Embodiments of the present principles generally relate to semiconductor processing of semiconductor substrates.
Microwaves are used in semiconductor processing to anneal, clean, cure, and degas substrates. The microwaves are typically generated externally from a process chamber and a waveguide is used to transmit the microwaves into a cavity of the process chamber. In general, the process chamber is sealed off from the external environment to control the processing environment's temperature and pressure. A microwave pressure window is used to allow the transmission of the microwaves into the chamber without affecting the pressure or temperature. The inventors have observed, however, that the microwave pressure window when used in high pressure differential environments are prone to failure after a given amount of pressure cycles. In addition, the microwave pressure windows are typically sealed units that must be totally replaced at a substantial cost after a failure occurs.
Accordingly, the inventors have provided improved microwave pressure windows with increased duty cycles and with low replacement costs.
Methods and apparatus for transmitting microwaves into a cavity with high pressure differentials are provided herein.
In some embodiments, an apparatus for transmitting microwaves may comprise a first plate with a first aperture surrounded by a first recess for a first pressure seal, wherein the first aperture includes a first vertical step area on a first vertical side of the first aperture and a second vertical step area on a second vertical side of the first aperture opposite of the first vertical side, wherein the first vertical step area and the second vertical step area have a thickness of approximately 50% of a thickness of the first plate that includes a dielectric plate recess and wherein the first vertical step area B and the second vertical step area each extends inwards into the first aperture and are configured to reduce reflected power and minimize impedance for microwaves transmitted through the apparatus, a second plate with a second aperture surrounded by a second recess for a second pressure seal, wherein the second aperture includes a third vertical step area on a third vertical side of the second aperture and a fourth vertical step area on a fourth vertical side of the second aperture opposite of the third vertical side, wherein the third vertical step area and the fourth vertical step area have a thickness of approximately 50% of a thickness of the second plate that includes a dielectric plate recess and wherein the third vertical step area and the fourth vertical step area each extends inwards into the second aperture and are configured to reduce reflected power and minimize impedance for microwaves transmitted through the apparatus, and a dielectric plate configured to transmit microwaves and interposed between the first plate and the second plate and between the first pressure seal and the second pressure seal.
In some embodiments, the apparatus may further include wherein the first aperture is approximately 15.8 mm in vertical height and approximately 35 mm in horizontal width excluding the first vertical step area and the second vertical step area, wherein the first vertical step area and the second vertical step area each extends inwards into the first aperture approximately 3 mm to approximately 5 mm, wherein the second aperture is approximately 15.8 mm in vertical height and approximately 35 mm in horizontal width excluding the third vertical step area and the fourth vertical step area, and wherein the third vertical step area and the fourth vertical step area each extends inwards into the second aperture approximately 3 mm to approximately 5 mm, wherein the first plate and the second plate have a plurality of holes for joining the first plate to the second plate spaced approximately 1.5 inches or less apart around a periphery of the first plate and the second plate, wherein the first plate, the second plate, the first pressure seal, the second pressure seal, and the dielectric plate are configured to be joined together with screws placed in the plurality of the holes, wherein the dielectric plate has a thickness of approximately 0.75 mm to approximately 1.25 mm, wherein the dielectric plate is configured to sustain at least approximately 1 atmosphere of differential pressure, wherein the first plate and the second plate are formed from an aluminum-based material or a stainless steel-based material, wherein the apparatus is configured to transmit microwaves from approximately 5.850 GHz to approximately 6.650 GHz with an impedance of less than approximately 50 ohms, wherein the apparatus is configured to permit replacement of the dielectric plate, the first pressure seal, or the second pressure seal by separating the first plate from the second plate after assembly, wherein the dielectric plate is configured to have a duty cycle of greater than 1000 cycles of pressure, and/or wherein the dielectric plate is a quartz-based material.
In some embodiments, an apparatus for transmitting microwaves may comprise a microwave pressure window configured to transmit microwaves from approximately 5.850 GHz to approximately 6.650 GHz with an impedance of less than approximately 50 ohms which may include a first plate with a first aperture surrounded by a first recess for a first O-ring, wherein the first aperture includes a first vertical step area on a first vertical side of the first aperture and a second vertical step area on a second vertical side of the first aperture opposite of the first vertical side, wherein the first aperture is approximately 15.8 mm in vertical height and approximately 35 mm in horizontal width excluding the first vertical step area and the second vertical step area, and wherein the first vertical step area and the second vertical step area have a thickness of approximately 50% a thickness of the first plate B that includes a dielectric plate recess and each extends inwards into the first aperture approximately 3 mm to approximately 5 mm, a second plate with a second aperture surrounded by a second recess for a second O-ring, wherein the second aperture includes a third vertical step area on a third vertical side of the second aperture and a fourth vertical step area on a fourth vertical side of the second aperture opposite of the third vertical side, wherein the second aperture is approximately 15.8 mm in vertical height and approximately 35 mm in horizontal width excluding the third vertical step area and the fourth vertical step area, and wherein the third vertical step area and the fourth vertical step area have a thickness of approximately 50% of a thickness of the second plate that includes a dielectric plate B recess and each extends inwards into the second aperture approximately 3 mm to approximately 5 mm, and a dielectric plate formed of a quartz-based material configured to transmit microwaves and interposed between the first plate and the second plate and between the first O-ring and the second O-ring.
In some embodiments, the apparatus may further include wherein the first plate and the second plate having a plurality of holes for joining the first plate to the second plate spaced approximately 1.5 inches or less apart around a periphery of the first plate and the second plate, wherein the dielectric plate has a thickness of approximately 0.75 mm to approximately 1.25 mm, wherein the dielectric plate is configured to sustain at least approximately 1 atmosphere of differential pressure, wherein the apparatus is configured to permit replacement of the dielectric plate, the first O-ring, or the second O-ring by separating the first plate from the second plate after assembly, and/or wherein the dielectric plate is configured to have a duty cycle of greater than 1000 cycles of pressure.
In some embodiments, an apparatus for transmitting microwaves may comprise a metal plate with an aperture surrounded by a recess for a pressure seal, wherein the aperture is configured to transmit microwaves and includes a first vertical step area on a first vertical side of the aperture and a second vertical step area on a second vertical side of the aperture opposite of the first vertical side, wherein the first vertical step area and the second vertical step area have a thickness of approximately 50% of a thickness of the metal plate that includes a dielectric plate recess and each extends inwards into the aperture and are configured to reduce reflected power and minimize impedance for microwaves transmitted through the apparatus.
In some embodiments, the apparatus may further include wherein the aperture is approximately 15.8 mm in vertical height and approximately 35 mm in horizontal width excluding the first vertical step area and the second vertical step area, wherein the first vertical step area and the second vertical step area each extends inwards into the aperture approximately 3 mm to approximately 5 mm and/or wherein the metal plate is configured to interact with a second plate with a second aperture to hold a dielectric plate interposed between the metal plate and the second plate and between a first pressure seal in the recess of the metal plate and a second pressure seal in a second recess surrounding the second aperture in the second plate, wherein the dielectric plate is configured to provide a pressure window while transmitting microwaves.
Other and further embodiments are disclosed below.
Embodiments of the present principles, briefly summarized above and discussed in greater detail below, can be understood by reference to the illustrative embodiments of the principles depicted in the appended drawings. However, the appended drawings illustrate only typical embodiments of the principles and are thus not to be considered limiting of scope, for the principles may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
The methods and apparatus provide an increased pressure duty cycle microwave transmission window. The microwave transmission window solves the technical problem of delivering high microwave power into a high vacuum chamber with less reflected power. The microwave transmission window provides the additional benefits of a long life span with easy serviceability and low manufacturing costs. The microwave transmission window is generally composed of four main components, a metal housing comprising two metal plates, a dielectric plate, O-rings, and fastening components such as, for example, screws. The dielectric plate transmits the microwave energy and, at the same time, helps to maintain the vacuum integrity of the process chamber. The dielectric plate is sandwiched between two O-rings and the two metal plates. In some embodiments, the microwave transmission window is assembled using six screws spaced about the dielectric plate.
When microwave energy is transmitted through the dielectric plate, some of the energy will be dissipated inside the dielectric plate. The inventors have found that if the dielectric plate thickness is increased significantly, the energy dissipation in the dielectric plate will increase to a point that the energy dissipation will heat the O-rings and cause the O-rings to disintegrate. The inventors also found that if the thickness of the dielectric plate is decreased significantly, the dielectric plate may break when subjected to differential pressures on the order of negative 15 psi (pounds per square inch). The inventors also found that the spacing or distance between the fastening components such as, for example, screws should be set to prevent microwave leakage from the microwave transmission window. Additionally, the opening in the metal housing should be sized such that the forward and reflected power going in and out of the process chamber is controlled.
A controller 198 controls the operation of the process chamber 102 and/or the microwave source 108 using a direct control of the process chamber 102 and/or the microwave source 108 or alternatively, by controlling the computers (or controllers) associated with the process chamber 102 and/or the microwave source 108. In operation, the controller 198 enables data collection and feedback from the respective chamber and systems to optimize performance of the process chamber 102. The controller 198 generally includes a Central Processing Unit (CPU) 160, a memory 158, and a support circuit 162. The CPU 160 may be any form of a general-purpose computer processor that can be used in an industrial setting. The support circuit 162 is conventionally coupled to the CPU 160 and may comprise a cache, clock circuits, input/output subsystems, power supplies, and the like. Software routines may be stored in the memory 158 and, when executed by the CPU 160, transform the CPU 160 into a specific purpose computer (controller 198). The software routines may also be stored and/or executed by a second controller (not shown) that is located remotely from the process chamber 102.
The memory 158 is in the form of computer-readable storage media that contains instructions, when executed by the CPU 160, to facilitate the operation of the semiconductor processes and equipment. The instructions in the memory 158 are in the form of a program product such as a program that implements the method of the present principles. The program code may conform to any one of a number of different programming languages. In one example, the disclosure may be implemented as a program product stored on a computer-readable storage media for use with a computer system. The program(s) of the program product define functions of the aspects. Illustrative computer-readable storage media include, but are not limited to: non-writable storage media (e.g., read-only memory devices within a computer such as CD-ROM disks readable by a CD-ROM drive, flash memory, ROM chips, or any type of solid-state non-volatile semiconductor memory) on which information is permanently stored; and writable storage media (e.g., floppy disks within a diskette drive or hard-disk drive or any type of solid-state random access semiconductor memory) on which alterable information is stored. Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are aspects of the present principles.
Although examples illustrated below may apply to a specific frequency or frequencies for the sake of brevity, the present principles may be configured to apply to any frequency or frequencies to reduce reflected power and minimize impedances for microwave transmissions.
The front plate aperture 202A has a front plate window area 212A. In some embodiments, the front plate window area 212A may have a width 236 of approximately 25 mm to approximately 29 mm depending on the widths of the first vertical step area 204A and the second vertical step area 206A. The front plate window area 212A acts like a microwave filter that is adjusted by changing the widths of the first vertical step area 204A and the second vertical step area 206A. The front plate aperture 202A is surrounded by a front plate sealing area 214A that is configured to mate with a waveguide connected to a microwave source. A high temperature O-ring is usually placed between the front plate 104A and the waveguide to seal the connection. A plurality of front plate mounting holes 208A surround the front plate sealing area 214A. The plurality of front plate mounting holes 208A are used to connect the front plate 104A to the back plate 104B in
A plurality of through holes 210A surround the front plate sealing area 214A to provide mounting of the microwave transmission window 104 to the process chamber 102 in
The back plate aperture 202B has a back plate window area 212B. In some embodiments, the back plate window area 212B may have a width 236 of approximately 25 mm to approximately 29 mm depending on the widths of the first vertical step area 204B and the second vertical step area 206B. The back plate window area 212B acts like a microwave filter that is adjusted by changing the widths of the first vertical step area 204B and the second vertical step area 206B. The back plate aperture 202B is surrounded by a back plate sealing area 214B on a front surface 224B of the back plate 104B that is configured to mate with a process chamber. A high temperature O-ring is usually placed between the back plate 104B and the process chamber to seal the connection. A plurality of back plate mounting holes 208B surround the back plate sealing area 214B. The plurality of back plate mounting holes 208B are used to connect the front plate 104A (
A plurality of through holes 210B surround the back plate sealing area 214B to provide mounting of the microwave transmission window 104 to the process chamber 102 in
The second vertical step area 206B of the back plate 1048 has a thickness 810B of approximately one half of a thickness 808B of the back plate 104B in the area with accommodations for the thickness of the dielectric plate. In some embodiments, the dielectric plate thickness is approximately 0.75 mm to approximately 1.25 mm as is the thickness 812. In some embodiments, the thickness 810B is 1.96 mm+/−10%. The thicknesses of the first vertical step area and the second vertical step area of the back plate 104B provide optimum performance when the thicknesses are 50% of the back plate thickness in the area accommodating the dielectric plate (50% of the thickness 8088). In some embodiments, a total thickness 814 that includes the step areas of the front and back plates along with the dielectric plate thickness is 4.93 mm+/−10%. The total thickness 814 influences the microwave transmission with respect to reflected power.
The dielectric plate recesses 306, 308 of the front plate 104A have a depth 806A of approximately one half of the thickness 812 of the dielectric plate. The dielectric plate recesses 506, 508 of the back plate 104B have a depth 806B of approximately one half of the thickness 812 of the dielectric plate. The first recessed channel 302 of the front plate 104A has a depth 804A of approximately 1.5 mm to approximately 2 mm to accommodate the first O-ring 702 in
Embodiments in accordance with the present principles may be implemented in hardware, firmware, software, or any combination thereof. Embodiments may also be implemented as instructions stored using one or more computer readable media, which may be read and executed by one or more processors. A computer readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing platform or a “virtual machine” running on one or more computing platforms). For example, a computer readable medium may include any suitable form of volatile or non-volatile memory. In some embodiments, the computer readable media may include a non-transitory computer readable medium.
While the foregoing is directed to embodiments of the present principles, other and further embodiments of the principles may be devised without departing from the basic scope thereof.
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Number | Date | Country | |
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20220140456 A1 | May 2022 | US |