Patent Grant
11496822
The present invention relates to a microphone mounting structure for a headset and more particularly, to an improved microphone mounting structure for a headset, especially for a TWS (True Wireless Stereo) product, enhancing sound quality, water resistance, and durability thereof.
A speaker is an electronic product outputting sound by converting an electronic signal to a form of sound wave, which uses the principle opposite to that used in a microphone. When currents flow through a coil, the magnet becomes an electromagnet having its own magnetic field. Interacting with peripheral magnetic fields, the electromagnet generates forces of attraction and repulsion, thereby alternatively pulling or pushing the sound wave, vibrating a diaphragm, and producing sound wave.
According to recent developments in a headset, especially a TWS product, a hybrid-type wireless headset has been widely used, which has a function that a user can deliver their voice using a microphone mounted inside the headset. The voice of a user is generated from a vibration of their vocal cord; this vibration arrives to the ear via the auditory cells and the inner ear from the vocal cord, and it is also delivered to the external auditory meatus of the ear as external sounds through vocalization. When a microphone senses the vibration as analog sound, the sound is converted to an electronic signal through an electronic substrate such as a PCB, and is transmitted to an external device, such as an earphone of a counterpart user. The speaker of the counterpart user converts the electronic signal to audio signal, and deliver it to the external auditory meatus of the ear.
Korean Patent No. 10-1835353 is related to an electronic device with a built-in microphone, which discloses a structure of a microphone mounted in an opposite side of an audio output channel of a head set, which is inserted to the ear of a user. Korean Patent No. 10-1892263 discloses a structure comprising a small size microphone mounted in the rear side of an audio output channel of a headset housing, and a shielding member that blocks the audio of a speaker and prevents the audio from being delivered to the microphone, thereby removing noise caused by the speaker. Korean Patent No. 10-2002784 discloses a structure that microphones are disposed in a front side and a rear side of a housing, respectively. The microphone in the front side collects sound delivered to the ear of a user, and the microphone in the rear side collects external noises and filters them. Korean Application Publication No. 10-2017-0123818 discloses a structure of a microphone installed in one side of an audio output channel of a housing. Specifically, the microphone is installed in a space, which is closed with regard to a main path of the audio output channel, to avoid disturbing audio signals from a speaker; however, the installment of the structure is too complicated.
These prior arts commonly have drawbacks that the installment of the microphone structure for preventing interference with the speaker is too complicated to design and manufacture, is not effective to exclude exterior noises, and does not have water resistance and durability functions.
To solve these problems, inventors devised an improved microphone mounting structure for a headset, especially for a TWS (True Wireless Stereo) product, enhancing sound quality, water resistance, and durability thereof.
Accordingly, the object of the invention is to provide a microphone mounting structure for a headset, which enables a microphone to be easily mounted on a wearable device, such as a headset, and to have good water resistance and durability properties.
The present invention provides a microphone mounting structure for a headset, the microphone mounting structure comprising: a housing surrounding the headset and forming an audio output channel along a vertical direction inside; a microphone mounted along the vertical direction inside a space formed by the audio output channel, and a substrate connected to a main board and including a supporting part mounted in a rear side of the microphone, wherein the microphone includes a circuit substrate formed in a rear side of the microphone, and the circuit substrate includes a hole, wherein the supporting part includes a substrate hole communicating the hole.
A speaker driver is installed inside the housing, and wherein the substrate is mounted on an audio output surface of the speaker driver, and comprises: a ring part having an opening in the center thereof, a supporting part bending downward from one point of the ring part, and a connecting part extending toward the main board from the ring part.
The microphone mounting structure further comprises an upper plate mounted between the audio output surface and the substrate and including: an upper ring part having the same shape as the ring part, and an upper supporting part having the same shape as the supporting part.
The microphone mounting structure further comprises a lower plate, wherein the lower plate includes a lower ring part having the same shape as the ring part, and is mounted to be overlapped and meet with a bottom side of the ring part.
The hole comprises a plurality of holes, wherein a sum of diameters of the plurality of the holes ranges from 1 um to 500 um.
The plurality of the holes includes a center hole, and a plurality of periphery holes surrounding the center hole.
In addition, The present invention provides microphone mounting structure for a headset, the microphone mounting structure comprising: a housing surrounding the headset and forming an audio output channel along a vertical direction inside; a speaker driver and a battery mounted inside the housing, wherein an audio output surface of the speaker driver is perpendicular to the vertical direction, and a microphone mounted along the vertical direction inside a space formed by the audio output channel.
The purposes, technical effects, and technical elements of the present invention will be clarified by embodiments described in detail later in conjunction with the accompanying drawings. Detailed explanation regarding related elements or functions, which are well known to one of ordinary skill in the art, will be omitted in case it may obscure the gist of the present invention.
In this specification, when a portion “comprises” and/or “includes” an element, it does not mean to preclude the presence or addition of one or more other elements and/or components unless the context clearly indicates otherwise. Meanwhile, in embodiments of the present invention, each element, component, functional block, or mean may be composed of one or more of subordinate elements.
The headset 1 comprises a housing 4 forming most of an exterior view, an earpiece or an ear tip 2 connected to an audio output channel 16 of the housing 4.
A battery 20 and a speaker driver 8 are arranged in turn from a top inside the housing 4. Components such as a coil, a diaphragm, and a magnet are mounted inside the driver 8. The audio output channel 16 having a narrow circle shape is formed along a vertical direction toward a front side of the housing 4, which is a bottom side of
As shown in
The substrate 22 is mounted on the audio output surface of the driver 8, which is the bottom side of the driver 8, and comprises: a ring part 202 having an opening in the center thereof, a supporting part 204 extending from one point of the ring part 202 and bending downward in a vertical direction, and a connecting part 200 extending upward toward the main board 22a from the ring part 202 in a vertical direction. The microphone 10 is mounted on the supporting part 204.
An upper plate 102 comprises an upper ring part 110 having the same shape as the ring part 202, and an upper supporting part 112 having the same shape as the supporting part 204. The upper plate 102 is mounted in direct contact with the bottom side of the driver 8; corresponding parts of the substrate 22 are overlapped with the plate 102 without dislocation and meets with the bottom side of the plate 102, thereby guiding the microphone 10 to be mounted inside the audio output channel 16.
A lower plate 120 comprises a lower ring part 122 having the same shape as the ring part 202, and is mounted to be overlapped and meet with the bottom side of the ring part 202, thereby reinforcing the hardness of the corresponding parts of the substrate 22.
The upper and the lower plate 102, 120 prevent the soft FPCB from being deformed or damaged between the housing 4 and the driver 8. The upper and the lower plate 102, 120 may be made of a metal plate, such as SUS, or a plastic film. In case the substrate 22 is made of rigid materials, one or more of the upper and the lower plate 102, 120 can be omitted. Other than embodiment shown in the drawings, the supporting part 204 supporting the microphone 10 can be directly connected to the connecting part 200. In this instance, the ring part 202 can be omitted. In addition, in
The microphone 10 is mounted along a vertical direction in such a way that a rear side thereof (a left side of the microphone 10 in
The microphone mounting structure for a headset of the present invention does not need an extra space inside the housing 4 for mounting the microphone, thereby enabling an easy manufacturing process. In addition, the microphone 10 can be easily mounted on using the space of the audio output channel 16. Furthermore, the substrate 22 can be reinforced by installing the plates, thereby enhancing durability thereof. Moreover, since the microphone 10 is installed in proximity to the ear of a user, the microphone can clearly receive sound wave, which vibrates in the ear.
Hereafter, a waterproof function of the microphone 10 mounting structure will be described.
To prevent these problems, referring to
Referring to
While embodiments of the present invention have been described, the present invention is not limited to what has been particularly shown. It would be apparent that many more modifications and variations than mentioned above are possible by an ordinary person skilled in the art.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2020-0085242 | Jul 2020 | KR | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 20130221457 | Conti | Aug 2013 | A1 |
| 20170318401 | Chang | Nov 2017 | A1 |
| Number | Date | Country |
|---|---|---|
| 10-2007-0069440 | Jul 2007 | KR |
| 10-2017-0123818 | Nov 2017 | KR |
| Number | Date | Country | |
|---|---|---|---|
| 20220014832 A1 | Jan 2022 | US |
