Modular measurement instrument

Information

  • Patent Grant
  • D444086
  • Patent Number
    D444,086
  • Date Filed
    Monday, March 13, 2000
    24 years ago
  • Date Issued
    Tuesday, June 26, 2001
    22 years ago
  • US Classifications
    Field of Search
    • US
    • D10 46
    • D10 75
    • D10 81
    • D10 78
    • D14 100
    • 073 431
    • 073 3365
    • 128 630
    • 128 745
    • 128 746
    • 340 5731
    • 340 5733
    • 340 601
    • 340 576
    • 340 521
    • 364 41308
    • 364 41309
    • 324 158
  • International Classifications
    • 1004
    • Term of Grant
      14Years
      Disclaimer
      Terminal disclaimer
Abstract
Description




The ornamental design disclosed in the application is for a modular measurement instrument having a display and processor module with raised bumper guards at the corners, a bi-level rear surface, an array of raised protrusions on the right and left sides of the display screen, an array of ribs formed on the left side of the instrument and extending onto the top and bottom surfaces with the top surface ribs terminating adjacent to the array of raised protrusions, and array of raised protrusions on the rear surface of the instrument adjacent to the ribs and a measurement module positioned on the lower surface of the bi-level rear surface such that the top surface of the measurement module is approximately level with the upper surface of the bi-level rear surface with the rear surface of the measurement module having an array of raised protrusions adjacent to the right side surface of the modular measurement instrument.




FIG. 1 is a perspective view of a modular measurement instrument;




FIG. 2 is a front elevation view of the modular measurement instrument;




FIG. 3 is a rear elevation view of the modular measurement instrument;




FIG. 4 is a left side elevation view of the modular measurement instrument;




FIG. 5 is a right side elevation view of the modular measurement instrument.




FIG. 6 is a top plan view of the modular measurement instrument; and,




FIG. 7 is a bottom plan view of the modular measurement instrument.



Claims
  • The ornamental design for a modular measurement instrument, as shown and described.
US Referenced Citations (4)
Number Name Date Kind
D. 383400 Wada Sep 1997
D. 412156 Mizusugi et al. Jul 1999
5410474 Fox Apr 1995
6111501 Honeyager et al. Aug 2000