BRIEF DESCRIPTION OF THE DRAWINGS
The aforementioned and other features and objects of the present invention and the manner of attaining them will become more apparent and the invention itself will be best understood by reference to the following description of a preferred embodiment taken in conjunction with the accompanying drawings, wherein:
FIG. 1 shows a typical configuration of racks in a data center according to one embodiment of the present invention;
FIG. 2 shows a high level block diagram for modular cooling of electronic components while preserving the integrity of a data center cooling structure according to one embodiment of the present invention;
FIG. 3 shows a system for modular cooling of electronic components while preserving the integrity of a data center cooling structure according to one embodiment of the present invention;
FIGS. 4
a and 4b show a perspective view of one embodiment of a modular component and conductive element for use in a system for modular cooling of electronic components according to the present invention;
FIG. 5 shows a side view of one embodiment of a conductive element for use in a system for modular cooling of electronic components according to the present invention;
FIGS. 6
a and 6b comprise two side views of the conductive element of FIG. 5 showing the operation of a tightening device to increase surface contact and thermal transfer between opposing portions of the conductive element according to one embodiment of the present invention;
FIG. 7 is a high level block diagram of an alternate embodiment for modular cooling of electronic components while preserving the integrity of a data center cooling system according to the present invention;
FIG. 8 shows another schematic of the alternate embodiment of FIG. 7 for modular cooling of electronic components while preserving the integrity of a data center cooling structure according to the present invention;
FIG. 9 shows a perspective view of a rack for housing modular components using a system for cooling of electronic components while preserving the integrity of a data center cooling structure according to one embodiment of the present invention; and
FIG. 10 is a flow diagram for a method for modular cooling of electronic components while preserving the integrity of a data center cooling structure according to one embodiment of the present invention.
The Figures depict embodiments of the present invention for purposes of illustration only. One skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the invention described herein.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention is illustrated and described in terms of the aforementioned figures. A data center houses a multitude of electronic components and devices such as servers, data storage devices, tape drives, communication switches, and other electronic components in a single location. By consolidating the location of these electronic components, security, fire suppressant, as well as environmental considerations can be economized. FIG. 1 shows a typical data center 100 according to one embodiment of the present invention. As previously described, the density of electronic components and the heat that these components produce has risen to the point of requiring new and innovative means to control the environment in which they operate.
The data center 100 of FIG. 1 shows multiple racks 110 or cabinets in which the electronic components are maintained. In each rack 110, multiple modular components, designed so as to be easily removed and replaced, are housed. The racks 110, however, are typically semi-permanent components of the data center 100. According to the present invention, each rack is coupled to a cooling structure that centrally provides a liquid cooling resource 120 to each rack 110. In the embodiment shown in FIG. 1, a cooling resource 120 is shown as a separate entity from the data center 100 housing the racks 110 of electronic components. The cooling resource 120 is functionally connected to each rack 110 in the data center 100 to provide each rack 110 with a cooling means. As shown in FIG. 1, a series of coolant lines 130 supplies each rack with a coolant or refrigerant. As the coolant accepts heat from each of the racks 110 comprising the data center 100, the now warm coolant is returned to the cooling center 120 via separate return lines 140.
The cooling resource 120 acts to reject the heat acquired by the coolant so as to maintain the data center 100 environment. As will be appreciated by one skilled in the art, the cooling resource 120 may be any commercial cooling system or refrigeration type of system capable of taking large volumes of heated water or other types of coolant, extracting the heat from the liquid, and returning to the data center 100 a cool resource that can be used to cool electronic components. The cooling resource 120 is maintained separate from the data center 100 so as to extricate the heat from the data center 120 environment.
As previously described, electronic components are frequently removed and replaced. It is one object of the present invention to provide the means to remove and replace the various electronic components associated with a data center 100 without affecting the integrity of the data center's 100 cooling system. FIG. 2 shows a high level block diagram for modular cooling of electronic components while preserving the integrity of a data center cooling system according to one embodiment of the present invention. The cooling system of FIG. 2 shows two racks 210, each having multiple modular components 250. As shown in FIG. 2, each rack 210 is coupled to a cooling system comprising a cooling resource 120 and cooling feed and return lines 220.
The cooling resource 120 in FIG. 2 is shown to possess a condenser 230 for removing the heat from the liquid contained within the cooling feed and return line system 220 and a pump 240 to circulate the coolant. Components such as temperature sensors, pressure sensors, evaporators, and other elements known to one skilled in the relevant art are contemplated by the present invention. Furthermore, implementation methodologies for providing a liquid cooling resource are known within the art and the specifics of their application within the context of the present invention will be readily apparent to one of ordinary skill in the relevant art in light of this specification.
As shown in FIG. 2, the cooling resource 120 provides coolant to each of the racks 210. In one embodiment of the present invention, each rack possesses a heat exchanger 260 for each modular unit 250. In this example, each rack 120 possesses three modular units 250. Each unit is coupled to a heat exchanger 260 which is in fluid communication with the cooling line system 220.
In one embodiment of the present invention, each modular unit 250 possesses an internal liquid cooling system that is distinct from the data center cooling system. The modular cooling system channels coolant to the various electronic components within the modular unit so as to extract heat from each of the electronic components and deliver it to the heat exchanger 260 associated with the data center cooling system.
The modular cooling system can be contained within each module or can be part of a rack cooling system that is then thermally coupled to the data center 100 cooling system. When the modular cooling system is contained within each module it may employ an internal pump to circulate the coolant within the module or utilize heat pipes that rely on phase changes in the coolant to convey heat from the electronic components to the heat exchanger 260. Significantly, both approaches maintain the integrity of the primary data center 100 cooling system. The removal and/or replacement of modular units 250 in no way affects the integrity of the data center cooling system and thus does not jeopardize a data center 100 cooling system shut down that would render the entire data center inoperative.
As mentioned, each modular unit 250 may possess an internal liquid cooling system or set of heat pipes designed to convey the heat, typically from the enclosed electronic components or heat sources, out of the modular unit 250 and ultimately external to the data center environment. FIG. 3 shows such a system for modular cooling of electronic components according to one embodiment of the present invention.
FIG. 3 shows two liquid cooling system loops. The first liquid cooling loop 305 refers to the cooling loop implemented to extract heat from the electronic components within the modular unit 250 and convey it to the heat exchanger 260. The liquid loop can be comprised of various types of liquid coolants or refrigerants as will be appreciated by one skilled in the art. Likewise various designs and their implementation of an internal liquid cooled system are contemplated by the present invention and each can be successfully utilized by the present invention. As with the data center cooling system, the implementation methodologies for providing liquid cooling to electronic components in a modular unit are known within the art and the specifics of their application within the context of the present invention will be readily apparent to one of ordinary skill in the relevant art in light of this specification.
In the embodiment shown in FIG. 3, the first cooling loop 305 possesses a means 320 by which the coolant is in thermal contact with the electronic components. A pump 330 circulates the coolant of the first cooling loop 305 via a cooling conduit 310 maintained within the modular unit 250. Also associated with the first cooling loop 305 is a heat exchanger 340 that provides a means to convey heat from the first cooling loop 305 to a second cooling loop 395 which, in this case, is synonymous to the data center 100 cooling system. The second cooling loop 395 receives heat via a heat exchange 370 that is in fluid and thermal communication with the second cooling loop's 395 cooling line system 220.
Interposed between the heat exchangers associated with the first cooling loop 305 and the second cooling loop 395 is a thermally conductive element 355. The conductive element 355 can provide support for mounting the modular unit 250 within the rack as well as conveying heat from the first heat exchanger 340 to the second heat exchanger 370. In other embodiments of the present invention the modular unit 250 is supported in the rack by a mounting fixture independent of the thermally conductive element 355. The conductive element, in one embodiment of the present invention, comprises a first portion 350 associated with the first cooling loop 305, and a second portion 360 associated with the second cooling loop 395. The first portion of the conductive element 350 accepts heat from the first cooling loop 305 heat exchanger and transfers that heat to the second portion of the conductive element 360. Correspondingly, the second portion of the conductive element 360 conveys the heat to the heat exchanger associated with the second cooling loop 395 which ultimately transfers the heat to the coolant within the loop and away from the data center.
In one embodiment of the present invention, the first and second portion of the conductive element 355 comprise interlocking surfaces. These surfaces can take of the form of fins, ridges, rails, and other shapes conducive to thermal conduction. As the two portions come together and into contact with each other, heat is transferred from the first portion of the conductive element 350 to the second portion of the conductive element 260 via conduction. Conduction is the process of energy transfer as heat through a stationary medium such as copper, water or air. In solids the energy transfer arises because atoms at the higher temperature vibrate more excitedly, hence they can transfer energy to more lackadaisical atoms nearby by microscopic work, that is, heat. In metals the free electrons also contribute to the heat-conduction process. In a liquid or gas the molecules are also mobile, and energy is also conducted by molecular collisions.
The other heat transfer mechanism is radiation which is the transfer of energy by disorganized photon propagation. The fact that radiation is disorganized makes radiation a very inefficient means to transfer heat. Convection is another term sometimes associated with heat transfer. Convection is the transfer of energy between moving fluids and solids. What is convected however is internal energy and not heat. A convective process may have some conductive heat transfer associated with it but convection is not the means of that transfer.
The heat transfer processes associated with the above described embodiment implements several instances of conduction. First, heat is conducted from the electronic components to the liquid in the first loop 310. Second, the heat in the first liquid is conducted to the first portion of the conductive element 350. Next, heat collected by the first portion of the conductive element 350 is conducted, and radiated, to the second portion of the conductive element 360. Thereafter heat gained by the second portion of the conductive element 360 is transferred via conduction to the liquid associated with the second cooling loop 395 and carried away from the data center 100 to the cooling center 120 where it is extracted from the second liquid.
Optimally, the joining of the first portion of the conductive element 350 and the second portion of the conductive element 360 creates a coupling that provides for maximal surface to surface contact so as to enhance conduction rather than rely on radiation as a means for heat transfer. The thermal interface between the first portion of the conductive element 350 and the second portion of the conductive element 360 can be enhanced by co-joining to each respective surface a thermally conductive interface material. The thermally conductive interface material improves thermal conducting by minimizing and ideally eliminating any voids or gaps between the respective portions. The minimization of voids, even at a microscopic level, significantly enhances the thermal conduction between conductive surfaces. The implementation methodologies of using such interface material is well known within the art and the specifics of their application within the context of the present invention will be readily apparent to one of ordinary skill in the relevant art in light of this specification.
FIG. 4 shows a perspective view of one embodiment of a modular component and conductive element for use in a system for modular cooling of electronic components according to the present invention. The modular unit 250 shown in FIG. 4 can be used to house various electronic components (not shown). Within the modular unit a series of conduits and capillaries interface with, and are in thermal contact with, the electronic components so as to enable coolant within the first cooling loop to collect heat. The heated liquid enters a channel or conduit 415 in the first portion of the conductive element 350 via two inflow ports 410. The channel 415, as shown in subsequent figures, acts as a heat exchanger 340 to conduct heat from the liquid and to the first portion of the conductive element 350. The liquid exits the channel (heat exchanger) and reenters the area housing the electronic components via two similar exit ports 420 at the opposing end of the first portion 350. Similarly, the second portion of the conductive element 360 also has two channels 435 acting as a heat exchanger 370 possessing two input ports 430 and two exit ports 440.
As shown in FIG. 4, the conductive element 355 is a joining of opposing extensions or fins. The first portion of the conductive element 350 possesses a plurality of extensions along each longitudinal edge of the modular unit 250 creating a series of extensions and troughs. The second portion of the conductive element 360 is fixed to the rack and also possesses a plurality of extension and troughs opposing those of the first conductive element 350.
The modular unit 250 is supported by the extensions associated with the first portion of the conductive element 350 and the second portion of the conductive element 370. Accordingly, the extensions must be of sufficient strength to support the weight associated with the modular unit, the cooling system that is maintained within the modular unit, and the electronic components that reside in the modular unit 250. In this embodiment of the present invention, the extensions allow the modular unit 250 to slide into the rack facilitating both the mounting of the modular unit 250 and heat transfer simultaneously.
FIG. 5 shows a side view of one embodiment of a conductive element for use in a system for modular cooling of electronic components according to the present invention. Each extension 510 or surface associated with the first portion 350 shown in FIG. 5 is positioned to align with a trough of the second portion 360 and likewise the extension 520 of the second portion 360 is aligned with a trough of the first portion 360. The only exception to this configuration lies in the two bounding extensions 525 of the second portion. To fully capture and provide an optimal means for conductive heat transfer, each surface of the extensions from the first portion 350 are captured by a trough of the second portion 360. As a result, the number of extensions of the second portion 360 necessarily exceeds the number of extensions of the first portion 350 by at least one. (This feature can be fully seen in FIG. 5 as described below.) As shown in FIG. 5, the second portion of the conductive element 360 has seven extensions while the first portion of the conductive element 350 possesses six.
The shape of the extensions 510, 525 may vary as will be appreciated by one skilled in the art, provided a complimentary interface that maximizes surface area contact between the first and second portions of the conductive element is established. In the embodiment shown in FIG. 5, the extensions are trapezoidal in shape. Associated with the extensions, and shown in FIG. 5, is a tightening device 530 configured to drive the extensions associated with the first portion of the conductive element 350 into the troughs associated with the second portion of the conductive element 360 thus ensuring maximal surface contact between the two respective portions. FIG. 6 comprises two side views of the conductive element of FIG. 5 showing the operation of the tightening device 530 to increase surface contact and thermal transfer between opposing portions of the conductive element. In this embodiment of the present invention, the device 530 is associated with a cam that upon rotation drives the portions of the conductive element together. As the device 530 is rotated down, the cam places pressure on the first portion of the conductive element 350 forcing it into the stationary second portion of the conductive element 360. FIG. 6a shows the device in the closed, full contact position, and FIG. 6b shows the device in the open or retracted position revealing space between the extensions and the troughs of the respective portions of the conductive element to facilitate installation and removal of the modular unit 250.
FIG. 7 is a high level block diagram of an alternate embodiment for modular cooling of electronic components while preserving the integrity of a data center cooling system according to the present invention. Depicted in FIG. 7 is a rack 110 that is thermally coupled to the data cooling center 100. Each rack 110 houses a plurality of modular units 250 that convey heat to one or more heat exchangers 720. The heat exchanger assemblies 720 are comprised of pumps and controls 705, manifolds 725, and radiators 715. Heat from each modular unit 250 is transferred from the modular unit cooling system to the data center cooling system 100 via the heat exchanger assembly 720 maintained within each rack 110.
FIG. 8 shows a high level schematic of the alternate embodiment of FIG. 7 for modular cooling of electronic components according to the present invention. As described above, the system presented in FIGS. 7 and 8 shows an alternate means for transferring heat from the modular units 250 to the second cooling loop 395 that is associated with the data center 100 cooling system. According to this embodiment of the present invention, the first cooling loop 810 is associated with the rack of modular units rather than each individual modular unit 250. Each modular unit possesses an internal network of channels and capillaries 840 that are in thermal contact with the electronic components contained within the modular unit. As described in previous embodiments, heat produced by the electronic components is transferred to a coolant associated with the first cooling loop 810.
FIG. 8 shows the first cooling loop 810 extracting heat from the electronic components associated with three modular units installed in the rack. As opposed to the first cooling loop 810 being entirely contained within each modular unit as previously described, the first cooling loop is associated with each modular unit in the rack via a series of quick connect/disconnects. Each modular unit, upon installation into the rack, connects to the cooling loop 810 associated with that rack eliminating the need for each modular unit to have a pump and means to transfer heat to the second cooling loop 395. Rather, a centralized pump 830 associated with each rack circulates coolant to each of the installed modular units. Thus, the operation of the first cooling loop 810 is continuous and independent of the number of installed modular units.
As the coolant from the first cooling loop 810 circulates to the various modular units, it collects heat from various electronic components contained within. The first cooling loop 810 conveys the coolant to a heat exchanger assembly 720 which interfaces with the second cooling loop 395. The heat exchanger assembly 720 allows heat associated with the first cooling loop 810 to be transferred to the second cooling loop 395 via conduction. As previously described, the second cooling loop 395 carries the heat via coolant associated with the second cooling loop 395 outside of the data center 100 environment.
FIG. 9 shows a perspective view of a rack for housing modular components using a system for cooling of electronic components according to the embodiment of FIG. 7 while preserving the integrity of a data center cooling structure. Each modular unit 250 is coupled to the cooling system for the rack 110 via input connections 920 and an input conduit 925 as well as output connections 930 and an output conduit 935. The rack 110 is also coupled to the data center cooling system 100 via a system input connection 940 and a system output connection 950. Internal to the rack (not shown) is a pump for circulating coolant associated with the rack coolant system to each modular unit 250, and a heat exchanger assembly 720 for conveying the heat collected by the coolant of the rack cooling system to the coolant associated with the data center cooling system. Conduits within the rack 110 transport the coolant associated with rack coolant system 960 to the heat exchanger assembly. Likewise, conduits 970 fluidly couple the data center cooling system 100 to the heat exchanger assembly 720 wherein heat is conveyed from the rack coolant system to the data center cooling system 100. While the rack 110 becomes a permanent part of the data center cooling system 100, each modular unit 250 may be removed and replaced without affecting the integrity of the data center cooling system 100.
FIG. 10 is a flow diagram for a method for modular cooling of electronic components while preserving the integrity of a data center cooling structure according to one embodiment of the present invention. Heat associated with electronic components housed in each modular unit is transferred 1010 to a coolant associated with the first cooling loop. The coolant associated with this first cooling loop is thereafter transported 1030 to a heat exchanging system. The heat exchanging system conveys 1050 heat from the first cooling liquid associated with the first cooling loop to a second coolant associated with a second cooling loop. As described above, the heat exchanging system may comprise a conductive element or other configurations to convey the heat from one cooling loop to another. The second cooling loop thereafter transports 1070 the second coolant and heat associated therewith away from the data center environment.
The aforementioned embodiment of the present invention uses two or more liquid cooling loops to convey heat away from electronic components while maintaining the integrity of the cooling system associated with a data center. As will be appreciated by one skilled in the art, variations of the theme of the present invention are possible without departing from the intent and contemplated scope of the invention.
Particularly, it is recognized that the teachings of the foregoing disclosure will suggest other modifications to those persons skilled in the relevant art. Such modifications may involve other features which are already known per se and which may be used instead of or in addition to features already described herein. Although claims have been formulated in this application to particular combinations of features, it should be understood that the scope of the disclosure herein also includes any novel feature or any novel combination of features disclosed either explicitly or implicitly or any generalization or modification thereof which would be apparent to persons skilled in the relevant art, whether or not such relates to the same invention as presently claimed in any claim and whether or not it mitigates any or all of the same technical problems as confronted by the present invention. The Applicant hereby reserves the right to formulate new claims to such features and/or combinations of such features during the prosecution of the present application or of any further application derived therefrom.
Patent Application
20070297136
