Patent Application
20130309349
An aspect generally relates to (but is not limited to) a mold-tool system including (but not limited to) a molding system having the mold-tool system.
U.S. Pat. No. 7,160,101 discloses a radiant energy source for a nozzle in which the nozzle is partially transparent. The nozzle, or parts thereof, is at least partially transparent to allow radiant energy to pass therethrough.
U.S. Patent publication Number 2007/0181282 discloses an injection molding system for molding metal alloy above alloy solidus temperature.
U.S. Patent publication Number 2004/0166195 discloses an injection molding device useful for dissipating heat from a manifold comprises dissipation device having first end coupled to the manifold and second end bent towards cooling member prior to introducing heat to the manifold.
The inventors have researched a problem associated with known molding systems that inadvertently manufacture bad-quality molded articles or parts. After much study, the inventors believe they have arrived at an understanding of the problem and its solution, which are stated below, and the inventors believe this understanding is not known to the public.
A problem identified by the inventors is that a cooling layout of a mold-tool system may result in the nozzle assemblies that are located at the outer positions of a manifold assembly may be subjected to increased surface area of cooling when compared to the inner positioned nozzle assemblies or drops of the manifold assembly of a runner system. The result may be for the outer located nozzle assemblies to have smaller part weights than the inner positioned nozzle assemblies. The increased cooling to the nozzle assemblies may results in a colder operating manifold plate, which cools the nozzle housing, which reduces the plastic flow to a mold assembly.
According to one aspect, there is provided a mold-tool system, comprising: a manifold assembly; a plate assembly defining a manifold-receiving space receiving the manifold assembly; a nozzle assembly; a nozzle-locating assembly positionally locating the nozzle assembly relative to the manifold assembly and to the plate assembly; and a heat-transfer obstruction being positioned between the plate assembly and the nozzle-locating assembly, the heat-transfer obstruction being configured to obstruct transfer of heat from the plate assembly toward the nozzle-locating assembly.
Other aspects and features of the non-limiting embodiments will now become apparent to those skilled in the art upon review of the following detailed description of the non-limiting embodiments with the accompanying drawings.
The non-limiting embodiments will be more fully appreciated by reference to the following detailed description of the non-limiting embodiments when taken in conjunction with the accompanying drawings, in which:
The drawings are not necessarily to scale and may be illustrated by phantom lines, diagrammatic representations and fragmentary views. In certain instances, details not necessary for an understanding of the embodiments (and/or details that render other details difficult to perceive) may have been omitted.
The definition of the mold-tool system (100) is as follows: a system that may be positioned and/or may be used in an envelope defined by a platen system of the molding system (not depicted), such as an injection-molding system for example. The platen system may include a stationary platen and a movable platen that is moveable relative to the stationary platen. By way of example, the mold-tool system (100) may be included in (and is not limited to): a runner system, such as a hot runner system or a cold runner system.
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The nozzle assembly (106) may include or may have a stem-actuation assembly (204). The plate assembly (104) may have a cooling line (300). It is understood that a cooling line (300) may be one or more cooling lines (300). A technical effect of the mold-tool system (100), amongst other effects, is that the heat-transfer obstruction (110) may improve balance of the manifold assembly (102) by reducing relative coolness of the nozzle assembly (106). A support mechanism (116), which may be also called a back-up pad, may support the nozzle-locating assembly (108) with the heat-transfer obstruction (110). The heat-transfer obstruction (110) may be configured, amongst other things, to locally reduce heat-transfer efficiency of the cooling line (300) in the plate assembly (104). A drop block (906) may be received in the manifold assembly (102). The drop block (906) may define part of the melt channel (201). A dowel 908 may be used to positional locate the manifold assembly (102) with the plate assembly (104). An orientation dowel (910) may be used to positionally orient the drop block (906) with the manifold assembly (102). A spring assembly (912) may be used to bias the nozzle assembly (106) to the manifold assembly (102). A nozzle-locating pin (913) may be used to (that is, configured to) locate the nozzle assembly (106) relative to the manifold assembly (102). A locating pin (914) may positionally locate the backing-plate assembly (900) with the manifold plate (902). A locating pin (916) may positionally locate the manifold plate (902) with the mold assembly (904).
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According to one option, the insulation pocket (400) may be positioned proximate to the nozzle-body assembly (200). According to another option, the insulation pocket (400) may be positioned proximate to the stem-actuation assembly (204). According to another option, (i) the insulation pocket (400) may be positioned proximate to the nozzle-body assembly (200), and (ii) the insulation pocket (400) may be positioned proximate to the stem-actuation assembly (204). The insulation pocket (400) may also be called a cut out. The insulation pocket (400) may be any one of a thru pocket and a blind pocket and a combination thereof.
It will be appreciated that the mold-tool system (100) may be adapted, for example and not limited to) the following arrangement: the heat-transfer obstruction (110) may include (by way of example and is not limited to) all of the following components in combination: (i) the cooling-obstructive member (302), and (ii) the insulation pocket (400).
It will be appreciated that installation of plastic tubes in the cooling line (300) may be used (or may be configured) to reduce the cooling efficiency of a corner drop (nozzle assembly). The tube may be installed to a block or reduce cooling to a corner drop—that is a nozzle assembly that may be located at a corner position of the manifold assembly (102). The insulation pocket (400) or the insulation pockets (400) may be configured to block or reduce heat transfer from the nozzle assembly to a header. The insulator spacer may be positioned between the header lines and the plate to thermally insolate the headers from the nozzle assemblies.
It is understood that the scope of the present invention is limited to the scope provided by the independent claim(s), and it is also understood that the scope of the present invention is not limited to: (i) the dependent claims, (ii) the detailed description of the non-limiting embodiments, (iii) the summary, (iv) the abstract, and/or (v) description provided outside of this document (that is, outside of the instant application as filed, as prosecuted, and/or as granted). It is understood, for the purposes of this document, the phrase “includes (and is not limited to)” is equivalent to the word “comprising”. It is noted that the foregoing has outlined the non-limiting embodiments (examples). The description is made for particular non-limiting embodiments (examples). It is understood that the non-limiting embodiments are merely illustrative as examples.
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/US12/23903 | 2/5/2012 | WO | 00 | 7/24/2013 |
| Number | Date | Country | |
|---|---|---|---|
| 61440881 | Feb 2011 | US |
