Patent Application
20220395934
The present invention relates to a soldering technology and more particularly to a reflow soldering technology using a mixed alloy solder paste.
In the packaging process of sensors based on MEMS (Micro-Electro-Mechanical System) technology, welding (reflow soldering) must be performed a plurality of times. For example, high-temperature solder is used to solder a silicon chip to a lead frame to form an assembly in the first-stage packaging. The packaged or unpackaged silicon chip/lead frame assembly is attached to a PCB using reflow soldering in the subsequent second-stage packaging. A soldering point formed after the cooling of the first-stage reflow soldering can also be remelted in the second-stage packaging, causing various problems. For example, bridging may occur between different soldering points, resulting in product failure. Therefore, a new technical solution to this problem must be sought.
Against the deficiency of the prior art, the purpose of the present invention is to solve the problem of bridging between soldering points caused by the melting of solder paste in the process of soldering performed a plurality of times. The present invention adopts the following technical solution for the preceding purpose:
a solder paste, characterized in that the solder paste comprises:
a first solder alloy powder in an amount ranging from 30% to 95% by weight, the first solder alloy powder including a first solder alloy with a solidus temperature of 200° C. to 260° C., the first solder alloy including an Sn—Cu alloy or Sn—Cu—Ag alloy;
a second solder alloy powder in an amount ranging from 5% to 70% by weight, the second solder alloy powder including a second solder alloy with a solidus temperature below 250° C.; and a solder flux.
Preferably, the second solder alloy includes an Sb or Sn alloy.
Preferably, the Sn alloy includes an Sn—Ag or Sn—Cu alloy.
Preferably, the Sn alloy includes an Sn—Ag—Cu alloy.
Preferably, the Sn alloy includes an Sn—Ag—Cu—Y alloy, where Y is Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn.
Preferably, the second solder alloy includes at least one of Cu and Sn, the second solder alloy including, by weight, 0%-3% of Cu, and 0%-4% of Ag, with the remainder being Sn or Sn and other additives, the additives being at least one of Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn.
Preferably, the first solder alloy includes 10%-50% of Cu, and 0%-4% of Ag, and the remainder is Sn.
According to another aspect of the present invention, there is provided a method of making a solder paste, wherein the method of making a solder paste comprises mixing the solder paste according to any of the preceding claims.
According to yet another aspect of the present invention, there is provided a soldering method, wherein the soldering method comprises:
applying the solder paste according to any of claims 1 to 7 between a first device and a second device;
heating to melt the solder paste using the reflow soldering process to form a soldering seam connecting the first device and the second device, the first device and the second device forming a soldering assembly.
Preferably, the soldering method comprises inhibiting any remelting of the soldering seam when the soldering assembly and other devices are soldered in a further reflow soldering process.
It can be seen from the preceding contents that the mixed alloy solder paste according to an embodiment of the present invention has a variable melting point in the soldering performed a plurality of times. In multiple reflow soldering, the remelting of solder paste can be inhibited under different temperature conditions accordingly. Therefore, no functional failure will occur during the assembly and/or packaging of PCBs or electronic devices due to bridging caused by the melting of solder paste.
The characteristics, features, advantages, and benefits of the present invention will become apparent from the following detailed description in conjunction with the accompanying drawings.
In conjunction with the accompanying drawings, the embodiments of the present invention will be further described below. It is important to note that the embodiments provide detailed modes of execution and specific operating processes on the premise of the present technical solution, but the scope of protection of the present invention is not limited to the embodiments.
The present invention relates to a solder paste comprising a mixture of different solder alloys and a solder flux. The solder paste is used to solder different devices. The solder paste comprises two or more solder alloys or metals mixed with a solder flux material. The first solder alloy or metal will form the body of a soldering seam during the reflow. The second solder alloy or metal or any additional solder alloy or metal is selected according to the chemical reaction of devices to be soldered or the affinity to the first solder alloy. The melting temperature Tm(B) of the second solder alloy is lower than the melting temperature Tm(A) of the first solder alloy. The second solder alloy melts and spreads to devices to be soldered during the reflow soldering. When the first solder alloy melts, the existence of the second solder alloy helps place the melted first solder alloy onto devices to be soldered. The second solder alloy is used to be completely converted into an Intermetallic Compound (IMC) and produces the least or no low-melting-point phase in the final soldering seam. Additives in the solder paste are used to improve reaction chemistry during the reflow, better the wettability, control the IMC thickness, and enhance the bonding strength.
During the reflow soldering, the temperature of the soldering assembly 50 first rises above the melting temperature Tm(B) of the second solder alloy 20. The second solder alloy 20 melts and spreads around the first solder alloy particles that are still in the solid state on the first device 11. The surface chemical reaction of the second solder alloy 20 contributes to the wetting of the second solder alloy 20 on the first device 11. It also causes the formation of an IMC layer between the melted second solder alloy 20 and the first device 11. The IMC layer is mainly controlled by the amount of the second solder alloy 20 of the initial solder paste 10.
The second solder alloy 20 is designed to have a good affinity to the first solder alloy 30. In some embodiments, the affinity causes part of the first solder alloy 30 to dissolve in the melted second solder alloy 20 to form a mixture of the first solder alloy 30 and the second solder alloy 20.
As the temperature continues to rise above the melting temperature Tm(A) of the first solder alloy 30 during the reflow soldering process, the first solder alloy 30 melts to form a solution of the first solder alloy 30 and the second solder alloy 20, which wets the IMC layer. As the soldering assembly 50 remains above Tm(A), the second solder alloy 20 is removed from the solution, the IMC layer is increased, and the melted first solder alloy 30 remains. In some other embodiments, in addition to forming an IMC layer, excessive components from the second solder alloy 20 are incorporated into the IMC together with components from the first solder alloy 30. The affinity between the first solder alloy 30 and the second solder alloy 20 helps improve the wettability of the first solder alloy 30 on the IMC layer, thus enhancing the bonding strength.
Technicians in this field shall understand that, in some other embodiments, the temperature continues to rise but does not reach and exceed the melting temperature Tm(A) of the first solder alloy 30 during the reflow soldering process. At this moment, the first solder alloy 30 does not finish melting, but in the condition of the solder alloy 20 being completely dissolved, the first solder alloy 30 is partly dissolved into the solution of the second solder alloy 20, which wets the IMC layer. In addition, components from the second solder alloy 20 are incorporated into the IMC together with components from the partly dissolved first solder alloy 30.
As the soldering assembly 50 cools down during the reflow soldering process, a solder bump or soldering seam is formed on the first device 11 that binds to the IMC. This IMC binds to the solidified first solder alloy 30. In addition, a homogeneous soldering seam with an improved bonding interface is formed after solidification. Particles of the first solder alloy 30 are randomly suspended in the solder bump or soldering seam after the reflow soldering, as shown in
A solder bump or soldering seam produced by the use of a solder paste consisting of the elements of the mixed alloy 10, especially the first solder alloy 30 and the second solder alloy 20, show better properties than a solder bump or soldering seam produced by the use of a solder paste containing a single solder alloy.
In this embodiment, the mixed alloy solder paste 10 includes an Sn—Cu or Sn—Cu—Ag alloy as the first solder alloy 30 and Sn or an Sn alloy as the second solder alloy 20. The Sn alloy includes an Sn—Ag alloy, an Sn—Cu alloy or an Sn—Ag—Cu alloy or an Sn—Ag—Cu—Y alloy, where Y is Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn. In addition, the mixed alloy solder paste includes a powder of the first solder alloy 30 in an amount ranging from 30 wt % to 95 wt % and a powder of the second solder alloy 20 in an amount ranging from 5 wt % to 70 wt %. The Sn—Cu alloy of the first solder alloy 30 has a solidus temperature of 200° C. to 260° C. The Sn or Sn alloy of the second solder alloy 20 has a solidus temperature below 250° C. The Sn or Sn alloy has a lower melting temperature than the Sn—Cu or Sn—Cu—Ag alloy. The mixed alloy solder paste in this embodiment can be used, for example, in a field that needs to use the multiple reflow soldering process for surface mounting of electronic devices on PCBs. For example, in the packaging process of sensors based on MEMS technology, it is necessary to perform the chip-level packaging of sensing elements, followed by the device-level and system-level packaging. The mixed solder paste in this embodiment is preferably used in the chip-level packaging. The maximum temperature for reflow soldering is generally 250° C. in the chip-level packaging.
By referring to the Sn—Cu binary phase diagram of
In the chip-level packaging of the MEMS sensor, the mixed alloy solder paste 10 is applied between the Cu substrate of the first device 11 and the MEMS sensing element. The temperature rises during the reflow soldering. When the temperature reaches and exceeds the melting temperature of the powder of the second solder alloy 20 of the mixed alloy paste 10, the powder of the second solder alloy 20 completely melts to form an Sn-containing IMC layer on the surface of the Cu substrate of the first device 11. The good affinity between Cu and Sn ensures that the melted Cu has a good adhesion to the Sn-containing IMC layer.
When the reflow soldering temperature rises to a temperature required for the chip-level packaging of MEMS sensors such as 250° C., it does not reach the melting temperature of the powder of the first solder alloy 30. At this moment, under the condition of the solder alloy 20 being completely melted, the first solder alloy 30 is partly dissolved into the solution of the second solder alloy 20, which wets the IMC layer. In addition, components from the completely melted second solder alloy 20 are incorporated into the IMC together with components from the partly dissolved first solder alloy 30. Specifically, the first solder alloy 30 partially dissolves to release Cu, which will dissolve into the solution of the completely melted second solder alloy 20. Cu released from partial dissolution of the first solder alloy 30 is also incorporated into the IMC together with components from the second solder alloy 20. In addition, the existence of Ag in the second solder alloy 20 converts any excessive Sn released from the partial dissolution of the first solder alloy 30 into Ag3Sn IMC existing in the solder body.
As the assembly cools down during the reflow soldering process, a solder bump or soldering seam is formed on the Cu substrate of the first device 11 that binds to the IMC. This IMC binds to the solidified first solder alloy 30. In addition, a homogeneous soldering seam with an improved bonding interface is formed after solidification. At this moment, the melting point of the solder bump or soldering seam rises due to the addition of Cu. Therefore, when the next level of packaging of MEMS sensors such as device-level or system-level packaging is performed and the temperature required for reflow soldering is reached, the solder bump or soldering seam with an elevated melting point is difficult to melt or melts slowly. The manufacturing of MEMS sensors is finished after multiple reflow soldering.
In an embodiment of the present invention, the first solder alloy 30 includes 10 wt %-50 wt % of Cu, and 0 wt %-4 wt % of Ag, with the remainder being Sn.
In an embodiment of the present invention, the second solder alloy 20 includes at least one of Cu and Ag, for example, 0 wt %-3 wt % of Cu, 0 wt %-4 wt % of Ag, and the remainder being Sn or Sn and other additives such as Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn.
On the other hand, the embodiment of the present invention provides a method of making the preceding mixed alloy solder paste 10. The method comprises forming particles of the first solder alloy 30 and second solder alloy 20 grain and then mixing particles of the first solder alloy 30 and second solder alloy 20 particles and the solder flux to form a mixed alloy solder paste 10. The final mixed alloy solder paste 10 includes a powder of the first solder alloy 30, and a powder of the second alloy 20, with the remainder being solder flux. The first solder alloy 30 is an alloy that has a liquidus temperature of 200° C.-260° C. In this embodiment, the first solder alloy 30 is an Sn—Cu or Sn—Cu—Ag alloy.
Furthermore, the second solder alloy 20 is an alloy that has a liquidus temperature below 250° C. In this embodiment, the second solder alloy 20 is Sn or an Sn alloy. Specifically, the Sn alloy includes an Sn—Ag, Sn—Cu, or Sn—Ag—Cu alloy. In this embodiment, the mixed alloy solder paste 10 includes 30 wt % to 95 wt % of a powder of the first solder alloy 30 and 5 wt % to 70 wt % of a powder of the second solder alloy 20.
Furthermore, the first solder alloy 30 includes 10 wt %-50 wt % of Cu, and 0 wt %-4 wt % of Ag, with the remainder being Sn.
Furthermore, the second solder alloy 20 includes at least one of Cu and Ag, for example, 0 wt %-3 wt % of Cu, 0 wt %-4 wt % of Ag, and the remainder being Sn or Sn and other additives such as Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn.
In the further embodiment, powder of the second solder alloy 20 includes powder consisting of a plurality of types of powder. For example, powder of the second solder alloy 20 includes a mixture of alloys other than the alloys described in this embodiment. In some embodiments, the relative amount of the first solder alloy 30 and second solder alloy 20 in the mixture paste 10 is determined according to the solder application
According to the preceding embodiments of the present invention, a mixed alloy solder paste with a variable melting point is provided. During the reflow soldering process, the solder bump or soldering seam formed after the cooling of the solder paste has a higher melting point than that before the reflow soldering so that the remelting of the solder bump or soldering seam can be inhibited in the multiple reflow soldering, which helps the high-temperature solder withstand multiple reflow without causing any functional failure. Technicians in this field shall understand that the melting fluidity of the mixed alloy solder paste depends on the mixing ratio of the melted part to non-melted part of the mixed alloy solder paste, and so the melting fluidity of the mixed alloy solder paste can be adjusted to adapt to different usage scenarios.
Technicians in this field can make various corresponding changes and modifications according to the preceding technical solution and conception, and all of such changes and modifications shall be included in the scope of protection of the claims of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201811285893.3 | Oct 2018 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2019/079580 | 10/30/2019 | WO |
