TREA

Microvoid polyurethane materials

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Information

  • Patent Grant
  • 5652278
  • Patent Number
    5,652,278
  • Date Filed
    Monday, May 9, 1994
    30 years ago
  • Date Issued
    Tuesday, July 29, 1997
    27 years ago
Information
Abstract
Microvoid polyurethane materials having densities below 300 kg/m.sup.3 and void sizes below 5 micron which are suitable for use as insulating filler in evacuated insulation panels.
Description
Claims
  • 1. Microvoid polyurethane material having a mean void size of less than 5 micron yielding at a pressure of 10 mbar a thermal conductivity at 10.degree. C. of at the most 23 mW/M.degree. K., and having a density under vacuum of less than 200 kg/m.sup.3.
  • 2. Microvoid polyurethane material according to claim 1 yielding at a pressure of 10 mbar a thermal conductivity at 10.degree. C. of at the most 15 mW/m.degree. K.
  • 3. Microvoid polyurethane material according to claim 1 yielding at a pressure of 20 mbar a thermal conductivity at 10.degree. C. of at the most 27 mW/m.degree. K.
  • 4. Microvoid polyurethane material according to claim 3 yielding at a pressure of 20 mbar a thermal conductivity at 10.degree. C. of at the most 18 mW/m.degree. K.
  • 5. Microvoid polyurethane material according to claim 1 yielding a critical pressure of above 0.1 mbar.
  • 6. Microvoid polyurethane material according to claim 5 yielding a critical pressure of above 3 mbar.
  • 7. Microvoid polyurethane material according to claim 1 having a surface area of above 1 m.sup.2 /g.
  • 8. Microvoid polyurethane material according to claim 7 having a surface area of above 50 m.sup.2 /g.
Priority Claims (1)
Number Date Country Kind
9312868 Jun 1993 GBX
CROSS-REFERENCE TO RELATED APPLICATION

The present application is a continuation-in-part of U.S. patent application Ser. No. 08/100,025, filed Jul. 30, 1993, entitled "Microvoid Polyurethane Materials" which is now abandoned.

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Foreign Referenced Citations (3)
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Non-Patent Literature Citations (2)
Entry
Kistler, S. S., "The Relation Between Heat Conductivity and Structure in Silica Aerogel", Journal of Physical Chemistry, vol. 39 (1935), pp. 79-85, Jun. 14, 1934.
Strong, H. M. et al, "Flat Panel Vacuum Thermal Insulation", Journal of Applied Physics, vol. 31, No. 1, pp. 39-50 (Jan. 1960).
Continuation in Parts (1)
Number Date Country
Parent 100025 Jul 1993