Patent Grant
10848845
The present application claims priority to and the benefit of Chinese Patent Application No. 201910027949.3, filed on Jan. 11, 2019, the entire content of which is incorporated herein by reference.
The invention relates to the field of microphone, and more particularly, to a microphone with a mechanical switch function.
The MEMS (Micro Electrical-Mechanical Systems) microphones are produced by using the MEMS technology. Of note, a diaphragm and a backplate are essential components of the MEMS microphone. Moreover, the diagram and the backplate together form a capacitor and are integrated in a silicon wafer, converting a sound signal into an electrical signal.
In recent years, electronic products, such as driven-by-wire headphones and bluetooth headsets, are becoming compact due to the development of science and technology. In addition, there are higher demands for lighter and thinner products, so efforts have been made to reduce the packaging size of the MEMS microphone. And such trend will continue into the future. Although electronic products become smaller in size, microphone and a device switch still needs to be separated from each other. It has to be recognized that such a structure may meet the basic requirements in use, however, its design is not satisfactory, that is, it has complicated structure, and many components are involved during the manufacture of the products, hence high cost are inevitable. Moreover, humid weather may also lead to the corrosion of metal components in the interior of the switch, such that contact failure may occur when in use.
The technical problem in this invention is to provide a microphone with a mechanical switch function. This type of microphone may function as a switch, has a simple structure and is easy to operate. To solve the above-mentioned technical problem, the invention provides a microphone with a mechanical switch function, comprising: a microphone body, wherein the microphone body comprises a circuit substrate above which a metal cover is disposed, and an acoustic cavity formed by the metal cover and the circuit substrate;
further comprising: a metal elastic piece, wherein a gap is formed between the metal elastic piece and the metal cover, and the metal elastic piece electrically contacts with the metal cover under an effect of a pressing force.
Preferably, a metal cover cap is sleeved outside of the metal cover, and at least one surface of the metal cover cap is made of an elastic material which functions as the metal elastic piece.
Preferably, the metal elastic piece comprises a mounting portion that is insulated from the metal cover cap.
Preferably, an acoustic through-hole is disposed on the circuit substrate.
Preferably, the metal elastic piece comprises an arc-shaped surface, a concave face of the arc-shaped surface is arranged to face the metal cover, to form the gap.
The metal elastic piece further comprises a mounting frame, wherein a buckle is disposed on a top of the mounting frame, a mounting portion of the metal elastic piece is provided with a connection portion fitting with the buckle, and the mounting frame is arranged on the circuit substrate.
Preferably, the metal elastic piece is an elastic metal cover which is disposed outside the metal cover, and a gap is formed between the elastic metal cover and the metal cover, and the gap is in the range of 0.03 to 0.07 mm.
Preferably, the elastic metal cover is mounted on the circuit substrate, and an enclosed space is formed by the elastic metal cover and the circuit substrate.
The technical solutions adopted in the present invention have the follow beneficial effects: such an integrated structure has the advantages of thin product, simple structure, strong stability and small occupancy. Moreover, it is low in cost, such that it may be produced for a wide range of applications. It should be mentioned that such microphone not only has the switch function, but also has a microphone function. In addition, it has a beautiful appearance, making the customer more satisfied.
The accompanying drawings, together with the specification, illustrate exemplary embodiments of the present disclosure, and, together with the description, serve to explain the principles of the present invention.
Hereinafter, two exemplary embodiments according to the present disclosure will be described with reference to the accompanying drawings. It should be noted that unless otherwise defined, the relative arrangements of the components and steps, numerical expressions and numerical values set forth in these two embodiments are not intended to limit the scope of the invention.
The following description of at least one exemplary embodiment is merely illustrative, and will be never intended to limit the invention and the application thereof.
Techniques and devices known to those of ordinary skilled in the relevant art may not be discussed in detail, however, all the techniques and devices, where appropriate, should be construed as a part of the specification.
In all of the examples shown and discussed herein, any specific values are to be construed as illustrative and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.
Referring to
When the metal elastic piece 1 electrically contacts with the metal cover 7 under an effect of a pressing force, a sound test will be implemented: the tester sends out sound towards the acoustic through-hole, and the acoustic through-hole receives the sound from the tester, wherein sound signals received by a microphone chip may be all the sound signals received by the microphone acoustic through-hole during some time, and this set of sound signals may contain one or more signal signals. The process is implemented as follows:
As a preferred embodiment, the package structure of the present invention further comprises a MEMS chip 5, a ASIC chip 6 disposed in an enclosed space of the metal cover 7, wherein the MEMS chip 5 a transducer that functions to convert a sound signal into an electrical signal, and the transducer is fabricated by using the MEMS (Micro-electromechanical Systems) process. ASIC chip 6 is used to subsequently process the electrical signal output from the MEMS chip 5. The MEMS chip 5 and the ASIC chip 6 may be connected to the circuit substrate 4 by solder ball welding or bonding; moreover, the mounting may be performed by any mounting technologies that are known to those skilled in the art, and the MEMS chip 5 is electrically connected with the ASIC chip 5 via leads to achieve the signal transmission. The MEMS chip 5 is connected with the circuit on the circuit substrate 4 through wires. The ASIC chip 6 is connected with the circuit on the circuit substrate 4 through wires.
It should be noted that the package structure of the present invention further comprises a lower sound bore disposed on the circuit substrate 4. when pressing the switch, sound from the outside will transmit into the interior of the package structure through the lower sound bore, and impacts on the MEMS chip 5; the MEMS chip 5 will then converts the received sound signal into a corresponding electrical signal, and the electrical signal will be transmitted to the ASIC chip 6 through wires to facilitate the recognition and processing of the electrical signals executed by the ASIC chip 6. The aperture of the low sound bore can be adjusted according to the requirements of those skilled in the art. The lower sound bore microphone places the acoustic sensor MEMS chip 5 directly on the sound bore, while such an arrangement may make a front chamber become smaller, which in turn leads to an increase in a center frequency of the resonance. Since the resonance is always in the high frequency part of the audio-frequency band, the increased resonance makes the frequency response becomes flatter, such that sensitivity of the acoustic sensor MEMS chip 5 will be enhanced.
Referring to
Switch-on and Switch-off actions are achieved by means of the metal elastic piece. The microphone has two layers of metal shells, an inner metal shell is rigid, and an outer metal shell is a metal elastic piece or the metal cover which has certain elasticity. When subjected to the external force, the metal elastic piece or the metal cover will deform and contact with the inner metal shell to cause short circuit. When the force exerted on the metal elastic piece or the metal cover disappears, the metal elastic piece is loosened, and switch-off is achieved, thereby, turning off the device. It should be understood that such a structure has advantages of thinner product, simple structure, strong stability and small occupancy. Moreover, it is low in cost, such that it may be produced for a wide range of applications. In addition, the combination of the switch with the electronic device function and the microphone function saves a lot of space. Such a structure may be applied to all the electronic devices with a switch, such as driven-by-wire headphones, wireless and bluetooth headsets.
The above descriptions are only the preferred embodiments of the invention, not thus limiting the embodiments and scope of the invention. Those skilled in the art should be able to realize that the schemes obtained from the content of specification and drawings of the invention are within the scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019 1 0027949 | Jan 2019 | CN | national |
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| Number | Date | Country | |
|---|---|---|---|
| 20200228887 A1 | Jul 2020 | US |
