1. Field of the Invention
The present invention relates generally to satellite design. More particularly, the present invention relates to modular design for small satellite fabrication and construction.
2. Related Art
In the last 15 years small satellites have opened a window through which the aerospace industry can rapidly access low earth orbit at a fraction of the cost required by large spacecrafts. The cost to place any size object in space, however, can still be exorbitant. The harsh environment of space typically requires that every component used to build a satellite be thoroughly tested on Earth before the satellite is launched to provide the greatest probability that the satellite will function properly in space. The costs for construction and testing can quickly add up.
Most satellites are designed based upon the specific mission that they will perform. This approach works well for unique programs with large budgets. Fixed budget and low cost programs, however, can require that the design and testing of satellite components be reduced.
A system and methods are disclosed for a modular platform configured to carry small payloads into orbit. The system comprises a prefabricated module comprising a plurality of panels. An orthogrid pattern can be located on an inner side of one or more of the panels. The orthogrid pattern can comprise an array of orthogonal recessed areas surrounded by an orthogrid wall. The system can include a bolt pattern comprising an attachment location placed near each corner of each recessed area. A torquer coil can be integrated into one or more of the panels.
Additional features and advantages of the invention will be apparent from the detailed description which follows, taken in conjunction with the accompanying drawings, which together illustrate, by way of example, features of the invention.
a is an embodiment of a side panel of the modular platform system in accordance with the present invention;
b is an illustration showing different thicknesses of panels used within the modular platform, in accordance with an embodiment of the present invention;
c is a perspective view of a top panel having a torquer coil in accordance with an embodiment of the present invention;
d is an embodiment of the present invention illustrating a panel having an orthogrid with a plurality of attachment locations having uniform helicoils;
a is an embodiment illustrating the modular platform system having an inner deck for placement of components with a high mass or high cantilever configuration in accordance with the present invention;
b is an exploded view of the modular platform system having a plurality of decks in accordance with an embodiment of the invention;
Reference will now be made to the exemplary embodiments illustrated in the drawings, and specific language will be used herein to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended. Alterations and further modifications of the inventive features illustrated herein, and additional applications of the principles of the inventions as illustrated herein, which would occur to one skilled in the relevant art and having possession of this disclosure, are to be considered within the scope of the invention.
One method for reducing the cost of design and test of a satellite is to create standards. Standardized modules can be thoroughly designed and tested for the rigors of space, allowing them to be available as off the shelf components. Engineers can select standardized modules and their respective parts that have been proven to be reliable. The necessary infrastructure, manufacturing, and documentation can be minimized.
A design and construction standard for small satellites, including micro, nano, and pico-satellites is needed to reduce the cost of manufacturing and testing these satellites. Prefabricated modules that can be used to house components for such satellites are greatly desired. As illustrated in
The panels can be formed to couple and support mechanical and electrical satellite components such as payload components, communications components, power and power management components, propulsion components, attitude determination components, data gathering and processing components, etc. In the present invention, satellite components can refer to both individual electrical and mechanical components (i.e. circuit chips, resistors, capacitors, inductors, etc.) and modules (i.e. transmitters, receivers, detectors, etc.). The panels can be formed in such a way as to maximize the allowable space for the satellite components to be housed within the enclosure formed by the panels. The panels can be configured to allow the satellite components to be attached using standardized attachment means such as screws, bolts, rivets, or other attachment means. The panels will be discussed in more details below.
The panels can be joined using various connectors such as screws or bolts. The panels may be formed of metal or composite materials. Each of the panels can have an orthogrid pattern 116 on an inner side. The orthogrid pattern can be made up of a plurality of substantially quadrilateral areas coincident to one another. The quadrilateral areas can include a recessed area. The recessed area can be milled from the panel to form the orthogrid pattern comprising an array of recessed areas 204, as shown in
The recessed areas may also be formed using die stamping or plastic forming techniques. Each of the recessed areas can be substantially square. The recessed areas can each have four attachment locations 220. The attachment locations can be placed at each of the four corners of each recessed area. In one embodiment, the attachment locations of one recessed area can be shared with the attachment locations of adjoining recessed areas. Thus, four adjoining recessed areas may have a total of nine attachment locations. The positioning of the attachment locations on the panels is designed to substantially optimize the number of satellite components that can be securely carried within the enclosure.
The recessed areas 204 can be formed as a closed grid pattern machined into each panel. In one embodiment, the panels can have at least three different thicknesses, as shown in
The box attachment area can also act as a wall for the array of recessed areas 204, referred to as an orthogrid, to form an orthogrid wall. Each recessed area can have a third thickness 216, recessed below the orthogrid wall. In one embodiment, the third thickness can be less than 0.05 inches. The array of recessed areas in the orthogrid can reduce the weight of each panel. The attachment locations 220 located in the corner of each recessed area can have a surface of substantially similar thickness to the box attachment area and orthogrid wall 212. The attachment locations can have an area sufficient to be drilled to have a mounting hole 224 placed within each attachment location, as shown in
Each of the mounting holes 224 can be tapped to have a substantially similar thread size. Alternatively, a helicoil having a substantially similar thread size can be placed within each of the mounting holes. The substantially similar thread size can reduce the number of fasteners used to attach components to the inside of the panels. In one embodiment, a single fastener size can be used to attach components. Using a single fastener size can reduce the amount of tooling necessary for assembly of the modular platform 100. It can also reduce the time spent selecting and testing numerous fasteners capable of being used in space.
Referring again to
Referring to
The panel sub-system 300, as shown in
Each panel sub-system 300 can contain one or more intra-module connectors 320. Electrical wiring and cabling 324 from the components 304 and modules 308 on each panel sub-system can be routed to the intra-module connector. A harness attachment (not shown) can be connected to the attachment locations 220 to enable placement of electrical wiring and cabling. Tape and glue typically do not work well in the extremes of outer space, due to extreme temperatures and outgassing of glues in the vacuum of space. Therefore, it can be advantageous to use the harness attachment to secure wiring and cabling to the attachment locations. A standard threaded pattern can be used for the harness attachment. Wiring the components and modules to the intra-module connector can enable the panel sub-system to be quickly assembled and tested with other sub-systems.
One exemplary panel of the modular platform system can comprise an integrated backplane 404, as shown in
One panel of the modular platform 100 (
In another embodiment, as shown in
The orthogrid and attachment locations make it possible to attach components and wiring at a plurality of positions on the panels of the modular platform. In some instances, one or more decks 604 can be positioned within the modular platform 100 to secure components having a high mass or high cantilever configuration, as shown in
The one or more decks 604 can be installed within the modular platform to minimize vibrations and allow components having a comparatively greater mass to be attached more securely. Each deck can also increase stiffness to the overall modular platform 100. Each deck can be configured to be coupled to two or more orthogrid panels. The deck can be coupled to the orthogrid panel using connectors such as screws, bolts, rivets, or any other type of connector capable of securely mounting a deck to the attachment locations on the orthogrid panel. In one embodiment, the deck can be coupled to the two or more orthogrid panels using the attachment locations 220 (
A deck can contain electrical wire or cables used to connect components on the deck to one or more intra-module connectors. The deck can be electrically connected to the platform via the intra-module connector. The decks can allow more components to be installed within the modular platform and increase surface area perpendicular to a launch axis. This can significantly reduce the strain of heavy components caused by the forces that can occur as the modular platform is launched from Earth into space.
For example, an exploded view of the modular platform 100 is shown in
In one embodiment, each deck 604 can be comprised of an array of through-holes 704 to form an orthogrid deck, as shown in
Similar to the panels, one or more decks can also be used to enable simpler testing of components and modules. The components and modules may need to be placed near each other for testing purposes. Also, components and modules (not shown) can be connected to one or more decks 604 while they are external to the modular platform 100 (
Several different configurations are possible for the modular platform. One embodiment can comprise a light internal component configuration 800 of the modular system, as shown in
Solar panels 808, patch antennae, or other substantially flat accessories can be body mounted to the external side of the panels. Body mounting can reduce complexity by eliminating the need for deployable panels or hinges. The solar panels, patch antennae, and/or other accessories can be connected to the internal wiring by creating through-holes in one or more of the panels. Vented and self-locking fasteners can be used to attach external devices to the panels. The panel can be configured to have an attachment area outside the orthogrid. The attachment area can have a thickness greater than the recessed area. This can enable the attachment area to be used to attach non-standard devices to the modular platform system. Larger through-holes can be machined in a recessed area 204 (
Another embodiment can include a heavy internal component configuration 900 of the modular platform system, as shown in
A further embodiment can comprise an externally deployable module configuration 1000, as shown in
Each deployable module can first be assembled on its respective panel or module and pre-tested with all the components attached to the same module. Other external devices such as one or more patch antennae 1008 can be body mounted to an exterior side of a panel. Windows can be placed in one or more recessed area 204 (
Constructing a small satellite using panels having an orthogrid pattern with a plurality of attachment locations can allow the satellite to be quickly designed and constructed. The orthogrid pattern enables a greater number of satellite components to be included within a required volume. In one embodiment, the attachment locations can reduce the types of connectors used to attach satellite components and decks to the modular platform system. This can further reduce the costs of construction and test. Use of individual panels and decks can enable panel sub-systems to be constructed and tested. The required time and money can be reduced by testing the sub-systems individually and then coupling them together to form the modular platform system.
It is to be understood that the above-referenced arrangements are only illustrative of the application for the principles of the present invention. Numerous modifications and alternative arrangements can be devised without departing from the spirit and scope of the present invention. While the present invention has been shown in the drawings and fully described above with particularity and detail in connection with what is presently deemed to be the most practical and preferred embodiment(s) of the invention, it will be apparent to those of ordinary skill in the art that numerous modifications can be made without departing from the principles and concepts of the invention as set forth herein.
Priority of U.S. Provisional patent application Ser. No. 60/602,283 filed on Aug. 16, 2004 is claimed.
This invention was made with support from the United States Government, and the United States Government may have certain rights in this invention pursuant to DOD AFRL 03-4131.
Number | Date | Country | |
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60602283 | Aug 2004 | US |