Claims
- 1. A modular flow system comprising:one or more stampings having a channel formed therein for receiving one or more flow bridges therein, with a bottom wall of said channel having a springlike raised protrusion formed therein; said flow bridges being formed of a material having a coefficient of thermal expansion less than the material of said channel; said flow bridges being received in said channel wherein said protrusion is depressed wherein said system is preloaded so that when said system is heated to a specified temperature said height of said channel top surface becomes about flush with said top surface of said flow bridges.
RELATED APPLICATIONS
This application is a divisional of Ser. No. 09/544,020, filed Apr. 6, 2000 and fully incorporated by reference herein, which was a continuation of copending International patent application No. PCT/US99/10980 with an International Filing Date of May 18, 1999, which was published in English under PCT Article 21(2) designated the U.S., and which was a continuation in part of International patent application No. PCT/US99/04972 with an International Filing Date of Mar. 5, 1999, which was published in English under PCT Article 21(2) designated the U.S. This application further claims the benefit of U.S. provisional application No. 60/076,871 filed on Mar. 5, 1998, U.S. provisional application No. 60/085,817 filed on May 18, 1998 and U.S. provisional application No. 60/102,277 filed on Sep. 29, 1998.
US Referenced Citations (3)
Provisional Applications (3)
|
Number |
Date |
Country |
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60/076871 |
Mar 1998 |
US |
|
60/085817 |
May 1998 |
US |
|
60/102277 |
Sep 1998 |
US |
Continuations (2)
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Number |
Date |
Country |
Parent |
PCT/US99/10980 |
May 1999 |
US |
Child |
09/544020 |
|
US |
Parent |
PCT/US99/04972 |
Mar 1999 |
US |
Child |
PCT/US99/10980 |
|
US |