Claims
- 1. A method of making a mold cover powder, the mold cover powder comprising a basis powder and particles of at least one metal nitride and having a free-carbon content (%Cfree) between 0 and 1% by weight, the method comprising:(a) forming a slip comprising (i) raw materials for the basis powder, (ii) the at least one metal nitride and (iii) water; (b) atomizing the slip to form a mist; and (c) drying the mist to form granules having diameters lying between 20 μm and 800 μm.
- 2. A method according to claim 1, wherein step (c) comprises drying the mist in a stream of air at 600° C.
- 3. A method according to claim 1, wherein the granules have an average diameter between 300 and 500 μm.
- 4. A method according to claim 1, wherein the nitride is selected from a group consisting of boron, silicon, aluminum, titanium, manganese, zirconium, iron and chromium nitrides.
- 5. A method according to claim 4, wherein the nitride is silicon nitride having a weight content (%Si3N4) equal to:%Si3N4=0.5−0.28×%Cfree±0.10.
- 6. A method according to claim 1, wherein the metal nitride particles have an average diameter less than or equal to 5 μm and a specific surface area of from 2.5 to 3.5 g/m2.
Priority Claims (1)
Number |
Date |
Country |
Kind |
95-00915 |
Jan 1995 |
FR |
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Parent Case Info
This is a division of application Ser. No. 08/716,430 filed Sep. 20, 1996.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4038067 |
Takeuchi |
Jul 1977 |
|
5876482 |
Debiesme et al. |
Mar 1999 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
2314000A |
Jan 1977 |
FR |
2201108A |
Aug 1988 |
GB |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan; vol. 004, No. 190 (C-037), Dec. 26, 1980 & JP-A-55128526 (Nippon Kokan KK; Others; 01), Oct. 4, 1980. |