Patent Application
20050088258
This invention relates to the field of millimeter wave filters, and more particularly, this invention relates to millimeter wave filters, such as parallel coupled line filters formed as hairpin filters.
Almost every high frequency, RF module manufactured today requires a number of filters, including millimeter wave filters. For example, a transceiver will typically have an image reject filter and one local oscillator (LO) reject filter. The estimated number of RF modules built worldwide, including cell phones, is now over 600 million.
Traditionally, high performance filters at frequencies greater than 800 MHz for use in millimeter wavelength applications are designed and fabricated using dielectric resonators. Tight design and manufacturing tolerances are required to achieve a desired filter response at these high frequencies. The filter length and width usually varies as a function of frequency band, substrate parameters, and performance requirements. These filters are expensive, typically $10 each at the present time, and are usually hand-tuned during fabrication. Conventionally designed parallel, coupled line filters are not practical at and below L-band frequencies because of their large size. A standard three pole, 1.5 GHz hairpin filter is about 800 mils by about 400 mils and printed on an alumina (Er=9.9) substrate.
Commonly assigned U.S. Pat. No. 6,483,404, issued Nov. 19, 2002, the disclosure which is hereby incorporated by reference in its entirety, discloses a high performance, millimeter wave radio frequency filter using standard thick film technology and manufacturing tolerances. The invention disclosed in this '404 patent is an improvement over prior art parallel-coupled line filters where the length of the filter is proportional to the number of poles and RF wavelength, for example, as commonly manufactured using thin film, filter designs.
In the incorporated by reference '404 patent, a high performance, millimeter wave filter uses low temperature, co-fired ceramic thick film technology and is operative as a high “Q” filter. This filter is small and can include vertically stacked resonators positioned in a multilayer, low temperate co-fired ceramic film allowing even smaller designs. The disclosed resonators can form parallel, coupled line filters, including a hairpin filter formed by a number of hairpin resonators cascaded together. In one aspect of the '404 patent, microstrip and stripline interface connections are used to stack the filters in the low temperature co-fired ceramic layers, allowing the filter to be used for standard surface mount packages. The filters are desensitized to traditional critical tolerances associated with thin film technology and compensate for bandwidth and return loss degradation caused by wider tolerances associated with thick film technology. These type of filters disclosed in the incorporated by reference '404 patent can be manufactured for high performance capabilities at a fraction of the cost of thin film filters. Additionally, these types of filters, including hairpin filters, can eliminate filter size variation versus frequency and reduce the size of the filter by 50%.
In another aspect of the disclosed '404 patent, the millimeter wave filter includes a dielectric base plate having opposing surfaces. A ground plane layer is formed on a surface of the dielectric base plate. At least one low temperature, co-fired ceramic layer is positioned over the ground plane layer and defines an outer filter surface. A plurality of coupled line millimeter wavelength resonators, such as parallel coupled resonators, including hairpin resonators, are formed as stripline or microstrip and positioned on the outer filter surface.
Radio frequency terminal contacts are positioned on the surface of the dielectric base plate opposite the at least one low temperature co-fired ceramic layer. Conductive vias extend through the at least one low temperature co-fired ceramic layer, ground plane and dielectric base plate and each interconnect radio frequency terminal contacts and the at least one coupled line resonator.
Hairpin filters are advantageously used and have been typically about half the size of traditional parallel-coupled line filters. A hairpin filter allows size reduction from a parallel-coupled line structure. A filter of this type usually is a cascade of U-shaped resonators. A standard tapped hairpin filter could occupy about 850 mils by 450 mils, including sufficient area beyond the hairpin loops to maintain consistent dielectric properties. Printed hairpin filters can sometimes be excessively large at L-band frequencies and are often replaced with lumped component filters.
It is therefore an object of the present invention to provide a millimeter wave, thick film surface mount filter as a hairpin filter with reduced size.
The present invention is a very small, low cost, high performance RF filter using standard thick film technology and manufacturing tolerances. It incorporates a unique, hairpin resonator folded upon itself and manufactured on ceramic material. No other packaging is required. It achieves high radio frequency performance using standard thick film technology while forming a high Q filter in a very small space using folded hairpin resonators. The filter can be designed for a standard surface mount assembly and can achieve high performance filtering that is desensitized to traditional critical tolerance associated with dielectric resonator technology. Thus, in accordance with the present invention, high precision filters can be achieved at a fraction of the cost of dielectric resonator filters and superior performance achieved that is greater than performances achieved with typical SAW filters, including lower insertion losses and lower group delay.
A millimeter wave filter for surface mount applications, in accordance with the present invention, includes at least one low temperature, co-fired ceramic layer defining an outer filter surface. A plurality of parallel, coupled line millimeter wavelength hairpin resonators are each formed from a single stripline or microstrip on the outer filter surface. Each hairpin resonator is folded back upon itself into substantially parallel resonator lines.
In one aspect of the present invention, each hairpin resonator is folded back upon itself into at least six, substantially parallel resonator lines. The at least one low temperature, co-fired ceramic layer can comprise alumina that is about 5 to about 25 mils thick. A ground layer can be formed opposite the outer filter surface. A ground layer can include one of a layer of gold or silver. It can include input and output terminals on a surface opposite the outer filter surface.
A conductive via could extend through the at least one low temperature, co-fired ceramic layer and interconnect respective input and output terminals and a hairpin resonator. The hairpin resonators that are folded back upon themselves could form a millimeter wave filter that is about 320 mil by about 320 mil.
In yet another aspect of the present invention, a plurality of low temperature, co-fired ceramic layers and interposed ground plane layers form a multilayer, low temperature, co-fired ceramic substrate board. A plurality of millimeter wavelength hairpin resonators are formed on the ceramic layers and each folded back upon themselves into parallel resonator lines. A dielectric cover is positioned over the outer filter surface and can include a metallized interior surface spaced from the resonators for generating a predetermined cut-off frequency.
Other objects, features and advantages of the present invention will become apparent from the detailed description of the invention, which follows when considered in light of the accompanying drawings in which:
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
The present invention advantageously provides a small, low cost, high performance, millimeter wave RF filter using standard thick film technology and manufacturing tolerances. The high performance filter of the present invention is designed with unique hairpin resonators that are folded upon themselves and manufactured on ceramic material, such as LTCC. No other packaging is required. It achieves high RF performance using standard thick film technology, while achieving a high Q in a small space. The filter of the present invention can be designed for standard surface mount assembly and desensitized to traditional critical tolerances associated with dielectric resonator technology. The present invention provides a high performance filter at a fraction of the cost of a dielectric resonator filter and achieves superior performance as compared to SAW filters, including lower insertion losses and lower group delay.
The present invention has the arms of each of the hairpin resonators of a hairpin filter folded upon themselves to reduce the overall size significantly. The length of the hairpin resonators in a hairpin filter in one aspect of the present invention is a quarter wavelength long at the design frequency. A fractional bandwidth of the narrow band filter is less than 1.5% and it takes more time to synthesize than on regular filters. The filters can be successfully fabricated on etched thick film alumina substrate with excellent performance.
For purposes of background, a description of a millimeter wave filter for surface mount applications that uses at least one low temperature co-fired ceramic layer and coupled line, millimeter wavelength resonators formed from stripline or microstrip and positioned on an outer filter surface are described relative to
Referring now to
A plurality of coupled line millimeter wavelength hairpin resonators 22 are formed as either stripline or microstrip and positioned on the outer filter surface 30. Radio frequency terminal contacts 32 are positioned on the surface of the dielectric base plate opposite the low temperature co-fired ceramic layer 28 formed from the green tape. As illustrated, conductive vias 34 extend through the low temperature co-fired ceramic layer 28, ground plane layer 26, and dielectric base plate, i.e., carrier plate 24, and each interconnect the radio frequency terminal contacts 32 (
The dielectric base plate is formed about 10 to about 35 mils thick (and preferably in one aspect about 25 mils thick) and formed from alumina, also known as aluminum oxide, a well-known ceramic dielectric material. Other dielectric materials could be used as suggested by those skilled in the art.
As shown in
In
These filters described relative to
In the present invention, the arms of each of the hairpin resonators 102 are folded back upon themselves to reduce the overall size significantly as shown in
The hairpin filter as shown in
The hairpin filter 100, as described with reference to
Many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed, and that the modifications and embodiments are intended to be included within the scope of the dependent claims.
