Module assembly

Information

  • Patent Grant
  • D553572
  • Patent Number
    D553,572
  • Date Filed
    Thursday, October 14, 2004
    20 years ago
  • Date Issued
    Tuesday, October 23, 2007
    17 years ago
Abstract
Description


FIG. 1 is a top plan view of a module assembly, showing our new design;



FIG. 2 is a front elevation view thereof;



FIG. 3 is a rear elevation view thereof;



FIG. 4 is a side elevation view thereof;



FIG. 5 is a side elevation view of the opposite side shown in FIG. 4;



FIG. 6 is a bottom plan view thereof; and,



FIG. 7 is a top, front and side perspective view thereof.


The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.


Claims
  • The ornamental design for a module assembly, as shown and described.
US Referenced Citations (8)
Number Name Date Kind
D303246 Freeman et al. Sep 1989 S
D392645 Wakabayashi Mar 1998 S
D421964 Nagasawa et al. Mar 2000 S
D432991 Taguchi Oct 2000 S
6299480 Xu et al. Oct 2001 B1
D503384 Weatherley Mar 2005 S
D526616 Nakashima et al. Aug 2006 S
20050277339 Caveney et al. Dec 2005 A1