Claims
- 1. A composite microstrip circuit comprising:
- a base of dielectric material with a predetermined dielectric constant, the base having a top and bottom surface;
- a plurality of substrates with predetermined dielectric constants higher than the dielectric constant of the base, the plurality of substrates having top, bottom, and edge surfaces wherein each of the edge surfaces of each of the substrates tapers linearly from the bottom surface of the substrate to a predetermined height and connects to the top surface of the substrate thereby causing a linear increase in thickness of each of substrates, the plurality of substrates mounted on the top surface of the base such that the top surface of the base abuts the bottom surface of each substrate, thereby forming a substrate-base junction;
- a plurality of discrete microstrip components mounted on the top surface of the plurality of substrates; and
- a plurality of microstrip transmission lines electrically connecting the discrete microstrip components in a predetermined manner wherein the microstrip transmission lines connected to the microstrip components electrically extend over and mount onto the top and edge surfaces of the plurality of substrates and the top surface of the base,
- whereby the higher dielectric constant of the substrate offsets the increase of impedance in the transmission lines extending over and mounted on the edge surface of the substrates due to the increase in thickness of the substrate.
STATEMENT OF GOVERNMENT RIGHTS
The invention described herein may be manufactured, used, and licensed by or for the government for governmental purposes without the payment to us of any royalties thereon.
US Referenced Citations (5)