Claims
- 1. An imaging method comprising the steps of:
- a. providing an imaging member comprising a photoconductive softenable material layer containing migration marking particles;
- b. electrically charging said member;
- c. exposing said member to an image pattern of activating radiation and;
- d. developing an image by decreasing the resistance of the photoconductive softenable material to migration of migration marking particles through the photoconductive softenable material whereby selected portions of the migration marking particles imagewise migrate in depth in the softenable layer.
- 2. An imaging method according to claim 1 wherein said migration marking particles are dispersed throughout said photoconductive softenable layer.
- 3. An imaging method according to claim 2 wherein said photoconductive softenable layer comprises an organic photoconductor dispersed in a resin binder.
- 4. An imaging method according to claim 2 wherein said photoconductive softenable material layer overlies a substrate and wherein said particles have an average particle size in the range of about 0.01 to about 2 microns.
- 5. An imaging method according to claim 2 wherein said developing is accomplished by contacting said member with a solvent liquid whereby selected portions of the migration marking particles migrate to the substrate and whereby other migration marking particles and portion of the photoconductive softenable layer are washed away.
- 6. An imaging method according to claim 2 wherein said developing is accomplished by heating said member.
- 7. An imaging method according to claim 2 wherein said developing is accomplished by exposing said member to vapors of a solvent for said photoconductive softenable layer.
- 8. An imaging method according to claim 2 wherein said migration marking particles are photoconductively inert.
- 9. An imaging method comprising:
- providing an imaging member comprising a photoconductive softenable layer comprising photoconductive softenable material, said softenable layer containing a fracturable layer of migration marking material contacting one surface of said softenable layer and said softenable layer being otherwise substantially devoid of migration marking material,
- substantially uniformly electrically charging said imaging member,
- exposing the imaging member to an image pattern of activating radiation, and
- developing an image by decreasing the resistance of the softenable material to migration of migration marking material through the softenable material whereby selective portions of the migration marking material imagewise migrate in depth in the softenable layer.
- 10. The method of claim 9 wherein said imaging member additionally comprises a substrate contacting the surface of the softenable layer spaced apart from the surface of the softenable layer to which the fracturable layer of migration marking material is contiguous.
- 11. The method of claim 10 wherein said substrate is substantially transparent.
- 12. The method of claim 9 wherein said photoconductive softenable layer is of a thickness in the range between about 1/2 and about 16 microns.
- 13. The method of claim 12 wherein said photoconductive softenable layer is of a thickness in the range between about 1 and about 4 microns.
- 14. The method of claim 9 wherein said photoconductive softenable material comprises a charge-transfer complex of an aromatic resin with a Lewis acid.
- 15. The method of claim 9 wherein said photoconductive softenable material comprises an organic photoconductor in a resin binder.
- 16. The method of claim 9 wherein said fracturable layer of migration marking material is overcoated with a second photoconductive softenable layer comprising photoconductive softenable material.
- 17. The method of claim 9 wherein said fracturable layer of migration marking material is of a thickness in the range between about 0.01 and about 2.0 microns.
- 18. The method of claim 9 wherein said migration marking material is particulate material.
- 19. The method of claim 17 wherein said particulate material is of average particle size in the range between about 0.01 and about 2.0 microns.
- 20. The method of claim 19 wherein said particulate material is of average particle size not greater than about 0.7 microns.
- 21. The method of claim 10 wherein the image is developed contacting the imaging member with a solvent liquid for the photoconductive softenable material.
- 22. The method of claim 21 wherein the image is developed by contacting the imaging member with a solvent liquid for the photoconductive softenable material whereby the photoconductive softenable layer and unmigrated portions of the fracturable layer of migration marking material are substantially removed while permitting imagewise migration of selected portions of the migration marking material toward the substrate leaving an image pattern of migration marking material on the surface of the substrate.
- 23. The method of claim 10 wherein the image is developed by contacting the imaging member with a vaporous solvent for the photoconductive softenable layer.
- 24. The method of claim 10 wherein the image is developed by heating the photoconductive softenable material.
- 25. The method of claim 22 wherein the migration marking material is tackifiable but not completely soluble in said solvent and the image is developed by contacting the imaging member with a solvent liquid for the photoconductive softenable material which solvent also tackifies the migration marking material, whereby the photoconductive softenable layer and unmigrated portions of the fracturable layer of migration marking material are substantially removed while permitting imagewise migration of selected portions of the migration marking material toward the substrate leaving an image pattern of tackified migration marking material on the surface of the substrate.
- and drying said member whereby the migration marking material in imagewise configuration on the substrate is fixed to said substrate.
Parent Case Info
This application is a division of pending application Ser. No. 572,762, filed Apr. 29, 1975, now abandoned, which in turn is a division of application Ser. No. 181,990, filed Sept. 20, 1971, now U.S. Pat. No. 3,933,491, which is in turn a continuation-in-part of co-pending application Ser. No. 837,592, filed June 30, 1969 (which is a continuation-in-part of Ser. No. 553,837, filed May 31, 1966), now abandoned, and of co-pending application Ser. No. 837,591, filed June 30, 1969, now U.S. Pat. No. 4,013,462.
US Referenced Citations (4)
Related Publications (1)
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Number |
Date |
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837591 |
Jun 1969 |
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Divisions (2)
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Number |
Date |
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Parent |
572762 |
Apr 1975 |
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Parent |
181990 |
Sep 1971 |
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Continuation in Parts (2)
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Number |
Date |
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Parent |
837592 |
Jun 1969 |
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Parent |
553837 |
May 1966 |
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