Mold for packaging semiconductor light emitting device

Abstract

Description

FIG. 1 is a perspective view of a mold for packaging semiconductor light emitting device, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a sectional view thereof, taken generally along the line A-A′ in FIG. 6; and,

FIG. 9 is a sectional view thereof, taken generally along the line B-B′ in FIG. 6.

Claims

The ornamental design for a mold for packaging semiconductor light emitting device, as shown and described.