This application claims priority to and the benefit of Chinese Patent Application Serial No. 202021855660.5, filed on Aug. 31, 2020. The entire contents of this application are incorporated herein by reference in their entirety.
This application relates to electrical connectors, and in particular to an electrical connector for providing an electrical connection between electronic systems, such as printed circuit boards (PCBs).
Electrical connectors may be used to electrically connect different electronic systems together. One typical electrical connector is a card edge connector that may be mounted onto a first electronic system, such as a motherboard, such that tail portions of terminals of the card edge connector may be electrically connected to conductive portions of the first electronic system by, for example, soldering. The card edge connector may also act as a female connector for interfacing directly with conductive portions on or near an edge of a PCB of a second electronic system, such as a daughter card, such that the conductive portions of the second electronic system are in contact with the contact portions of the corresponding terminals of the card edge connector. In this case, the PCB itself acts as a male connector for interfacing with the card edge connector, without the need for a separate male connector. In this way, the conductive portions of the second electronic system may be electrically connected to the corresponding conductive portions of the first electronic system via the terminals of the card edge connector, thereby establishing an electrical connection between the first electronic system and the second electronic system. This makes it possible to manufacture individual PCBs for a specific purpose and then electrically connect the individual PCBs together using the card edge connector(s) to form a desired system, rather than manufacturing the entire system as a single component.
Aspects of the present disclosure relate to miniaturized electrical connectors for compact electronic systems.
Some embodiments relate to an electrical connector. The electrical connector may include an insulative housing, and a plurality of terminals disposed in the insulative housing. The insulative housing may include a top face comprising a socket, a bottom face opposite to the top face, and a plurality of side faces extending between the top face and the bottom face, the plurality of side faces comprising first and second side faces extending perpendicularly to each other. Each of the plurality of terminals may include a contact portion and a tail portion, the contact portion being accessible through the socket of the insulative housing, and the tail portion protruding from the bottom face of the insulative housing. The insulative housing comprises a chamfered surface connecting one of the first side faces and one of the second side faces.
In some embodiments, the insulative housing may include a platform projecting outwardly at one end of the insulative housing that is proximate to the bottom face.
In some embodiments, the platform may include a corner portion comprising the chamfered surface.
In some embodiments, the chamfered surface may be a first chamfered surface. The platform may include a second chamfered surface such that the platform has a trapezoidal shape.
In some embodiments, the plurality of terminals may be arranged in two terminal rows mutually opposed and spaced apart in the insulative housing, with the terminals in each terminal row aligned therein.
In some embodiments, the electrical connector may include at least one retention mechanism for retaining the plurality of terminals in place relative to each other.
In some embodiments, the at least one retention mechanism may be overmolded around the plurality of terminals.
In some embodiments, the insulative housing may include the at least one retention mechanism.
In some embodiments, the at least one retention mechanism may be formed separately from the insulative housing and removably mounted into the insulative housing.
In some embodiments, the retention mechanism may include two halves having interlocking mechanisms. Each half may retain a terminal row formed by some of the plurality of terminals.
In some embodiments, the electrical connector may include a positioning mechanism for ensuring a proper positioning of the electrical connector on the electronic system when the electrical connector is mounted to an electronic system.
In some embodiments, the electrical connector may include a fixing mechanism for fixing the electrical connector to an electronic system.
In some embodiments, the electrical connector may be a vertical connector or a right angle connector.
In some embodiments, the electronic system may be a printed circuit board.
In some embodiments, the one of the first side faces may extend in a first plane. The one of the second side faces may extend in a second plane. The first plane and the second plane may cross each other along a line. The chamfered surface may be spaced from the line by a distance no less than 0.36 mm.
In some embodiments, the platform may include slots for receiving tabs.
Some embodiments relate to an electronic system. The electronic system may include a printed circuit board; and an electrical connector. The electrical connector may include an insulative housing and a plurality of terminals disposed in the insulative housing. The insulative housing may include a socket, a bottom face mounted against the printed circuit board, and a plurality of side faces extending perpendicular to the bottom face, the plurality of side faces comprising first and second side faces extending perpendicularly to each other. Each of the plurality of terminals may include a contact portion and a tail portion, the contact portion being accessible through the socket of the insulative housing, and the tail portion protruding from the bottom face of the insulative housing. The printed circuit board may include a first edge and a second edge and curved corner joining the first edge and the second edge. The electrical connector may be mounted to the printed circuit board with the first side face adjacent and parallel to the first edge and the second side face adjacent and parallel to the second edge. The insulative housing may include an angled surface connecting the first side face and the second side face. The angled surface may be mounted adjacent the curved corner.
In some embodiments, the insulative housing may include a socket portion including the socket and at least one platform extending from the socket portion in a direction parallel to the bottom face. The angled surface may include a surface of a platform of the at least one platform.
In some embodiments, the platform may be a first platform. The at least one platform may include a second platform, extending from the socket portion in a direction opposite the first platform. The angled surface may be a first angled surface. The second platform may include a second angled surface.
In some embodiments, the electronic system may include a plurality of fixing tabs extending through the first platform and the second platform and engaging the electrical connector to the printed circuit board
Some embodiments relate to an electrical connector. The electrical may include an insulative housing comprising a top face, a bottom face opposite to the top face and a plurality of side faces extending between the top face and the bottom face; and a plurality of terminals disposed in the insulative housing, each of the plurality of terminals comprising a contact portion and a tail portion, the contact portion being accessible through a socket in the insulative housing, and the tail portion protruding from the bottom face and configured to be mounted to an electronic system. A corner portion between at least two adjacent side faces of the side faces is formed as a chamfered surface.
In some embodiments, a portion of at least one end of the insulative housing that is proximate to the bottom face may project outwardly to form a platform.
In some embodiments, the chamfered surface may be formed at a corner portion of the platform.
In some embodiments, each of two corner portions of the platform may be formed as the chamfered surface such that the platform has a trapezoidal shape.
In some embodiments, the plurality of terminals may be arranged in two terminal rows mutually opposed and spaced apart in the insulative housing, with the terminals in each terminal row aligned therein.
In some embodiments, the electrical connector may include at least one retention mechanism for retaining the plurality of terminals in place relative to each other.
In some embodiments, the at least one retention mechanism may be overmolded around the plurality of terminals.
In some embodiments, the at least one retention mechanism may be provided by the insulative housing.
In some embodiments, the at least one retention mechanism may be formed separately from the insulative housing and removably mounted into the insulative housing.
In some embodiments, the retention mechanism may include two halves having interlocking mechanisms, each half retaining a terminal row formed by some of the plurality of terminals.
In some embodiments, the electrical connector may include a positioning mechanism provided on the insulative housing for ensuring a proper positioning of the electrical connector on the electronic system when the electrical connector is mounted to the electronic system.
In some embodiments, the electrical connector may include a fixing mechanism provided on the insulative housing for fixing the electrical connector to the electronic system.
In some embodiments, the electrical connector may be a vertical connector or a right angle connector.
In some embodiments, the electronic system may be a printed circuit board.
In some embodiments, the corner portion being formed as the chamfered surface may allow the corner portion to be indented inward by at least 0.36 mm, as compared to the case where the corner portion is not formed as the chamfered surface.
These techniques may be used alone or in any suitable combination. The foregoing summary is provided by way of illustration and is not intended to be limiting.
The above and other aspects of the present disclosure will be more thoroughly understood and appreciated below when read in conjunction with the appended drawings. It should be noted that the appended drawings are only schematic and are not drawn to scale. In the appended drawings:
100 vertical connector
101 housing
103 top face
105 bottom face
107 front side face
109 rear side face
111 left side face
113 right side face
115 first retention mechanism
117 second retention mechanism
119 first socket
121 second socket
123 positioning protrusion
125 fixing tab
127 receiving slot
129 first platform
131 second platform
133 chamfered surface
200 terminals
201 tip portion
203 contact portion
205 body portion
207 tail portion
210 ground terminal
220 first signal terminal
230 second signal terminal
240 additional ground terminal
300 terminal row
400 printed circuit board
401 edge.
Disclosed herein is a miniaturized electrical connector. The electrical connector may include an insulative housing and a plurality of terminals disposed in the insulative housing. The insulative housing may include a top face, a bottom face opposite to the top face, and a plurality of side faces extending between the top face and the bottom face. Each of the plurality of terminals may include a contact portion and a tail portion. The contact portion may be accessible through a socket in the insulative housing, and the tail portion may protrude from the bottom face and may be capable of being mounted to an electronic system. A corner portion between at least two adjacent side faces of the side faces may be formed as a chamfered surface.
Such configuration may reduce the dimension of the electrical connector. For example, when the electrical connector is mounted to an electronic system such as a PCB, the electrical connector may occupy less space and be disposed closer to other components on the electronic system, enabling a more compact arrangement of the components on the electronic system. Alternatively or additionally, the electrical connector may be disposed closer to an edge of the electronic system, such that the space utilization on the electronic system can be optimized. These also enable the dimension of the electronic system to be reduced, such that the entire assembly, including the electrical connector and the electronic system, can be manufactured at a lower cost and can be more compact and more lightweight.
The electrical connectors of the present disclosure may be various types of card edge connectors, including but not limited to, vertical connectors and right angle connectors. Preferred embodiments of the present disclosure are described in detail below in conjunction with some examples. It should be appreciated by the skilled person in the art that these embodiments are not meant to form any limitation on the present disclosure.
The vertical connector 100 according to a preferred embodiment of the present disclosure will be described below in conjunction with
The vertical connector 100 may further include a plurality of terminals 200 housed in the housing 101. Each of the plurality of terminals 200 may be formed of a conductive material. Conductive materials that are suitable for forming the terminals 200 may be a metal, such as copper, or a metal alloy. A set of three terminals 200 may be configured for transmitting differential signals between a first electronic device (e.g., a motherboard) and a second electronic device (e.g., a daughter board).
Turning to
The first signal terminal 220 and the second signal terminal 230 may constitute a differential signaling pair. Each of the ground terminal 210, the first signal terminal 220 and the second signal terminal 230 includes a tip portion 201, a contact portion 203, a body portion 205 and a tail portion 207. The tail portion 207 may be configured for being connected to a first PCB (e.g., a motherboard). The contact portion 203 may be configured to establish an electrical contact with a conductive portion of another electronic system (e.g., another PCB).
In some examples, the distance D1 between the distal ends of the tip portion 201 of the first signal terminal 220 and the tip portion 201 of the second signal terminal 230 is equal to the distance D2 between the distal ends of the tip portion 201 of the first signal terminal 220 and the tip portion 201 of the ground terminal 210. In some examples, the distance D3 between the contact portion 203 of the first signal terminal 220 and the contact portion 203 of the second signal terminal 230 is equal to the distance D4 between the contact portion 203 of the first signal terminal 220 and the contact portion 203 of the ground terminal 210. In some examples, the distances D3 and D4 are less than the distances D1 and D2, respectively. As a non-limiting example, D1 and D2 may be equal to 0.6 mm, and D3 and D4 may be equal to 0.38 mm. The vertical connector 100 has a terminal pitch equal to D1. Thus, in the example where D1 is equal to 0.6 mm, the vertical connector 100 may be referred to as a 0.6 mm card edge connector.
A plurality of sets of three terminals 200 may be arranged in terminal rows, with the terminals in each terminal row aligned therein.
As shown in
In some embodiments, the vertical connector 100 may include at least one retention mechanism for retaining the plurality of terminals 200 in place relative to each other. The retention mechanism may be partially or entirely formed of an insulative material. Examples of insulative materials that are suitable for forming the retention mechanism include, but are not limited to, plastic, nylon, liquid crystal polymer (LCP), polyphenyline sulfide (PPS), high temperature nylon or polyphenylenoxide (PPO) or polypropylene (PP).
At least one retention mechanism may be overmolded around the plurality of terminals 200. In some examples, the at least one retention mechanism may be formed separately from the housing 101 and then removably mounted into the housing 101. Turning back to
Then, the first retention mechanism 115 and the second retention mechanism 117 may be fitted into the housing 101, thereby retaining the terminal rows in the housing 101. In some examples, the first retention mechanism 115 and the second retention mechanism 117 may be provided with snap fit mechanisms for cooperating with corresponding mechanisms of the housing 101 so as to secure the retention mechanisms in the housing 101. In some examples, as shown in
As shown in
The top face 103 of the housing 101 of the vertical connector 100 may include at least one socket for allowing the contact portion 203 of each of the plurality of terminals 200 to be accessible therethrough. For example, the second PCB (e.g., a daughter board) may be inserted into the at least one socket, such that conductive portions (e.g., conductive traces) of the second PCB are arranged in contact with the contact portions 203 of the corresponding terminals 200. For example, the conductive portions of the second PCB may be received between two terminal rows mutually opposed and in contact with the contact portions 203 of the corresponding terminals 200. In this way, the conductive portions of the second PCB may be electrically connected to the corresponding conductive portions of the first PCB via the terminals 200, thereby establishing an electrical connection between the second PCB and the first PCB. The first PCB and the second PCB may communicate with each other by transmitting signals via the vertical connector 100 using a standardized protocol, such as a PCI protocol. Two sockets, i.e., a first socket 119 and a second socket 121, are shown in
The vertical connector 100 may further include a positioning mechanism provided on the housing 101 for ensuring a proper positioning of the vertical connector 100 on the first PCB when the vertical connector 100 is mounted to the first PCB. For example, the positioning mechanism may be in the form of a positioning protrusion, with two positioning protrusions 123 shown in
The vertical connector 100 may further include a fixing mechanism for fixing the vertical connector 100 to the first PCB. For example, the fixing mechanism may be in the form of a fixing tab, with three fixing tabs 125 shown in
In order to minimize a space occupied by the vertical connector 100 on the first PCB, a corner portion between at least two adjacent side faces of the side faces of the housing 101 may be formed as a chamfered surface 133 so as to reduce the space occupied by the housing 101 on the first PCB. In some examples, the corner portion between at least two adjacent side faces of the front side face 107, the rear side face 109, the left side face 111 and the right side face 113 of the housing 101 is formed as a chamfered surface 133. In some examples, all of the corner portions between adjacent side faces of the housing 101 are formed as chamfered surfaces 133. In some examples, the corner portions between adjacent side faces of the housing 101 proximate to an edge of the first PCB are each formed as a chamfered surface 133.
In conventional vertical connectors, the corner portions between adjacent side faces are typically formed as rounded or beveled portions. As compared with conventional vertical connectors, the corner portions between adjacent side faces of the vertical connector 100 being formed as chamfered surfaces may reduce a dimension of the vertical connector 100 and thus reduce the space occupied by the housing 101 on the first PCB. As such, the vertical connector 100 may be disposed closer to other components on the first PCB, thereby allowing for a more compact arrangement of components on the PCB. In addition, the vertical connector 100 may also be disposed closer to an edge of the first PCB, such that the space utilization on the first PCB may be optimized. These allow for reducing the dimension of the PCB, such that the entire assembly, including the vertical connector and PCB, may be manufactured at a lower cost, and may be more miniaturized and more lightweight.
In some embodiments, portions of opposite ends of the housing 101 that are proximate to the bottom face 105 may protrude outward to form a platform. As shown in
As shown in
Although the present disclosure is described in detail above in connection with a vertical connector, it should be appreciated that the present disclosure is also applicable to right angle connectors. Unlike the vertical connector 100, in a right angle connector, a socket is formed in a side face of the insulative housing, rather than a top face thereof, and terminals of the right angle connector are configured such that contact portions of the terminals are accessible via the socket. For example, the right angle connector may be used to connect a mezzanine card to a mother board. In some examples, the right angle connector may be configured to be mounted to a first PCB (such as a motherboard), such that the tail portions of the terminals of the right angle connector are electrically connected to the conductive portions (for example, conductive traces) of the first PCB. A second PCB (such as a mezzanine card) may be inserted into the socket such that the conductive portions of the second PCB are disposed in contact with the contact portions of the corresponding terminals. In this way, the conductive portions of the second PCB may be electrically connected to the corresponding conductive portions of the first PCB via the terminals of the right angle connector, thereby establishing an electrical connection between the second PCB and the first PCB. The first PCB and the second PCB may communicate with each other by transmitting signals using the right angle connector using a standardized protocol, such as a PCI protocol.
It should also be appreciated that the terms “first” and “second” are only used to distinguish an element or component from another element or component, and that these elements and/or components should not be limited by the terms.
The present disclosure has been described in detail in conjunction with specific embodiments. Obviously, the above description and the embodiments shown in the appended drawings should be understood to be exemplary and do not constitute a limitation on the present disclosure. For the person skilled in the art, various variations or modifications falling within the scope of the present disclosure can be made without departing from the spirit of the present disclosure.
Number | Date | Country | Kind |
---|---|---|---|
202021855660.5 | Aug 2020 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
2996710 | Pratt | Aug 1961 | A |
3002162 | Garstang | Sep 1961 | A |
3134950 | Cook | May 1964 | A |
3322885 | May et al. | May 1967 | A |
3530422 | Goodman | Sep 1970 | A |
3573706 | Haberlen | Apr 1971 | A |
3631381 | Pittman | Dec 1971 | A |
3786372 | Epis et al. | Jan 1974 | A |
3825874 | Peverill | Jul 1974 | A |
3863181 | Glance et al. | Jan 1975 | A |
3970353 | Kaufman | Jul 1976 | A |
3977757 | Yurtin | Aug 1976 | A |
4155613 | Brandeau | May 1979 | A |
4195272 | Boutros | Mar 1980 | A |
4276523 | Boutros et al. | Jun 1981 | A |
4286837 | Yasutake et al. | Sep 1981 | A |
4371742 | Manly | Feb 1983 | A |
4408255 | Adkins | Oct 1983 | A |
4447105 | Ruehl | May 1984 | A |
4471015 | Ebneth et al. | Sep 1984 | A |
4484159 | Whitley | Nov 1984 | A |
4487468 | Fedder et al. | Dec 1984 | A |
4490283 | Kleiner | Dec 1984 | A |
4518651 | Wolfe, Jr. | May 1985 | A |
4519664 | Tillotson | May 1985 | A |
4519665 | Althouse et al. | May 1985 | A |
4632476 | Schell | Dec 1986 | A |
4636752 | Saito | Jan 1987 | A |
4682129 | Bakermans et al. | Jul 1987 | A |
4687267 | Header et al. | Aug 1987 | A |
4728762 | Roth et al. | Mar 1988 | A |
4751479 | Parr | Jun 1988 | A |
4761147 | Gauthier | Aug 1988 | A |
4787548 | Abbagnaro et al. | Nov 1988 | A |
4806107 | Arnold et al. | Feb 1989 | A |
4846724 | Sasaki et al. | Jul 1989 | A |
4846727 | Glover et al. | Jul 1989 | A |
4871316 | Herrell et al. | Oct 1989 | A |
4878155 | Conley | Oct 1989 | A |
4948922 | Varadan et al. | Aug 1990 | A |
4970354 | Iwasa et al. | Nov 1990 | A |
4975084 | Fedder et al. | Dec 1990 | A |
4992060 | Meyer | Feb 1991 | A |
5000700 | Masubuchi et al. | Mar 1991 | A |
5066236 | Broeksteeg | Nov 1991 | A |
5141454 | Garrett et al. | Aug 1992 | A |
5150086 | Ito | Sep 1992 | A |
5166527 | Solymar | Nov 1992 | A |
5168252 | Naito | Dec 1992 | A |
5168432 | Murphy et al. | Dec 1992 | A |
5171161 | Kachlic | Dec 1992 | A |
5176538 | Hansell, III et al. | Jan 1993 | A |
5266055 | Naito et al. | Nov 1993 | A |
5280257 | Cravens et al. | Jan 1994 | A |
5287076 | Johnescu et al. | Feb 1994 | A |
5334050 | Andrews | Aug 1994 | A |
5340334 | Nguyen | Aug 1994 | A |
5346410 | Moore, Jr. | Sep 1994 | A |
5393247 | DiOrazio et al. | Feb 1995 | A |
5429520 | Morlion et al. | Jul 1995 | A |
5429521 | Morlion et al. | Jul 1995 | A |
5433617 | Morlion et al. | Jul 1995 | A |
5433618 | Morlion et al. | Jul 1995 | A |
5456619 | Belopolsky et al. | Oct 1995 | A |
5461392 | Mott et al. | Oct 1995 | A |
5474472 | Niwa et al. | Dec 1995 | A |
5484310 | McNamara et al. | Jan 1996 | A |
5496183 | Soes et al. | Mar 1996 | A |
5499935 | Powell | Mar 1996 | A |
5551893 | Johnson | Sep 1996 | A |
5562497 | Yagi et al. | Oct 1996 | A |
5597328 | Mouissie | Jan 1997 | A |
5651702 | Hanning et al. | Jul 1997 | A |
5669789 | Law | Sep 1997 | A |
5796323 | Uchikoba et al. | Aug 1998 | A |
5810623 | Regnier | Sep 1998 | A |
5831491 | Buer et al. | Nov 1998 | A |
5885088 | Brennan et al. | Mar 1999 | A |
5924899 | Paagman | Jul 1999 | A |
5981869 | Kroger | Nov 1999 | A |
5982253 | Perrin et al. | Nov 1999 | A |
5993259 | Stokoe et al. | Nov 1999 | A |
6019616 | Yagi et al. | Feb 2000 | A |
6152747 | McNamara | Nov 2000 | A |
6168469 | Lu | Jan 2001 | B1 |
6174202 | Mitra | Jan 2001 | B1 |
6174203 | Asao | Jan 2001 | B1 |
6174944 | Chiba et al. | Jan 2001 | B1 |
6217372 | Reed | Apr 2001 | B1 |
6293827 | Stokoe | Sep 2001 | B1 |
6296491 | Pickles | Oct 2001 | B1 |
6296496 | Trammel | Oct 2001 | B1 |
6299438 | Sahagian et al. | Oct 2001 | B1 |
6299483 | Cohen et al. | Oct 2001 | B1 |
6315615 | Raistrick | Nov 2001 | B1 |
6322395 | Nishio et al. | Nov 2001 | B1 |
6328601 | Yip et al. | Dec 2001 | B1 |
6347962 | Kline | Feb 2002 | B1 |
6350134 | Fogg et al. | Feb 2002 | B1 |
6361363 | Hwang | Mar 2002 | B1 |
6364711 | Berg et al. | Apr 2002 | B1 |
6375510 | Asao | Apr 2002 | B2 |
6379188 | Cohen et al. | Apr 2002 | B1 |
6394842 | Sakurai et al. | May 2002 | B1 |
6398588 | Bickford | Jun 2002 | B1 |
6409543 | Astbury, Jr. et al. | Jun 2002 | B1 |
6447170 | Takahashi et al. | Sep 2002 | B1 |
6482017 | Van Doorn | Nov 2002 | B1 |
6503103 | Cohen et al. | Jan 2003 | B1 |
6506076 | Cohen et al. | Jan 2003 | B2 |
6517360 | Cohen | Feb 2003 | B1 |
6530790 | McNamara et al. | Mar 2003 | B1 |
6537087 | McNamara et al. | Mar 2003 | B2 |
6540559 | Kemmick et al. | Apr 2003 | B1 |
6551140 | Billman et al. | Apr 2003 | B2 |
6554647 | Cohen et al. | Apr 2003 | B1 |
6565387 | Cohen | May 2003 | B2 |
6565390 | Wu | May 2003 | B2 |
6579116 | Brennan et al. | Jun 2003 | B2 |
6582244 | Fogg et al. | Jun 2003 | B2 |
6592381 | Cohen et al. | Jul 2003 | B2 |
6595801 | Leonard et al. | Jul 2003 | B1 |
6595802 | Watanabe et al. | Jul 2003 | B1 |
6602095 | Astbury, Jr. et al. | Aug 2003 | B2 |
6607402 | Cohen et al. | Aug 2003 | B2 |
6609922 | Torii | Aug 2003 | B2 |
6616864 | Jiang et al. | Sep 2003 | B1 |
6638105 | Wu | Oct 2003 | B1 |
6648682 | Wu | Nov 2003 | B1 |
6652318 | Winings et al. | Nov 2003 | B1 |
6652319 | Billman | Nov 2003 | B1 |
6655966 | Rothermel et al. | Dec 2003 | B2 |
6709294 | Cohen et al. | Mar 2004 | B1 |
6713672 | Stickney | Mar 2004 | B1 |
6726492 | Yu | Apr 2004 | B1 |
6743057 | Davis et al. | Jun 2004 | B2 |
6749463 | Fan | Jun 2004 | B1 |
6776659 | Stokoe et al. | Aug 2004 | B1 |
6786771 | Gailus | Sep 2004 | B2 |
6808420 | Whiteman, Jr. et al. | Oct 2004 | B2 |
6814619 | Stokoe et al. | Nov 2004 | B1 |
6830489 | Aoyama | Dec 2004 | B2 |
6872085 | Cohen et al. | Mar 2005 | B1 |
6875031 | Korsunsky et al. | Apr 2005 | B1 |
6932649 | Rothermel et al. | Aug 2005 | B1 |
6979202 | Benham et al. | Dec 2005 | B2 |
6979226 | Otsu et al. | Dec 2005 | B2 |
6986681 | Tsai | Jan 2006 | B2 |
7008250 | Shuey et al. | Mar 2006 | B2 |
7008267 | Fan | Mar 2006 | B2 |
7044794 | Consoli et al. | May 2006 | B2 |
7057570 | Irion, II et al. | Jun 2006 | B2 |
7074067 | Yang et al. | Jul 2006 | B2 |
7074086 | Cohen et al. | Jul 2006 | B2 |
7086872 | Myer et al. | Aug 2006 | B2 |
7094102 | Cohen et al. | Aug 2006 | B2 |
7104842 | Huang et al. | Sep 2006 | B1 |
7108556 | Cohen et al. | Sep 2006 | B2 |
7156672 | Fromm et al. | Jan 2007 | B2 |
7163421 | Cohen et al. | Jan 2007 | B1 |
7232344 | Gillespie et al. | Jun 2007 | B1 |
7285018 | Kenny et al. | Oct 2007 | B2 |
7316585 | Smith et al. | Jan 2008 | B2 |
7318740 | Henry et al. | Jan 2008 | B1 |
7320614 | Toda et al. | Jan 2008 | B2 |
7322845 | Regnier et al. | Jan 2008 | B2 |
7331822 | Chen n | Feb 2008 | B2 |
7335063 | Cohen et al. | Feb 2008 | B2 |
7364464 | Iino et al. | Apr 2008 | B2 |
7371117 | Gailus | May 2008 | B2 |
7407413 | Minich | Aug 2008 | B2 |
7467977 | Yi et al. | Dec 2008 | B1 |
7473124 | Briant et al. | Jan 2009 | B1 |
7494383 | Cohen et al. | Feb 2009 | B2 |
7540781 | Kenny et al. | Jun 2009 | B2 |
7581990 | Kirk et al. | Sep 2009 | B2 |
7588464 | Kim | Sep 2009 | B2 |
7604502 | Pan | Oct 2009 | B2 |
7637783 | Sasaoka et al. | Dec 2009 | B2 |
7645165 | Wu et al. | Jan 2010 | B2 |
7677907 | Guan et al. | Mar 2010 | B2 |
7690946 | Knaub et al. | Apr 2010 | B2 |
7699644 | Szczesny et al. | Apr 2010 | B2 |
7722401 | Kirk et al. | May 2010 | B2 |
7727027 | Chiang et al. | Jun 2010 | B2 |
7727028 | Zhang et al. | Jun 2010 | B1 |
7731537 | Amleshi et al. | Jun 2010 | B2 |
7731541 | Lee | Jun 2010 | B1 |
7753731 | Cohen et al. | Jul 2010 | B2 |
7771233 | Gailus | Aug 2010 | B2 |
7789676 | Morgan et al. | Sep 2010 | B2 |
7794240 | Cohen et al. | Sep 2010 | B2 |
7794278 | Cohen et al. | Sep 2010 | B2 |
7806729 | Nguyen et al. | Oct 2010 | B2 |
7824192 | Lin et al. | Nov 2010 | B2 |
7871296 | Fowler et al. | Jan 2011 | B2 |
7874873 | Do et al. | Jan 2011 | B2 |
7883369 | Sun et al. | Feb 2011 | B1 |
7887371 | Kenny et al. | Feb 2011 | B2 |
7887379 | Kirk | Feb 2011 | B2 |
7892006 | Guan et al. | Feb 2011 | B2 |
7906730 | Atkinson et al. | Mar 2011 | B2 |
7914304 | Cartier et al. | Mar 2011 | B2 |
7946889 | Mizumura | May 2011 | B2 |
7972171 | Teh | Jul 2011 | B2 |
7985097 | Gulla | Jul 2011 | B2 |
7993147 | Cole et al. | Aug 2011 | B2 |
8018733 | Jia | Sep 2011 | B2 |
8083553 | Manter et al. | Dec 2011 | B2 |
8123544 | Kobayashi | Feb 2012 | B2 |
8142207 | Ljubijankic | Mar 2012 | B1 |
8182289 | Stokoe et al. | May 2012 | B2 |
8187031 | Li et al. | May 2012 | B2 |
8215968 | Cartier et al. | Jul 2012 | B2 |
8216001 | Kirk | Jul 2012 | B2 |
8262411 | Kondo | Sep 2012 | B2 |
8272877 | Stokoe et al. | Sep 2012 | B2 |
8337247 | Zhu | Dec 2012 | B2 |
8348701 | Lan et al. | Jan 2013 | B1 |
8371875 | Gailus | Feb 2013 | B2 |
8382524 | Khilchenko et al. | Feb 2013 | B2 |
8403689 | Li et al. | Mar 2013 | B2 |
8440637 | Elmen | May 2013 | B2 |
8480432 | Wu | Jul 2013 | B2 |
8506319 | Ritter et al. | Aug 2013 | B2 |
8506331 | Wu | Aug 2013 | B2 |
8535077 | Shen et al. | Sep 2013 | B2 |
8545253 | Amidon et al. | Oct 2013 | B2 |
8550861 | Cohen et al. | Oct 2013 | B2 |
8597051 | Yang et al. | Dec 2013 | B2 |
8657627 | McNamara et al. | Feb 2014 | B2 |
8715003 | Buck et al. | May 2014 | B2 |
8715005 | Pan | May 2014 | B2 |
8740637 | Wang et al. | Jun 2014 | B2 |
8764492 | Chiang | Jul 2014 | B2 |
8771016 | Atkinson et al. | Jul 2014 | B2 |
8864506 | Little | Oct 2014 | B2 |
8864521 | Atkinson et al. | Oct 2014 | B2 |
8905777 | Zhu et al. | Dec 2014 | B2 |
8926377 | Kirk et al. | Jan 2015 | B2 |
8944831 | Stoner et al. | Feb 2015 | B2 |
8968034 | Hsu | Mar 2015 | B2 |
8998642 | Manter et al. | Apr 2015 | B2 |
9004942 | Paniauqa | Apr 2015 | B2 |
9011177 | Lloyd et al. | Apr 2015 | B2 |
9022806 | Cartier, Jr. et al. | May 2015 | B2 |
9028281 | Kirk et al. | May 2015 | B2 |
9065230 | Milbrand, Jr. | Jun 2015 | B2 |
9124009 | Atkinson et al. | Sep 2015 | B2 |
9166317 | Briant | Oct 2015 | B2 |
9219335 | Atkinson et al. | Dec 2015 | B2 |
9225085 | Cartier, Jr. et al. | Dec 2015 | B2 |
9246253 | Defibaugh et al. | Jan 2016 | B1 |
9257778 | Buck et al. | Feb 2016 | B2 |
9257794 | Wanha et al. | Feb 2016 | B2 |
9263835 | Guo | Feb 2016 | B2 |
9281590 | Liu et al. | Mar 2016 | B1 |
9287668 | Chen et al. | Mar 2016 | B2 |
9300074 | Gailus | Mar 2016 | B2 |
9337585 | Yang | May 2016 | B1 |
9350095 | Arichika et al. | May 2016 | B2 |
9431734 | Guo | Aug 2016 | B2 |
9450344 | Cartier, Jr. et al. | Sep 2016 | B2 |
9484674 | Cartier, Jr. et al. | Nov 2016 | B2 |
9509101 | Cartier, Jr. et al. | Nov 2016 | B2 |
9520686 | Hu et al. | Dec 2016 | B2 |
9520689 | Cartier, Jr. et al. | Dec 2016 | B2 |
9537250 | Kao et al. | Jan 2017 | B2 |
9640915 | Phillips | May 2017 | B2 |
9692183 | Phillips | Jun 2017 | B2 |
9742132 | Hsueh | Aug 2017 | B1 |
9831605 | Buck et al. | Nov 2017 | B2 |
9843135 | Guetig et al. | Dec 2017 | B2 |
9887485 | Lambie | Feb 2018 | B2 |
9935385 | Phillips et al. | Apr 2018 | B2 |
9972945 | Huang et al. | May 2018 | B1 |
9997853 | Little et al. | Jun 2018 | B2 |
9997871 | Zhong | Jun 2018 | B2 |
10103476 | Qiu et al. | Oct 2018 | B1 |
10122129 | Milbrand, Jr. et al. | Nov 2018 | B2 |
10135165 | Zuo | Nov 2018 | B2 |
10135197 | Little et al. | Nov 2018 | B2 |
10211577 | Milbrand, Jr. et al. | Feb 2019 | B2 |
10224653 | Niu et al. | Mar 2019 | B2 |
10243304 | Kirk et al. | Mar 2019 | B2 |
10270191 | Li et al. | Apr 2019 | B1 |
10276995 | Little | Apr 2019 | B2 |
10283910 | Chen et al. | May 2019 | B1 |
10320102 | Phillips et al. | Jun 2019 | B2 |
10320125 | Ju et al. | Jun 2019 | B2 |
10348040 | Cartier, Jr. et al. | Jul 2019 | B2 |
10381767 | Milbrand, Jr. et al. | Aug 2019 | B1 |
10431936 | Horning et al. | Oct 2019 | B2 |
10439311 | Phillips et al. | Oct 2019 | B2 |
10511128 | Kirk et al. | Dec 2019 | B2 |
10541482 | Sasame et al. | Jan 2020 | B2 |
10573987 | Osaki et al. | Feb 2020 | B2 |
10601181 | Lu et al. | Mar 2020 | B2 |
10680387 | Cheng et al. | Jun 2020 | B2 |
10714875 | Wan et al. | Jul 2020 | B2 |
10741944 | Long | Aug 2020 | B2 |
10777921 | Lu et al. | Sep 2020 | B2 |
10797446 | Liu et al. | Oct 2020 | B2 |
10826214 | Phillips et al. | Nov 2020 | B2 |
10833437 | Huang et al. | Nov 2020 | B2 |
10840622 | Sasame et al. | Nov 2020 | B2 |
10855020 | Phillips | Dec 2020 | B1 |
10916894 | Kirk | Feb 2021 | B2 |
10965064 | Hsu et al. | Mar 2021 | B2 |
11146025 | Lu et al. | Oct 2021 | B2 |
11189971 | Lu | Nov 2021 | B2 |
11264755 | Te | Mar 2022 | B2 |
11381015 | Lu | Jul 2022 | B2 |
20010012730 | Ramey et al. | Aug 2001 | A1 |
20010042632 | Manov et al. | Nov 2001 | A1 |
20010046810 | Cohen et al. | Nov 2001 | A1 |
20020042223 | Belopolsky et al. | Apr 2002 | A1 |
20020061671 | Torii | May 2002 | A1 |
20020089464 | Joshi | Jul 2002 | A1 |
20020098738 | Astbury et al. | Jul 2002 | A1 |
20020111068 | Cohen et al. | Aug 2002 | A1 |
20020111069 | Astbury et al. | Aug 2002 | A1 |
20020123266 | Ramey et al. | Sep 2002 | A1 |
20020132518 | Kobayashi | Sep 2002 | A1 |
20020146926 | Fogg et al. | Oct 2002 | A1 |
20030119360 | Jiang et al. | Jun 2003 | A1 |
20030220018 | Winings et al. | Nov 2003 | A1 |
20040005815 | Mizumura et al. | Jan 2004 | A1 |
20040020674 | McFadden et al. | Feb 2004 | A1 |
20040058572 | Fromm et al. | Mar 2004 | A1 |
20040115968 | Cohen | Jun 2004 | A1 |
20040121652 | Gailus | Jun 2004 | A1 |
20040171305 | McGowan et al. | Sep 2004 | A1 |
20040196112 | Welbon et al. | Oct 2004 | A1 |
20040235352 | Takemasa | Nov 2004 | A1 |
20040259419 | Payne et al. | Dec 2004 | A1 |
20050042928 | Yi | Feb 2005 | A1 |
20050048818 | Pan | Mar 2005 | A1 |
20050048838 | Korsunsky et al. | Mar 2005 | A1 |
20050048842 | Benham et al. | Mar 2005 | A1 |
20050070160 | Cohen et al. | Mar 2005 | A1 |
20050133245 | Katsuyama et al. | Jun 2005 | A1 |
20050176835 | Kobayashi et al. | Aug 2005 | A1 |
20050233610 | Tutt et al. | Oct 2005 | A1 |
20050283974 | Richard et al. | Dec 2005 | A1 |
20050287869 | Kenny et al. | Dec 2005 | A1 |
20060019525 | Lloyd et al. | Jan 2006 | A1 |
20060068640 | Gailus | Mar 2006 | A1 |
20060166560 | Shuey et al. | Jul 2006 | A1 |
20060255876 | Kushta et al. | Nov 2006 | A1 |
20060276082 | Hung et al. | Dec 2006 | A1 |
20060292932 | Benham et al. | Dec 2006 | A1 |
20070004282 | Cohen et al. | Jan 2007 | A1 |
20070004828 | Khabbaz | Jan 2007 | A1 |
20070021000 | Laurx | Jan 2007 | A1 |
20070021001 | Laurx et al. | Jan 2007 | A1 |
20070021002 | Laurx et al. | Jan 2007 | A1 |
20070021003 | Laurx et al. | Jan 2007 | A1 |
20070021004 | Laurx et al. | Jan 2007 | A1 |
20070037419 | Sparrowhawk | Feb 2007 | A1 |
20070042639 | Manter et al. | Feb 2007 | A1 |
20070054554 | Do et al. | Mar 2007 | A1 |
20070059961 | Cartier et al. | Mar 2007 | A1 |
20070155241 | Lappohn | Jul 2007 | A1 |
20070173118 | Chen | Jul 2007 | A1 |
20070197063 | Ngo et al. | Aug 2007 | A1 |
20070218765 | Cohen et al. | Sep 2007 | A1 |
20070243764 | Liu et al. | Oct 2007 | A1 |
20070293084 | Ngo | Dec 2007 | A1 |
20080020640 | Zhang et al. | Jan 2008 | A1 |
20080194146 | Gailus | Aug 2008 | A1 |
20080246555 | Kirk et al. | Oct 2008 | A1 |
20080248658 | Cohen et al. | Oct 2008 | A1 |
20080248659 | Cohen et al. | Oct 2008 | A1 |
20080248660 | Kirk et al. | Oct 2008 | A1 |
20090011641 | Cohen et al. | Jan 2009 | A1 |
20090011645 | Laurx et al. | Jan 2009 | A1 |
20090035955 | McNamara | Feb 2009 | A1 |
20090061661 | Shuey et al. | Mar 2009 | A1 |
20090117386 | Vacant et al. | May 2009 | A1 |
20090203259 | Nguyen et al. | Aug 2009 | A1 |
20090239395 | Cohen et al. | Sep 2009 | A1 |
20090258516 | Hiew et al. | Oct 2009 | A1 |
20090291593 | Atkinson et al. | Nov 2009 | A1 |
20090305530 | Ito et al. | Dec 2009 | A1 |
20090305533 | Feldman et al. | Dec 2009 | A1 |
20090305553 | Thomas et al. | Dec 2009 | A1 |
20100048058 | Morgan et al. | Feb 2010 | A1 |
20100068934 | Li et al. | Mar 2010 | A1 |
20100075538 | Ohshida | Mar 2010 | A1 |
20100081302 | Atkinson et al. | Apr 2010 | A1 |
20100112846 | Kotaka | May 2010 | A1 |
20100124851 | Xiong et al. | May 2010 | A1 |
20100144167 | Fedder et al. | Jun 2010 | A1 |
20100203772 | Mao et al. | Aug 2010 | A1 |
20100291806 | Minich et al. | Nov 2010 | A1 |
20100294530 | Atkinson et al. | Nov 2010 | A1 |
20110003509 | Gailus | Jan 2011 | A1 |
20110065297 | Guan et al. | Mar 2011 | A1 |
20110067237 | Cohen et al. | Mar 2011 | A1 |
20110104948 | Girard, Jr. et al. | May 2011 | A1 |
20110130038 | Cohen et al. | Jun 2011 | A1 |
20110136388 | Fu | Jun 2011 | A1 |
20110143605 | Pepe | Jun 2011 | A1 |
20110212649 | Stokoe et al. | Sep 2011 | A1 |
20110212650 | Amleshi et al. | Sep 2011 | A1 |
20110230095 | Atkinson et al. | Sep 2011 | A1 |
20110230096 | Atkinson et al. | Sep 2011 | A1 |
20110256739 | Toshiyuki et al. | Oct 2011 | A1 |
20110275238 | Iijima et al. | Nov 2011 | A1 |
20110287663 | Gailus et al. | Nov 2011 | A1 |
20120094536 | Khilchenko et al. | Apr 2012 | A1 |
20120156929 | Manter et al. | Jun 2012 | A1 |
20120178274 | Manickam | Jul 2012 | A1 |
20120184145 | Zeng | Jul 2012 | A1 |
20120184154 | Frank et al. | Jul 2012 | A1 |
20120202363 | McNamara et al. | Aug 2012 | A1 |
20120202386 | McNamara et al. | Aug 2012 | A1 |
20120202387 | McNamara | Aug 2012 | A1 |
20120214344 | Cohen et al. | Aug 2012 | A1 |
20130012038 | Kirk et al. | Jan 2013 | A1 |
20130017733 | Kirk et al. | Jan 2013 | A1 |
20130065454 | Milbrand Jr. | Mar 2013 | A1 |
20130078870 | Milbrand, Jr. | Mar 2013 | A1 |
20130078871 | Milbrand, Jr. | Mar 2013 | A1 |
20130090001 | Kagotani | Apr 2013 | A1 |
20130109232 | Paniaqua | May 2013 | A1 |
20130143442 | Cohen et al. | Jun 2013 | A1 |
20130196553 | Gailus | Aug 2013 | A1 |
20130217263 | Pan | Aug 2013 | A1 |
20130225006 | Khilchenko et al. | Aug 2013 | A1 |
20130237100 | Affeltranger | Sep 2013 | A1 |
20130280926 | Ono | Oct 2013 | A1 |
20130316590 | Hon | Nov 2013 | A1 |
20140004724 | Cartier, Jr. et al. | Jan 2014 | A1 |
20140004726 | Cartier, Jr. et al. | Jan 2014 | A1 |
20140004746 | Cartier, Jr. et al. | Jan 2014 | A1 |
20140024263 | Dong et al. | Jan 2014 | A1 |
20140057498 | Cohen | Feb 2014 | A1 |
20140113487 | Chen et al. | Apr 2014 | A1 |
20140273557 | Cartier, Jr. et al. | Sep 2014 | A1 |
20140273627 | Cartier, Jr. et al. | Sep 2014 | A1 |
20140370729 | Wang | Dec 2014 | A1 |
20140377992 | Chang et al. | Dec 2014 | A1 |
20150056856 | Atkinson et al. | Feb 2015 | A1 |
20150072546 | Li | Mar 2015 | A1 |
20150099408 | Myer et al. | Apr 2015 | A1 |
20150111401 | Guo | Apr 2015 | A1 |
20150111427 | Foxconn | Apr 2015 | A1 |
20150126068 | Fang | May 2015 | A1 |
20150140866 | Tsai et al. | May 2015 | A1 |
20150214673 | Gao et al. | Jul 2015 | A1 |
20150236451 | Cartier, Jr. et al. | Aug 2015 | A1 |
20150236452 | Cartier, Jr. et al. | Aug 2015 | A1 |
20150255904 | Ito | Sep 2015 | A1 |
20150255926 | Paniagua | Sep 2015 | A1 |
20150340798 | Kao et al. | Nov 2015 | A1 |
20160118736 | Hoyack | Apr 2016 | A1 |
20160149343 | Atkinson et al. | May 2016 | A1 |
20160268744 | Little et al. | Sep 2016 | A1 |
20170077654 | Yao et al. | Mar 2017 | A1 |
20170302031 | Cheng | Oct 2017 | A1 |
20170352970 | Liang et al. | Dec 2017 | A1 |
20180062323 | Kirk et al. | Mar 2018 | A1 |
20180076555 | Scholeno et al. | Mar 2018 | A1 |
20180145438 | Cohen | May 2018 | A1 |
20180198220 | Sasame | Jul 2018 | A1 |
20180205177 | Zhou et al. | Jul 2018 | A1 |
20180212376 | Wang et al. | Jul 2018 | A1 |
20180212385 | Little | Jul 2018 | A1 |
20180219331 | Cartier, Jr. et al. | Aug 2018 | A1 |
20180241156 | Huang et al. | Aug 2018 | A1 |
20180269607 | Wu et al. | Sep 2018 | A1 |
20180331444 | Ono | Nov 2018 | A1 |
20190006778 | Fan et al. | Jan 2019 | A1 |
20190044284 | Dunham | Feb 2019 | A1 |
20190052019 | Huang et al. | Feb 2019 | A1 |
20190067854 | Ju et al. | Feb 2019 | A1 |
20190165518 | Hsu | May 2019 | A1 |
20190173209 | Lu | Jun 2019 | A1 |
20190173232 | Lu | Jun 2019 | A1 |
20190199023 | Soh | Jun 2019 | A1 |
20190214755 | Manickam | Jul 2019 | A1 |
20190334292 | Cartier, Jr. et al. | Oct 2019 | A1 |
20200021052 | Milbrand, Jr. et al. | Jan 2020 | A1 |
20200076131 | Hu | Mar 2020 | A1 |
20200076135 | Tang | Mar 2020 | A1 |
20200153134 | Sasame et al. | May 2020 | A1 |
20200161811 | Lu | May 2020 | A1 |
20200203865 | Wu et al. | Jun 2020 | A1 |
20200203867 | Lu | Jun 2020 | A1 |
20200203886 | Wu et al. | Jun 2020 | A1 |
20200235529 | Kirk et al. | Jul 2020 | A1 |
20200259294 | Lu | Aug 2020 | A1 |
20200266584 | Lu | Aug 2020 | A1 |
20200335914 | Hsu et al. | Oct 2020 | A1 |
20200358226 | Lu et al. | Nov 2020 | A1 |
20200395698 | Hou et al. | Dec 2020 | A1 |
20200403350 | Hsu | Dec 2020 | A1 |
20210036452 | Phillips et al. | Feb 2021 | A1 |
20210050683 | Sasame et al. | Feb 2021 | A1 |
20210135389 | Jiang | May 2021 | A1 |
20210135403 | Yang et al. | May 2021 | A1 |
20210135404 | Jiang | May 2021 | A1 |
20210203104 | Chen | Jul 2021 | A1 |
20210218195 | Hsu et al. | Jul 2021 | A1 |
20210288423 | Guo et al. | Sep 2021 | A1 |
20210351529 | Yang | Nov 2021 | A1 |
20210376508 | Hu | Dec 2021 | A1 |
20210399449 | Guo et al. | Dec 2021 | A1 |
20220037828 | Hu et al. | Feb 2022 | A1 |
20220059954 | Yue | Feb 2022 | A1 |
20220181811 | Liu et al. | Jun 2022 | A1 |
Number | Date | Country |
---|---|---|
1175101 | Mar 1998 | CN |
1192068 | Sep 1998 | CN |
1275825 | Dec 2000 | CN |
2519434 | Oct 2002 | CN |
1179448 | Dec 2004 | CN |
1650479 | Aug 2005 | CN |
1799290 | Jul 2006 | CN |
2896615 | May 2007 | CN |
1996678 | Jul 2007 | CN |
2930006 | Aug 2007 | CN |
101019277 | Aug 2007 | CN |
101176389 | May 2008 | CN |
101208837 | Jun 2008 | CN |
101312275 | Nov 2008 | CN |
201323275 | Oct 2009 | CN |
101600293 | Dec 2009 | CN |
201374434 | Dec 2009 | CN |
101752700 | Jun 2010 | CN |
101790818 | Jul 2010 | CN |
101120490 | Nov 2010 | CN |
101926055 | Dec 2010 | CN |
201846527 | May 2011 | CN |
102106041 | Jun 2011 | CN |
201868621 | Jun 2011 | CN |
102195173 | Sep 2011 | CN |
102224640 | Oct 2011 | CN |
102232259 | Nov 2011 | CN |
102239605 | Nov 2011 | CN |
102292881 | Dec 2011 | CN |
101600293 | May 2012 | CN |
102456990 | May 2012 | CN |
102487166 | Jun 2012 | CN |
102593661 | Jul 2012 | CN |
102598430 | Jul 2012 | CN |
202395248 | Aug 2012 | CN |
102694318 | Sep 2012 | CN |
102738621 | Oct 2012 | CN |
202633554 | Dec 2012 | CN |
102859805 | Jan 2013 | CN |
202695788 | Jan 2013 | CN |
202695861 | Jan 2013 | CN |
203445304 | Feb 2014 | CN |
103840285 | Jun 2014 | CN |
203660106 | Jun 2014 | CN |
203690614 | Jul 2014 | CN |
204030057 | Dec 2014 | CN |
204167554 | Feb 2015 | CN |
104409906 | Mar 2015 | CN |
104577577 | Apr 2015 | CN |
104659573 | May 2015 | CN |
204349140 | May 2015 | CN |
204577746 | Aug 2015 | CN |
204696287 | Oct 2015 | CN |
105633660 | Jun 2016 | CN |
105703103 | Jun 2016 | CN |
106099546 | Nov 2016 | CN |
107069281 | Aug 2017 | CN |
304240766 | Aug 2017 | CN |
304245430 | Aug 2017 | CN |
206712072 | Dec 2017 | CN |
206712089 | Dec 2017 | CN |
107706632 | Feb 2018 | CN |
207677189 | Jul 2018 | CN |
108539464 | Sep 2018 | CN |
208078300 | Nov 2018 | CN |
208209042 | Dec 2018 | CN |
208797273 | Apr 2019 | CN |
210326355 | Apr 2020 | CN |
112072400 | Dec 2020 | CN |
107706675 | Apr 2021 | CN |
212874843 | Apr 2021 | CN |
113517619 | Oct 2021 | CN |
214505858 | Oct 2021 | CN |
60216728 | Nov 2007 | DE |
0 560 551 | Sep 1993 | EP |
0 820 124 | Jan 1998 | EP |
1 018 784 | Jul 2000 | EP |
1 779 472 | May 2007 | EP |
2 169 770 | Mar 2010 | EP |
2 405 537 | Jan 2012 | EP |
227943 | Jan 1925 | GB |
1049435 | Nov 1966 | GB |
1272347 | Apr 1972 | GB |
H3-156761 | Jul 1991 | JP |
H07-302649 | Nov 1995 | JP |
2001-510627 | Jul 2001 | JP |
2002-151190 | May 2002 | JP |
2006-344524 | Dec 2006 | JP |
2010-129173 | Jun 2010 | JP |
9907324 | Aug 2000 | MX |
200835073 | Aug 2008 | TW |
M357771 | May 2009 | TW |
M474278 | Mar 2014 | TW |
M475740 | Apr 2014 | TW |
M502979 | Jun 2015 | TW |
I535129 | May 2016 | TW |
M534922 | Jan 2017 | TW |
I596840 | Aug 2017 | TW |
M558481 | Apr 2018 | TW |
M558482 | Apr 2018 | TW |
M558483 | Apr 2018 | TW |
M559006 | Apr 2018 | TW |
M559007 | Apr 2018 | TW |
M560138 | May 2018 | TW |
M562507 | Jun 2018 | TW |
M565894 | Aug 2018 | TW |
M565895 | Aug 2018 | TW |
M565899 | Aug 2018 | TW |
M565900 | Aug 2018 | TW |
M565901 | Aug 2018 | TW |
M605564 | Dec 2020 | TW |
WO 8805218 | Jul 1988 | WO |
WO 9835409 | Aug 1998 | WO |
WO 02073819 | Sep 2002 | WO |
WO 2004059794 | Jul 2004 | WO |
WO 2004059801 | Jul 2004 | WO |
WO 2006039277 | Apr 2006 | WO |
WO 2007005597 | Jan 2007 | WO |
WO 2007005599 | Jan 2007 | WO |
WO 2008124052 | Oct 2008 | WO |
WO 2008124054 | Oct 2008 | WO |
WO 2008124057 | Oct 2008 | WO |
WO 2008124101 | Oct 2008 | WO |
WO 2010030622 | Mar 2010 | WO |
WO 2010039188 | Apr 2010 | WO |
WO 2011100740 | Aug 2011 | WO |
WO 2017007429 | Jan 2017 | WO |
Entry |
---|
Taiwanese Office Action dated Jun. 16, 2022 for Taiwan Application No. 107138468. |
[No Author Listed], DDR5 Memory Module Sockets (SMT). Storage & Server IO. Amphenol ICC. 2022. 2 pages. URL:https://cdn.amphenol-cs.com/media/wysiwyg/files/documentation/datasheet/ssio/ssio_ddr5_smt.pdf [last accessed Mar. 22, 2022]. |
[No Author Listed], DDR5 SDRAM—Wikipedia. Aug. 8, 2021. 6 pages. URL:https://en.wikipedia.org/wiki/DDR5_SDRAM [last accessed on Aug. 16, 2021]. |
Armasu, What We Know About DDR5 So Far. Jun. 7, 2019. 20 pages. URL:https://www.tomshardware.com/news/what-we-know-ddr5-ram,39079.html [last accessed Jul. 21, 2022]. |
Hsu, Compact Electrical Connector, U.S. Appl. No. 17/867,067, filed Jul. 18, 2022. |
Lu et al., Robust, Miniaturized Card Edge Connector, U.S. Appl. No. 17/856,507, filed Jul. 1, 2022. |
Chinese communication for Chinese Application No. 201580014851.4, dated Jun. 1, 2020. |
Chinese Office Action for Chinese Application No. 201580014851.4 dated Sep. 4, 2019. |
Chinese Office Action for Application No. 201680051491.X dated Apr. 30, 2019. |
Chinese Office Action for Chinese Application No. 201780064531.9 dated Jan. 2, 2020. |
Chinese Office Action for Chinese Application No. 201780097919.9, dated Dec. 3, 2021. |
Chinese Office Action for Chinese Application No. 201780097919.9, dated Mar. 10, 2021. |
Chinese Office Action dated Jan. 18, 2021 in connection with Chinese Application No. 202010031395.7. |
Extended European Search Report for European Application No. EP 11166820.8 dated Jan. 24, 2012. |
Extended European Search Report dated May 19, 2021 in connection with European Application No. 17930428.2. |
International Search Report and Written Opinion for International Application No. PCT/CN2017/108344 dated Aug. 1, 2018. |
International Preliminary Report on Patentability Chapter II for International Application No. PCT/CN2017/108344 dated Mar. 6, 2020. |
International Preliminary Report on Patentability for International Application No. PCT/SG2016/050317 dated Jan. 18, 2018. |
International Search Report and Written Opinion for International Application No. PCT/SG2016/050317 dated Oct. 18, 2016. |
International Search Report with Written Opinion for International Application No. PCT/US2006/025562 dated Oct. 31, 2007. |
International Search Report and Written Opinion for International Application No. PCT/US2005/034605 dated Jan. 26, 2006. |
International Preliminary Report on Patentability for International Application No. PCT/US2010/056482 dated May 24, 2012. |
International Search Report and Written Opinion for International Application No. PCT/US2010/056482 dated Mar. 14, 2011. |
International Preliminary Report on Patentability for International Application No. PCT/US2011/026139 dated Sep. 7, 2012. |
International Search Report and Written Opinion for International Application No. PCT/US2011/026139 dated Nov. 22, 2011. |
International Search Report and Written Opinion for International Application No. PCT/US2011/034747 dated Jul. 28, 2011. |
International Preliminary Report on Patentability for International Application No. PCT/US2012/023689 dated Aug. 15, 2013. |
International Search Report and Written Opinion for International Application No. PCT/US2012/023689 dated Sep. 12, 2012. |
International Search Report and Written Opinion for International Application No. PCT/US2012/060610 dated Mar. 29, 2013. |
International Search Report and Written Opinion for International Application No. PCT/US2015/012463 dated May 13, 2015. |
International Search Report and Written Opinion for International Application No. PCT/US2017/047905 dated Dec. 4, 2017. |
International Search Report and Written Opinion dated Nov. 29, 2021 for International Application No. PCT/CN2021/114671. |
International Search Report and Written Opinion dated Jul. 18, 2019 for International Application No. PCT/CN2018/118798. |
[No Author Listed], Mini Cool Edge IO—The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System. Jul. 25, 2018. 2 pages. URL:https://www.amphenol-icc.com/connect/mini-cool-edge-io-the-ideal-solution-to-transmit-next-generation-high-speedsignal.html [retrieved on Apr. 11, 2022]. |
[No Author Listed], Mini Cool Edge IO Connector. Commercial IO. Amphenol ICC. 5 pages. URL:https://cdn.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/inputoutput/io_mini_cool_edge_io.pdf [retrieved on Apr. 11, 2022]. |
[No Author Listed], MCIO 124pos 85ohm. Amphenol Assembletech. 1 page. URL:http://www.amphenol-ast.com/v3/en/overview.aspx?classId=234 [retrieved on Apr. 11, 2022]. |
[No Author Listed], Carbon Nanotubes for Electromagnetic Interference Shielding. SBIR/STTR. Award Information. Program Year 2001. Fiscal Year 2001. Materials Research Institute, LLC. Chu et al. Available at http://sbir.gov/sbirsearch/detail/225895. Last accessed Sep. 19, 2013. |
[No Author Listed], High Speed Backplane Connectors. Tyco Electronics. Product Catalog No. 1773095. Revised Dec. 2008. 1-40 pages. |
[No Author Listed], Military Fibre Channel High Speed Cable Assembly, www.gore.com. 2008. [last accessed Aug. 2, 2012 via Internet Archive: Wayback Machine http://web.archive.org] Link archived: http://www.gore.com/en.sub.--xx/products/cables/copper/networking/militar-y/military.sub.--fibre . . . Last archive date Apr. 6, 2008. |
[No Author Listed], SFF-TA-1016 Specification for Internal Unshielded High Speed Connector System. Rev 0.0.1. SNIA SFF TWG Technology Affiliate. Nov. 15, 2019. 40 pages. |
Beaman, High Performance Mainframe Computer Cables. 1997 Electronic Components and Technology Conference. 1997;911-7. |
Reich et al., Microwave Theory and Techniques. Boston Technical Publishers, Inc. 1965;182-91. |
Shi et al. Improving Signal Integrity in Circuit Boards by Incorporating Absorbing Materials. 2001 Proceedings. 51st Electronic Components and Technology Conference, Orlando FL. 2001:1451-56. |
Number | Date | Country | |
---|---|---|---|
20220069496 A1 | Mar 2022 | US |