Patent Application
20240429592
The present disclosure relates generally to electronics and wireless communications, and more specifically to antennas for use with such wireless communications.
Wireless communication devices and technologies are becoming ever more prevalent. Wireless communication devices generally transmit and receive communication signals. A communication signal is typically processed by a variety of different components and circuits. In some modern communication systems, many different wavelengths of electromagnetic waves can be used in a single device. Supporting different wavelengths for wireless communications can involve managing complex interactions among device elements while managing interactions and interference between elements supporting communications on the different wavelengths.
Various implementations of systems, methods and devices within the scope of the appended claims each have several aspects, no single one of which is solely responsible for the desirable attributes described herein. Without limiting the scope of the appended claims, some prominent features are described herein.
Aspects described herein include millimeter wave (mmW) modules and arrays including one or more antennas for communications at frequencies above 20 gigahertz (GHz) (e.g., above approximately 24 GHz). Wireless communications at such frequencies can be highly directional, and the directional wireless signals can be subject to occlusion in electronic devices with adjustable physical configurations, such as hinged laptops.
Aspects described herein include elements of a mmW communication apparatus integrated with a hinge, pivot structure, or movable joint structure of an electronic device with a configuration to limit signal blockage associated with movement of the structure.
One aspect is wireless communication apparatus, comprising: a millimeter wave (mmW) module comprising a mmW antenna array; at least one mmW signal node configured to communicate mmW signals in association with the mmW antenna array; a first joint having an attachment leaf and a central leaf; and a second joint having an attachment leaf and a central leaf; where the central leaf of the first joint and the central leaf of the second joint are configured in a shared plane to align the mmW antenna array of the mmW module to limit signal obstruction from objects attached to the attachment leaf of the first joint and the attachment leaf of the second joint.
Some such aspects operate where the mmW antenna array is configured to radiate the mmW signals in a boresight direction perpendicular to the shared plane at frequencies greater than 20 gigahertz (GHz). Some such aspects operate where the mmW module is mounted to a heatsink coupled to the central leaf of the first joint or the central leaf of the second joint. Some such aspects operate where the mmW module is coupled to the heatsink via a heat dispersion adhesive.
Some such aspects operate where the mmW module is mounted to the bracket; and the bracket is coupled to the central leaf of the first joint and the central leaf of the second joint such that the first joint creates a first degree of freedom for rotation of the first joint around a first line and the second joint creates a second degree of freedom for rotation of the second joint around a second line parallel to the first line. Some such aspects operate where the mmW module is removably mounted to the bracket via a socket comprising an electrical connection that provides a data path from the mmW module to a first object of the objects attached to the attachment leaf of the first joint.
Some such aspects operate where a first object of the objects is a computing device comprising one or more processors and a keyboard attached to the attachment leaf of the first joint.
Some such aspects operate where a second object of the objects is a display screen attached to the attachment leaf of the second joint.
Some such aspects operate where the first joint and the second joint are configured to orient the mmW antenna array with a boresight between the display screen and the keyboard and the first joint and the second joint rotate the keyboard and the display screen from a closed position where the keyboard is facing the display screen in parallel planes to an open position where the keyboard is facing away from the display screen in parallel planes.
Some such aspects operate where the computing device comprises: a second mmW module, where the boresight of the mmW module is directed in a first direction relative to the central leaf, and boresight of the second mmW module is directed in a second direction relative to the central leaf that is different than the first direction; and a third mmW module having a boresight directed in a third direction different from the second direction and the first direction.
Some such aspects operate where the bracket is configured to function as a heatsink mechanically coupled to the mmW module to facilitate heat transfer away from the mmW module and to radiate heat into air around the bracket. Some such aspects operate where the heatsink is configured to dissipate heat received from the mmW module via a thermally conductive adhesive. Some such aspects further comprise a non-mmW antenna integrated with the heatsink.
Another aspect is wireless communication apparatus comprising: a bracket; a millimeter wave (mmW) module comprising a mmW antenna array; means for attaching the mmW module to the bracket; means for setting an angle between the bracket and a first object coupled to the bracket along a first line; and means for setting an angle between the bracket and a second object coupled to the bracket along a second line parallel to the first line.
Another aspect is a wireless communication apparatus, comprising: a bracket; a first pivot structure attached to the bracket configured to pivot the bracket around a first line; and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, where the second line is parallel to the first line; and a millimeter wave (mmW) antenna array mounted to the bracket, where the mmW antenna array is positioned between the first line and the second line.
Some such aspects operate where the mmW antenna array is configured to radiate mmW signals in a boresight direction perpendicular to a plane formed by the first line and the second line at frequencies greater than 20 gigahertz (GHz).
Some such aspects further comprise a mmW module coupled to the bracket, where the mmW module is positioned between the first line and the second line of the bracket. Some such aspects operate where the mmW module is mounted to the bracket via a heatsink coupled the bracket. Some such aspects operate where the mmW module is coupled to the heatsink via a heat dispersion adhesive.
Some such aspects operate where a pivot position of the first pivot structure and a pivot position of the second pivot structure are configured to orient the mmW antenna array to limit signal obstruction from objects attached to the first pivot structure and the second pivot structure.
Some such aspects further include a first electrical device coupled to a first leaf of the first pivot structure, where the bracket is coupled to a second leaf of the first pivot structure, such that the first leaf and the second leaf pivot independently around the first line.
Some such aspects operate where the first electrical device comprises a millimeter wave integrated circuit (MMWIC), where the MMWIC is coupled to the mmW antenna array via a flexible mmW cable.
Some such aspects operate where the wireless communication apparatus comprises a laptop computer, where the first electrical device further comprises one or more processors and a keyboard.
Some such aspects further include a display screen coupled to a first leaf of the second pivot structure, where the bracket is coupled to a second leaf of the second pivot structure, such that the bracket is configured between the first pivot structure and the second pivot structure with two degrees of freedom relative to the display screen attached to the first leaf of the first pivot structure.
Some aspects further comprise a thermally conductive adhesive used to physically attach portions of one or more surfaces of the means for receiving the mmW signal to portions of one or more surfaces of the means for jointly receiving the non-mmW signal while dissipating the thermal energy received from the means for receiving the mmW signal.
Some aspects further comprise a thermally conductive adhesive used to physically attach portions of one or more surfaces of the means for receiving the mmW signal to portions of one or more surfaces of the means for jointly receiving the non-mmW signal while dissipating the thermal energy received from the means for receiving the mmW signal.
In some aspects, the apparatuses described above can include a mobile device with a camera for capturing one or more pictures. In some aspects, the apparatuses described above can include a display screen for displaying one or more pictures. The summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification, any or all drawings, and each claim.
The foregoing, together with other features and embodiments, will become more apparent upon referring to the following specification, claims, and accompanying drawings.
In the figures, like reference numerals refer to like parts throughout the various views unless otherwise indicated. For reference numerals with letter character designations such as “102a” or “102b”, the letter character designations may differentiate two like parts or elements present in the same figure. Letter character designations for reference numerals may be omitted when it is intended that a reference numeral encompass all parts having the same reference numeral in all figures.
The detailed description set forth below in connection with the appended drawings is intended as a description of exemplary implementations and is not intended to represent the only implementations in which the invention may be practiced. Examples, aspects, and exemplary embodiments as described herein refer to details “serving as an example, instance, or illustration,” and should not necessarily be construed as preferred or advantageous over other exemplary implementations. The detailed description includes specific details for the purpose of providing a thorough understanding of the exemplary implementations. In some instances, some devices are shown in block diagram form. Drawing elements that are common among the following figures may be identified using the same reference numerals.
Standard form factors for devices such as cell phones, tablets, laptop computers, cellular hotspot devices, and other such devices are subject to increasingly limited space. At the same time, additional wireless communication systems are being integrated into such devices. Performance and space tradeoffs are design considerations in all such devices. Millimeter wavelength (mmW) modules that include mmW circuitry (e.g., transmission (Tx) and receive (Rx) elements for mmW communications) are subject to significant power usage and associated heat generation. Additionally, mmW communications are subject to directionality where objects in a line-of-sight between antenna arrays degrade or eliminate communications due to the blocking of the mmW signals.
For configurable hinged electronic devices such as laptops with a hinge between a display and a keyboard, flip-phones or tablets with a hinge between a display and a keypad, or other such devices, the position of the hinge can impact mmW communication performance when the mmW antenna array is obstructed. For certain devices, such as laptops designed for multiple operating modes such as a tablet mode as well as a keyboard mode, mmW antenna array placement to allow communications across multiple operating modes can present a significant design challenge.
According to aspects described herein, a device is provided with one or more mmW modules or mmW antenna arrays integrated with a device hinge of the device. The mmW module or array can send and/or receive signals from a processing device via a communication (e.g., signal) node (e.g., on a conductive communication line or path) between the processing device and the mmW module or array. In some cases, the device hinge is structured with multiple degrees of freedom to allow an mmW antenna array to be directed independently of the objects attached to the hinge. Such a hinge can be configured to direct the boresight of a mmW antenna array to reduce obstruction of mmW signals from devices coupled by the hinge.
Additionally, mmW modules can generate significant amounts of heat, and dispersing heat from active mmW modules can cause design issues. Aspects described herein include devices with hinges configured to provide heat dispersion for integrated mmW and non-mmW antennas. Such aspects can include the use of heat dispersing materials functioning both as a mechanical hinge as well as a heatsink, or can include modular mechanical connection of heatsink and antenna materials onto a hinge bracket or other parts of a hinge structure. Aspects include devices with a hinge modified for wireless antenna and heatsink integration, along with integrating support for communication paths or data feeds (e.g., a connection point for passing electrical signals generated from wireless signals between antennas and processing circuitry). In some aspects, heatsink structures can be jointly structured for both dissipation of thermal energy and antenna operation for non-mmW frequencies.
Such a device may improve the performance of the device with improved communication performance in certain device configurations and positions relative to wireless nodes. Additionally, such a device may further increase efficient usage of space and device cooling, allowing improved device performance for a given space and power usage. In some aspects, some such devices can leverage space efficiency where the combination of a heatsink and communication elements are integrated into a hinge structure for improved thermal performance and efficient space usage in a design. Additional device improvements will be apparent from the descriptions provided herein.
The wireless device 110 may also be referred to as a user equipment (UE), a mobile station, a terminal, an access terminal, a subscriber unit, a station, etc. Wireless device 110 may be a cellular phone, a smartphone, a tablet, or other such mobile device (e.g., a device integrated with a display screen). Other examples of the wireless device 110 include a wireless modem, a personal digital assistant (PDA), a handheld device, a laptop computer, a smartbook, a netbook, a tablet, a cordless phone, a medical device, a device configured to connect to one or more other devices (for example through the internet of things), a wireless local loop (WLL) station, a Bluetooth device, etc. Wireless device 110 may communicate with wireless communication system 120. Wireless device 110 may also receive signals from broadcast stations (e.g., a broadcast station 134) and/or signals from satellites (e.g., a satellite 150 in one or more global navigation satellite systems (GNSS), etc.). Wireless device 110 may support one or more radio technologies for wireless communication such as LTE, WCDMA, CDMA 1×, EVDO, TD-SCDMA, GSM, 802.11, 5G, etc.
The wireless communication system 120 may also include a wireless device 160. In an exemplary embodiment, the wireless device 160 may be a wireless access point, or another wireless communication device that comprises, or comprises part of a wireless local area network (WLAN). In an exemplary embodiment, the wireless device 110 may be referred to as a customer premises equipment (CPE), which may be in communication with a base station 130 and a wireless device 110, or other devices in the wireless communication system 120. In some embodiments, the CPE may be configured to communicate with the wireless device 160 using WAN signaling and to interface with the base station 130 based on such communication instead of the wireless device 160 directly communicating with the base station 130. In exemplary embodiments where the wireless device 160 is configured to communicate using WLAN signaling, a WLAN signal may include WiFi, or other communication signals.
Wireless device 110 may support carrier aggregation, for example as described in one or more LTE or 5G standards. In some embodiments, a single stream of data is transmitted over multiple carriers using carrier aggregation, for example as opposed to separate carriers being used for respective data streams. Wireless device 110 may be able to operate in a variety of communication bands including, for example, those communication bands used by LTE, WiFi, 5G or other communication bands, over a wide range of frequencies. Wireless device 110 may also be capable of communicating directly with other wireless devices without communicating through a network.
In general, carrier aggregation (CA) may be categorized into two types-intra-band CA and inter-band CA. Intra-band CA refers to operation on multiple carriers within the same band. Inter-band CA refers to operation on multiple carriers in different bands.
In the example shown in
A transmitter or a receiver may be implemented with a super-heterodyne architecture or a direct-conversion architecture. In the super-heterodyne architecture, a signal is frequency-converted between radio frequency (RF) and baseband in multiple stages, e.g., from RF to an intermediate frequency (IF) in one stage, and then from IF to baseband in another stage for a receiver. In the direct-conversion architecture, a signal is frequency converted between RF and baseband in one stage. The super-heterodyne and direct-conversion architectures may use different circuit blocks and/or have different requirements. In the example shown in
In the transmit path, the data processor 210 processes data to be transmitted and provides in-phase (I) and quadrature (Q) analog output signals to the transmitter 230. In an exemplary embodiment, the data processor 210 includes digital-to-analog-converters (DAC's) 214a and 214b for converting digital signals generated by the data processor 210 into the I and Q analog output signals, e.g., I and Q output currents, for further processing. In other embodiments, the DACs 214a and 214b are included in the transceiver 220 and the data processor 210 provides data (e.g., for I and Q) to the transceiver 220 digitally.
Within the transmitter 230, bandpass (e.g., lowpass) filters 232a and 232b filter the I and Q analog transmit signals, respectively, to remove undesired images caused by the prior digital-to-analog conversion. Amplifiers (Amp) 234a and 234b amplify the signals from bandpass filters 232a and 232b, respectively, and provide I and Q baseband signals. An upconverter 240 having upconversion mixers 241a and 241b upconverts the I and Q baseband signals with I and Q transmit (TX) local oscillator (LO) signals from a TX LO signal generator 290 and provides an upconverted signal. A filter 242 filters the upconverted signal to remove undesired images caused by the frequency upconversion as well as noise in a receive frequency band. A power amplifier 244 amplifies the signal from filter 242 to obtain the desired output power level and provides a transmit RF signal. The transmit RF signal is routed through a duplexer or switch 246 and transmitted via an antenna array 248. While examples discussed herein utilize I and Q signals, those of skill in the art will understand that components of the transceiver may be configured to utilize polar modulation.
In the receive path, the antenna array 248 receives communication signals and provides a received RF signal, which is routed through duplexer or switch 246 and provided to a low noise amplifier (LNA) 252. The switch 246 is designed to operate with a specific RX-to-TX duplexer frequency separation, such that RX signals are isolated from TX signals. The received RF signal is amplified by LNA 252 and filtered by a filter 254 to obtain a desired RF input signal. Downconversion mixers 261a and 261b in a downconverter 260 mix the output of filter 254 with I and Q receive (RX) LO signals (i.e., LO_I and LO_Q) from an RX LO signal generator 280 to generate I and Q baseband signals. The I and Q baseband signals are amplified by amplifiers 262a and 262b and further filtered by baseband (e.g., lowpass) filters 264a, 264b to obtain I and Q analog input signals, which are provided to data processor 210. In the exemplary embodiment shown, the data processor 210 includes analog-to-digital-converters (ADC's) 216a and 216b for converting the analog input signals into digital signals to be further processed by the data processor 210. In some embodiments, the ADCs 216a and 216b are included in the transceiver 220 and provide data to the data processor 210 digitally.
In
In an exemplary embodiment, the RX PLL 282, the TX PLL 292, the RX LO signal generator 280, and the TX LO signal generator 290 may alternatively be combined into a single LO generator circuit 295, which may include common or shared LO signal generator circuitry to provide the TX LO signals and the RX LO signals. Alternatively, separate LO generator circuits may be used to generate the TX LO signals and the RX LO signals.
Wireless device 200 may support CA and may (i) receive multiple downlink signals transmitted by one or more cells on multiple downlink carriers at different frequencies and/or (ii) transmit multiple uplink signals to one or more cells on multiple uplink carriers. Those of skill in the art will understand, however, that aspects described herein may be implemented in systems, devices, and/or architectures that do not support carrier aggregation.
Certain components of the transceiver 220 are functionally illustrated in
The power amplifier 244 may comprise one or more stages comprising, for example, driver stages, power amplifier stages, or other components, that can be configured to amplify a communication signal on one or more frequencies, in one or more frequency bands, and at one or more power levels. Depending on various factors, the power amplifier 244 can be configured to operate using one or more driver stages, one or more power amplifier stages, one or more impedance matching networks, and can be configured to provide good linearity, efficiency, or a combination of good linearity and efficiency.
In an exemplary embodiment in a super-heterodyne architecture, the power amplifier 244 and LNA 252 (and filter 242 and/or 254 in some examples) may be implemented separately from other components in the transmitter 230 and receiver 250, and may be implemented on a millimeter wave integrated circuit. An example super-heterodyne architecture is illustrated in
The wireless device 200a is an example of a heterodyne (or superheterodyne) architecture in which the upconverter 240 and the downconverter 260 are configured to process a communication signal between baseband and an intermediate frequency (IF). For example, the upconverter 240 may be configured to provide an IF signal to an upconverter 275. In an exemplary embodiment, the upconverter 275 may comprise summing function 278 and upconversion mixer 276. The summing function 278 combines the I and the Q outputs of the upconverter 240 and provides a non-quadrature signal to the mixer 276. The non-quadrature signal may be single ended or differential. The mixer 276 is configured to receive the IF signal from the upconverter 240 and TX RF LO signals from a TX RF LO signal generator 277, and provide an upconverted mmW signal to phase shift circuitry 281. While PLL 292 is illustrated in
In an exemplary embodiment, components in the phase shift circuitry 281 may comprise one or more adjustable or variable phased array elements, and may receive one or more control signals from the data processor 210 over connection 289 and operate the adjustable or variable phased array elements based on the received control signals.
In an exemplary embodiment, the phase shift circuitry 281 comprises phase shifters 283 and phased array elements 287. Although three phase shifters 283 and three phased array elements 287 are shown for ease of illustration, the phase shift circuitry 281 may comprise more or fewer phase shifters 283 and phased array elements 287.
Each phase shifter 283 may be configured to receive the mmW transmit signal from the upconverter 275, alter the phase by an amount, and provide the mmW signal to a respective phased array element 287. Each phased array element 287 may comprise transmit and receive circuitry including one or more filters, amplifiers, driver amplifiers, and/or power amplifiers. In some embodiments, the phase shifters 283 may be incorporated within respective phased array elements 287.
The output of the phase shift circuitry 281 is provided to an antenna array 248. In an exemplary embodiment, the antenna array 248 comprises a number of antennas that typically correspond to the number of phase shifters 283 and phased array elements 287, for example such that each antenna element is coupled to a respective phased array element 287. In an exemplary embodiment, the phase shift circuitry 281 and the antenna array 248 may be referred to as a phased array.
In a receive direction, an output of the phase shift circuitry 281 is provided to a downconverter 285. In an exemplary embodiment, the downconverter 285 may comprise an I/Q generation function 291 and a downconversion mixer 286. In an exemplary embodiment, the mixer 286 downconverts the receive mmW signal provided by the phase shift circuitry 281 to an IF signal according to RX mmW LO signals provided by an RX mmW LO signal generator 279. The I/Q generation function 291 receives the IF signal from the mixer 286 and generates I and Q signals for the downconverter 260, which downconverts the IF signals to baseband, as described above. While PLL 282 is illustrated in
In some embodiments, the upconverter 275, downconverter 285, and the phase shift circuitry 281 are implemented on a common IC. In some embodiments, the summing function 278 and the I/Q generation function 291 are implemented separate from the mixers 276 and 286 such that the mixers 276, 286 and the phase shift circuitry 281 are implemented on the common IC, but the summing function 278 and I/Q generation function 291 are not (e.g., the summing function 278 and I/Q generation function 291 are implemented in another IC coupled to the IC having the mixers 276, 286). In some embodiments, the LO signal generators 277, 279 are included in the common IC. In some embodiments in which phase shift circuitry is implemented on a common IC with 276, 286, 277, 278, 279, and/or 291, the common IC and the antenna array 248 are included in a module, which may be coupled to other components of the transceiver 220 via a connector. In some embodiments, the phase shift circuitry 281, for example, a chip on which the phase shift circuitry 281 is implemented, is coupled to the antenna array 248 by an interconnect. For example, components of the antenna array 248 may be implemented on a substrate and coupled to an integrated circuit implementing the phase shift circuitry 281 via a flexible printed circuit. Any of the ICs described above may be an example of an IC in any of the mmW modules 610, 710, 810 or any mmW module recited herein or of the mmW integrated circuitry 914. Any of the modules described above may be an example of any of the mmW modules 610, 710, 810 or any mmW module recited herein.
In some embodiments, both the architecture illustrated in
Examples illustrated with respect to
The circuitry of
In some aspects, an antenna array with the antenna array elements 371, 372, 373, 374, 375 and 376 (or a fewer or greater number of elements) can be separate from the other elements of a module as described below with respect to
Such a frame or package structure can further be particularly configured based on an expected non-mmW antenna configuration and associated physical interfaces for thermal conduction of heat energy to allow the non-mmW antenna to interact with or facilitate heat transfer of heat sink elements to dissipate thermal energy from the mmW module. Such a non-mmW integration can allow the mmW and any non-mmW antennas to operate without mutual interference. Regardless of the wireless antennas used, a wide variety of thermal transfer characteristics can be implemented via mmW module packaging, thermal adhesives, and hinge structures as described herein.
The electronic device 400 of
Device 500A of
Device 500B of
Device 500C of
Device 500D of
Device 500E of
For any orientation of a mmW module positioned near the rotation axis of the hinges (e.g., similar to the mmW module 422 of
If an alternate orientation of the mmW module 422 is used with the signal pointing out toward the user (e.g., perpendicular with the plane of the keyboard), the signal will be partially blocked in the positions illustrated by devices 500B and possibly 500E (e.g., depending on whether the display is pointed up during tablet use, which is an expected use where the mmW module of this configuration would point toward the ground and provide no benefit) of
The mmW integrated hinge 600A can be referred to as a compound or double hinge, including two joint structures with each joint 630, 640 of the mmW integrated hinge having separate degrees of freedom for rotation around a corresponding line associated with each hinge. The joints can be considered as rotationally connected elements of a hinge, or pivot points of a hinge structure. The joint 630 is associated with rotation around line 631, and the joint 640 is associated with rotation around line 641. The lines 631 and 641 are roughly parallel, and can be further supported in a device by one or more additional hinges (e.g., similar to the hinge 412 and/or the hinge 414) that provide mechanical stability for rotation of objects around the lines 631 and 641. Such additional hinges can include structures similar to the bracket 620, joint 630, and attachment leaf 632, 642 without the mmW module 610 and associated heatsink, case, or support structures for the mmW module 610 described below.
Each joint 630, 640 of the mmW integrated hinge 600A can have internal structures to allow the rotation around the corresponding line 631, 641. In some implementations, each joint includes a barrel with a pin inside the barrel running along the lines associated with the joint. Leaves are portions of a joint that extend away from internal rotation structures along a line (e.g., a barrel and/or a pin) and also revolve around the associated line. In the mmW integrated hinge 600A, the joint 630 includes internal structures to support rotation around the line 631, and has associated attachment leaf 632 which rotates around the line 631. The bracket 620 can be considered a central leaf for the joint 630, such that the joint 630 allows the attachment leaf 632 and the bracket 620 to rotate around the line 631 relative to each other. Similarly, the joint 640 also includes internal structures (e.g., a barrel and/or pin) to support rotation of the joint 640 around the line 641. The joint 640 has associated attachment leaf 642 which rotates around the line 641. The bracket 620 can be considered a central leaf for the joint 640, such that the joint 640 allows the attachment leaf 642 and the bracket 620 to rotate around the line 641 relative to each other. The bracket 620 can be considered a shared leaf of the joints 630 and 640 in the compound mmW integrated hinge 600A. Leaf 632, 642 can be configured in any size or shape to facilitate coupling to respective objects.
The lines 631 and 641 as roughly parallel lines can define a shared plane 650 of the central leaves of the joints 630 and 640. The shared plane 650 provides a central location for placement of the mmW module 610, supporting structures to attach the mmW module 610 to the bracket 620, and/or any other materials, such as non-mmW antennas, heatsink structures, etc. As can be seen, the mmW module 610 (and any antenna array thereof) is positioned between the lines 631, 641.
A basic hinge joint allows free independent rotation around the associated lines 631, 641. The mmW integrated hinge 600A, however, may be configured to avoid a free rotation placement where an object attached to one joint angles to cover the mmW module 610 while an object attached to the other leaf is at an open angle. The joint 630 and the joint 640 can thus include gearing or other physical structures to constrain the rotation around the lines 631 and 641 to threshold ranges relative to the motion of the other joint.
For example,
The thermally conductive adhesive 652 can be implemented in various ways in different aspects. In some aspects, the thermally conductive adhesive 652 is thermally conductive epoxy adhesive. Such epoxy adhesives can include silicone epoxies, polyurethane epoxies, and other such epoxy materials, which can be selected based on the expected thermal environment and desired thermal transfer characteristics. Some thermal conductive epoxies in accordance with aspects described herein have a thermal conductivity of approximately 0.5 Watts per square meter (W/m2) (e.g., between approximately 0.4 and 0.6 W/m2). High performance thermal epoxies may have thermal conductivity over 1.5 W/m2 (e.g., between 1.5 and 3 W/m2) in some implementations. In some implementations, the thermally conductive adhesive 652 can be combined with a non-adhesive thermal material to further improve heat transfer performance with a pattern of adhesive combined with non-adhesive thermal transfer material. Such non-adhesive thermal transfer materials (e.g., thermal paste, thermal grease, etc.) can have thermal conductivity characteristics up to approximately 70 W/m2 using filler materials such as zinc oxide, ceramics, aluminum, copper, silver, graphite, and/or carbon nanoparticles along with other materials. In different implementations, electrically conductive or electrically non-conductive adhesives can be used, or combinations of such adhesives can be used based on a particular design and antenna operation to prevent mmW and non-mmW antennas from interfering with each other. Some such epoxies can include silver filled epoxy, graphite filled epoxy, or other such conductive epoxies. In some aspects, the thermally conductive adhesive 652 can be a thermally conductive tape material. In other aspects, other such adhesives can be used, or combinations of various adhesives can be used.
In some aspects of such an apparatus, the thermally conductive adhesive 652 is optional, or alternative heat dispersion materials can be used. In some aspects, a non-adhesive conductive material can be used at portions of the physical connection between the mmW module 610 and the heatsink 660. In such aspects, the apparatus can use alternative methods of maintaining a connection between the mmW module 610 and the heatsink 660, such as mechanical fasteners at fixed points, adhesives at certain points other than where a heat transfer material is located, or other such mechanisms for maintaining a mechanical (e.g., physical) connection. Such a mechanical connection between the mmW module 610 and the heatsink 660 can directly facilitate heat transfer from the mmW module 610 to the heatsink 660, and associated heat dispersion via the heatsink 660 without use of the thermally conductive adhesive 652. Further, it will be apparent that a mmW integrated hinge need not be configured for heat transfer in all implementations. For example, the structure used for the heatsink 660 may not be specially configured as a heatsink and/or any means for attaching radiators to the structure may not require specific heat transfer characteristics. For example, a mmW module 610 may not require such heat transfer mechanisms or heat transfer elements may instead be incorporated into a housing enclosing the mmW integrated hinge. Further, antenna arrays (that are not packaged into a module including certain circuit components) which are implemented with a mmW integrated hinge may not suffer from the same thermal constraints.
In some aspects, the protective housing 690 can be functionally integrated with the heatsink 660 to transfer heat away from the mmW module 610. In some aspects, the protective housing is a dielectric cover to prevent mechanical wear on the mmW module 610 and any non-mmW antennas coupled to the heatsink 660, with the material of the protective housing chosen to avoid interference with the wireless signals communicated to and from the mmW module 610 and any additional non-mmW antennas included in the mmW integrated hinge 600C.
As described herein, the mmW integrated hinge 600C includes one or more mmW antennas in the mmW module 610, and also can include a non-mmW antenna as part of the heatsink 660. Such a design can function with a metallic or conductive portion of the structure for the heatsink 660 integrated directly as a non-mmW antenna without sacrificing mmW or non-mmW antenna performance, and while preserving heat dispersion characteristics. By fine tuning the structure of the heatsink 660 as part of the design of the mmW integrated hinge 600C, the non-mmW antenna aspect of the heatsink 660 allows flexibility to provide antenna performance or additional radio access technology (RAT) functionality based on the particular design of the heatsink 660 and design preferences of a device including the mmW integrated hinge 600C. For example, parameters (width, length, thickness, shape, material, grounding points, distance from the mmW module 610, etc.) of the non-mmW antenna may be adjusted based on frequency at which communications may be transmitted and/or received, based on desired antenna efficiency or radiated power, based on electrical or conductive components which will be positioned near the mmW integrated hinge 600C when included in a device, etc. In some aspects, the heatsink 660 includes metal structures that can be configured for particular RAT and frequency operation, as well as providing physical structures for connections between the mmW module 610 and the heatsink 660 (e.g., using the thermally conductive adhesive 652). In some aspects, structures for physically fastening objects of a device (e.g., displays, computing elements, keyboards, etc.) to attachment leaves 632, 642 (e.g., via screw holes for fastening to frame structures of a mobile device, a laptop, a tablet, CPE, or any other such devices including mmW and non-mmW wireless communication support) are included in a device. In some aspects, the post structures along line 631 and 641 can be used to support mmW and/or non-mmW antenna structures or other such structures. In some aspects, such post structures can be used as non-mmW antennas, or they can form a slot antenna for non-mmW communication when adjacent a platform (e.g., formed by a portion of the bracket 620) on which the module 610 rests. In some aspects, one or more such posts structures may be omitted, such that only the bracket 620 is present to support the mmW module with no post structures or with only one post structure. In some aspects, the structure between lines 631 and 641 can be configured as a solid piece, instead of as the separate post structures illustrated in
In various aspects, the mmW integrated hinge 600C can be configured with additional control or communication circuitry configured to provide data signals compatible with a particular RAT. As described herein, “data signals” include signals transmitted and received as part of a communication system, ranging codes in global positioning systems, radar signals (e.g., transmissions or reflections including data about local objects), or other such codes or signals including information that can be received by an antenna and processed by control circuitry coupled to the antenna. The non-mmW antenna can receive an amplified signal via a signal feed that is particularly configured and amplified to a given gain level for the non-mmW antenna and an associated RAT. Such a RAT may, for example, have particular power transmission limits, with the data signal amplified to within a threshold level of the power transmission limits in order to provide for acceptable transmission distances while avoiding excessive electromagnetic exposure to sensitive objects or individuals near the mmW integrated hinge 600C. The heatsink in such aspects is not simply reflecting ambient signals, but is configured as a non-mmW device configured to receive signals in a particular RAT configuration and/or transmit signals in the RAT configuration, within power limits defined by the RAT standard operation. For example, the non-mmW antenna of a laptop computer integrated into the mmW integrated hinge 600C may be configured to resonate or radiate at a certain frequency so as to provide a desired gain to communication signals, operate with a desired EIRP, or perform according to another metric that is determined to be effective for wireless communication.
In one implementation, the mmW module 610 is approximately 2 millimeters (mm) wide, 3.5 mm tall, and 24 mm long. In some such implementations, the heatsink 660 can include mechanical attachments to the mmW module 610 that extend along any surface of the dimensions of the mmW module 610. In some implementations, the heatsink 660 can extend any distance past the dimensions of the mmW module to provide structure for the non-mmW antenna that makes up part of the heatsink and radiates thermal energy to a heat dissipation environment (e.g., air, a thermal dissipation liquid, etc.) In some aspects where the heatsink 660 is configured with conductive elements configured to radiate signals at non-mmW frequencies, the heatsink is designed to radiate at frequencies at or around 1.6 GHz to receive global positioning system (GPS) signals (e.g., 1.575 GHz). In other aspects, the antenna can be designed to receive other non-mmW GPS signals (e.g., 1.2276 GHZ, L2; 1.176 GHz, L5; etc.). In further aspects, the antenna can be designed to receive or transmit signals below 7 GHZ, in communication bands between 1.5 GHz and 4.75 GHz, 800 megahertz (MHz) to 1.2 GHz, 600 MHz to 700 MHz (e.g., LTE low bands), 6 GHz to 7 GHZ (e.g., WiFi 6E bands), or at other such non-mmW frequencies or frequency ranges, for example to communicate according to a 5G, 4G (LTE), 3G, 2G, WiFi (e.g., 2.4 GHz, GHz, etc.), Bluetooth, etc. standard or according to another communication protocol or strategy.
The mmW module is positioned so that a boresight 799 of the antenna array (of the mm W module 710) is roughly perpendicular to the bracket and the plane between the lines of rotation around the separate joints 730, 740. The angle 792 represents a difference in orientation between the object 780 and the boresight 799, and the angle 791 represents a difference in orientation between the object 770 and the boresight 799. By using two joints 730 and 740 with offset lines of rotation, when either angle 792 or angle 791 becomes zero, the objects 770 and 780 become roughly parallel with the boresight 799 rather than aligning or intersecting. Limits on the first degree of freedom 731 and the second degree of freedom 741 may prevent the angles 791, 792 from becoming negative and directly blocking the boresight 799.
Additionally, as described above, gearing or physical connections between the joints 730 and 740 can create dependent relationships between the rotation of the objects 770, 780 around corresponding joints. For example, such a dependency can attempt to maintain roughly equal values of the angles 791 and 792, (e.g., within a threshold tolerance such as plus or minus 5 degrees or plus or minus 10 degrees) so that the signals from the mmW module 710 along the boresight 799 (e.g., as determined by placement of elements of the mmW antenna array of the mmW module 710) are directed between the objects 770 and 780. Such use of the mmW integrated hinge 701 improves performance of the device 700 by avoiding degradation of mmW signals from the mmW module due to positioning of the joints 730, 740, which, if able to swing freely, could allow the objects 770, 780 to block the mmW signals.
In different aspects, different physical restrictions or designs can be used to manage the relative rotations of the joints 830, 840 in a mmW integrated compound hinge to both prevent attached objects such as the objects 870 and 880 from blocking the mmW signal, and to allow improved performance (e.g., such as via positions that create constructive interference with the reflected signals 812).
In some examples, the mmW antenna array or module may not be directly attached to the hinge, but may be coupled in fixed relation to the bracket 620. For example, the array or module may be coupled to or affixed within a housing of the hinge or enclosing the hinge and the array/module. In one such aspect, the array or module may be disposed in the protective housing 690, but not directly connected to the hinger in the manner illustrated in
The apparatus further comprises a millimeter wave (mmW) array 1004. The mmW array 1004 can be connected to (e.g., packaged together with) a mmWIC, or can be communicatively coupled to a mmW IC. The mmW array 1004 can be included in the mmW module 300, the mmW module 610, the mmW module 710, the mmW module 810, or any such mmW module described herein, or implemented in a non-module configuration, as described above.
The apparatus further comprises means 1006 for attaching the mmW array 1004 to the bracket. Means 1006 can include a thermal heatsink, adhesive, or packaging structure that can attach or integrate the mmW array 1004 to the bracket 1002.
The apparatus further comprises means 1008 for setting an angle between the bracket and a first object coupled to the bracket along a first line. The means 1008 can include a pivot structure or joint of a hinge in accordance with any details provided herein, such as the joint 630 and/or the attachment leaf 632 of
The apparatus further comprises means 1010 for setting an angle between the bracket and a second object coupled to the bracket along a second line parallel to the first line. Similar to the means 1008, the means 1010 can include a pivot structure or joint of a hinge in accordance with any details provided herein, such as the joint 640 and/or the attachment leaf 642 of
As described above, for both means 1008 and 1010, the mechanism within the hinge for setting the angle can vary depending on the implementation, and can include a free hinge with mechanical limits, geared limiters that maintain given angles as the alternate joint pivots, friction limiters on joint rotation, or other physical limiters for setting or selecting an angle of objects attached to either side of a double jointed hinge as described in
In some aspects, the electronic device 1102 includes a display screen 1199 that can be used to display information associated with data transmitted via wireless link 1106 and processed using components of electronic device 1102 described below. In the environment 1100, the electronic device 1102 communicates with a base station 1104 through a wireless link 1106. As shown, the electronic device 1102 is depicted as a laptop. However, the electronic device 1102 may be implemented as any suitable computing or other electronic device, such as a cellular or mobile phone, gaming device, navigation device, media device, tablet computer, Internet of Things (IoT) device, sensor or security device, asset tracker, and so forth with any such device implemented using a hinge structure in accordance with aspects described herein.
The base station 1104 communicates with the electronic device 1102 via the wireless link 1106, which may be implemented as any suitable type of wireless link. Although depicted as a base station tower of a cellular radio network, the base station 1104 may represent or be implemented as another device, such as a satellite, terrestrial broadcast tower, access point, peer to peer device, mesh network node, fiber optic line, another electronic device generally as described above, and so forth. Hence, the electronic device 1102 may communicate with the base station 1104 or another device via a wired connection, a wireless connection, or a combination thereof. The wireless link 1106 can include a downlink of data or control information communicated from the base station 1104 to the electronic device 1102 and an uplink of other data or control information communicated from the electronic device 1102 to the base station 1104. The wireless link 1106 may be implemented using any suitable communication protocol or standard, such as 3rd Generation Partnership Project Long-Term Evolution (3GPP LTE, 3GPP NR 5G), IEEE 802.11, IEEE 802.16, Bluetooth™, and so forth.
The electronic device 1102 includes a processor 1180 and a memory 1182. The memory 1182 may be or form a portion of a computer readable storage medium. The processor 1180 may include any type of processor, such as an application processor or a multi-core processor, that is configured to execute processor-executable instructions (e.g., code) stored by the memory 1182. The memory 1182 may include any suitable type of data storage media, such as volatile memory (e.g., random access memory (RAM)), non-volatile memory (e.g., Flash memory), optical media, magnetic media (e.g., disk or tape), and so forth. In the context of the disclosure, the memory 1182 is implemented to store instructions 1184, data 1186, and other information of the electronic device 1102, and thus when configured as or part of a computer readable storage medium, the memory 1182 does not include transitory propagating signals or carrier waves.
The electronic device 1102 may also include input/output (I/O) ports 1190. The I/O ports 1190 enable data exchanges or interaction with other devices, networks, or users or between components of the device.
The electronic device 1102 may further include a signal processor (SP) 1192 (e.g., such as a digital signal processor (DSP)). The signal processor 1192 may function similar to the processor 1180 and may be capable of executing instructions and/or processing information in conjunction with the memory 1182.
For communication purposes, the electronic device 1102 also includes a modem 1194, a wireless transceiver 1196, and an antenna (not shown). The wireless transceiver 1196 provides connectivity to respective networks and other electronic devices connected therewith using radio-frequency (RF) wireless signals and may include the transceiver circuitry implemented to include a mmW integrated hinge in accordance with aspects described herein. The wireless transceiver 1196 may facilitate communication over any suitable type of wireless network, such as a wireless local area network (LAN) (WLAN), a peer to peer (P2P) network, a mesh network, a cellular network, a wireless wide area network (WWAN), a navigational network (e.g., the Global Positioning System (GPS) of North America or another Global Navigation Satellite System (GNSS)), and/or a wireless personal area network (WPAN).
Devices, networks, systems, and certain means for transmitting or receiving signals described herein may be configured to communicate via one or more portions of the electromagnetic spectrum. The electromagnetic spectrum is often subdivided, based on frequency or wavelength, into various classes, bands, channels, etc. In 5G NR two initial operating bands have been identified as frequency range designations FR1 (410 MHz-7.125 GHz) and FR2 (24.25 GHz-52.6 GHz). The frequencies between FR1 and FR2 are often referred to as mid-band frequencies. Although a portion of FR1 is greater than 6 GHZ, FR1 is often referred to (interchangeably) as a “sub-6 GHz” band in various documents and articles, and will be referred to herein as “sub-7 GHz”. A similar nomenclature issue sometimes occurs with regard to FR2, which is often referred to (interchangeably) as a “millimeter wave” (mmW) band in documents and articles, despite including frequencies outside of the extremely high frequency (EHF) band (30 GHz-300 GHz) which is identified by the International Telecommunications Union (ITU) as a “mmWave” or mmW band.
The circuit architecture described herein may be implemented on one or more ICs, analog ICs, mmWICs, mixed-signal ICs, ASICs, printed circuit boards (PCBs), electronic devices, etc. The circuit architecture described herein may also be fabricated with various IC process technologies such as complementary metal oxide semiconductor (CMOS), N-channel MOS (NMOS), P-channel MOS (PMOS), bipolar junction transistor (BJT), bipolar-CMOS (BiCMOS), silicon germanium (SiGe), gallium arsenide (GaAs), heterojunction bipolar transistors (HBTs), high electron mobility transistors (HEMTs), silicon-on-insulator (SOI), etc.
Although selected aspects have been illustrated and described in detail, it will be understood that various substitutions and alterations may be made therein without departing from the spirit and scope of the present invention, as defined by the following claims.
Illustrative aspects of the present disclosure include, but are not limited to:
Aspect 1: A wireless communication apparatus, comprising: a bracket; a first pivot structure attached to the bracket configured to pivot the bracket around a first line; and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, wherein the second line is parallel to the first line; and a millimeter wave (mmW) antenna array mounted to the bracket, wherein the mmW antenna array is positioned between the first line and the second line.
Aspect 2: The wireless communication apparatus according to Aspect 1, wherein the mmW antenna array is configured to radiate mmW signals in a boresight direction perpendicular to a plane formed by the first line and the second line at frequencies greater than 20 gigahertz (GHz).
Aspect 3: The wireless communication apparatus according to any of Aspects 1 through 2, further comprising a mmW module coupled to the bracket, wherein the mmW module is positioned between the first line and the second line of the bracket.
Aspect 4: The wireless communication apparatus according to Aspect 3, wherein the mmW module is mounted to the bracket via a heatsink coupled to the bracket.
Aspect 5: The wireless communication apparatus according to Aspect 3, wherein the mmW module is coupled to the heatsink via a heat dispersion adhesive.
Aspect 6: The wireless communication apparatus according to any of Aspects 1 through 5, wherein a pivot position of the first pivot structure and a pivot position of the second pivot structure are configured to orient the mmW antenna array to limit signal obstruction from objects attached to the first pivot structure and the second pivot structure.
Aspect 7: The wireless communication apparatus according to any of Aspects 1 through 6, further comprising a first electrical device coupled to a first leaf of the first pivot structure, wherein the bracket is coupled to a second leaf of the first pivot structure, such that the first leaf and the second leaf pivot independently around the first line.
Aspect 8: The wireless communication apparatus according to any of Aspects 1 through 7, wherein the first electrical device comprises a millimeter wave integrated circuit (MMWIC), wherein the MMWIC is coupled to the mmW antenna array via a flexible mmW cable.
Aspect 9: The wireless communication apparatus according to any of Aspects 1 through 8, wherein the wireless communication apparatus comprises a laptop computer, wherein the first electrical device further comprises one or more processors and a keyboard.
Aspect 10: The wireless communication apparatus according to Aspect 7, further comprising a display screen coupled to a first leaf of the second pivot structure, wherein the bracket is coupled to a second leaf of the second pivot structure, such that the bracket is configured between the first pivot structure and the second pivot structure with two degrees of freedom relative to the display screen attached to the first leaf of the first pivot structure.
Aspect 11: A wireless communication apparatus, comprising: a millimeter wave (mmW) module comprising a mmW antenna array; at least one mmW signal node configured to communicate mmW signals in association with the mmW antenna array; a first joint having an attachment leaf and a central leaf; and a second joint having an attachment leaf and a central leaf; wherein the central leaf of the first joint and the central leaf of the second joint are configured in a shared plane to align the mmW antenna array of the mmW module to limit signal obstruction from objects attached to the attachment leaf of the first joint and the attachment leaf of the second joint.
Aspect 12: The wireless communication apparatus according to Aspect 11, wherein the mmW antenna array is configured to radiate the mmW signals in a boresight direction perpendicular to the shared plane at frequencies greater than 20 gigahertz (GHz).
Aspect 13: The wireless communication apparatus according to any of Aspects 1 through 12, wherein the mmW module is mounted to a heatsink coupled to the central leaf of the first joint or the central leaf of the second joint.
Aspect 14: The wireless communication apparatus according to Aspect 13, wherein the mmW module is coupled to the heatsink via a heat dispersion adhesive.
Aspect 15: The wireless communication apparatus according to any of Aspects 11 through 14, wherein: the mmW module is mounted to the bracket; and the bracket is coupled to the central leaf of the first joint and the central leaf of the second joint such that the first joint creates a first degree of freedom for rotation of the first joint around a first line and the second joint creates a second degree of freedom for rotation of the second joint around a second line parallel to the first line.
Aspect 16: The wireless communication apparatus according to Aspect 15, wherein the mmW module is removably mounted to the bracket via a socket comprising an electrical connection that provides a data path from the mmW module to a first object of the objects attached to the attachment leaf of the first joint.
Aspect 17: The wireless communication apparatus according to any of Aspects 11 through 16, wherein a first object of the objects is a computing device comprising one or more processors and a keyboard attached to the attachment leaf of the first joint.
Aspect 18: The wireless communication apparatus according to any of Aspects 11 through 17, wherein a second object of the objects is a display screen attached to the attachment leaf of the second joint.
Aspect 19: The wireless communication apparatus according to any of Aspects 11 through 18, wherein the first joint and the second joint are configured to orient the mmW antenna array with a boresight between the display screen and the keyboard and the first joint and the second joint rotate the keyboard and the display screen from a closed position where the keyboard is facing the display screen in parallel planes to an open position where the keyboard is facing away from the display screen in parallel planes.
Aspect 20: The wireless communication apparatus according to Aspect 19, wherein the computing device comprises: a second mmW module, wherein the boresight of the mmW module is directed in a first direction relative to the central leaf, and boresight of the second mmW module is directed in a second direction relative to the central leaf that is different than the first direction; and a third mmW module having a boresight directed in a third direction different from the second direction and the first direction.
Aspect 21: The wireless communication apparatus according to any of Aspects 11 through 20, wherein the bracket is configured to function as a heatsink mechanically coupled to the mmW module to facilitate heat transfer away from the mmW module and to radiate heat into air around the bracket.
Aspect 22: The wireless communication apparatus according to Aspect 21, wherein the heatsink is configured to dissipate heat received from the mmW module via a thermally conductive adhesive.
Aspect 23: The wireless communication apparatus according to any of Aspects 21 through 22, further comprising a non-mmW antenna integrated with the heatsink.
Aspect 24: A wireless communication apparatus comprising: a bracket; a millimeter wave (mmW) module comprising a mmW antenna array; means for attaching the mmW module to the bracket; means for setting an angle between the bracket and a first object coupled to the bracket along a first line; and means for setting an angle between the bracket and a second object coupled to the bracket along a second line parallel to the first line.
Aspect 25: The wireless communication apparatus according to Aspect 24, further comprising means for dispersing heat from the mmW module.
Aspect 26: The wireless communication apparatus according to any of Aspects 24 through 25, further comprising a non-mmW antenna integrated with the bracket.
Aspect 27: The wireless communication apparatus according to any of Aspects 24 through 26, The wireless communication apparatus of claim 24, further comprising means for communicating electrical signals with processing circuitry, wherein the electrical signals are generated by received mmW signals or used by the mmW module to generate transmitted mmW signals.
Aspect 28: The wireless communication apparatus according to any of Aspects 24 through 27, further comprising a second millimeter wave (mmW) module separate from the first mmW module, wherein the first mmW module has a boresight in a first direction separate from a second direction of a boresight of the second mmW module.
Aspect 30: A wireless communication apparatus, comprising: a display; a keyboard; a millimeter wave (mmW) phased array coupled in a fixed relationship with a hinge, the hinge coupled between the display and the keyboard such that a boresight of the phased array can be rotated independent of a position of the keyboard and the display.
Aspect 31: A method for operating a wireless communication apparatus according to any of the aspects above.
Aspect 32: An apparatus comprising means for performing operations according to any of the aspects above.
Aspect 33: A non-transitory computer-readable storage medium comprising instructions stored thereon which, when executed by one or more processors, cause the one or more processors to implement operations according to any of the aspects above.
