This application claims the benefit of U.S. Provisional Application No. 60/290,622 filed May 14, 2001.
Number | Name | Date | Kind |
---|---|---|---|
4061017 | Sloane et al. | Dec 1977 | A |
5226326 | Polen et al. | Jul 1993 | A |
5471877 | Brown | Dec 1995 | A |
5841030 | Honsberg et al. | Nov 1998 | A |
5929340 | Cochran et al. | Jul 1999 | A |
6005404 | Cochran et al. | Dec 1999 | A |
6006163 | Lichtenwalner et al. | Dec 1999 | A |
6363789 | Rassaian et al. | Apr 2002 | B1 |
Entry |
---|
Yang, Q ; Lim, G ; Lin, R ;Yap, F; Peng, H; Wang, Z; “Experimental Modal Analysis of PBGA Printed Circuit Board Assemblies”;Proceedings 1997 Electronic Packaging Technology Conference; Oct. 1997; pp 290-296.* |
Garry, W; “Developing an ESS Automation Tool”;Proceedings Annual Reliability And Maintainability Symposium; 1989; pp 495-501.* |
D.J. Ewins, Modal . . . and Practice, 1984, pp. 57-59, 157, 159, 224-226, 255-256, RSP Ltd, Gr. Britain. |
Number | Date | Country | |
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60/290622 | May 2001 | US |