This invention relates generally to connector stub resonance, and more specifically, to methods and apparatuses for mitigating the adverse effect of connector stub resonance in signal transmission.
The connector constitutes one of the largest discontinuities in a chip-to-chip communication channel. In related art implementations, the connector stub is utilized for mechanical reliability but is detrimental for high-speed signal transmission. US Patent Applications US 2013/0328645A1 and US 2014/0167886A1 shape the plating stub, commonly found in wire-bond electronic package, into multiple segments of different widths in order to shift the stub's resonant frequency higher. These applications focus on increasing the resonant frequency of the plating stub.
The present invention is directed to shaping or determining modifications for the connector stub to provide desirable input impedance at the frequency of interest so that the system performance can be improved from direct current (DC) to beyond the original resonant frequency.
In one aspect of the present invention, the stub is designed to have larger width at the contact point and smaller width towards the open end. Compared to the original constant-width design, this new design alters the stub's input impedance and shifts the resonant frequency higher.
In another aspect of the present invention, the total capacitance of the new varying-width stub design is made to be no larger than the total capacitance of original constant-width stub design, so that the new design gives an electrical performance that is equal to or better than the original design at frequencies below the original resonant frequency.
Aspects of the present disclosure include systems and methods for mitigating connector stub resonance, which can involve shifting the resonant frequency of the connector stub higher, and perturbing the characteristic impedance of the connector stub such that its input impedance becomes capacitive at the original resonant frequency. Such a connector stub can involve a plurality of segments with each segment having different width or impedance to attain the desired (e.g. low-then-high) impedance structure. The connector stub may also involve a continuously shaped structure to attain the desired (low-then-high) impedance structure. The reshaped connector stub can have a total capacitance that is the same as or less than the total capacitance of the original stub design. Further, the reshaped connector stub has total area that is the same as or less than the total area of the original stub.
Aspects of the present disclosure include a connector, which can involve a connector plug. The connector plug can include a connector stub configured to engage with a receptacle, the connector stub comprising a first portion and a second portion, the first portion configured to be in closer proximity to an entrance of the receptacle than the second portion when the connector stub engages the receptacle; wherein the first portion has a smaller impedance than the second portion, wherein at least one of a capacitance of the connector stub and total area of the connector stub is made to be equal to or less than a connector stub formed with two first portions.
The accompanying drawings, which are incorporated in and constitute a part of this specification exemplify the embodiments of the present invention and, together with the description, serve to explain and illustrate principles of the inventive technique. Specifically:
The following detailed description provides further details of the figures and example implementations of the present application. Reference numerals and descriptions of redundant elements between figures are omitted for clarity. Terms used throughout the description are provided as examples and are not intended to be limiting. Example implementations described herein may be used singularly, or in combination other example implementations described herein, or with any other desired implementation.
In a high-speed system, it is crucial to increase the signal bandwidth to higher frequency. A chip-to-chip communication channel can include interconnects such as electronic packages, vias, Printed Circuit Board (PCB) traces, connectors and cables where the signal path may encounter stubs at various locations (e.g., connector contacts). These stubs result in resonance at frequencies where each stub length becomes equal to the multiples of quarter wavelength. Resonance can limit the highest data rate at which a digital system can operate.
Example implementations described herein can involve methods for mitigating connector stub resonance. As described herein, such methods can include modifying an original connector stub design by shifting resonant frequency of the connector stub to be higher; and modifying the characteristic impedance of the connector stub such that input impedance of the connector stub becomes capacitive at the original resonant frequency as described in detail of
In example implementations, the connector stub can be divided into a plurality of segments (e.g., sections, portions, etc.), wherein at least one of the plurality of segments has a different width or impedance than another one of the plurality of segments as illustrated in examples from
In example implementations, the connector stub can be manufactured or modified from an original connector stub to have a continuously shaped structure having a low-then-high impedance structure from a plug portion of the connector stub to an end of the connector stub as illustrated in examples from
In example implementations, the connector stub can be manufactured or reshaped from the original connector stub such that the connector stub has a total capacitance that is equal to or less than the total capacitance of the original stub as described with respect to
In example implementations, the connector stub can be manufactured or reshaped from the original connector stub such that the connector stub has a total area that is equal to or less than the total area of the original stub as illustrated in examples from
Example implementations can also involve a connector plug or a connector receptacle, which can involve a connector stub reshaped from an original connector stub, the connector stub configured to engage with a receptacle, the connector stub involving a first section and a second section, the first section configured to be in closer proximity to an entrance of the receptacle than the second section when the connector stub engages the receptacle, the second section disposed towards a plug end of the connector plug; wherein the first section has a smaller impedance than the second section, wherein at least one of: a) capacitance of the connector stub, and b) total area of the connector stub is made to be equal to or less than the original connector stub as illustrated in the examples of
In the subsequent paragraphs, the “connector stub” refers to connector plug stub. Nevertheless, the method of mitigation of connector stub resonance applies to a connector receptacle stub as well as a connector plug stub.
A constant-width stub can be modeled by a transmission line with its input impedance (Z1) given by
Zin=−jZ0 cot βl
where Z0 is characteristic impedance, β is propagation constant and l is length.
As illustrated in
Specifically,
As illustrated in
The input impedance of a two-section stub can be written as
where Zk is characteristic impedance, βk is propagation constant and lk is length of each section (k=1,2). If β1l1=β2l2=X, then
which is reduced to
at the first original resonant frequency when
As illustrated from the above input impedance equations, in order to have negative input reactance, Z1 must be made less than Z2 (i.e. Z1<Z2).
Note that graph line 112 in
where tk is propagation delay of each section (k=1,2). Let t1=t2, Z1=xZ0 and Z2=ρZ1, then
For the total capacitance to be equal to or less than the original stub total capacitance, the first section stub impedance Z1 and second section stub impedance Z2 must satisfy the conditions as described above.
In
As illustrated in
In example implementations described herein, there may also be other configurations to obtain the low-then-high impedance structure in the singular or in the aggregate in accordance with the desired implementation while maintaining a varying-impedance connector stub design. Depending on the desired implementation and the desired resonance frequency shift, an aggregation or a plurality of low-then-high impedance structures can be utilized for each section of the connector stub as illustrated in the following examples.
Although the above examples are directed to forming the low-then-high impedance structure through modification of the widths of sections from the original connector stub, other implementations are also possible to create the low-then-high impedance structure, and the present disclosure is not limited thereto.
Similarly, other implementations are also possible to modify the total capacitance of the connector stub from an original connector stub, and the present disclosure is not limited thereto to reshaping the connector stub. One of ordinary skill in the art can utilize any desired means to reduce the total capacitance of a connector stub to facilitate the shift in resonance frequency to be higher.
Although example implementations described herein are directed to a connector stub, other implementations that operate at high signal frequency and need mitigation for insertion loss are also possible and the present disclosure is not limited thereto. For example, PCB via stubs may also be divided into sections with varying impedance to shift the resonance frequency higher.
Moreover, other implementations of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the teachings of the present application. Various aspects and/or components of the described example implementations may be used singly or in any combination. It is intended that the specification and example implementations be considered as examples only, with the true scope and spirit of the present application being indicated by the following claims.
This regular U.S. patent application is based on and claims the benefit of priority under 35 U.S.C. 119 from provisional U.S. patent application Ser. No. 62/469,469, filed on Mar. 9, 2017, the entire disclosure of which is incorporated by reference herein.
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Number | Date | Country | |
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20180261961 A1 | Sep 2018 | US |
Number | Date | Country | |
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62469469 | Mar 2017 | US |