1. Field
The present disclosure relates generally to headpieces such as, for example, the headpieces in implantable cochlear stimulation (or “ICS”) systems.
2. Description of the Related Art
ICS systems are used to help the profoundly deaf perceive a sensation of sound by directly exciting the intact auditory nerve with controlled impulses of electrical current. Ambient sound pressure waves are picked up by an externally worn microphone and converted to electrical signals. The electrical signals, in turn, are processed by a sound processor, converted to a pulse sequence having varying pulse widths and/or amplitudes, and transmitted to an implanted receiver circuit of the ICS system. The implanted receiver circuit is connected to an implantable electrode array that has been inserted into the cochlea of the inner ear, and electrical stimulation current is applied to varying electrode combinations to create a perception of sound. A representative ICS system is disclosed in U.S. Pat. No. 5,824,022, which is entitled “Cochlear Stimulation System Employing Behind-The-Ear Sound Processor With Remote Control” and incorporated herein by reference in its entirety.
As alluded to above, some ICS systems include an implantable device, a sound processor unit, and a microphone that is in communication with the sound processor unit. The implantable device communicates with the sound processor unit and, to that end, some ICS systems include a headpiece, with a microphone, that is in communication with both the sound processor unit and the implantable device. In one type of ICS system, the sound processor unit is worn behind the ear (a “BTE unit”), while other types of ICS systems have a body worn sound processor unit (or “body worn unit”). The body worn unit, which is larger and heavier than a BTE unit, is typically worn on the user's belt or carried in the user's pocket. One example of a conventional body worn unit is the Advanced Bionics Platinum Series body worn unit.
One issue associated with ICS systems is the moisture resistance of the headpiece. In particular, the present inventor has determined that it would be desirable to provide a headpiece that includes a microphone and is capable of being worn during activities such as swimming and bathing where the headpiece may be subjected to submersion in water, splashing and the like. The present inventor has also determined that the moisture resistance features of the headpiece should be configured in such a manner that the acoustic response is not substantially degraded, as compared to an identical microphone that is not within the headpiece.
A cochlear implant headpiece in accordance with one embodiment of a present invention comprises a housing including a housing microphone aperture, a microphone carried within the housing and associated with the housing microphone aperture, a membrane between the housing microphone aperture and the microphone, and a cap, including a sound port and a shield over the sound port, configured to be positioned on the housing such that the sound port and shield are aligned with the housing microphone aperture. The present inventions also include cochlear stimulation systems with a cochlear implant, a sound processor, and such a headpiece.
A cochlear implant headpiece in accordance with one embodiment of a present invention comprises a housing, including an internal volume and a housing microphone aperture that extends to the internal volume, and a microphone carried within the housing internal volume and aligned with the housing microphone aperture. The internal volume is protected against particulate and moisture ingress to an extent greater than that required by IEC IP67. The present inventions also include cochlear stimulation systems with a cochlear implant, a sound processor, and such a headpiece.
A cochlear implant headpiece in accordance with one embodiment of a present invention comprises a housing, a transmitter, and a connector. The connector includes an electrically conductive barrel, an electrically conductive socket, an electrical insulator between the barrel and the socket, a first seal compressed between the barrel and the insulator, and a second seal compressed between the socket and the insulator. The present inventions also include cochlear stimulation systems with a cochlear implant, a sound processor, and such a headpiece.
A method of manufacturing a cochlear implant headpiece includes calculating the volume of the microphone aperture according to the formula
VAPERTURE>(WPMAX/AP)VMIC−VMIC, where
VAPERTURE=microphone aperture volume, WPMAX=water pressure at the predetermined maximum depth, AP=atmospheric pressure, and VMIC=internal microphone volume.
The above described and many other features of the present inventions will become apparent as the inventions become better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings.
Detailed descriptions of the exemplary embodiments will be made with reference to the accompanying drawings.
The following is a detailed description of the best presently known modes of carrying out the inventions. This description is not to be taken in a limiting sense, but is made merely for the purpose of illustrating the general principles of the inventions.
The present inventions have application in a wide variety of systems that provide sound (i.e., either sound or a perception of sound) to the hearing impaired as well as others who require such systems on a situational basis. One example of such a system is an ICS system where an external sound processor communicates with a cochlear implant and, accordingly, the present inventions are discussed in the context of ICS systems. The present inventions are not, however, limited to ICS systems and may be used in combination with other systems for the hearing impaired that currently exist, or are yet to be developed.
One example of an ICS system is generally represented by reference numeral 10 in
The exemplary headpiece 100 includes a housing 102 and a removable cap 104, as well as various components, e.g., a RF connector 106, a microphone 108, an antenna (or other transmitter) 110 and a positioning magnet 112, that are carried by the housing. Additional details concerning the headpiece 100 are described below with reference to
The exemplary sound processor 300 includes a housing 302 in which and/or on which various components are supported. Such components may include, but are not limited to, sound processor circuitry 304, a headpiece port 306, an auxiliary device port 308 for an auxiliary device such as a mobile phone or a music player, a control panel 310 (including, e.g., a volume knob and program switch), a Euro Plug receptacle 312 (for a Euro Plug such as that associated with the Phonak MLxi FM receiver), and a power supply receptacle 314 with electrical contacts 316 and 318 for a removable battery or other removable power supply 320 (e.g., rechargeable and disposable batteries or other electrochemical cells). A power button (not shown) may also be carried on the housing 302. The headpiece port 306 and auxiliary device port 308 may be connected to the sound processor circuitry 304 by way of, for example, a signal splitter/combiner (not shown) such as that found in the Platinum Signal Processor body worn unit from Advanced Bionics.
The headpiece 100 in the exemplary ICS system 10 may be connected to the headpiece port 306 by a cable 114. In at least some implementations, the cable 114 will be configured for forward telemetry and power signals at 49 MHz and back telemetry signals at 10.7 MHz. It should be noted that, in other implementations, communication between a sound processor and a headpiece and/or auxiliary device may be accomplished through wireless communication techniques.
The exemplary cochlear implant 400 includes a housing 402, an antenna 404, an internal processor 406, a cochlear lead 408 with an electrode array, and a positioning magnet (or magnetic material) 410. The transmitter 110 and receiver 404 communicate by way of electromagnetic induction, radio frequencies, or any other wireless communication technology. The positioning magnet 112 and positioning magnet (or magnetic material) 410 maintain the position of the headpiece antenna 110 over the cochlear implant antenna 404.
During use, the microphone 108 picks up sound from the environment and converts it into electrical impulses, and the sound processor 300 filters and manipulates the electrical impulses and sends the processed electrical signals through the cable 114 to the antenna 110. Electrical impulses received from an auxiliary device are processed in essentially the same way. The receiver 404 receives signals from the antenna 110 and sends the signals to the cochlear implant internal processor 406, which modifies the signals and passes them through the cochlear lead 408 to the electrode array. The electrode array may be wound through the cochlea and provides direct electrical stimulation to the auditory nerves inside the cochlea. This provides the user with sensory input that is a representation of external sound waves which were sensed by the microphone 108.
The exemplary sound processor 300 may be carried by the user in a variety of ways. By way of example, but not limitation, the sound processor 300 may be carried in the user's pocket, secured to a belt with a belt clip that is either part of housing 106 or a separate carrier, or placed in a harness that is configured to be worn by a small child.
Turning to
The exemplary housing 102 has an internal volume 144 (
The cap 104 in the illustrated embodiment may be connected to and then removed from the housing 102, i.e., the cap may be removably connected to the housing. As used herein, “removably connected” means that, once connected, the cap 104 will remain on the housing 102 under normal use conditions, but can be removed from the housing without destruction of the housing, the cap and/or the instrumentality that secures the two to one another. Although one exemplary connector configuration is illustrated in
Referring to
The exemplary friction pads 138 and 142 facilitate retention of the headpiece in the desired location over hair and sweat. As illustrated in
Suitable materials for the pads 138 and 142 include, but are not limited to, thermoplastic elastomers (TPE) such as SANTOPRENE TPE or VERSOLLAN TPE, or a silicone rubber such as SILASTIC silicone elastomer. The material may have a durometer of between 20 and 70 Shore A, and may be about 50 Shore A in some embodiments.
In the illustrated implementation, the base 176 is secured to the recess 140 in the housing cover bottom wall 134 with adhesive or other suitable instrumentalities. In other implementations, a second magnet (not shown) may be secured to the recess 140 in place of the friction pad 142 for patients that require a higher retention force.
Turning to
A variety of aspects of the exemplary headpiece 100 contribute to the aforementioned particulate and moisture ingress protection that is superior to that represented by the IEC IP67 standard. For example, and referring to
With respect to dimensions, the headpiece 100 may be any size suitable for the intended application. In one exemplary embodiment, and referring to
The connector 106 may also be configured so as to prevent particulate and moisture ingress beyond that required by an IP67 rating and, as discussed in greater detail below, to at least an IP68 rating. Turning to
With respect to assembly of the connector 106 into the housing 102, and referring to
Turning to
It should be noted here that, in the illustrated embodiment, the headpiece microphone aperture 226 (
Passage of moisture through the hole 207 in the microphone diaphragm 208 and into the interior of the microphone would damage or destroy the microphone 108, while dust and other particulates would degrade the acoustic response. Accordingly, the exemplary headpiece 100 is configured to protect the microphone diaphragm 208 from moisture without adversely effecting the acoustic response of the headpiece.
For example, the exemplary membrane 148 is a hydrophobic membrane that protects against water ingress into the microphone 108 at relatively low pressures, e.g., in the shower, or during submersion at depths up to 0.5 m where the water pressure is about 0.05 bar. Suitable materials for the membrane 148 include, but are not limited to, a hydrophobic-treated polyethylene sheet from Porex Technologies (part no. XM-18505) that is about 0.45+/−0.05 mm thick.
The exemplary shield 168 is an acoustic hydrophobic membrane that is configured to prevent dust, soap, oils, and other relatively large particles and drops (i.e. 30 microns or larger) from reaching membrane 148. The shield 168 will not preclude water from reaching the membrane 148 (e.g., during submersion), but will prevent air turbulence between the shield and membrane 148. The significance of turbulence prevention is discussed below. Suitable materials for the shield 168 include, but are not limited to, PETEX hydrophobic acoustic material (part no. 145-27 07-27/16), which is a 1:2 twill weave of PET monofilament fibers. It should also be noted that the shield 168 is a non-permanent, serviceable portion of the headpiece 100 and may be readily removed from the housing 102, along with the cap 104, and replaced as necessary or desired. In the illustrated embodiment, the shield 168 is a permanently secured to the cap 104 with adhesive and the shield will be replaced with the cap. The shield 168 is also robust enough to be cleaned by wiping the shield with a cloth when the cap 104 is removed from the housing.
The exemplary headpiece 100 may also be configured to maintain a column of air over the microphone 108 that will prevent moisture from reaching the microphone diaphragm 208 during submersion of the headpiece up to a predetermined maximum submersion depth (e.g., submersion up to a depth of 3.0 m). The column of air will not, however, interfere with the transmission of sound waves to the microphone diaphragm 208 or otherwise degrade the acoustic response of the headpiece as would positioning a non-porous cover between the microphone and the environment.
More specifically, and referring to
One example of the above-described volumetric relationship is diagrammatically illustrated in
The relationship of volumes V1, V2 and V3 is related Boyle's gas law, which states that the product of gas pressure and gas volume is a constant. Thus,
VACAP×AP=VACCOMP×WPMAX; and
VACCOMP=VACAP×(AP/WPMAX).
For example, atmospheric pressure is 100 kPa and water pressure at a depth of 3.0 m is 130 kPa. Thus, for a maximum submersion depth of 3.0 m, VACCOMP=VACAP×(100/130)=(V1+V2+V3)(100/130). However, given that VACCOMP should be greater than V3 in order to prevent damage to the microphone, the equation (V1+V2)>0.3V3 defines the volumetric relationship when the predetermined maximum submersion depth is 3.0 m. The relationship of (V1+V2), which is the aperture volume on the housing side of the microphone diaphragm 208, to V3, which is the volume on the other side of the microphone diaphragm, will be different for different maximum submersion depths. Thus, more generally, the equation (V1+V2)>(WPMAX/AP)V3−V3 defines a volumetric relationship whereby the air column will prevent water from reaching the microphone diaphragm 208.
Additionally, for best performance, the air column AC should not be subjected to turbulence during submersion that could result is some of the air escaping from the column and being replaced with water. The shield 168 reduces the likelihood that there will be turbulence sufficient to result in air escape. Alternatively, or in addition, horizontal and/or vertical baffles (not shown) may be provided in the air column AC in some embodiments to further prevent turbulence in the air column.
The headpiece described above was also tested under various conditions. Test results, which are presented in graph form in
The acoustic response of a microphone 108 mounted in a headpiece 100 in the manner described above was measured at frequencies ranging from 150 Hz to 10 kHz under a variety of test conditions. The goal prior to testing was no more than +/−6 dB deviation from a theoretically perfect microphone after being subjected to all test conditions, as shown by the upper limit UL and lower limit LL plots on the graph illustrated in
A single headpiece 100 was employed for all of the tests discussed below. Under test condition TC1, the acoustic response of the microphone 108 in a new, dry headpiece 100 was tested. In other words, test condition TC1 is simply used to confirm that the microphone 108 is not defective and that the acoustic response of the headpiece is within the acceptable, not substantially degraded, range. For test condition TC2, which is referred to herein as the “IP68 test,” the same headpiece 100 was submerged in water at a depth of 3 m for 30 minutes. The headpiece 100 was then fully dried and the acoustic response of the microphone 108 in the headpiece tested. Test conditions TC3 to TC5 simulate the exposure to water and other contaminants that a headpiece 100 could experience over the course of three years, and are substantially tougher than the IP68 test. Test condition TC3 is representative of the amount of direct exposure to a shower stream that the headpiece will experience, assuming that the wearer takes one shower a day for three years. Here, the headpiece 100 was subjected to 27 cycles of exposure to a direct shower stream. Each cycle consisted of 30 minutes of direct exposure to the shower stream followed by shaking, wiping and full drying (e.g., 1-8 hours in a desiccant dryer). The acoustic response of the microphone 108 in the headpiece 100 was tested after the last cycle. Test condition TC4 is representative of conditions that would be experienced in a bathtub environment over the course of three years. Here, the headpiece 100 was subjected to 9 cycles of submersion to a depth of 0.05 m in bath water including soap, shampoo and lotion. Each cycle consisted of 1 hour of submersion followed by shaking, wiping and full drying (e.g., 1-8 hours in a desiccant dryer). The acoustic response of the microphone 108 in the headpiece 100 was tested after the last cycle. Test condition TC5 is representative of the conditions that could be experienced by a headpiece worn by a person who swims twice a week. Here, the headpiece 100 was subjected to 5 cycles of submersion to a depth of 1.0 m in pool water including chlorine. Each cycle consisted of 30 minutes of submersion followed by shaking, wiping and full drying (e.g., 1-8 hours in a desiccant dryer). The acoustic response of the microphone 108 in the headpiece 100 was tested after the last cycle.
As illustrated in
Although the inventions disclosed herein have been described in terms of the preferred embodiments above, numerous modifications and/or additions to the above-described preferred embodiments would be readily apparent to one skilled in the art. By way of example, but not limitation, the inventions include any combination of the elements from the various species and embodiments disclosed in the specification that are not already described. Additionally, the inventions described herein are also applicable to BTE sound processors. The present inventions also include systems including headpieces in accordance with description above and claims below in combination with a sound processor and/or a cochlear implant. It is intended that the scope of the present inventions extend to all such modifications and/or additions and that the scope of the present inventions is limited solely by the claims set forth below.
This application is a continuation of U.S. application Ser. No. 13/977,549, now U.S. Pat. No. 9,132,270, which has a 35 U.S.C. § 371(c) date of Jul. 23, 2013, which is the U.S. National Stage of PCT App. Ser. No. PCT/US2012/020980, filed Jan. 11, 2012, which claims priority to U.S. Prov. App. Ser. No. 61/433,622, filed Jan. 18, 2011. The content of each application is incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
3064089 | Ward | Nov 1962 | A |
3976848 | Estes | Aug 1976 | A |
4073366 | Estes | Feb 1978 | A |
4447677 | Miyahra et al. | May 1984 | A |
4570746 | Das et al. | Feb 1986 | A |
4736740 | Parker et al. | Apr 1988 | A |
4776343 | Hubbard | Oct 1988 | A |
4870952 | Martinez | Oct 1989 | A |
4953215 | Weiss et al. | Aug 1990 | A |
4966252 | Drever | Oct 1990 | A |
4987597 | Haertl | Jan 1991 | A |
5000177 | Hoffmann | Mar 1991 | A |
5168876 | Quedens | Dec 1992 | A |
5205288 | Quedens | Apr 1993 | A |
5222050 | Marren | Jun 1993 | A |
5278360 | Carbe et al. | Jan 1994 | A |
5365595 | Li | Nov 1994 | A |
5530763 | Aebi et al. | Jun 1996 | A |
5545859 | Ullrich | Aug 1996 | A |
5627802 | Langer | May 1997 | A |
5828761 | Langer | Oct 1998 | A |
6018585 | Akino et al. | Jan 2000 | A |
6061457 | Stockhamer | May 2000 | A |
6071527 | Tsujino et al. | Jun 2000 | A |
6093144 | Jaeger et al. | Jul 2000 | A |
6104816 | Downs, Jr. et al. | Aug 2000 | A |
6129174 | Brown et al. | Oct 2000 | A |
6134333 | Flagler | Oct 2000 | A |
6164409 | Berger | Dec 2000 | A |
6188773 | Murata et al. | Feb 2001 | B1 |
6310961 | Oliveira et al. | Oct 2001 | B1 |
6422991 | Jaeger | Jul 2002 | B1 |
6427018 | Keliiliki | Jul 2002 | B1 |
6505076 | Tziviskos et al. | Jan 2003 | B1 |
6512834 | Banter et al. | Jan 2003 | B1 |
6600825 | Leysieffer | Jul 2003 | B1 |
6626822 | Jaeger et al. | Sep 2003 | B1 |
6707920 | Miller | Mar 2004 | B2 |
6795562 | Gunnersen et al. | Sep 2004 | B1 |
6813364 | Vonlanthen | Nov 2004 | B1 |
6879696 | Vonlanthen | Apr 2005 | B1 |
6891956 | Heerlein et al. | May 2005 | B2 |
6935458 | Owens | Aug 2005 | B2 |
7013016 | Wolf | Mar 2006 | B2 |
7065224 | Cornelius et al. | Jun 2006 | B2 |
7136496 | van Halteren et al. | Nov 2006 | B2 |
7283640 | Karamuk | Oct 2007 | B2 |
7313245 | Shennib | Dec 2007 | B1 |
7322930 | Jaeger et al. | Jan 2008 | B2 |
7433482 | Wehner | Oct 2008 | B2 |
7630772 | Walsh et al. | Dec 2009 | B1 |
7751579 | Shulein et al. | Jul 2010 | B2 |
7793756 | Karamuk | Sep 2010 | B2 |
8068914 | Walsh et al. | Nov 2011 | B1 |
8155748 | Walsh et al. | Apr 2012 | B1 |
8509469 | Miller, III | Aug 2013 | B2 |
9132270 | Vaishya | Sep 2015 | B2 |
20010036264 | Ito et al. | Nov 2001 | A1 |
20020177883 | Tziviskos et al. | Nov 2002 | A1 |
20030002706 | Keliiliki | Jan 2003 | A1 |
20030219138 | Vonlanthen et al. | Nov 2003 | A1 |
20040039245 | Jaeger et al. | Feb 2004 | A1 |
20040161104 | DeMichele et al. | Aug 2004 | A1 |
20040179709 | Niederdraenk | Sep 2004 | A1 |
20050018866 | Schulein et al. | Jan 2005 | A1 |
20050077102 | Banter | Apr 2005 | A1 |
20050175203 | Karamuk | Aug 2005 | A1 |
20060042865 | Berg et al. | Mar 2006 | A1 |
20060114751 | Ferri et al. | Jun 2006 | A1 |
20060140432 | Ueki | Jun 2006 | A1 |
20060161255 | Zarowski | Jul 2006 | A1 |
20060215863 | Sauer | Sep 2006 | A1 |
20060254851 | Karamuk | Nov 2006 | A1 |
20070003081 | Ram et al. | Jan 2007 | A1 |
20070003087 | Ram et al. | Jan 2007 | A1 |
20070106344 | Darley | May 2007 | A1 |
20070113964 | Crawford et al. | May 2007 | A1 |
20080095390 | Gebert et al. | Apr 2008 | A1 |
20080165996 | Saito et al. | Jul 2008 | A1 |
20080240479 | Linford et al. | Oct 2008 | A1 |
20080298627 | Bonebright et al. | Dec 2008 | A1 |
20090074220 | Shennib | Mar 2009 | A1 |
20090147978 | Sauer et al. | Jun 2009 | A1 |
20090154747 | Vestergaard | Jun 2009 | A1 |
20100092021 | Wiskerke | Apr 2010 | A1 |
20100128915 | Vonlanthen et al. | May 2010 | A1 |
20100137941 | Darley | Jun 2010 | A1 |
20100137942 | Darley | Jun 2010 | A1 |
20100185254 | Lindquist | Jul 2010 | A1 |
20100202648 | Dittli et al. | Aug 2010 | A1 |
20100204747 | Lindquist | Aug 2010 | A1 |
20100317936 | Al-Ali | Dec 2010 | A1 |
20100319189 | Karamuk | Dec 2010 | A1 |
20110029041 | Wiskerke | Feb 2011 | A1 |
20110046730 | Meskens | Feb 2011 | A1 |
20110085688 | Ram | Apr 2011 | A1 |
20110319703 | Wiskerke | Dec 2011 | A1 |
20120041517 | Walsh et al. | Feb 2012 | A1 |
20120163643 | Vestergaard | Jun 2012 | A1 |
20120219167 | Yoong | Aug 2012 | A1 |
20130035744 | Wiskerke | Feb 2013 | A1 |
20130243229 | Shennib | Sep 2013 | A1 |
20140169602 | Walsh | Jun 2014 | A1 |
20150016648 | Kazemzadeh et al. | Jan 2015 | A1 |
Number | Date | Country |
---|---|---|
10104129 | Aug 2002 | DE |
102007027920 | Dec 2008 | DE |
0548580 | Mar 1996 | EP |
0835042 | Apr 1998 | EP |
0847227 | Jun 1998 | EP |
0920239 | Jun 1999 | EP |
1011295 | Jun 2000 | EP |
1060640 | Dec 2000 | EP |
1154583 | Nov 2001 | EP |
1439733 | Jul 2004 | EP |
2802374 | Jun 2001 | FR |
1099527 | Jan 1968 | GB |
2119203 | Nov 1983 | GB |
2369522 | May 2002 | GB |
62-290296 | Dec 1987 | JP |
07-015494 | Jan 1995 | JP |
07-162984 | Jun 1995 | JP |
2003-259474 | Sep 2003 | JP |
2004-007330 | Jan 2004 | JP |
2005-311917 | Nov 2005 | JP |
2006-186422 | Jul 2006 | JP |
2008-098743 | Apr 2008 | JP |
2008-199225 | Aug 2008 | JP |
WO 9701258 | Jan 1997 | WO |
WO 9945744 | Sep 1999 | WO |
WO 0002419 | Jan 2000 | WO |
WO 0045617 | Aug 2000 | WO |
WO 03061335 | Jul 2003 | WO |
WO 2004075159 | Sep 2004 | WO |
WO 2007005852 | Jan 2007 | WO |
WO 2007109517 | Sep 2007 | WO |
WO 2008116500 | Oct 2008 | WO |
WO 2008154954 | Dec 2008 | WO |
WO 2009138524 | Nov 2009 | WO |
WO 2009146494 | Dec 2009 | WO |
WO 2009152528 | Dec 2009 | WO |
WO 2010009504 | Jan 2010 | WO |
WO 2010116005 | Oct 2010 | WO |
WO 2011015674 | Feb 2011 | WO |
Entry |
---|
PCT Invitation to Pay Additional Fees and Results of Partial International Search dated Apr. 4, 2012 for PCT App. Ser. No. PCT/US2012/020980. |
Number | Date | Country | |
---|---|---|---|
20150382118 A1 | Dec 2015 | US |
Number | Date | Country | |
---|---|---|---|
61433622 | Jan 2011 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13977549 | US | |
Child | 14796157 | US |