The present disclosure relates to a method of minimizing the formation of glass defects during a manufacturing process involving precious metal systems, and more particularly to minimizing the formation of rhodium-rich defects in a glass or glass ceramic material during the manufacturing process.
Many glass materials are manufactured in a process that involves melting, fining, delivery, mixing, and/or forming vessels made out of platinum or platinum alloys. Platinum or platinum alloys are used in such vessels that hold, channel, and form the molten glass because they have the necessary properties, such as a high melting point, strength, and resistance to corrosion, to withstand the extreme environment of molten glass (melt). Precious metals like platinum and platinum alloys are generally considered to be inert with respect to the glass at high temperatures, but oxidations, reductions, or other reactions can occur at the melt-metal interface inside the vessel and those reactions can lead to the generation of defects in the melt and the glass products obtained therefrom.
Rhodium can be alloyed with platinum to increase the strength and extend the life of the manufacturing vessels. Rhodium defects have been previously identified in some glasses, however, the defects were transitory rather than persistent, or did not appear in a quantity sufficient to warrant mitigation schemes. Eliminating rhodium from the system and using another suitable precious metal alloy may be an option for certain glasses, but that option is generally unacceptable for glasses with higher melting temperatures.
In various embodiments, a method of minimizing the formation of a rhodium-platinum defect in a glass or glass ceramic material is provided. The method can include providing a vessel made of a platinum-rhodium alloy for use in a manufacturing process for obtaining the material, wherein an interface between the vessel and a melt of the material is present. The method can include providing a partial pressure of hydrogen outside the vessel relative to a partial pressure of hydrogen inside the vessel in an amount sufficient to control the partial pressure of oxygen in a region of the melt adjacent to the interface. In the various embodiments, the rhodium-platinum defect can be rhodium-rich and the platinum-rhodium alloy in the vessel can be platinum-rich.
In some embodiments, the rhodium-platinum defect can include about 80% rhodium and about 20% platinum, and the platinum-rhodium alloy in the vessel can include about 80% platinum and about 20% rhodium.
In some embodiments, the material produced by the method of minimizing a rhodium-platinum defect is provided. In such embodiments, the material can be substantially free of the rhodium-platinum defect.
In various embodiments, a method of minimizing the formation of, or counteracting an impact of, a localized thermal, electrical, or composition cell in a glass or glass ceramic material is provided. The method can include providing a vessel made of a platinum-rhodium alloy for use in a manufacturing process, in which an interface between the vessel and a melt of the material is present. The method can include at least one step selected from adding a multivalent compound to the melt, stirring the melt in a fining vessel of the manufacturing process, and stirring the melt immediately after it exits the fining vessel.
In some embodiments, the formation of the electrical, thermal or composition cell can result in the formation of a rhodium-platinum defect. In some embodiments, the defect can be rhodium-rich and the platinum-rhodium alloy in the vessel is platinum-rich. In some embodiments, the defect can include about 80% rhodium and about 20% platinum, and the platinum-rhodium alloy in the vessel can include about 80% platinum and about 20% rhodium. In such embodiments, the material can be substantially free of the rhodium-platinum defect.
In some embodiments, the material produced by the method of minimizing the formation of, or counteracting an impact of, a localized thermal, electrical, or composition cell is provided. In some embodiments, the material includes a multivalent species. In some embodiments, the material can include more than 0.1 wt. % of tin oxide (SnO2), iron oxide (Fe2O3), manganese oxide (MnO2), cerium oxide (Ce2O3), or a combination thereof. In some embodiments, the material can include at least 0.05 wt. % of the combined amount of antimony oxide (Sb2O3) and arsenic oxide (As2O3).
Additional features and advantages of the embodiments disclosed herein will be set forth in the detailed description that follows, and in part will be clear to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings.
Both the foregoing general description and the following detailed description present embodiments intended to provide an overview or framework for understanding the nature and character of the embodiments disclosed herein. The accompanying drawings are included to provide further understanding and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure, and together with the description explain the principles and operations thereof.
The drawings are not necessarily to scale, and certain features and certain views of the drawings may be shown exaggerated in scale or in schematic in the interest of clarity and conciseness.
Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. However, this disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless otherwise expressly stated, any method set forth herein is not to be construed as requiring that its steps be performed in a specific order, nor that with any apparatus, specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification.
As used herein, the term “about” means that amounts, sizes, formulations, parameters, and other quantities or characteristics are not and need not be exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art.
Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value to the other particular value. Similarly, when values are expressed as approximations by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. In some embodiments, “about” denotes values within 10% of each other, such as within 5% of each other, or within 2% of each other.
The terms “substantial,” “substantially,” and variations thereof as used herein are intended to note that a described feature is equal or approximately equal to a value or description. For example, a “substantially planar” surface is intended to denote a surface that is planar or approximately planar. Moreover, “substantially” is intended to denote that two values are equal or approximately equal. In some embodiments, “substantially” denotes values within about 10% of each other, such as within about 5% or within about 2% of each other.
As used herein, “vessel” includes a component used in the apparatus or system for manufacturing glass or glass ceramic materials, including a melting chamber, fining tube, forming chamber, or any connecting pipe between such vessels. Typical components in a glass manufacturing system are described in U.S. Pat. No. 7,032,412, the content of which is hereby incorporated by reference in its entirety. As shown in
As used herein “higher temperature” refers to a temperature in the range of about 1400° C. to about 1600° C., and “lower temperature” refers to a temperature in the range of about 1000° C. to about 1350° C.
In various embodiments, a process of manufacturing a high alkali glass is disclosed. In some embodiments, the process includes the manufacture of other glass materials, glass ceramic, and/or ceramic materials. In such processes, persistent and novel defects have been identified in the material. The defects are highly reflective and, despite being typically less than 100 microns in diameter, they can be seen down to 2 μm in diameter in polished glass. A glass having the defect is unacceptable for many applications, including, e.g., the use of the material in a display, protective cover glass, or as a substrate.
In some embodiments, the defects are thin sheets of crystalline rhodium-platinum (Rh/Pt) (also referred to herein as “cRh”). The cRh defects have regular geometry (e.g., triangle, hexagon), and have a thin, substantially planar cross-section thickness.
In some embodiments, the composition of the cRh defects was determined using a combination of SEM and energy-dispersive X-ray spectroscopy (EDS).
Without being bound by a particular scientific theory, the cRh defects are thought to be produced via a three step process in the melt as illustrated in
In
The cRh defects formed via the aforementioned three-step process are rhodium-rich because the solubility of rhodium is much greater than the solubility of platinum in the local melt (170). For example, when an 80 Pt/20 Rh alloy is exposed to various glass melts at a high temperature, the melt can pick up 2 to 10 times more rhodium oxide than platinum oxide species. As a result, when this glass is subsequently cooled and/or experiences a lower partial pressure of oxygen (pO2) and becomes supersaturated with platinum and rhodium species, the defect that forms is enriched in rhodium. In some embodiments, the rhodium concentration in the defect is in a range of about 60% to about 90%, or about 65% to about 85%, or about 70% to about 80%, including any combination of subranges therein. This is in contrast to defects formed through a gas pathway. For example, when a 80 Pt/20 Rh alloy is exposed to an oxygen-containing gas at high temperature, the gas picks up the rhodium and platinum species in approximate proportion to their concentrations in the source alloy. Therefore, when the gas is subsequently cooled and/or experiences a lower pO2 and becomes supersaturated, the defect that forms is platinum-rich like the source alloy.
In various embodiments, a process of minimizing the formation of cRh defects in a high alkali glass is provided. In some embodiments, the process comprises one or more steps that can be used alone or in combination during the manufacturing process to prevent, eliminate, or minimize the formation of the cRh defects in the melt.
In some embodiments, for example, the process comprises minimizing or maximizing the partial pressure of oxygen (pO2) in the local melt. In some embodiments, the cRh defects are minimized by limiting the oxidation reaction in the first step of the three-step process for PtRh formation. In some embodiments, the cRh defects are minimized by limiting the reduction reaction and/or the precipitation of the cRh defect in the melt during the third step. In some embodiments, the process comprises limiting the oxidation reaction in the first step and limiting the reduction reaction and/or precipitation in the third step. In such embodiments, the process comprises minimizing the pO2 in the local melt during the first step and maximizing the pO2 in the local melt during the third step.
In such embodiments, the pO2 in the local melt (170) (as opposed to the pO2 in the bulk melt (150)) refers to the pO2 of the melt adjacent to the PtRh vessel wall (140). The local melt (170) is the relevant area because the PtRh vessel wall (140) is the source of the platinum and rhodium oxides, and the dissolved oxides will remain most enriched in the melt (170) near the PtRh wall (140) due to the laminar flow of the melt through the manufacturing system. In this context, “adjacent” includes the melt in direct contact with the PtRh vessel wall (140) and a portion of the melt that is affected by an enrichment or depletion in oxygen (O2). For example, the region of local melt (170) adjacent to the vessel wall (140) includes the melt within a spaced distance of about 2 mm from the wall, within about 1 mm from the wall, or within about 0.1 mm from the wall, or any combined range of distances thereof. In some embodiments, the local melt (170) adjacent to the vessel wall is a radial ring ranging from directly in contact with the vessel wall to about 2 mm away from the vessel wall. As would be appreciated by one skilled in the art, the size of the area of local melt (170) considered adjacent to the vessel wall depends on many factors, including the geometry, flow, and temperature of the melt.
In various embodiments, hydrogen permeation exacerbates the first and/or third step of the process that produces cRh defects by impacting the pO2 of the melt adjacent to the PtRh wall. The PtRh walls are permeable to hydrogen, so hydrogen can exchange between the local melt (170) and the gas atmosphere (160) surrounding the PtRh wall (140). In various embodiments, the direction and the extent of hydrogen exchange, and therefore the extent of change in pO2 of the melt adjacent to the PtRh wall (140), can be controlled by adjusting the relative values of the partial pressure of hydrogen in the gas atmosphere, pH2(gas) (160), and the partial pressure of hydrogen in the local melt pH2(melt) (170). Thus, in some embodiments, a mismatch between the pH2 in the local melt (170) and the pH2 in the gas atmosphere (160) surrounding the vessel results in hydrogen either leaving or entering the local melt from the surrounding gas atmosphere. In such embodiments, the local melt (170) adjacent to the PtRh wall becomes either enriched or depleted in O2, as dictated by the following water reaction: H2O↔2H+0.5O2. For example, when a high local pH2(melt) exists at the interface of the melt and vessel, hydrogen will permeate out of the melt into the gas atmosphere, depleting the local melt (170) of hydrogen. Based on the water reaction, for every mole of hydrogen that leaves the local melt, a ½ mole of oxygen is left behind at the interface.
In some embodiments, the hydrogen exchange between the local melt (170) and the surrounding gas atmosphere (160) can be controlled by modifying the water content (β-OH) in the melt. As used herein, “β-OH” is a measure of the hydroxyl content in the glass as measured by IR spectroscopy. Specifically, β-OH is the linear absorption coefficient of the material and is calculated from the material's IR transmittance spectrum using the equation: β-OH=(1/X)LOG10(T1/T2), in which X is the sample thickness in millimeters, T1 is the sample transmittance at the reference wavelength (nm) and T2 is the minimum sample transmittance of the hydroxyl absorption wavelength (nm). In some embodiments, for example, increasing the pH2(melt) can be accomplished by increasing the water content (β-OH) of the glass. In such embodiments, the water content can be increased through various process modifications, including, for example, the addition of high-water content raw materials or batches such as those described in U.S. Pat. No. 8,623,776, the content of which is hereby incorporated by reference in its entirety, and/or the bubbling of wet gases through the bulk melt (150). As used herein, a “wet gas” refers to a gas with some amount of water vapor present. Such modifications provide a way to directly inject water into the melt, and can be appropriate during different stages of the manufacturing process, such as early in the pre-melt or later in the finer tube.
In some embodiments, the pH2(gas) can be set to any desired value by controlling the % O2 and dew point in the gas atmosphere (160). In some embodiments, a higher pH2(gas) (e.g., 1% oxygen (O2) in nitrogen (N2) humidified to a dew point of 65° C.) can be utilized in the higher temperature upstream section (e.g., prior to and including the finer tube (16) in
In some embodiments, the gas atmosphere around the platinum-rhodium vessels is controlled by providing an enclosure (e.g., 180 in
In some embodiments, the process comprises controlling the formation of electrical, thermal, and composition cells in the PtRh system. As shown in
In some embodiments, for example, a composition cell is the sludge layer in the finer tube. As used herein, “sludge layer” refers to a layer of glass with a different composition than that of the bulk melt and typically enriched with oxides of the refractory materials from the vessel walls and electrodes. In some embodiments, the sludge layer is formed in the pre-melt by refractory brick and/or electrodes being continuously dissolved into the melt, which is then carried downstream to the finer tube and other downstream sections before the stir chamber. For example,
With reference to
In some embodiments, stirring the melt (150) using mixing devices that minimize composition gradients before the melt enters the cooling section is important. In some embodiments, for example, stirring devices (e.g., bubblers or static mixers) are added before and/or immediately after the finer tube to minimize the sludge layer and the development of concentration cells in the higher and lower temperature sections of the glass manufacturing process.
In some embodiments, the addition of multivalent species, such as tin, iron, etc., to the melt minimize the impact of any composition, electrical, or thermal cells that cannot be eliminated using mechanical process modifications. In such embodiments, the multivalent species counteract any local pO2(melt) gradients and minimize the subsequent formation of cRh defects. For example, in some embodiments, the multivalent species can buffer the melt from negatively charged oxygen ions, caused by the breakdown of water or hydroxyl species in the melt, that can be converted to molecular oxygen.
As shown in Table 1, the samples with the lowest concentration of multivalent species (Ex. 1) produced the highest number of metallic defects, samples with cerium or manganese additions (Ex. 8, Ex. 10) produced some defects, and samples with tin or iron additions (Ex. 2, Ex. 5; Ex. 3, Ex. 6) produced no defects. Accordingly, the tin and iron additions were very effective and the cerium and manganese additions were somewhat effective at minimizing the local pO2 gradient (formed by the composition cell created by the SnO2 powder in the bottom of the crucible) and subsequent formation of cRh defects. In the examples, the concentration cell formed is likely more severe than any cells observed in the glass manufacturing process due to the relatively large amount of tin oxide powder added in the examples. Therefore, smaller multivalent additions may be sufficient in a larger production vessel in combination with proper thermal and atmospheric controls.
In some embodiments, the glass or glass ceramic material comprises more than 0.1 wt % of one or more multivalent species. In some embodiments, for example, the material comprises more than 0.1 wt % SnO2. In some embodiments, the material comprises more than 0.1 wt % Fe2O3. In some embodiments, the material comprises more than 0.2 wt % of the combined amounts of SnO2, Fe2O3, MnO2, and Ce2O3. In some embodiments, the material comprises at least 0.05 wt % of the combined amounts of Sb2O3 and As2O3. In some embodiments, the melt comprises Li2O in a molar amount that is greater than Al2O3.
In some embodiments, a method of minimizing the cRh defects in a process of manufacturing a glass or glass ceramic material using one or more vessels (e.g., melting chamber, fining tube), or all vessels in the manufacturing system, are made of a precious metal or metal alloy that does not include rhodium is provided. In such embodiments, the elimination of rhodium from the system and the use of a suitable Rh-free precious metal alloy is provided for higher melting temperature glasses. In some embodiments, the dissolution of rhodium into the melt (150) is minimized or eliminated by changing the vessels from 80 Pt/20 Rh to 100 Pt. In some embodiments, the dissolution of rhodium into the melt (150) is minimized or eliminated by changing the vessels from 80 Pt/20 Rh to a platinum alloy containing another precious metal (e.g., molybdenum). In such embodiments, the formation of the cRh defects in the melt is avoided.
In various embodiments, a process of manufacturing a glass or glass ceramic material is provided. In some embodiments, the material comprises SiO2, Al2O3, Li2O, P2O5, ZrO2, K2O, and Na2O. In various embodiments, the formation of cRh defects was minimized or eliminated through permeation control, including providing a pH2(gas) relative to the pH2(melt) in an amount sufficient to control the partial pressure of oxygen in a region of the melt adjacent to the interface between the melt and the vessel wall, and/or through minimizing the formation of a localized thermal, electrical, or composition cell in the melt. In various embodiments, the material comprises less than 15 cRh defects per pound, or less than 10 cRh defects per pound, or less than 5 cRh defects per pound, or less than 1 cRh defects per pound.
It will be apparent to those skilled in the art that various modifications and variations can be made to embodiments of the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present disclosure cover such modifications and variations provided they come within the scope of the appended claims and their equivalents.
This application is a national stage entry of International Patent Application Serial No. PCT/US2021/045179, filed on Aug. 9, 2021, which in turn, claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Ser. No. 63/069,194 filed on Aug. 24, 2020, the contents of which are relied upon and incorporated herein by reference in their entireties.
Filing Document | Filing Date | Country | Kind |
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PCT/US2021/045179 | 8/9/2021 | WO |
Number | Date | Country | |
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63069194 | Aug 2020 | US |