Embodiments of the disclosure pertain to packaging pieces, and more particularly to packaging pieces that enable packaging using alternating module orientations.
A photovoltaic module or solar panel is an assembly of photovoltaic cells mounted and organized in a framework for generating energy. Solar panels use sunlight as a source of energy to generate direct current electricity. An AC (alternating current) module is a photovoltaic module which has an AC inverter mounted onto its back side and which produces AC power with no external DC connector. In order to complete successful shipping projects, solar panels need to be packaged in a manner that prevents damage. This is because damage related shipping and packaging costs can contribute significantly to the overall cost of a project. Some current trends in the solar panel industry present challenges to the prevention of such damage.
One such trend involves the reduction of frame heights to increase shipping density, and to reduce shipping costs. The reduction of frame height can present clearance issues for AC solar panel modules that have thick AC Microinverters (ACMI) installed on the modules at the factory. Specifically, because the height of the AC solar panel module frame may not extend a sufficient distance outward from the panel to accommodate the height of thick ACMIs, the ACMI may protrude below the bottom of the AC solar panel module. Importantly, the protruding ACMI can contact adjacent solar panels in a manner that causes damage to the adjacent solar panels during shipping. Thus, AC solar panel modules that have frame heights that are less than the heights of their ACMIs, can present challenges to the packaging of the AC solar panel modules in a way that prevents damage to adjacent AC solar panel modules during shipping and handling. Moreover, conventional packaging methods may be inadequate to provide packaging that can prevent damage to AC solar panel modules during shipping for AC solar panel modules that have frames with heights that are less than the heights of their ACMIs.
Packaging pieces that enable packaging using alternating module orientations are described. It should be appreciated that although embodiments are described herein with reference to example packaging piece implementations, the disclosure is applicable to packaging piece implementations in general as well as other kinds of packaging piece implementations. In the following description, numerous specific details are set forth, such as specific integration and material regimes, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to one skilled in the art that embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known features, such as integrated circuit design layouts, are not described in detail in order to not unnecessarily obscure embodiments of the present disclosure. Furthermore, it is to be appreciated that the various embodiments shown in the Figures are illustrative representations and are not necessarily drawn to scale.
Certain terminology may also be used in the following description for the purpose of reference only, and thus are not intended to be limiting. For example, terms such as “upper”, “lower”, “above”, and “below” refer to directions in the drawings to which reference is made. Terms such as “front”, “back”, “rear”, and “side” describe the orientation and/or location of portions of the component within a consistent but arbitrary frame of reference which is made clear by reference to the text and the associated drawings describing the component under discussion. Such terminology may include the words specifically mentioned above, derivatives thereof, and words of similar import.
As used herein, the term “module” is intended to refer to a photovoltaic module or solar panel.
As used herein, the term “glass components” refer to the glass and associated photovoltaic elements and encapsulant that can be attached together as a unit to the frame of a module.
As used herein, the term “interface” is intended to refer to the area between facing frames, or facing glass components, of frame-to-frame or glass-to-glass oriented modules.
As used herein, a “short side” is intended to refer to one of the two sides of a rectangular module or stack of modules that is shorter than the longer sides of the rectangular module or stack of modules.
As used herein, the term “long side” is intended to refer to one of the two sides of a rectangular module or stack of modules that is longer than the shorter sides of the rectangular module or stack of modules.
As used herein the term “sunny side” is intended to refer to the side of a photovoltaic module that is designed to face a light source and to receive light.
As used herein a reference to the “face” or “front” of a photovoltaic module is intended to refer to the sunny side of the photovoltaic module.
As used herein a reference to the “back” of a photovoltaic module is intended to refer to the side of the photovoltaic module opposite the “face” of the photovoltaic module.
As used herein the term “glass-to-glass” is intended to refer to a face-to-face orientation of a pair of photovoltaic modules.
As used herein the term “frame-to-frame” is intended to refer to a back-to-back orientation of a pair of photovoltaic modules.
As used herein, the term “backsheet” side is intended to refer to the back side of a photovoltaic module (the side that does not face a light source), that includes a backsheet that protects the inner components of the photovoltaic module. In one embodiment, as regards bifacial modules, glass can be used on the back side of the photovoltaic module instead of a backsheet.
As used herein the term “channel” is intended to refer to a trench that is formed in a packaging piece that is configured to firmly hug either a flange or a lip of a module frame.
As used herein the term “package” is intended to refer to one or more modules that are bundled and/or boxed for storage or transit.
As used herein the term “packaging” is intended to refer to the act of creating a package of modules.
As used herein, the term “pack” is intended to refer to one or more vertically or horizontally placed modules. A pack of one module would include a single module vertically or horizontally disposed. A pack of two or more modules would comprise two or more either vertically or horizontally disposed modules for packaging.
As used herein the term “packing,” or, to “pack” is intended to refer to the act of placing one or more modules either vertically or horizontally together for packaging.
As used herein, the term “stack” is intended to refer to a pile of horizontally oriented modules that can be used in the preparation of a package. As used herein to “stack” is intended to refer to the act of piling a plurality of horizontally oriented modules for use in the preparation of a package.
As used herein the term “full quantity of modules” is intended to refer to the number of modules that is necessary to fill what is considered to be a full package of modules.
As used herein the term “partial quantity of modules” is intended to refer to a number of modules that is less than that which is necessary to fill what is considered to be a full package of modules.
As used herein the term “full package” of modules is intended to refer to a package of modules that contains the number of modules that is considered to completely fill the package of modules.
As used herein the term “partial package” of modules is intended to refer to a package of modules that contains a number of modules that is less than that which is considered to completely fill the package of modules.
As used herein the term “packaging piece” or “module packaging piece” is intended to refer to a device that can be firmly fastened or clipped to the frame of a first module and which provides a channel for restraining the movement of a second module.
As used herein, a number that is preceded by a capital letter “F” or “G” is intended to refer to a packaging piece. For example, the reference numbers F103 and G103 are intended to refer generally to frame-to-frame and glass-to-glass packaging pieces respectively. More specifically, if the reference number F103 or G103 does not include a subscript or a number enclosed in parentheses, the frame-to-frame or glass-to-glass packaging piece identified represents frame-to-frame or glass-to-glass packaging pieces in general.
For purposes of clarity and brevity the reference number for specific frame-to-frame and glass-to-glass packaging pieces used in a stack of alternating sunny side up and sunny side down modules is based on the position of the packaging pieces with respect to the downward oriented side of the upper positioned module of the pairs of modules in the stack of modules that share either a frame-to-frame or a glass-to-glass interface. For example, as used herein, the reference numbers F103 or G103 of a packaging piece followed by a number enclosed by a parenthesis such as “(1)” is intended to indicate the position of the packaging piece with respect to the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame or a glass-to-glass interface. In particular, as used herein “(1)” refers to the left top corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame or a glass-to-glass interface, “(2)” refers the right top corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame or a glass-to-glass interface, “(3)” refers to the right bottom corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame or a glass-to-glass interface, and “(4)” refers to the left bottom corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame or a glass-to-glass interface. This is reference scheme is illustrated in
Thus, as used herein, a reference to F101(1) refers to the frame-to-frame packaging piece that is positioned at the left top corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame interface, F101(2) refers to the frame-to-frame packaging piece that is positioned at the right top corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame interface, F103(3) refers to the frame-to-frame packaging piece that is positioned at the right bottom corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame interface, and F103(4) refers to the frame-to-frame packaging piece that is positioned at the left bottom corner of the downward oriented side of an upper positioned module of a pair of modules that share a frame-to-frame interface (see
Similarly, as regards glass-to-glass packaging pieces, as used herein, a reference to G101(1) refers to the glass-to-glass packaging piece that is positioned at the left top corner of the downward oriented side of an upper positioned module of a pair of modules that share a glass-to-glass interface, G101(2) refers to the glass-to-glass packaging piece that is positioned at the right top corner of the downward oriented side of an upper positioned module of a pair of modules that share a glass-to-glass interface, G103(3) refers to the glass-to-glass packaging piece that is positioned at the right bottom corner of the downward oriented side of an upper positioned module of a pair of modules that share a glass-to-glass interface, and G103(4) refers to the glass-to-glass packaging piece that is positioned at the left bottom corner of the downward oriented side of an upper positioned module of a pair of modules that share a glass-to-glass interface (see
As used herein, subscripts associated with a module's reference number indicate the position of the module in a stack of modules. For example, the subscript 3 in the reference number 1013, indicates that the identified module is the third module (as counted from the top of the stack of modules) in the stack of modules. As used herein, subscripts associated with a glass component's reference letter identifies the modules that the referenced glass component is associated with. For example, the subscript 1 in the reference character A1, indicates that the identified glass component is associated with the first module in the stack of modules. As used herein, subscripts associated with a frame's reference letter identifies the module that the referenced frame is associated with. For example, the subscript 1 in the reference character B1, indicates that the identified frame is associated with the first module in the stack of modules. As used herein, subscripts associated an AC Microinverter's (ACMI's) reference letter identifies the module that the referenced AC Microinverter (ACMI) is associated with. For example, the subscript 1 in the reference character ACMI1, indicates that the identified ACMI is associated with the first module in the stack of modules. As used herein, subscripts associated with package pieces indicate the position of the package pieces in a stack of a plurality of modules. For example, as used herein, reference number F103(2)1-2 refers to the frame-to-frame packaging piece F103 positioned at the right top corner position (2) of module 1011 at the frame-to-frame interface between sunny side up module 1011 and sunny side down module 1012. In one embodiment, lower case letters that are used as a part of reference numbers herein refer to specific structural features of a packaging piece (see
An objective of module packaging is to prevent the packaged modules from being damaged during shipping and transport. Shipping and packaging costs that are attributable to damage incurred during shipping and transport can contribute significantly to the overall cost of a project. Reducing frame height to increase shipping density is a measure that can be taken to reduce shipping costs. However, the reduction of frame height causes clearance (space for accommodating the height of a component) challenges for alternating current (AC) modules which can have thick AC Microinverters (ACMIs) installed thereon. In addition, challenges to avoiding module damage can be presented by forces that are typically encountered during the preparation, shipping and transportation of packages such as from the weight of pallet double stacking, vibrations, drop impact loads, and side loads.
Approaches that overcome the challenges of the previous approaches are disclosed herein. As part of a one embodiment, module packaging pieces are disclosed. In one embodiment, a packaging piece includes: a first side that includes: one or more flange securing tabs; and a first channel that is configured to accommodate a flange of a first module, and a second side that includes: a second channel that is configured to accommodate a flange of a second module.
In addition, in one embodiment, a module packaging piece includes a first side that includes: a plurality of tapered structures; and a first channel that is configured to accommodate a component of a first module frame, and a second side that includes: a second channel that is configured to accommodate a component of a second module frame; and a securing component that is configured to attach the packaging piece to the second module frame.
In one embodiment, the packaging pieces include a frame-to-frame corner piece and a glass-to-glass corner piece that are provided for packaging alternating current (AC) modules with either reduced frame height or conventional frame height. In one embodiment, when employing the corner pieces, the modules can be stacked horizontally on a pallet parallel to the ground. In one embodiment, the modules can be stacked to alternate sunny side up and sunny side down in the stack to provide clearance for the ACMI between the backsheets of the sunny side up and sunny side down modules (that share a frame-to-frame interface). In one embodiment, as regards bifacial modules, clearance is provided for the ACMI between the back side glass of the sunny side up and sunny side down modules. In one embodiment, the glass-to-glass corner pieces can be positioned between modules that share a glass-to-glass interface, and the frame-to-frame corner pieces can be positioned between the frames of modules that share a frame-to-frame interface. The packaging pieces resist the forces of vibration, drop impact loads, and side loads that are encountered during shipping, and keep modules stably stacked. Conventional module packaging includes vertical module packaging that uses carton braces to achieve module stability. However, such methods may inadequately restrict modules leaving them prone to damage and movement that can cause injury when they are removed one at a time. Vertical packaging also presents challenges for partial pallet shipments because the center of gravity of modules must be precisely controlled on the pallet to maintain package stability. In contrast, a horizontal package provides a centered center of gravity that is inherently stable regardless of the number of modules that are stacked. Consequently, the stable horizontal packaging that is enabled by the frame-to-frame and glass-to-glass packaging pieces described herein provides clearance for the ACMIs in modules with reduced frame height, provides protection against damage to modules during transport and allows the removal of individual modules without the risk of injury from package instability.
Referring to
In one embodiment, the ACMIs C1-Cn can be centered near an end of the modules 1011-101n with which they are associated. In one embodiment, for modules in the solar panel module stack 100 that share a frame-to-frame interface, the orientation of the individual modules that share the interface is selected such that the ACMI of the sunny side up module and the ACMI of the sunny side down module are located near opposite ends. In one embodiment, because the height of an ACMI can be greater than the height of the frame of the module with which it is associated, this orientation enables the ACMI to extend beyond the space circumscribed by the frame of the module with which it is associated into unoccupied space circumscribed by the frame of the module with which its module shares a frame-to-frame interface.
This is illustrated in
Referring again to
In one embodiment, glass-to-glass packaging pieces G103 include a plurality of sets of four glass-to-glass packaging pieces, that are positioned between the glass components of sunny side down and sunny side up modules of modules 1012-101n. Some of the glass-to-glass packaging pieces G103 are not visible in
Referring again to
The glass-to-glass packaging pieces G103(1-4)2-3, G103(1-4)4-5, and G103(1-4)6-7 are configured to be attached to a catch feature that is part of the design of the module frame. In one embodiment, the glass-to-glass packaging pieces G103(1-4)2-3, G103(1-4)4-5, and G103(1-4)6-7 can be snap fitted to the catch feature of the module frame (see description below) of sunny side up modules 1013, 1015 and 1017 and provide a upwardly directed channel to tightly hug the lips of the frames of sunny side down modules 1012, 1014, 1016 and 1018. In one embodiment, the glass-to-glass packaging pieces G103(1-4)2-3, G103(1-4)4-5, and G103(1-4)6-7 prevent movement of the sunny side down modules 1012, 1014, 1016 and 1018 that are positioned above the sunny side up modules 1013, 1015 and 1017 to which they are attached in the x and y direction (prevent lateral movement of the modules relative to one or more of the other modules in the stack of horizontally oriented modules). In one embodiment, the packaging pieces G103(1-4)2-3, G103(1-4)4-5, and G103(1-4)6-7 prevents the movement of the sunny side down modules 1012, 1014, and 1016 positioned above the sunny side up modules 1013, 1015 and 1017 to which they are attached by providing a force sufficient to prevent movement of the sunny side down modules 1012, 1014, and 1016 that opposes forces that can act on the modules during handling and transport.
Referring again to
In one embodiment, based on the exemplary arrangement of modules, each pair of reduced frame height modules in the module stack 100 that share a frame-to-frame interface provides the clearance necessary to accommodate thick ACMIs between their backsheets. Thus, a reduction in module frame height and an increase in module shipping density is enabled. In one embodiment, the increased module shipping density enables a reduction in module shipping cost.
Referring to
Bottom frame flange channel F103b includes shallow trenches that are formed in the packaging piece F103 and are configured to tightly hug bottom frame flanges. In one embodiment, the bottom frame flange channel F103b can include perpendicular regions that are designed to accommodate the corner flanges of a module frame. In one embodiment, the bottom frame flange channel F103b is configured to hug the bottom frame flanges of the lower module (the module with a sunny side down orientation) of a pair of modules with a frame-to-frame orientation. In one embodiment, the bottom frame flange channel F103b hugs the bottom frame flange on the outside and the inside to prevent movement in the x and the y direction (to prevent lateral movement of the module relative to one or more of the other modules in a stack of horizontally oriented modules).
Inner walls of frame channel F103c are the inner sidewalls of the bottom frame flange channel F103b. The inner walls of frame channel F103c are configured to firmly hug the frame flanges of the lower module (the module with a sunny side down orientation) of a pair of modules with a frame-to-frame orientation. In particular, in one embodiment, inner walls of frame channel F103c are configured to prevent movement in a first sidewise direction when a module stack (e.g., 100 in
Referring to
Inner walls of frame channel F103f are the inner sidewalls of the bottom frame flange channel F103e. The inner walls of frame channel F103f are configured to firmly hug the frame flanges of the upper module (the module with a sunny side up orientation) of a pair of modules with a frame-to-frame orientation. In particular, in one embodiment, the inner walls of frame channel F103f are configured to prevent movement in a first sidewise direction when a module stack is handled or during transport. Outer walls of frame channel F103g are the outer sidewalls of the bottom frame flange channel F103e. The outer walls of frame channel F103g are configured to firmly hug the frame flanges of the upper module (the module with a sunny side up orientation) of a pair of modules with a frame-to-frame orientation. In particular, in one embodiment, outer walls of frame channel F103g are configured to prevent movement in a second sidewise direction when a package is handled or during transport.
Lead in feature F103h is a module guide structure formed on the corner of the frame-to-frame packaging piece F103 and extends in first and second directions along first and second sides of the packaging piece F103. In one embodiment, the lead in feature F103h is configured to guide a module into place, above the module to which frame-to-frame packaging piece F103 is attached, on top of a module stack (e.g., 100 in
Referring to
Referring to
Inner walls of frame lip channel G103d are the inner sidewalls of the frame lip channel G103c. The inner walls of frame lip channel G103d are configured to firmly constrain movement of the frame lips of the upper module (the module with a sunny side down orientation) of a pair of modules with a glass-to-glass orientation. In particular, in one embodiment, inner walls of frame lip channel G103d are configured to prevent movement in a first sidewise direction when a module stack is handled or during transport. Outer walls of frame lip channel G103e are the outer sidewalls of the frame lip channel G103c. The outer walls of frame lip channel G103e are configured to firmly constrain outward movement of the lips of the upper module (the module with a sunny side down orientation) of a pair of modules with a glass-to-glass orientation. Thus, in one embodiment, outer walls of frame lip channel G103e are configured to prevent movement in a second sidewise direction when a module stack is handled or during transport.
Frame lip channel G103f is a shallow trench with perpendicular parts that is formed in the glass-to-glass packaging piece G103 on the side opposite that of frame lip channel G103c. In one embodiment, frame lip channel G103f is configured to hug the frame lip to prevent movement of the frame in the x and y direction (laterally). In one embodiment, the frame lip channel G103f hugs the frame lip on the outside and the inside to prevent movement. In one embodiment, the frame lip channel G103f is configured to hug the frame lip of the lower module (the module with a sunny side up orientation) of a pair of modules with a glass-to-glass orientation.
Inner walls of frame lip channel G103g are the inner sidewalls of the frame lip channel G103f. The inner walls of frame lip channel G103g are configured to firmly constrain movement of the frame lip of the lower module (the module with a sunny side up orientation) of a pair of modules with a glass-to-glass orientation. In particular, in one embodiment, inner walls of frame lip channel G103g are configured to prevent movement in a first sidewise direction when a module stack is handled or during transport. Outer walls of frame lip channel G103h are the outer sidewalls of the frame lip channel G103f. The outer walls of frame lip channel G103h are configured to firmly constrain movement of the frame lip of the lower module (the module with a sunny side up orientation) of a pair of modules with a glass-to-glass orientation. In particular, in one embodiment, outer walls of frame lip channel G103h are configured to prevent movement in a second sidewise direction when a module stack is handled or during transport.
Referring to
Lead in feature G103j (
In operation, referring to
In one embodiment, the packaging pieces resist the force of vibrations, drop impact loads, and side loads during shipping, and maintain the modules in a stable condition on the pallet. Moreover, in one embodiment, packaging pieces F103 and G103 direct stress away from the horizontally stacked modules to prevent damage to the modules.
In one embodiment, the packaging piece design enables horizontal module packaging that provides greater package stability than does vertical packaging. In one embodiment, the stable horizontal module packaging allows field crews to remove one module at a time without the risk of pallet instability. In one embodiment, the preparation of partial packages, such as for residential product shipment, is straightforward, because a partial quantity of modules can be packaged readily from a stable horizontal orientation.
In one embodiment, the packaging pieces F103 and G103 enable AC modules to be shipped at high density because of the reduced module frame height that they facilitate. In one embodiment, the packaging pieces F103 and G103 use less material than conventional packaging piece designs (e.g., conventional plastic corner piece designs) which can have a height that is equal to that of the module frame. For example, conventional packaging pieces can have a height of more than 30 mm. In contrast, in one embodiment, the packaging pieces F103 and G103 can have a thickness of 1 to 2 mm and a height of 12 mm. In other embodiments, the packaging pieces F103 and G103 can have other thicknesses and heights.
In one embodiment, a package of modules is disclosed. In one embodiment, the package of modules includes a plurality of horizontally stacked modules and a plurality of first packaging pieces. The plurality of first packaging pieces includes a first side that includes one or more flange securing tabs and a first channel that is configured to accommodate a flange of a first module. And a second side that includes a second channel that is configured to accommodate a flange of a second module. In one embodiment, the package of modules further includes a plurality of second packaging pieces. The plurality of second packaging pieces include a first side that includes a plurality of tapered structures and a first channel that is configured to accommodate a component of a frame of a third module. A second side that includes a second channel that is configured to accommodate a component of a frame of the second module. And a packaging piece attaching component that includes a structure configured to attach the second plurality of packaging pieces to the frame of the second module.
In one embodiment, the first plurality of packaging pieces are located at each corner of at least one of the plurality of horizontally stacked modules. In one embodiment, the second plurality of packaging pieces are located at each corner of at least one of the plurality of horizontally stacked modules. In one embodiment, the first plurality of packaging pieces and the second plurality of packaging pieces are located on opposite sides of each corner of at least one of the plurality of horizontally stacked modules. In one embodiment, the first plurality of packaging pieces and the second plurality of packaging pieces are configured to brace the plurality of horizontally stacked modules. In one embodiment, the first plurality of packaging pieces and the second plurality of packaging pieces are frame-to-frame and glass-to-glass packaging pieces respectively. In one embodiment, the first plurality of packaging pieces and the second plurality of packaging pieces are configured to accommodate a frame-to-frame and a glass-to-glass orientation of solar panel modules.
Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even where only a single embodiment is described with respect to a particular feature. Examples of features provided in the disclosure are intended to be illustrative rather than restrictive unless stated otherwise. The above description is intended to cover such alternatives, modifications, and equivalents as would be apparent to a person skilled in the art having the benefit of the present disclosure. The scope of the present disclosure includes any feature or combination of features disclosed herein (either explicitly or implicitly), or any generalization thereof, whether or not it mitigates any or all of the problems addressed herein. Accordingly, new claims may be formulated during prosecution of the present application (or an application claiming priority thereto) to any such combination of features. In particular, with reference to the appended claims, features from dependent claims may be combined with those of the independent claims and features from respective independent claims may be combined in any appropriate manner and not merely in the specific combinations enumerated in the appended claims.
The various features of the different embodiments may be variously combined with some features included and others excluded to suit a variety of different applications.