Modulated optical reflectance measurement system with enhanced sensitivity

Information

  • Patent Application
  • 20080074668
  • Publication Number
    20080074668
  • Date Filed
    September 04, 2007
    17 years ago
  • Date Published
    March 27, 2008
    16 years ago
Abstract
A modulated optical reflectance (MOR) measurement system is disclosed which uses an infrared probe beam. Preferably the probe beam has a wavelength of at least 800 nm and preferable greater than one micron (1000 nm).
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a graph plotting the MOR signal dose dependence obtained using a 780/670 nm pump/probe wavelength combination for As-implanted Si sample (100 keV).



FIG. 2 is a graph using the same pump/probe wavelength combination of FIG. 1 and covering a higher dose range (1013−1016 cm−2) obtained for As-implanted Si.



FIG. 3 is a graph similar to FIG. 1 and includes a plot of the dose dependence obtained using a 780/1064 pump/probe wavelength combination.



FIG. 4 is a graph similar to FIG. 3 and illustrating the dose dependence for a B-implanted Si wafer.



FIG. 5 is a graph plotting dose dependencies for a number of different pump and probe beam wavelength combinations.



FIG. 6 is a graph similar to FIG. 2 and includes a plot of the dose dependence obtained using a 780/1064 pump/probe wavelength combination.



FIG. 7 is a schematic diagram of an apparatus for implementing the subject invention.





DETAILED DESCRIPTION OF THE SUBJECT INVENTION

The present invention provides a modulated optical reflectance measurement system with the capability to make measurements with very high sensitivity using an infrared probe beam. In particular, it has been found that for certain samples, it is preferable to have a probe beam with a wavelength of at least 800 nm and preferable greater than one micron (1000 nm). The pump beam preferably has wavelength in the near-IR range and be shorter than probe beam. Preferably, the pump beam is on the order of 670 nm to 800 nm. In certain experiments described below we used a 780/1064 nm pump/probe wavelength combination. Another useful combination would include a 670/1064 nm pump/probe wavelength system.


This particular wavelength combination was derived based on an analysis which we refer to as the Controlled Plasma-Thermal Interference (CPTI) principle. This principle is based on a deeper understanding of how the pump and probe beam wavelengths control the production and detection of the plasma and thermal waves in semiconductors. By selecting appropriate pump/probe beam wavelengths, the negative peak in the MOR signal dose dependence (FIG. 1) appearing as a result of the plasma-thermal destructive interference can be placed at the desired position to suit any particular application. The sharp MOR signal drop and rise associated with this peak will provide required high sensitivity to implantation dose.


An example of CPTI-MOR signal dose dependence obtained for As-implanted Si sample using a 780/1064 nm pump/probe wavelength combination is shown in FIG. 3. In this figure, CPTI-MOR signal dependence 200 has a pronounced negative peak 210 in the region where the conventional 780/670 nm pump/probe wavelength combination MOR response 100 has a plateau of low dose sensitivity. This negative peak produces very steep slopes in the MOR signal on either side of the peak and therefore provides high sensitivity in the mid-dose region, particularly in the dose range from 1012 to 1013 cm−2 region. This dose regime is of particular interest to semiconductor manufacturers and the illustrated variation in signal with dose provides about a factor of ten greater sensitivity than prior approach. This increase in sensitivity may allow manufacturers to use this technique for fine process control rather than just providing pass/fail test results.


It is believed that the position of the peak 210 on the dose axis can be changed by changing the pump and/or probe beam wavelength in a predetermined manner. Thus, the regions of a MOR signal high-sensitivity (defined as a slope of the MOR dose dependence shown in FIG. 3) can be adjusted and optimized for every particular application.


In order to determine the best wavelengths for a particular application, one would need to use a damaged based model of the MOR response from an ion-implanted semiconductor to calculate the MOR response as a function of dose. Damaged based modeling is disclosed in our prior papers, cited above. The pump and probe wavelengths along with the modulation frequency are adjusted in the model to set the position the minimum peak (corresponding to the maximum interference between the thermal and plasma waves) at the desired point on the dose curve.


It should be noted that MOR values to the left of the minimum are dominated by plasma effects while values to the right of the minimum are dominated by thermal effects. Thus, one might want to position the minimum to be either less than (to the left of) or greater than (to the right of) the dose region of interest. In the first case, where the minimum is positioned to be less than the dose region of interest, the response in the region of interest will be dominated by the thermal effects. In the second case, where the minimum is positioned to be greater than the dose region of interest, the response in the region of interest will be dominated by plasma effects. Since the two mechanisms (plasma and thermal) are completely different physically, in some cases it would be beneficial to be able to control not only the sensitivity of the MOR response, but also its dominating physical nature.


The CPTI principle can be applied to many implantation species processed at a variety of implantation energies. FIG. 4 shows the comparison between the CPTI-MOR dose dependence 200 obtained for B-implanted Si wafer using the same pump/probe beam wavelength combination as in FIG. 3 and a conventional non-CPTI dose dependence 100 recorded from the same sample.


The effectiveness and uniqueness of the CPTI principle is illustrated in FIG. 5. In this figure, the CPTI-MOR response 200 (780/1064 nm pump/probe wavelength combination) is shown together with a set of conventional non-CPTI MOR dose response 100 (described above), and three other response curves each having its own set of non-optimized pump/probe beam wavelengths from a wide spectral range from near-UV to near-IR. Curve 300 corresponds to a 780/405 pump/probe combination, curve 400 corresponds to a 405/670 pump/probe combination, and curve 500 corresponds to a 405/780 pump/probe combination. As may be appreciated, only the CPTI-MOR curve 200 exhibits high sensitivity to dose in the entire range of implantation doses shown in FIG. 5.


The shape of the negative peak in CPTI-MOR dose dependence shown in FIGS. 3-5 can be modified by varying other MOR system parameters, e.g. the pump beam modulation frequency, resulting in more control over the CPTI-MOR signal behavior.


In the high dose range, the CPTI approach improves the MOR signal behavior to monotonic with high sensitivity as shown in FIG. 6. In this figure, the CPTI-MOR dose dependence 200 in the high dose range (1014−1016 cm−2) exhibits a monotonic increase with a steady slope corresponding to the high sensitivity to dose variations in the region, thus comparing favorably with the conventional non-CPTI response 100 described above.


It should be noted that the method and system of the present invention could be used both as described and in combination with other improvements to a MOR instrument, i.e. a MOR system with multiple pump/probe beam wavelengths, Q-I signal processing algorithm, fiber-laser MOR system, position-modulated optical reflectance (PMOR) technique, etc.


In our initial investigation, we have found that using near-IR and IR parts of the spectrum for the pump and probe beams provides increased sensitivity in dose regions of particular interest to manufacturers for common wafer samples. We believe the use of an IR probe wavelength is of particular significance. In the preferred embodiment, the probe beam should have a wavelength of at least 1 micron (including 1.06 microns as described herein). We are in the process of testing even longer wavelengths with available lasers at 1.3 microns and 1.5 microns and believe we will find additional benefits at those wavelengths.


Referring to FIG. 7, probe laser 720 can be defined by a Nd:YAG laser generating light at 1.06 microns. Alternatively, the laser could be a diode laser or an optically pumped semiconductor laser configured to generate light having a wavelength of at least 800 nm. The pump laser could also be formed from a diode laser or an optically pumped semiconductor laser. The pump beam wavelength should be between 670 and 800 nm and is preferably 780 nm.


In operation, the processor 750 monitors the signals generated by the filter 740. The results are typically stored and/or displayed to the user. The results could also be used for process control.


It should be noted that some of the patents assigned to Boxer Cross (for example, U.S. Pat. No. 6,049,220) include suggestions of using IR wavelengths in the 900 nm wavelength range for the pump and probe beams. However, these patents teach that the modulation frequency of the pump beam should be slow enough so that plasma waves are not created. It is believed that the benefits of the subject invention are best realized when the modulation frequency is fast enough so that plasma waves are created. In the preferred embodiment, the modulation frequency should be at least 100,000 hertz and preferably on the order of a megahertz or greater.

Claims
  • 1. An apparatus for evaluating the characteristics of a semiconductor sample, comprising: an intensity-modulated pump beam, said pump beam being focused to a spot on the surface of the sample for periodically exciting the sample, with the intensity and frequency of the pump beam being selected in order to create thermal and plasma waves in the sample that modulate the optical reflectivity of the sample;a probe beam being directed to a spot on the surface of the sample within a region that has been periodically excited and is reflected therefrom, said probe beam having a wavelength of at least 800 nm;a photodetector for measuring the power of the reflected probe beam and generating an output signal in response thereto; andprocessing means operable to receive the output signal and generating information corresponding to the modulated optical reflectivity of the sample.
  • 2. An apparatus as recited in claim 1, wherein the probe beam wavelength is greater than one micron.
  • 3. An apparatus as recited in claim 1, wherein the pump beam modulation frequency is greater than 100,000 hertz.
  • 4. An apparatus as recited in claim 1, wherein the pump beam modulation frequency is greater than one megahertz.
  • 5. An apparatus as recited in claim 1, wherein the pump beam has a wavelength in the near infrared range.
  • 6. An apparatus as recited in claim 1, wherein the wavelength of the pump beam is between 670 and 800 nm.
  • 7. An apparatus for evaluating the characteristics of a semiconductor sample, comprising: an intensity-modulated pump beam, said pump beam being focused to a spot on the surface of the sample for periodically exciting the sample, with the intensity of the pump beam being selected in order to create thermal and plasma effects in the sample that modulate the optical reflectivity of the sample;a probe beam being directed to a spot on the surface of the sample within a region that has been periodically excited and is reflected therefrom, said probe beam having a wavelength of at least one micron;a photodetector for measuring the power of the reflected probe beam and generating an output signal in response thereto;a filter for receiving the output signal from the photodetector and generating a response corresponding to the modulated optical reflectivity of the sample; anda processor operable to receive the response from the filter for evaluating the sample.
  • 8. An apparatus as recited in claim 7, wherein the pump beam modulation frequency is greater than 100,000 hertz.
  • 9. An apparatus as recited in claim 7, wherein the pump beam modulation frequency is greater than one megahertz.
  • 10. An apparatus as recited in claim 7, wherein the pump beam has a wavelength in the near infrared range.
  • 11. An apparatus as recited in claim 7, wherein the wavelength of the pump beam is between 670 and 800 nm.
  • 12. A method for evaluating the characteristics of a semiconductor sample, comprising: focusing an intensity-modulated pump beam to a spot on the surface of the sample for periodically exciting the sample, with the intensity of the pump beam being selected in order to create thermal and plasma effects in the sample that modulate the optical reflectivity of the sample;directing a probe beam to a spot on the surface of the sample within a region that has been periodically excited and is reflected therefrom, said probe beam having a wavelength of at least one micron;monitoring the power of the reflected probe beam and generating an output signal in response thereto;processing the output signals to generate information corresponding to the modulated optical reflectivity of the sample.
  • 13. A method as recited in claim 12, wherein the pump beam modulation frequency is greater than 100,000 hertz.
  • 14. A method as recited in claim 12, wherein the pump beam modulation frequency is greater than one megahertz.
  • 15. A method as recited in claim 12, wherein the pump beam has a wavelength in the near infrared range.
  • 16. A method as recited in claim 12, wherein the wavelength of the pump beam is between 670 and 800 nm.
PRIORITY

This patent application claims priority to U.S. Provisional Application Ser. No. 60/846,147, filed Sep. 21, 2006, the disclosure of which is incorporated herein by reference.

Provisional Applications (1)
Number Date Country
60846147 Sep 2006 US