Mold clamping apparatus for injection molding machine

Abstract

A mold clamping apparatus has a mold clamping force transmitting member disposed in a middle part of a mold mounting platen on which a mold is mounted. An abutting member is detachably provided in a spaced area between a peripheral portion of a mold mounting platen and peripheral portion of a mold clamping force transmitting member. If this abutting member is retreated from the spaced area so that it does not touch the mold mounting platen or the mold clamping force transmitting member, the deflection of the mold clamping force transmitting member due to a mold clamping force is not transmitted to the mold mounting platen. On the other hand, if this abutting member is inserted in the spaced area so that it touches the mold mounting platen or the mold clamping force transmitting member, the deflection of the mold clamping force transmitting member is transmitted to the mold mounting platen. With this arrangement, in this mold clamping apparatus, it is possible to use both a mold that was corrected so as to cope with the occurrence of the deflection of a mold mounting platen and a mold that was not corrected in this way.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The forgoing and other objects and feature of the invention will be apparent from the following description of preferred embodiments of the invention with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of the first embodiment of a mold clamping apparatus of the present invention;

FIG. 2 is a schematic diagram of the second embodiment of a mold clamping apparatus of the present invention;

FIG. 3 is a schematic diagram of the third embodiment of a mold clamping apparatus of the present invention;

FIG. 4 is a schematic diagram of the fourth embodiment of a mold clamping apparatus of the present invention;

FIG. 5 is an enlarged view of a connecting member that constitutes the mold clamping apparatus shown in FIG. 4;

FIG. 6 is a schematic diagram of a conventional mold clamping apparatus; and

FIG. 7 is a schematic diagram of a mold clamping apparatus having a conventional mold clamping force transmitting member.

Claims

1. A mold clamping apparatus for an injection molding machine, in which a mold clamping force transmitting member which transmits a mold clamping force to a middle part of a mold mounting platen is provided and a peripheral portion of the mold mounting platen and a peripheral portion of the mold clamping force transmitting member are spaced from each other, wherein a connection member is provided in a spaced area between the peripheral portion of the mold mounting platen and the peripheral portion of the mold clamping force transmitting member in a manner such that it can be changed from connected state to non-connected state or from non-connected state to connected state; andsaid connection member has a portion which abuts against, or connects to, the peripheral portion of the mold mounting platen, on one side thereof, and a portion which abuts against, or connects to, the peripheral portion of the mold clamping force transmitting member, on the other side thereof.

2. The mold clamping apparatus according to claim 1, wherein the mold clamping force transmitting member has a leading end surface having a tapered shape that abuts against the middle part of a face of the mold mounting platen on the side opposite the mold mounting face thereof.

3. The mold clamping apparatus according to claim 2, wherein the spaced area between the peripheral portion of the mold mounting platen and peripheral portion of the mold clamping force transmitting member is formed having a tapered section, and the connection member is a wedge-shaped abutting member and is constructed so as to be inserted into the spaced area having a tapered section, with one surface thereof abutting against a surface of the peripheral portion of the mold mounting platen and the other surface thereof abutting against a surface of the peripheral portion of the mold clamping force transmitting member.

4. The mold clamping apparatus according to claim 1, further comprising connected state changeover means that carries out changeover between a state where the mold clamping force transmitting member and the mold mounting platen are connected to each other via the connection member and a state where the mold clamping force transmitting member is not connected to the mold mounting platen with the interposing of the connection member cancelled.

5. The mold clamping apparatus according to claim 4, wherein the connected state changeover means carries out changeover between a connected state where when a mold clamping force acts, one side of the connecting member abuts against or connects to the peripheral portion of the mold mounting platen and the other side thereof abuts against or connects to the peripheral portion of the mold clamping force transmitting member and a non-connected state where even when a mold clamping force does or does not act, one side of the connecting member does not abut against or does not connect to the peripheral portion of the mold mounting platen or/and further the other side thereof does not abut against or does not connect to the peripheral portion of the mold clamping force transmitting member.

6. The mold clamping apparatus according to claim 1, further comprising applied connecting force adjusting means that adjusts an abutting force or a connecting force applied to between the mold mounting platen and the mold clamping force transmitting member by interposing the connection member.

7. The mold clamping apparatus according to claim 6, wherein the abutting force or the connecting force adjusted by the applied connecting force adjusting means is a force that is applied to between the mold mounting platen and the mold clamping force transmitting member when a mold clamping force does not act on a mold mounted on the mold mounting platen.

8. The mold clamping apparatus according to claim 1, wherein the connection member comprises connected state maintaining means for maintaining a state of abutment or connection between the mold mounting platen and the mold clamping force transmitting member.

9. The mold clamping apparatus according to claim 8, wherein the connected state maintaining means is adjusted such that transmission of force by the connection member is started when a mold clamping force that acts on a mold mounted on the mold mounting platen has reached a prescribed value.

10. The mold clamping apparatus according to claim 8, wherein, after adjusting of the magnitude of an abutting force or a connecting force applied to between the mold mounting platen and the mold clamping force transmitting member by use of the applied connecting force adjusting means, the connected state maintaining means maintains a state where the connection means abuts against, or connects to, a connection area so that a force transmitted by the connection member becomes constant regardless of a mold clamping force.

11. The mold clamping apparatus according to claim 1, wherein the connection means is a fluid cylinder, one end of which is connected to the peripheral portion of the mold mounting platen and the other end of which is connected to the peripheral portion of the mold clamping force transmitting member, and a fluid circuit that supplies a fluid to the fluid cylinder can be closed and opened.

12. The mold clamping apparatus according to claim 1, wherein the connection means is a turnbuckle, one end of which is connected to the peripheral portion of the mold mounting platen and the other end of which is connected to the peripheral portion of the mold clamping force transmitting member, and the turnbuckle is constructed so as to permit disengagement from connection to the peripheral portion of the mold mounting platen or connection to the peripheral portion of the mold clamping force transmitting member.

13. A method of mold clamping adjustment of a mold clamping apparatus for an injection molding machine, said mold clamping apparatus comprises a mold clamping force transmitting member which transmits a mold clamping force to a middle part of a mold mounting platen, and a peripheral portion of the mold mounting platen and a peripheral portion of the mold clamping force transmitting member are spaced from each other,the mold clamping apparatus further comprises;a connection member in a spaced area between the peripheral portion of the mold mounting platen and the peripheral portion of the mold clamping force transmitting member in a manner such that it can be changed over from connected state to non-connected state or from non-connected state to connected state, and the connection member has a portion which abuts against, or connects to, the peripheral portion of the mold mounting platen, on one side thereof, and a portion which abuts against, or connects to, the peripheral portion of the mold clamping force transmitting member, on the other side thereof; andconnected state changeover means that carries out changeover between a state where the mold clamping force transmitting member and the mold mounting platen are connected to each other via the connection member and a state where the mold clamping force transmitting member is not connected to the mold mounting platen with the interposing of the connection member cancelled;the method of mold clamping adjustment including the steps of:mounting a mold to a fixed platen and a movable platen;carrying out molding, with the connection member brought into either of a connected state or a non-connected state;measuring the size and shape of a molded article obtained by the molding;carrying out mass-production molding without changing over the connection/non-connection of the connection member when the size and shape of the measured molded article fall in prescribed ranges;carrying out molding again by changing over the connection/non-connection of the connection member when the size and shape of the measured molded article go out of the prescribed ranges;measuring the size and shape of a molded article obtained by the molding carried out again; andcarrying out mass-production molding following the molding performed again without changing over the connection/non-connection of the connection member when the size and shape of the measured molded article fall in prescribed ranges.

14. A method of mold clamping adjustment of a mold clamping apparatus for an injection molding machine, said mold clamping apparatus comprises a mold clamping force transmitting member which transmits a mold clamping force to a middle part of a mold mounting platen, and a peripheral portion of the mold mounting platen and a peripheral portion of the mold clamping force transmitting member are spaced from each other,the mold clamping apparatus further comprises;a connection member in a spaced area between the peripheral portion of the mold mounting platen and the peripheral portion of the mold clamping force transmitting member in a manner such that it can be changed over from connected state to non-connected state or from non-connected state to connected state, and the connection member has a portion which abuts against, or connects to, the peripheral portion of the mold mounting platen, on one side thereof, and a portion which abuts against, or connects to, the peripheral portion of the mold clamping force transmitting member, on the other side thereof;connected state changeover means that carries out changeover between a state where the mold clamping force transmitting member and the mold mounting platen are connected to each other via the connection member and a state where the mold clamping force transmitting member is not connected to the mold mounting platen with the interposing of the connection member cancelled;applied connecting force adjusting means that adjusts an abutting force or a connecting force applied to between the mold mounting platen and the mold clamping force transmitting member by interposing the connection member; whereinthe connection member comprises connected state maintaining means for maintaining a state of abutment or connection between the mold mounting platen and the mold clamping force transmitting member;the method of mold clamping adjustment including the steps of:mounting a mold to a fixed platen and a movable platen;carrying out injection molding by use of the mold;measuring the size and shape of a molded article obtained by the injection molding;carrying out mass-production molding when the size and shape of the measured molded article fall in prescribed ranges;changing over a connected/non-connected state by use of the connected state changeover means according to differences between the size and shape of the molded article and target values thereof, or adjusting an abutting force or a connecting force applied to between the mold mounting platen and the mold clamping force transmitting member by use of the applied connecting force adjusting means when the size or shape of the measured molded particle goes out of a prescribed range; andcarrying out injection molding again, with the condition of abutment or connection between the mold mounting platen and the mold clamping force transmitting member maintained by use of the connected state maintaining means.

15. The mold clamping apparatus according to claim 3, further comprising connected state changeover means that carries out changeover between a state where the mold clamping force transmitting member and the mold mounting platen are connected to each other via the connection member and a state where the mold clamping force transmitting member is not connected to the mold mounting platen with the interposing of the connection member cancelled.

16. The mold clamping apparatus according to claim 6, wherein the connection member comprises connected state maintaining means for maintaining a state of abutment or connection between the mold mounting platen and the mold clamping force transmitting member.