This is the U.S. National Stage of PCT/EP2013/003558, filed Nov. 22, 2013, which in turn claims priority to French Patent Application No. 12/03420, filed Dec. 14, 2012, the entire contents of all applications are incorporated herein by reference in their entireties.
The present invention relates to a microwave-frequency filtering structure. More particularly, the invention relates to the field of stripline structures.
In the state of the art, there are so-called stripline structures (or also called tri-plate structures). By stripline structure, it is meant a form of transmission electromagnetic medium which uses a flat metal tape provided between two electrical insulators, also called dielectrics, being metallized on their exterior surface. These stripline structures have numerous advantages with respect to microstrip structures. By the so-called microstrip structure, it is meant a type of electrical transmission line which can be manufactured using the standard manufacturing process for electronic boards, and which is employed in microwave-frequency techniques. This microstrip structure is comprised of a conduction band separated from a ground plane by a dielectric layer. The advantage of the stripline structure with respect to a microstrip structure is on the one hand that the propagation is made in a Transverse Electro Magnetic (TEM) mode.
On the other hand, the stripline structure has its own electromagnetic shielding and hence does not radiate. Further, such a stripline structure is able to be separately insulated and tested, and then to be integrated as easily as a CMS component on a microwave-frequency printed circuit board. Finally, for a same dielectric material, in other words which has the same substrate permittivity, the stripline structures are of lower dimensions for a function equivalent to those of the microstrip structures.
However, the main drawback of the stripline structures is that transmission losses in the dielectric are higher than those exhibited by the equivalent structure in microstrip technology.
However, the progress now made on microwave-frequency dielectric substrates minimizes the impact of this drawback.
For that reason, the stripline structures are thus ideal for making microwave-frequency passive circuits such as couplers and filters.
In the example of
This distortion also appears outside the passband as spurious responses, in particular at frequencies higher than the centre frequency of the filter, as the high stop band.
The synthesis of the band-pass filter can be checked using an electromagnetic simulator. It is noticed by means of the electromagnetic simulator that the distortion observed and the spurious responses are due to the establishment of a TE10-type guided propagation mode.
The present invention aims at solving all the drawbacks of the state of the art. For this, the invention provides a new integratable filter structure the frequency response of which is free of distortion and of spurious response on a wide frequency band, thereby improving notably the filtering performance.
Thus, one object of the invention is to provide a microwave-frequency filtering structure characterized in that it includes:
The invention includes, any of the following characteristics:
One object of the invention is also to provide a printed circuit including a set of active and/or passive components, characterized in that it includes one or more structure(s), according to any of the preceding characteristics.
The invention will be better understood upon reading the description that follows and upon examining the accompanying figures. These are only presented by way of illustrating purposes, but in no way limiting for the invention. The figures show:
It is now noticed that the figures are not drawn to scale.
The following embodiments are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference relates to the same embodiment, or that the characteristics only apply to a single embodiment. Simple characteristics of different embodiments can also be combined to provide other embodiments.
The invention which will be described hereinafter aims at providing a new integratable filter structure the frequency response of which is free of distortion and of spurious response on a wide frequency band, thereby improving the filtering performance.
In the rest of the description, the conducting layer 22 will be called a filter 22. The upper and lower exterior faces of the stack of both dielectric layers 21, 23 are covered over the larger part of their surface with a conducting plane (not represented to facilitate the understanding of
The structure 20 also includes two identical devices 24, 25, one of them being an input transition device 24 and another one being an output transition device 25, illustrated in
The geometry of the transition device 24, 25 is optimized in order to minimize the Voltage Standing Wave Ratio (SWR) at the ports of the filter 22 and also to minimize the excitation and coupling of the TE10 mode in a rectangular guide structure included in the structure 20. These devices 24, 25 further enable the structure 20 to be transferred or assembled to a microwave-frequency microstrip-type printed circuit by soldering.
Further, the structure 20 includes at least two conducting pillars 27 perpendicular to the plane of the structure 20, situated as close as possible to its principal axis without there being a coupling with the filter 22 and linking the upper and lower ground planes. In one embodiment of the invention, these pillars 27 are made as metallized interconnection holes passing through both dielectric layers 21, 23. In a second embodiment of the invention, the pillars 27 are solid metal rods.
The entire structure 20 according to the invention constitutes a band-pass filter free of distortion and of spurious response on a wide frequency band, and able to be assembled to a microwave-frequency microstrip-type printed circuit.
A non-negligible advantage of the structure according to the invention is its capability to be made by means of standard techniques for manufacturing microwave-frequency circuits and hence results in a relatively low production cost.
Number | Date | Country | Kind |
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12 03420 | Dec 2012 | FR | national |
Filing Document | Filing Date | Country | Kind |
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PCT/EP2013/003558 | 11/22/2013 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2014/090375 | 6/19/2014 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
3135935 | Eugelbrecht | Jun 1964 | A |
6329890 | Brooks et al. | Dec 2001 | B1 |
20070063789 | Dalconzo et al. | Mar 2007 | A1 |
20120182093 | Vickes | Jul 2012 | A1 |
Number | Date | Country |
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1 508 935 | Feb 2005 | EP |
Entry |
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International Search Report as issued in International Patent Application No. PCT/EP2013/003558, dated Mar. 14, 2014. |
Leib, M. et al., “An Ultra-Wideband Vertical Transition from Microstrip to Stripline in PCB Technology,” Proceedings of 2010 IEEE International Conference on Ultra-Wideband (ICUWB2010), XP031784283, ISBN: 978-1-4244-5305-4. |
Number | Date | Country | |
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20160006095 A1 | Jan 2016 | US |