MODULAR TRANSISTOR OUTLINE CAN WITH INTERNAL COMPONENTS

Abstract

In one example configuration, an optical package includes a substrate that supports a laser. The laser is configured for electrical communication with circuitry disposed on the substrate, and the laser is arranged to emit an optical signal along a first path. The optical package also includes a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path. The beam steering device is configured such that the optical signal is output from the beam steering device along a second path. A group of electronic leads is provided that electronically communicates with the circuitry on the substrate. In this example, the group includes a set of modulation leads in electrical communication with the laser, and a set of bias leads in electrical communication with the laser. The set of bias leads is electrically isolated from the set of modulation leads.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

To further clarify the above and other aspects of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:

FIG. 1 is a cross-sectional view illustrating an embodiment of a TOSA;

FIG. 2A is a top view illustrating an embodiment of a header assembly for a TO-can;

FIG. 2B is a cross-sectional view taken along line A-A of FIG. 1A;

FIGS. 2C-2D are top views illustrating alternative embodiments of header assemblies;

FIG. 2E is a schematic diagram of an embodiment of a substrate for a header assembly;

FIGS. 3A-3B are schematic diagrams of embodiments of circuits for driving a laser and operating a monitor;

FIGS. 4A-4C are top views of example embodiments of a header assembly incorporating various types of substrates;

FIGS. 5A-5B are side views illustrating aspects of embodiments of OSAs that include a thermal control device; and

FIGS. 6A-6F are side views illustrating embodiments of optical component orientations usable in an OSA.

Claims

1. An optical package, the optical package comprising: a substrate;a laser supported by the substrate and configured for electrical communication with circuitry disposed on the substrate, and the laser being arranged to emit an optical signal along a first path;a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path, and the beam steering device being configured such that the optical signal is output from the beam steering device along a second path; anda plurality of electronic leads in communication with the circuitry on the substrate, the plurality of electronic leads including a set of modulation leads in electrical communication with the laser.

2. The optical package as recited in claim 1, wherein the plurality of electronic leads further includes a set of bias leads in electrical communication with the laser, the set of bias leads being electrically isolated from the set of modulation leads.

3. The optical package as recited in claim 1, wherein the optical package is configured to be implemented in a TO-can.

4. The optical package as recited in claim 1, wherein the beam steering device comprises a turning prism.

5. The optical package as recited in claim 1, wherein the first path is substantially orthogonal with respect to the second path.

6. The optical package as recited in claim 1, further comprising a backreflection inhibitor positioned in the path of the modulated optical signal so that the optical signal in the first beam path or second beam path passes through the backreflection inhibitor.

7. The optical package as recited in claim 6, wherein the backreflection inhibitor comprises a ¼ wave plate.

8. The optical package as recited in claim 1, further comprising at least one other component supported by the substrate, the at least one other component comprising one or more of: a monitor photodiode; an amplifier; driver chip; heating resistor; thermal control device; thermistor; monitor; matching resistor; inductor; capacitor; and, ferrite beads.

9. The optical package as recited in claim 8, wherein the plurality of electronic leads further comprises a set of leads configured and arranged to provide electrical current to the at least one other component.

10. The optical package as recited in claim 9, wherein the set of leads that is configured and arranged to provide electrical current to the at least one other component comprises at least six leads.

11. The optical package as recited in claim 1, wherein the plurality of electronic leads comprises six electronic leads.

12. The optical package as recited in claim 1, wherein at least one of the modulation leads is in electrical communication with at least one of: a matched-resistor; and, a tuning capacitor.

13. The optical package as recited in claim 1, wherein at least one of the bias leads is in electrical communication with one of the following components such that a bias current associated with the bias leads is electrically isolated from a modulation current associated with the modulation leads: an inductor; and, at least one ferrite bead.

14. The optical package as recited in claim 1, wherein the plurality of electronic leads includes at least one ground lead that is in electrical communication with one of the following components: an inductor; and, at least one ferrite bead.

15. The optical package as recited in claim 1, wherein the substrate defines a plurality of cutouts, each of the leads being at least partially received within a corresponding cutout.

16. An optical package, comprising: a substrate having a first surface that is substantially orthogonal with respect to a longitudinal axis of the optical package;a laser supported by the first surface of the substrate, the laser being arranged such that optical signal emitted by the laser travels along a path that is substantially orthogonal to the longitudinal axis; andan optical turner supported by the first surface of the substrate and oriented so as to receive the optical signal from the laser along the first path, and the beam steering device being configured such that the optical signal is output from the beam steering device along a second path that is substantially coincident with the longitudinal axis of the optical package.

17. The optical package as recited in claim 16, further comprising: a set of modulation leads in electrical communication with the laser; anda set of bias leads in electrical communication with the laser, the set of bias leads being electrically isolated from the set of modulation leads.

18. The optical package as recited in claim 16, further comprising: two electronic leads arranged for electrical communication with an electronic component within the package; andfour electronic leads in electrical communication with the laser.

19. The optical package as recited in claim 18, wherein the substrate defines a plurality of cutouts, each of which is configured to at least partially receive a corresponding electronic lead.

20. The optical package as recited in claim 16, wherein the laser comprises one of: a Fabry-Perot (FP) laser; or, a distributed feedback (DFB) laser.

21. The optical package as recited in claim 16, further comprising a backreflection inhibitor positioned in one of: the first path; or, the second path.

22. The optical package as recited in claim 21, wherein the backreflection inhibitor comprises a ¼ wave plate

23. The optical package as recited in claim 16, wherein the optical turner comprises a turning prism.

24. The optical package as recited in claim 16, further comprising a thermal control device in thermal communication with the laser.

25. An optoelectronic module, comprising: a housing;a printed circuit board at least partially disposed within the housing;at least one optical subassembly at least partially disposed within the housing and being in electrical communication with circuitry of the printed circuit board, the at least one optical subassembly comprising: a substrate having a first surface that is substantially orthogonal with respect to a longitudinal axis of the optical subassembly;a laser supported by the first surface of the substrate, the laser being arranged such that optical signal emitted by the laser travels along a path that is substantially orthogonal to the longitudinal axis; andan optical turner supported by the first surface of the substrate and oriented so as to receive the optical signal from the laser along thefirst path, and the beam steering device being configured such that the optical signal is output from the beam steering device along a second path that issubstantially coincident with the longitudinal axis.

26. The optoelectronic module as recited in claim 25, wherein the optoelectronic transceiver substantially complies with one of the following Multi-Source Agreements (MSA): SFF; SFP; or XFP.

27. The optoelectronic module as recited in claim 25, further comprising a receiver optical subassembly (ROSA) in electrical communication with circuitry of the printed circuit board.

28. The optoelectronic module as recited in claim 25, wherein the optoelectronic transceiver is compatible for operation with line speeds of at least about 10 Gb/s.

29. The optoelectronic module as recited in claim 25, further comprising: two electronic leads arranged for electrical communication with an electronic component within the optical subassembly; andfour electronic leads in electrical communication with the laser.

30. The optoelectronic module as recited in claim 25, further comprising: a set of modulation leads in electrical communication with the laser; anda set of bias leads in electrical communication with the laser, the set of bias leads being electrically isolated from the set of modulation leads.