupled from the housing of the hearing device thereby results. For example, the mass of the module can be altered by the additional receiver so that the coupling between the module and the hearing device housing can be varied.
Through the module housing, the microphone advantageously can be additionally decoupled from the housing of the hearing device. High amplifications can thus be employed with little danger of feedback.
An additional microphone with its own microphone housing is advantageously accommodated in the module housing. The same high-quality decoupling thereby ensues for both microphones.
The microphone furthermore can be contacted with a flexible circuit board that is lead out of the module housing. This is an alternative to individual cords that are directed out of the module having and entails advantages in the assembly.
According to a further embodiment, the module housing is hermetically sealed, other than from respective sound inlet openings for each microphone. This is in particular advantageous if the microphone module is installed in a hearing aid or another hearing device and, due to the seal, no sound penetrates into the internal components of the module housing and to the microphones via unintentional paths.
In a further embodiment, the microphone housing can be mounted in the module housing with a structurally supported sound-damping microphone pouch. Such a microphone pouch decouples the microphone housing and the microphone from the module housing with regard to the transmission of structure-borne sound.
In particular, the microphone pouch can have a sound conduction nozzle (connector) in order to conduct sound from a sound inlet opening of the module housing to an opening in the microphone housing. Such a sound inlet nozzle can provide advantages by transmitting the sound optimally undisturbed to the respective microphone.
Furthermore, the mounting device can have multiple rubber nubs that can be plugged into or onto the housing of the hearing device. A robust and installation-friendly mounting (support) of the microphone module can be achieved in this way.
The microphone module can be particularly advantageously used in a hearing device that is fashioned as a hearing aid. The danger of feedback is markedly reduced by a microphone module of this design in a hearing device.
The microphone module shown in
Furthermore, an inductive receiver 17 is arranged in the module housing 10, here between the microphones 11 and 12. It is only optionally contained in the microphone module. This can entail advantages with regard to the wiring because the inductive receiver 17, like the microphones 11, 12, represents an input transducer whose signals are to be transferred to an amplifier.
Furthermore, the module housing 10 has a base 18 onto which a rubber bearing element 19 is placed from the outside. This rubber bearing element 19 is better recognizable in
According to
The microphone module is shown from its top side in
The microphone module is shown installed into the hearing device in
In this example, the microphone module according to the invention integrates the two microphones 11, 12 (necessary for a directional effect) as well as an auditory coil into an independent unit that is completely separate from the hearing device housing 25 and is decoupled from this by an elastic bearing. The sealing of the microphones 11, 12 within this module is—as explained above—achieved conventionally by microphone pouches 13, 14 with or without corresponding sound conduction nozzles 15, 16. The better decoupling of the microphones from the hearing device housing or its internal module support (frame) is to be mentioned as a particular advantage of the microphone module according to the invention. Furthermore, a hermetic sealing from the internal hearing device space can be achieved. This has the result that the interference noise from the earpiece can be better suppressed.
Although modifications and changes may be suggested by those skilled in the art, it is the intention of the inventors to embody within the patent warranted hereon all changes and modifications as reasonably and properly come within the scope of their contribution to the art.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2009 009 274.9 | Feb 2009 | DE | national |