This document pertains generally, but not by way of limitation, to electronic modules, such as electronic component modules for servers.
Electronic devices, such as electronic computer devices, can include a PCI Express card, memory, graphics processor, power supply, or hard drive. In some examples, the electronic device can be connected to a server through a computer component, such as a motherboard, a PCI, or backplane connector. The electronic devices can be attached to one or more of the computer components and/or a server chassis. For instance, the computer component (e.g., motherboard) can be fastened to the server chassis and a cover can be coupled to the server chassis to protect the computer components and electronic devices within the server. In some examples, the electronic device can be removed from the server for repair, replacement, or other purposes. The server can be powered down and the cover of the server can be removed to expose the one or more electronic devices for removal or to provide access to install an electronic device. When the cover is removed, the computer components and electronic devices can be vulnerable to damage or electrical shorting. Accordingly, the server can be powered down when the cover is removed to mitigate damage to the server and/or the electronics devices and computer components therein.
In some examples, the server can be mounted on a server rack. The server rack can include a plurality of servers stacked vertically on the server rack. The server racks can include slidable server mounts to permit each server to be slid out independently from other adjacent servers, for instance, so the cover of the server can be removed for installing, removing, or replacing the electronic device. However, the addition of slidable server mounts can add to the cost and complexity of the server racks.
In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. Like numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in the present document.
A server and a component module are described herein, such as a component module that is installable within a component module bay of the server. The component module can include a component. The component can include a component contact interface having an engagement axis oriented laterally from an installation direction of the component module. The component contact interface is engageable with a server contact interface. The server contact interface also includes an engagement axis oriented laterally from the installation direction of the component module and can be aligned with the component contact interface. The component module can be installable while the server is in operation (e.g., powered on) and statically mounted within a server rack. For instance, the component module can be installed within the component module bay of the server and the component contact interface can be engaged with the server contact interface while the server remains in operation within the server rack.
The following description and drawings sufficiently illustrate specific embodiments to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. Portions and features of some embodiments may be included in, or substituted for, those of other embodiments. Embodiments set forth in the claims encompass all available equivalents of those claims.
The component module 102 can include a frame 112, a component platform 114, and a component 116 coupled to the component platform 114. The frame 112 can be movably coupled with the chassis 104 of the server 100. For instance, the component module 102 can be slid into the component module bay 108 along an installation direction. In other words, the component module 102 can be installed in the component module bay 108. The frame 112 can include an internally facing end 111 and an externally facing end 113. Where the component module 102 is installed, the externally facing end 113 is located toward an external end of the component module bay 108 and the internally facing end 111 is located toward an internal end of the component module bay 108. In one example, the component module 102 can be coupled to the chassis 104 with fasteners including, but not limited to, screws, clips, snaps, magnets, or other type of fastener. In the example of
The component 116 can include a component contact interface 122. The component contact interface 122 can include an engagement axis that is oriented in a lateral or substantially lateral direction (e.g., transverse or within five degrees of a lateral direction) with respect to the installation direction of the component module 102. The server 100 can include a server contact interface 124. The server contact interface 124 can be located on a server component, such as a motherboard or a backplane. For instance, the server contact interface 124 can include an engagement axis that is oriented in a lateral direction from the installation direction of the component module 102. The component contact interface 122 and the server contact interface 124 can be aligned for engagement (engageable) with one another.
As previously stated, the component 116 can be coupled to the component platform 114. The component platform 114 can be movable with respect to the frame 112. For instance, the component platform 114 can move between a decoupled position and an interfaced configuration along a lateral direction with respect to the installation direction. Accordingly, the component contact interface 122 can be engaged with the server contact interface 124 along the lateral direction in response to the movement of the component platform 114. As a result, the component 116 can be installed or replaced when the server 100 is in operation and/or powered on, according to one or more examples. Stated another way, the component 116 can be hot swapped when the cover 106 is attached to the chassis 104 and encloses the server components. Because the component 116 can be installed with the cover 106 in place, the need for costly and space consuming baffles is reduced. For instance, baffles may not be needed for protecting the server components exposed when the cover 106 is removed. In one example, the internally facing end 111 of the frame 112 can be located adjacently to the fan 115. As a result of the lateral position of the server contact interface 124, the fan 115 can generate airflow around the component 116 unobstructed by the server contact interface 124.
Where the server 100 is mounted within the server rack 200 as show in
The frame 112 can include the internally facing end 111 and the externally facing end 113, as previously described herein. The frame 112 can provide structural support for the component module 102 and provide a coupling interface for the installation of the component module 102 within the server 100. In one example, the frame 112 can include a rail 120 (as previously described herein) or other coupling interface for engaging with the chassis 104 of the server 100. The frame 112 can be constructed from a material including, but not limited to, aluminum, steel, polymer, or the like. For instance, the frame 112 can be constructed from sheet metal, cast, molded from a polymer, or the like. As shown in the example of
The component platform 114 can be movably coupled to the frame 112. In one example, the component platform 114 can be movable from a decoupled position to an interfaced position along a lateral direction with respect to the installation direction of the component module 102. One or more slidable couplings 308 can attach the component platform 114 to the frame 112. In the example of
As shown in
The rotatable joint 318 can couple the component actuator arm 302 to the component platform 114 as shown in the example of
The component 116 can be an electronics module including, but not limited to, a PCI Express card, memory module, hard drive, graphics card, expansion card, power supply, or the like. In one example, the component 116 can include a non-standardized shape. For instance, the component 116 can include a printed circuit board assembly having various shapes and sizes. The printed circuit board assembly can include a plurality of electronics components 502 populated on at least a first side of the printed circuit board assembly. The peripheral shape, e.g., peripheral edge 504, of the component 116 can include straight edges, stepped edges, arcuate edges, or other shapes. The component 116 can include a component contact interface 122. The component contact interface 122 can include at least one electrical contact. For instance, the component contact interface 122 can include, but is not limited to, a board or card edge connector, PCI Express connector, plug, socket, terminal, spring-loaded pin, backplane connector, or the like. In the example of
The component support 322 can be configured to support the component 116. For instance, the component support 322 can be configured to hold the peripheral edge 504 of the component 116. In the example of
As shown in
In one example, the location of the rotatable joint can minimize torsion (i.e., a rotational moment) applied to the component 116 and reduce the amount of force to engage the component contact interface 122 with the server contact interface 124. For instance, the rotatable joint 318 (
At 702, the component platform 114 can be movably coupled to the frame 112. The component platform 114 is movable (e.g., in a lateral direction) with respect to the installation direction of the frame 112. For instance, the component platform 114 can be movably coupled between the decoupled position and the interfaced position. In one example, the component platform 114 can be coupled to the frame 112 as previously described herein and shown in
At 704, the component actuator arm 302 arm can be rotatably coupled to the frame 112 with the hinge 312, the component actuator arm 302 can include the first actuator end 314 and the second actuator end 316. The component actuator arm 302 can be rotatable about the hinge 312 from the decoupled configuration to the interfaced configuration as shown in
At 706, the component actuator arm 302 can be coupled to the component platform 114 with the rotatable joint 318 located along the component actuator arm 302. The component actuator arm 302 can be configured to laterally move the component platform 114 between the decoupled and the interfaced positions based on the rotation of the component actuator arm 302 around the hinge 312 and correspondingly the translation of the rotatable joint 318 coupled with the component platform 114 as previously described and shown in
In one example, the component 116 can be coupled to one or more component supports 322. The one or more component supports 322 can be coupled to the component platform 114. As previously described, the component platform 114 can be translatable according to the lateral movement the component platform 114 from the decoupled position to the interfaced position. The component 116 can include the examples previously described. In one example, the one or more component supports 322 can hold the peripheral edge of the component 116. The component supports 322 can be rotatably coupled to the component platform 114 and can be adjustable to support a variety of shaped and sized components 116. In one example, the component 116 can include the component contact interface 122. The component contact interface 122 can be oriented laterally to the installation direction of the frame 112.
An example of an electronic system 800 (e.g., a server 100) using the component module 102 as described in the present disclosure is included to show an example of a higher level device application for the present invention.
An electronic assembly 810 is coupled to system bus 802. The electronic assembly 810 can include any circuit or combination of circuits. In one embodiment, the electronic assembly 810 includes a processor 812 which can be of any type. As used herein, “processor” means any type of computational circuit, such as but not limited to a microprocessor, a microcontroller, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a graphics processor, a digital signal processor (DSP), multiple core processor, or any other type of processor or processing circuit.
Other types of circuits that can be included in electronic assembly 810 are a custom circuit, an application-specific integrated circuit (ASIC), or the like, such as, for example, one or more circuits (such as a communications circuit 814) for use in wireless devices like mobile telephones, personal data assistants, portable computers, two-way radios, and similar electronic systems. The IC can perform any other type of function.
The electronic system 800 can also include an external memory 820, which in turn can include one or more memory elements suitable to the particular application, such as a main memory 822 in the form of random access memory (RAM), one or more hard drives 824, and/or one or more drives that handle removable media 826 such as compact disks (CD), flash memory cards, digital video disk (DVD), and the like.
The electronic system 800 can also include a display device 816, one or more speakers 818, and a keyboard and/or controller 830, which can include a mouse, trackball, touch screen, voice-recognition device, or any other device that permits a system user to input information into and receive information from the electronic system 800.
Each of these non-limiting examples can stand on its own, or can be combined in various permutations or combinations with one or more of the other examples. To better illustrate the method and apparatuses disclosed herein, a non-limiting list of embodiments is provided here:
Example 1 can include or use a component module including a frame configured for installation in an installation direction; a component platform movably coupled to the frame and movable between interfaced and decoupled positions; a component actuator arm extending between first and second actuator ends, wherein a hinge rotatably couples the component actuator arm to the frame and is remote from the first actuator end, and the component actuator arm is coupled to the component platform at a rotatable joint, wherein the component actuator arm is movable between a decoupled configuration and an interfaced configuration, wherein in the decoupled configuration, the component platform is in the decoupled position and recessed relative to the interfaced position, and in the interfaced configuration the component actuator arm is rotated relative to the decoupled configuration, and the component platform is laterally moved into the interfaced position relative to the installation direction by the component actuator arm.
Example 2 can include the component module of example 1, further comprising one or more component supports coupled to the component platform, the component platform and the one or more component supports configured to couple with a component positioned thereon, wherein a component can be mounted on the component supports.
Example 3 can include the component module of any one of examples 1-2, wherein the one or more component supports can be configured to hold a peripheral edge of the component.
Example 4 can include the component module of any one of examples 1-3, wherein the component can be an expansion card module.
Example 5 can include the component module of any one of examples 1-4, wherein the rotatable joint can be movably coupled with respect to the component actuator arm or the component platform.
Example 6 can include the component module of any one of examples 1-5, wherein the rotatable joint can be located between the first actuator end and the hinge.
Example 7 can include a server including or using a server chassis, the server chassis including a component module bay; a cover; a component module, configured for installation within the component module bay, the component module including: a frame including an insertion direction; a component platform movably coupled to the frame, the component platform including a decoupled position and an interfaced position; a component actuator arm coupled to the component platform and configured to move the component platform laterally with respect to the insertion direction of the frame, from the decoupled position to the interfaced position; and a component coupled to the component platform, the component including a component contact interface.
Example 8 can include the server of example 7, wherein the component module can be installed in the component module bay and removable from the component module bay through a cover opening.
Example 9 can include the server of any one of examples 7-8, wherein the component contact interface can be engageable with a server contact interface along a lateral direction to an installation direction of the frame.
Example 10 can include the server of any one of examples 7-9, wherein in the decoupled position of the component platform, the component contact interface can be disengaged from the server contact interface; and in the interfaced position of the component platform, the component contact interface can be engaged with the server contact interface.
Example 11 can include the server of any one of examples 7-10, wherein the component module can be installable into the component module bay and the component contact interface of the component is engageable with the server contact interface while the server can be operating.
Example 12 can include the server of any one of examples 7-11, wherein the frame includes an externally facing end and an internally facing end at opposing ends of the frame along the installed direction, wherein the internally facing end can be substantially open and configured for receiving airflow across the component.
Example 13 can include the server of any one of examples 7-12, wherein the server can be configured for installation within a rack including a plurality of servers, the server can be configured for a plurality of servers to be arranged along a top, bottom, right, and left sides of the server and a cover opening can be located on a back or front end of the server.
Example 14 can include the server of any one of examples 7-13, wherein the component can be coupled to the component platform with one or more component supports.
Example 15 can include or use a method of making a component module including movably coupling a component platform to a frame, wherein the component platform can be movable with respect to an installation direction of the frame; rotatably coupling a component actuator arm to the frame with a hinge, the component actuator arm including first and second actuator ends, wherein the component actuator arm can be rotatable about the hinge from a decoupled configuration to an interfaced configuration; and coupling the component actuator arm to the component platform with a rotatable joint located along the component actuator arm, wherein the component actuator arm can be configured to laterally move the component platform between the decoupled and the interfaced positions based on the rotation of the component actuator arm around the hinge and correspondingly the translation of the rotatable joint coupled with the component platform.
Example 16 can include the method of example 15, further comprising coupling a component to one or more component supports, wherein the component platform includes the one or more component supports, the component being translatable according to the lateral movement the component platform from the decoupled position to the interfaced position.
Example 17 can include the method of any one of examples 15-16, wherein coupling the component to the one or more component supports includes holding a peripheral edge of the component with the one or more component supports.
Example 18 can include the method of any one of examples 15-17, wherein coupling the component to the one or more component supports includes coupling a component including a component contact interface oriented laterally to the installation direction of the frame.
Example 19 can include the method of any one of examples 15-18, wherein coupling the component actuator arm to the component platform with the rotatable joint includes coupling the component actuator arm to the component platform with the rotatable joint that can be movably coupled between the component actuator arm and the component platform.
Example 20 can include the method of any one of examples 15-19, wherein coupling the component actuator arm to the component platform with the rotatable joint includes coupling the rotatable joint to the component actuator arm between the first actuator end and the hinge.
Example 21 can include or use a component module including a frame configured for installation in an installation direction; a component platform movably coupled to the frame and movably between interfaced and decoupled positions; an actuator assembly coupled with the frame and the component platform, the actuator assembly is configured to move the component platform between the interfaced and decoupled positions laterally relative to the installation direction, the actuator assembly includes a component actuator arm extending between first and second actuator ends, a hinge remote from the first actuator end, the hinge rotatably couples the component actuator arm with the frame, and a rotatable joint coupled between the frame and the component platform.
Example 22 can include a component module including a frame including an insertion direction; a component platform movably coupled to the frame, the component platform including a decoupled configuration and an interfaced configuration; a component actuator arm coupled to the component platform and configured to move the platform laterally with respect to the insertion direction of the frame, from the decoupled configuration to the interfaced configuration; and one or more component supports coupled to the component platform.
Example 23 can include the component module of example 22, wherein a component can be mounted on the component supports.
Example 24 can include the component module of any one of examples 22-23, wherein the one or more component supports can be configured to hold a peripheral edge of the component.
Example 25 can include the component module of any one of examples 22-24, wherein the component can be an expansion card module.
Example 26 can include the component module of any one of examples 22-25, wherein the actuator arm extended between a first and second actuator ends, a hinge rotatably couples the component actuator arm to the frame and can be remote from the first actuator end, and the component actuator arm can be rotatably coupled to the component platform at a joint, wherein the component actuator arm can be movable between a decoupled configuration and an interfaced configuration based on rotation of the component actuator arm around the hinge and translation of the joint coupled with the component platform.
Example 27 can include the component module of any one of examples 22-26, wherein the rotatable joint can be movably coupled with respect to the lever arm or the platform.
Example 28 can include the component module of any one of examples 22-27, wherein the rotatable joint can be located at between the first lever end and the hinge.
Example 29 can include a component module including a frame configured for installation in an installation direction, a component platform movably coupled to the frame and movable between interfaced and decoupled positions, a means for moving the component platform between a decoupled configuration and an interfaced configuration, wherein in the decoupled configuration, the component platform can be in the decoupled position and recessed relative to the interfaced position, and in the interfaced configuration the component actuator arm can be rotated relative to the decoupled configuration, and the component platform can be laterally moved into the interfaced position relative to the installation direction by the component actuator arm.
Example 30 can include the component module of Example 29, further comprising one or more component supports coupled to the component platform, the component platform and the one or more component supports configured to couple with a component positioned thereon, wherein a component can be mounted on the component supports.
Example 31 can include the component module of any one of examples 29-30, wherein the one or more component supports can be configured to hold a peripheral edge of the component.
Example 32 can include the component module of any one of examples 29-31, wherein a component can be coupled to the component platform.
Example 33 can include the component module of any one of examples 29-32, wherein the component includes a component contact interface, the component contact interface can be oriented laterally to the installation direction of the frame.
Each of these non-limiting examples can stand on its own, or can be combined in various permutations or combinations with one or more of the other examples.
The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention can be practiced. These embodiments are also referred to herein as “examples.” Such examples can include elements in addition to those shown or described. However, the present inventors also contemplate examples in which only those elements shown or described are provided. Moreover, the present inventors also contemplate examples using any combination or permutation of those elements shown or described (or one or more aspects thereof), either with respect to a particular example (or one or more aspects thereof), or with respect to other examples (or one or more aspects thereof) shown or described herein.
In the event of inconsistent usages between this document and any documents so incorporated by reference, the usage in this document controls.
In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In this document, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, composition, formulation, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.
Method examples described herein can be machine or computer-implemented at least in part. Some examples can include a computer-readable medium or machine-readable medium encoded with instructions operable to configure an electronic device to perform methods as described in the above examples. An implementation of such methods can include code, such as microcode, assembly language code, a higher-level language code, or the like. Such code can include computer readable instructions for performing various methods. The code may form portions of computer program products. Further, in an example, the code can be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media can include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memories (RAMs), read only memories (ROMs), and the like.
The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments can be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to comply with 37 C.F.R. §1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments can be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.