Claims
- 1. A miniaturized imaging device, comprising:
(a) a lens; (b) an SSID including an imaging array optically coupled to the lens; (c) an umbilical including a conductive line; and (d) an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line.
- 2. A miniaturized imaging device as in claim 1, wherein the conductive line includes wires providing power, ground, clock signal, and output signal.
- 3. A miniaturized imaging device as in claim 1, wherein the conductive line includes at least two conductive wires that are electrically isolated from one another.
- 4. A miniaturized imaging device as in claim 1, wherein the adaptor is rigid in construction, and is configured to provide electrical communication between the SSID and the conductive line through a conductive path, said conductive path configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface of the adaptor, and the conductive line is electrically coupled to the conductive path at a non-coplanar second surface of the adaptor.
- 5. A miniaturized imaging device as in claim 4, wherein the first surface is a bottom surface of the adaptor, and wherein the second surface is an adjacent side surface of the adaptor.
- 6. A miniaturized imaging device as in claim 5, wherein the SSID further includes conductive pads electrically coupled to the imaging array, said conductive pads providing the electrical communication between the SSID and the adaptor.
- 7. A miniaturized imaging device as in claim 1, wherein the adaptor is smaller than 500 microns in length, width, and height, respectively.
- 8. A miniaturized imaging device as in claim 1, wherein the adaptor is configured such that four separate electrical signals can pass therethrough at the same time without any of said signals substantially interfering with one another.
- 9. A miniaturized imaging device as in claim 1, further comprising a color filter insert between the lens and the imaging array, said color filter insert configured for producing multiple colors from a monochromatic camera image.
- 10. A miniaturized imaging device as in claim 9, wherein the color filter insert is configured in a Bayer filter pattern.
- 11. A miniaturized imaging device as in claim 1, wherein the SSID is a CCD imaging device.
- 12. A miniaturized imaging device as in claim 1, wherein the SSID is a CID imaging device.
- 13. A miniaturized imaging device as in claim 1, wherein the SSID is a CMOS imaging device.
- 14. A miniaturized imaging device as in claim 1, further comprising a utility guide configured for carrying utilities to the SSID, adaptor, or lens.
- 15. A miniaturized imaging device as in claim 14, further comprising a light source carried by the SSID, the adaptor, or the utility guide.
- 16. A miniaturized imaging device as in claim 1, wherein the lens is a GRIN lens.
- 17. A method of operating a microcamera, comprising:
(a) optically coupling a lens to an imaging array of an SSID, said SSID electrically coupled to a rigid adaptor; (b) defining a plurality of conductive paths, at least one of said conductive paths being configured along multiple non-coplanar surfaces of the adaptor; (c) powering the SSID through a first of the conductive paths; and (d) receiving signal from the SSID through a second of the conductive paths.
- 18. A method as in claim 17, wherein the lens supported by the adaptor.
- 19. A method as in claim 17, further comprising the step of illuminating an area around the lens.
- 20. A method as in claim 17, wherein the step of optically coupling includes the step of directly attaching the lens to an imaging array of the SSID.
- 21. A method as in claim 17, wherein the step of optically coupling includes the step of interposing an intermediate optical device between the lens and an imaging array of the SSID.
- 22. A method as in claim 17, wherein the step of defining a plurality of conductive paths includes defining at least four conductive paths.
- 23. A method as in claim 22, further comprising providing ground to the SSID through a third conductive path of the at least four conductive paths.
- 24. A method as in claim 22, further comprising providing control to the SSID through a fourth conductive path of the at least four conductive paths.
- 25. A miniaturized imaging device, comprising:
(a) a lens; (b) an SSID including an imaging array optically coupled to the lens; (c) an umbilical including a conductive line; and (d) a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path, said conductive path configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface of the adaptor, and the conductive line is electrically coupled to the conductive path at a non-coplanar second surface of the adaptor.
- 26. A miniaturized imaging device as in claim 25, wherein the adaptor includes multiple conductive paths.
- 27. A miniaturized imaging device as in claim 25, wherein the adaptor is electrically coupled to the SSID by a conductive material to form a rigid joint.
- 28. A miniaturized imaging device as in claim 25, wherein the adaptor is electrically coupled to the conductive line by a conductive material to form a rigid joint.
- 29. A miniaturized imaging device as in claim 25, wherein the conductive line includes wires providing power, ground, clock signal, and output signal.
- 30. A miniaturized imaging device as in claim 25, wherein the SSID further includes conductive pads electrically coupled to the imaging array, said conductive pads providing the electrical communication between the SSID and the adaptor.
- 31. A miniaturized imaging device as in claim 25, wherein the adaptor is configured such that four separate electrical signals can pass therethrough at the same time without any of said signals substantially interfering with one another.
- 32. A miniaturized imaging device as in claim 25, further comprising a color filter insert between the lens and the imaging array, said color filter insert configured for producing multiple colors from a monochromatic camera image.
- 33. A miniaturized imaging device as in claim 32, wherein the color filter insert is configured in a Bayer filter pattern.
- 34. A miniaturized imaging device as in claim 25, wherein the SSID is a CCD imaging device.
- 35. A miniaturized imaging device as in claim 25, wherein the SSID is a CID imaging device.
- 36. A miniaturized imaging device as in claim 25, wherein the SSID is a CMOS imaging device.
- 37. A miniaturized imaging device as in claim 25, further comprising a utility guide configured for carrying utilities to the SSID, adaptor, or lens.
- 38. A miniaturized imaging device as in claim 37, further comprising a light source carried by the SSID, the adaptor, or the utility guide.
- 39. A miniaturized imaging device as in claim 25, wherein the lens is a GRIN lens.
- 40. A method of making an adaptor, comprising:
(a) applying a conductive material layer to an adaptor substrate; (b) applying a photoresist material layer to the conductive material layer; (c) developing a portion of the photoresist material layer, such that a first portion of the conductive material layer is exposed, and a second portion of the conductive material layer is protected; and (d) removing the first portion of the conductive material from the adaptor substrate.
- 41. A method as in claim 40, comprising preliminary steps of applying a removable layer to a working substrate, followed by applying the adaptor substrate to the removable layer.
- 42. A method as in claim 41, comprising a step of removing the adaptor substrate from the removable layer after the first portion of the conductive material is removed from the adaptor substrate.
- 43. A method as in claim 41, wherein the step of developing the photoresist a portion of the photoresist material is by applying heat from beneath the working substrate, as well as applying UV light to a portion of the photoresist material that protects the first portion of the conductive material.
- 44. A method as in claim 40, wherein the photoresist material is completely removed after the first portion of the conductive material is removed from the adaptor substrate.
- 45. A method as in claim 40, wherein the adaptor is less than 500 microns in length, width, and height, respectively.
- 46. A method as in claim 40, further comprising the step of forming a hole through the adaptor substrate, thereby configuring the adaptor to support a lens.
Parent Case Info
[0001] The present application claims priority to U.S. Provisional Application Nos. 60/365,561, 60/365,692, and 60/431,261, each of which are incorporated herein by reference in their entirety.
Provisional Applications (3)
|
Number |
Date |
Country |
|
60365561 |
Mar 2002 |
US |
|
60365692 |
Mar 2002 |
US |
|
60431261 |
Dec 2002 |
US |