Patent Grant
11872457
Despite the current popularity of hockey, television viewing is hampered by the poor visibility of the hockey puck as it moves around the ice at high speeds. In order to be able to view all areas of the ice rink, cameras must be located far from the ice rink. Thus, a standard hockey puck tends to appear as a small dot on the screen. As a result, it is difficult to follow the puck as it is passed from player to player, and it is especially difficult to follow the puck as it is shot toward the goal and either deflected, caught or missed by the goalie. Often, viewers recognize a score only when a signal light is lit or the announcer informs the viewer that a goal has been scored.
U.S. Pat. No. 5,564,698 discloses a hockey puck including electromagnetic transmitters. The transmitters transmit a signal, for example an IR signal, which is captured in one or more sensors around the ice rink. The sensors are able to locate the instantaneous position of the hockey puck, which permits enhancement of the image of the puck on a television monitor. It is important that the transmitters within the puck not affect the overall dimensions of the puck, or the performance of the puck, such as its feel when struck and its reaction when received on a stick or bouncing off a surface.
Embodiments of the present technology relate to a hockey puck including an internal transmitter enabling instantaneous identification of its position as it moves around. In embodiments, the puck is comprised of two molded subcomponents, which encapsulate a signal transmitter and are sealed together to form the hockey puck. The signal transmitter may include driver electronics and a number of signal transmitters which together generate and emit an electromagnetic signal. In one embodiment, the electromagnetic signal may be infrared (IR) light emitted by a plurality of diodes mounted in openings in the subcomponents, for example around an outer circumference of the hockey puck and through a top and bottom surfaces of the hockey puck. In still further embodiments, the puck may be formed of a material that allows electromagnetic radiation to be emitted through the subcomponents, and the diode cavities may be omitted.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
Embodiments of the present technology will now be described with reference to the figures, which in general relate to a hockey puck including an internal signal transmitter enabling instantaneous identification of the puck position as it moves around an ice rink. In embodiments, the puck is comprised of two molded subcomponents, which encapsulate a signal transmitter and fit together to form the hockey puck. The two molded subcomponents may be formed of vulcanized rubber, and may include various features for supporting the signal transmitter and for ensuring a tight and secure fit when the subcomponents are joined together. In embodiments, the subcomponents may be formed of top and bottom halves, or an outer ring surrounding an inner plug.
It is understood that the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the invention to those skilled in the art. Indeed, the invention is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be clear to those of ordinary skill in the art that the present invention may be practiced without such specific details.
The terms “top” and “bottom,” “upper” and “lower” and “vertical” and “horizontal,” or variations thereof, as may be used herein are by way of example and illustrative purposes only, and are not meant to limit the description of the invention inasmuch as the referenced item can be exchanged in position and orientation. Also, as used herein, the terms “substantially” and/or “about” mean that the specified dimension or parameter may be varied within an acceptable manufacturing tolerance for a given application. In one embodiment, the acceptable manufacturing tolerance is ±0.25%.
The signal transmitter may include a printed circuit board with driver electronics, power source and a number of signal transmitters which together generate and emit an electromagnetic signal. In one embodiment, the electromagnetic signal may be infrared (IR) light emitted by a plurality of diodes around an outer circumference of the hockey puck and through top and bottom surfaces of the hockey puck. Other wavelengths of electromagnetic energy may be used in further embodiments. In embodiments, the printed circuit board and diodes may be encased within a capsule, but the capsule may be omitted in further embodiments.
In embodiments using diodes, the subcomponents may be formed with openings around the outer circumference and top and bottom surfaces for receiving the diodes. The openings allow ends of the diodes to extend to the outer surface of the puck to enable signal emission from the puck. In embodiments where the diodes are encased within a capsule recessed within the puck, signals from the diodes may be communicated from the diodes to the outer surface of the puck by light pipes provided in the openings in the subcomponents. In still further embodiments, the puck may be formed of a material that allows electromagnetic radiation to be emitted through the subcomponents, and the diode openings may be omitted.
The physical characteristics of the puck of the present technology may be the same as a conventional puck without a signal transmitter. Thus, the composition of the subcomponents may be customized for each embodiment of the signal transmitter. The physical characteristics may for example include the look, feel, size and weight of the puck. The physical characteristics may further include the performance of the puck, such as its feel and reaction when caught, struck or passed, and its reaction when bouncing off a surface.
As explained below, puck 100 may house a signal transmitter. As such, subcomponents of the puck 100 may be molded, and then assembled together with the signal transmitter encased within an interior of the puck 100. In the embodiment shown in
However, as explained below, the ratios of the various materials may be adjusted relative to those used in a conventional hockey puck to provide the same performance as a conventional hockey puck despite the hollow core and signal transmitter encased therein. In addition to or instead of varying the ratio of the puck materials, the cure time and/or temperature at which the subcomponents 106, 108 are formed may vary relative to that of a conventional hockey puck to provide the same performance as a conventional hockey puck.
The signal transmitter 110 emits electromagnetic radiation from the different surfaces of the puck 100, which radiation is detected by sensors around the ice rink regardless of the orientation of the puck 100. The sensors are able to locate the instantaneous position of the hockey puck, which permits enhancement of the image of the puck on a television monitor. For example, the puck may be highlighted in different colors, or different-colored contrails may be shown behind the puck, as it is shot, passed, leaves the ice surface or enters the goal.
Details of the electronics and components of signal transmitter 110 are disclosed for example in U.S. Pat. No. 5,564,698, entitled “Electromagnetic Transmitting Hockey Puck.” However, referring now to the perspective view of
In embodiments, the signal transmitter 110 may further include a number of diodes 120 (some of which are numbered in
In the embodiment shown, there are a total of eighteen diodes 120: four axially extending diodes 120a on a top surface of PCB 114 (to emit a signal from a top surface of the puck), four axially extending diodes 120b on a bottom surface of PCB 114 (to emit a signal from a bottom surface of the puck), and ten radially extending diodes 120c extending radially from the outer circumference of the PCB 114 (to emit the signal from an outer circumference of the puck). Thus, radiation from the puck may be detected regardless of an orientation of the puck. It is understood that the signal transmitter 110 may include more or less diodes 120 in further embodiments, and diodes in other places than shown. When the puck 100 is fully assembled, outer ends of the diodes 120 (i.e., most distal from the PCB 114) may lie flush with the exterior surfaces 103 of the subcomponents 106, 108.
As opposed to embodiments described hereinafter, the signal transmitter 110 in the embodiment of
As seen in
As seen in
The cavities 122, holes 102, channels 124 and other indentations on the interior surfaces 105 of subcomponents 106, 108 allow the subcomponents 106, 108 to fit tightly together with the signal transmitter 110 enclosed snuggly therebetween. With the exception of holes 102 and channels 124, no other indentations formed on the interior surfaces of subcomponents 106, 108 are open to an exterior of the puck 100.
The interior surfaces 105 of subcomponents 106, 108 further include keyed features 130 for ensuring a tight and secure fit of the subcomponents when they are glued to each other. The keyed features 130 may be in a variety of different configurations, some of which are shown in the drawings. In
The features 130 may have various characteristics. First, the features provide a relatively large surface area for receiving glue as explained below to securely affix the subcomponents 106 and 108 to each other. Second, in embodiments, the features 130 may be sandblasted, or formed within a mold that is sandblasted. The features/mold may alternatively be chemically etched. Sandblasting/chemical etching increases the surface area and provides nooks and crannies for the glue between adjacent surfaces of the features 130 of subcomponents 106, 108. Sandblasting may be omitted in further embodiments. Third, extending vertically, the features 130 are able to exert lateral forces against each other (for example parallel to the top and bottom surfaces of the puck 100) to provide a resistance to shear forces when the subcomponents are affixed together and thereafter.
The cones are arranged on the respective rings 140 such that, when the subcomponents 107, 109 are mated together, a positively extending cone mates within a negatively recessed cone in the opposite subcomponent. In the embodiments of
Referring again to the exploded perspective view of
The capsule 144 includes light pipes 156 and 160 for receiving diodes 120 and for communicating the electromagnetic radiation from diodes 120 to the exterior surface 103 of the hockey puck 100. Each sub-capsule half 146, 148 includes axially extending light pipes 156 (
The capsule 144 may further include radially extending light pipes 160 extending from an outer circumference of capsule 144. The radially extending light pipes 160 in capsule 144 receive the radially extending diodes 120c extending from the outer circumference of the PCB 114. Each of the radially extending light pipes 160 is formed of two mating pieces, with a first piece formed in sub-capsule half 146 and a second, complementary piece formed in sub-capsule half 148. The two pieces fit together around diodes 120c when the sub-capsule halves 146, 148 are brought together. The light pipes 160 in turn fit within channels 124 in the subcomponents 107, 109 to be flush with the exterior surface 103 of the subcomponents 107, 109.
The first and second pieces in respective halves may have the same configuration, each forming one-half of the light pipe 160. However, in other embodiments, the pieces may be dissimilar. For example, in
The sub-capsule halves may each have a cavity 122 for receiving the battery 112 as described above. The subcomponents 107, 109 may each include a recess 153 (
The capsule 144 includes notches 164 as shown for example in
Exterior surfaces of the sub-capsule halves 146, 148 may include dimples 168 (
In order to communicate the electromagnetic radiation from the diodes 120 within the capsule 144, the embodiment of
Further details of the puck 1200 of the embodiment of
As seen for example in
Further details of the subcomponents 111, 113 of the embodiment of
While the embodiment of
In embodiments described thus far, subcomponents described are top and bottom halves of the hockey puck.
In the embodiment of
The channels 186a receive and mate with the upwardly extending diodes 120a. A bottom portion 192 of the channels 186a may be sealed. The subcomponent 182, referred to hereinafter as cover 182, includes a number of axial recesses 196a and axial protrusions 196b around its outer circumference. The recesses 196a align with channels 186a and, together with the channels 186a, enclose the upwardly extending diodes 120a along their lengths when cover 182 is sealed within the opening 184. The recesses 196a and channels 186a are open at an upper surface of the puck 1900 to allow emission of electromagnetic radiation from diodes 120a at the upper surface, as shown in the top view of puck 1900 in
The protrusions 196b align with and fill channels 186b. As shown in the cross-sectional view of
These protrusions mate with upwardly-extending saw-tooth protrusions in the lower subcomponent 207 to form interleaved finger joints that make full surface contact between adjacent protrusions. The protrusions are tapered so that the edges that contact adjacent protrusions align along a radius of the puck, such that each protrusion is wider towards an exterior of the first and second subcomponents and narrower towards an interior of the first and second subcomponents, and wherein an interior end of each protrusion is curved.
In operation, a subcomponent, such as for example subcomponent 108, may be placed on a platform 4010 on the bottom plate 4004. The fixture 4008 may then be fit down over the bottom plate 4004 so that adjacent surfaces of the fixture 4008 and bottom plate 4004 lie contact with each other. The bottom plate 4004 may include a pair of upwardly extending guideposts 4012 received within guide holes 4014 in fixture 4008 to ensure precise alignment of the fixture 4008 on top of the bottom plate 4004.
The fixture 4008 includes a central opening 4016 which fits down over platform 4010. The central opening has a raised surface 4018 so that a height of the cylindrical walls of opening 4016 are equal to the height of the platform 4010 plus the height of the subcomponent 108 on top of platform 4010. An uppermost circular portion of the cylindrical walls of opening 4016 (where the raised surface 4018 meets the cylindrical walls) defines a lip 4020.
The top plate 4002 and top fixture 4006 have the same configurations and structures as lower plate 4004 and bottom fixture 4008, as indicated for example by those components which are numbered on top plate 4002 and top fixture 4006. The top plate and fixture 4002, 4006 may be turned upside down, and the second subcomponent, for example subcomponent 106, may then be placed on a platform 4010. The top fixture 4006 may then be fit over top plate 4002 to secure the subcomponent 106 in place as described above with respect to the bottom plate and fixture.
An adhesive material may then be applied to the features 130 (described above) on the interior surface(s) of subcomponent 106 and/or 108. The top plate 4002, top fixture 4006 and subcomponent 106 may then be flipped and fit on top of bottom plate 4004, bottom fixture 4008 and subcomponent 108. The guideposts 4012 in top plate 4002 fit through the guide holes in bottom fixture 4008. Similarly, the guideposts 4012 in bottom plate 4004 fit into guide holes 4014 in the top fixture 4006. This ensures proper alignment of all components in the press 4000, and proper alignment of the subcomponents 106 and 108 with respect to each other.
Thereafter, large compressive forces may be applied to the top and bottom plates 4002, 4004 by a hydraulic device (not shown) to press the features 130 on the interior surfaces of subcomponents 106, 108 against each other. The adhesive may then be cured under pressure for a period of time, and possibly at an elevated temperature. The adhesive may form a mechanical or chemical bond to seal the subcomponents 106, 108 together. The pressure may squeeze out any excess adhesive from between the subcomponents 106 and 108. The press 4000 may be heated during the gluing process to reduce the hydrostatic pressure generated by the glue as it is forced out from between the subcomponents 106, 108.
The tight engagement of the lip 4020 against the seam 104 in the subcomponents 106 and 108 ensures that, as glue is squeezed out from between subcomponents 106 and 108, the excess glue enters a space 4030 defined between the top and bottom fixtures 4006, 4008. Significantly, the tight engagement of the lip 4020 against the seam 104 prevents any excess glue from passing between the respective subcomponents and fixtures, onto the outer circumferential edge of the subcomponent 106 and/or 108. As discussed above, the outer circumferential edge of the hockey puck 100 may include a dimple pattern. The tight engagement of the lip 4020 against the seam 104 prevents adhesive from bleeding onto the dimple pattern.
Turning now to the fabrication of the subcomponents of hockey puck 100, the subcomponents may be formed of vulcanized rubber, for example containing natural rubber, oils for durability, minerals for curing and anti-aging agents, and coal dust (carbon black) for color. The various materials of the subcomponents may be thoroughly mixed together in predefined ratios, and then placed in a mold under pressure of a hydraulic press and cured, for example at 300° F. to 500° F. for 15 to 20 minutes. These temperatures and times are by way of example only, the curing temperatures and times may be lower or higher than the stated ranges in further embodiments.
The materials and ratios are controlled to provide the puck 100 with the same characteristics and properties as a conventional puck not having a signal transmitter core. For example, the signal transmitter in the hollow core tends to increase the amount by which the puck bounces off a surface as compared to a conventional puck. Thus, the materials and/or ratios may be controlled to be relatively energy absorbing so as to deaden the response of the subcomponents in comparison to the vulcanized rubber used in a conventional puck. In this way, the response of puck 100 including the signal transmitter core is the same as a conventional puck. It is understood that the materials and/or ratios may be varied, depending on whether the signal transmitter 110 is encased within a capsule 144 or sealed within the puck 100 without a capsule 144.
The subcomponents may be made in two pieces, and then glued around the signal transmitter 110 (as the signal transmitter may not withstand the curing conditions for the subcomponents if a single subcomponent were molded around the signal transmitter). However, in further embodiments, it is contemplated that the vulcanized rubber be molded in a single piece around the signal transmitter. In such embodiments, the signal transmitter may be encased in a capsule as described above, or not encased in a capsule as described above. The press 4000 may form a single puck 100. Alternatively, the press may be elongated (or made into an x-y matrix) including multiple central openings 4016 and other components described above for receiving multiple pairs of subcomponents 106, 108, so that multiple pucks 100 may be formed in a single process.
In embodiments described above, the subcomponents include openings so that the electromagnetic radiation from the diodes may be transmitted through the subcomponents to an exterior of the puck 100. In embodiments, the vulcanized rubber of the subcomponents may include carbon black, which prevents the transmission of certain wavelengths of electromagnetic radiation, such as for example radiation in the IR wavelengths.
In further embodiments of the present technology, the puck may be formed of materials that are transparent to the wavelengths of the electromagnetic radiation emitted from the signal transmitter 157. In such embodiments, the axial openings and radial channels in the subcomponents may be omitted, and the electromagnetic radiation may be transmitted through the walls of the subcomponents. Such an embodiment is shown in the perspective view of
It is further conceivable that the signal transmitter transmits at wavelengths that are not blocked or absorbed by carbon black. In such embodiments, the vulcanized rubber of puck 100 may include carbon black.
As seen in
Further considering the process for manufacturing a hockey puck,
Subsequent from installation of diodes 321, one or more power source 112, such as a rechargeable battery, is installed onto the PCB 114. In one embodiment, the battery is one of: a lithium-ion battery, a nickel-metal-hydride battery, a nickel-cadmium battery, or a lead acid battery. In a preferred embodiment, two power sources 112 are installed. In a preferred embodiment, sealant is placed between the one or more power source 112 and the PCB 114 as the one or more power source is installed. In one embodiment, about 0.015 ounces of sealant is dispensed under each one or more power source 112. In another embodiment, between about 0.005 and about 0.05 ounces of sealant is dispensed under each one or more power source 112. In yet another embodiment, sealant is not dispensed until the sealant potting step of puck assembly. One or more power source 112 is then charged before testing. In one embodiment, the one or more power source 112 is charged on a bed of nails fixture for twenty minutes. Finally, it is ensured that the diodes 321 and remainder of electronics on the PCB 114 are functional and operating properly.
Assembling the components of a hockey puck according to a preferred embodiment requires a high degree of precision and includes multiple steps, which are illustrated in
In the adhesive potting of sealant 519, puck assembly begins with two identical puck subcomponents 301 (puck halves). One subcomponent 301B is set aside, and a dose-controlled dispenser is used to apply sealant 331 in the sensor slot 310 and antenna depression 310 of the second subcomponent 301A. In one embodiment, about 0.009 ounces of sealant is dispensed into the subcomponent 301A. In another embodiment, between about 0.005 and about 0.05 ounces of sealant is dispensed into the subcomponent 301A. In one embodiment, if not previously completed during battery installation and charging 513, sealant is then dispensed under each one or more power source 112. In one embodiment, about 0.015 ounces of sealant is dispensed under each one or more power source 112. In another embodiment, between about 0.005 and about 0.05 ounces of sealant is dispensed under each one or more power source 112. In a preferred embodiment, the sealant is a modified sliane sealant such as TONSAN STP1921. In a preferred embodiment, tips such as 14 gauge 0.063 olive tips are used to dispense sealant. Throughout the sealant application process, gloves, acetone, and lint-free wipes are used as needed.
In the adhesive potting of glue 521, puck assembly continues with both identical puck subcomponents 301A and 301B. In one embodiment, all interior surface(s) and keyed features of subcomponents 301A and 301B are covered in glue, which is applied in one or more layers using an automated 3-axis dispensing system. In another embodiment, more than about 50% of the interior surface(s) and keyed features of subcomponents 301A and 301B are covered in glue. In yet another embodiment, more than about 25% of the interior surface(s) and keyed features of subcomponents 301A and 301B are covered in glue. In a preferred embodiment, there is one layer of glue applied. In an alternative embodiment, glue is applied by hand. In one embodiment, the approximate dispensing time of glue per subcomponent 301A and 301B is about 100 seconds. In another embodiment, the approximate dispensing time of glue per subcomponent 301 is between about 30 seconds and 180 seconds. This is accomplished with a bead of glue that is approximately 0.025 inches thick. Further, one or more layers of glue are dispensed in each hole 307, and in a preferred embodiment, three layers of glue are applied in each hole 307. In total, 0.102 ounces of glue are dispensed in the subcomponent 301B which did not receive sealant in the previous step, and 0.097 ounces of sealant are dispensed in the subcomponent 301A that did receive sealant in the previous step. In an alternative embodiment, between about 0.02 ounces and about 0.25 ounces of sealant are dispensed in the subcomponent 301B, and between about 0.02 ounces and about 0.25 ounces of sealant are dispensed in the subcomponent 301A. In a preferred embodiment, the adhesive is a cyanoacrylate adhesive such as CYBERBOND APOLLO 2240. In a preferred embodiment, tips such as polytetrafluoroethylene (PTFE) lined, pink, 0.5 inch by 0.012 inch tips are used to dispense the adhesive. Throughout the adhesive application process, gloves, acetone, and lint-free wipes are used as needed.
The parts of puck 300 are then assembled 523 prior to undergoing compression 325. Both subcomponents 301A and 301B are oriented such that the interior indicator marking 309 of each subcomponent 301A and 301B is pointing in a direction that indicates the keyed features are operable to line up. In one embodiment, each internal indicator marking 309 points directly towards the other internal indicator marking 309. In another embodiment, each internal indicator marking 309 is pointed directly away from the other internal indicator marking 309. In another embodiment, each internal indicator marking 309 points directly towards the other internal indicator marking 309, and then subcomponent 301A is rotated between 0 and 360 degrees counterclockwise, and subcomponent 301B is rotated by the same amount in the counterclockwise direction. Notably, each of the components are constructed such that valleys of a first subcomponent (301A) are aligned with peaks of a second subcomponent (301B) and peaks of the first subcomponent (301A) are aligned with valleys of a second subcomponent (301B), while the batteries, light pipes, and other elements are secured within the corresponding positions and cutouts. Thus, in one embodiment, the first subcomponent 301A and the second subcomponent 301B exhibit mirror and/or rotational symmetry when aligned. However, in one embodiment, the first subcomponent 301A is offset or rotated from the second subcomponent 301B to accommodate offset diodes and light pipes 321. The antenna of the signal processor 110 is then aligned with the antenna depression 310 on the subcomponent 301A which contains sealant 331. The signal processor 110, including diodes and power source, is pressed firmly into cavity 305 and holes 307 of the subcomponent 301A which includes sealant 331. Next, the interior surface 303 of both subcomponents 301A and 301B are aligned facing each other. Then, the exterior indicator markings 315 on both subcomponents are aligned such that they point in or indicate the same direction. Puck subcomponents 301 are then lightly pressed together. In one embodiment, an about 0.125 inch gap is left between puck halves. In one embodiment, the gap left between puck halves is larger than about 0.125 inches. In another embodiment, the gap left between puck halves is smaller than about 0.125 inches.
A press, such as the one illustrated by
In turning the outside diameter of the puck 531, the vertical sides 343 are made smooth and remaining glue squeeze-out from assembly is removed. In one embodiment, remaining glue squeeze-out is removed by a scraper or other mechanical means. With at least two passes using a turning tool, about 0.100 inches is removed from the outside diameter of the puck 300. In an alternative embodiment, between about 0.01 and about 0.50 inches are removed from the outside diameter of the puck 300. In one embodiment, this occurs on a CNC lathe, and in an alternative embodiment, occurs on a manual lathe. In another embodiment, a laser is used. In one embodiment, the puck runs on the turning tool with less than about 0.002 run out. After the outside diameter is decreased and the vertical sides 343 has been completely turned, the vertical sides 343 are polished in order to remove tooling marks and improve the surface finish. During the polishing process, the puck 300 is kept wet. The vertical sides 343 or puck 300 are sanded at least one time with at least one sandpaper grit. In a preferred embodiment, the vertical sides 343 of puck 300 are sanded twice with 600 grit sandpaper and then twice with 1500 grit sandpaper such that the vertical sides 343 meet a surface finish standard level of at least B-3 according to Society of the Plastics Industry (SPI) standards. In a preferred embodiment, the outside diameter of the puck 300 after polishing is between about 2.995 inches and about 3.020 inches. In an alternative embodiment, the outside diameter of the puck 300 after polishing is between about 2.90 inches and about 3.10 inches. In yet another embodiment, the final outside diameter of the puck 300 after polishing is between about 2.50 inches and about 3.50 inches. After turning, knurling is created on the vertical sides 343 of the puck 300. In one embodiment, the knurling is created on the vertical sides 343 of the puck 300 using a laser. Knurling, which in one embodiment is in the form of a dimple pattern or a diamond knurl pattern, is common for a conventional hockey puck in order to increase friction between the puck 100 and a hockey stick for improved handling, passing, and shooting of the puck. In one embodiment, a Gantry carbon dioxide (CO2) 80 Watt laser with a rotary attachment is used to provide the knurling. After laser knurling 533, there is no seam between the two subcomponents 301 that is visible with an unaided eye at 14 inches at standard office light levels, or, in another embodiment, at a distance of greater than 8 inches at standard office light levels.
Turning now to the external surfaces 313 of the puck 300, the first step is the removal of nubs from the puck 535. Nubs are initially present as the raised diode housings 317 that were molded with each subcomponent 301. The nubs are able to be removed from the puck 300 in a variety of ways, including by using a band saw, hand saw, sander, other mechanical means, or a laser. In a nonlimiting embodiment, the puck 300 is placed in a vice and the nubs are cut off of each side of the puck 300 with a band saw. Then, in order to provide the final surface texture of the puck, the external surfaces 313 are must be completely flattened. First, in surface grinding the puck 537 a grinder is used to ensure each external surface 313 is completely flat. In one embodiment, a hydraulic surface grinder is used to flatten each external surface 313. In an alternative embodiment, a different tool is used. Preferably, the surface grinder removes any residual material from the nubs. Preferably, the surface grinder also reduces the overall puck surface by about 0.010 inches on each side, thereby reducing the total height of the puck. In another embodiment, the surface grinder reduces the overall puck surface by between about 0.005 inches and about 0.1 inches.
After grinding, the puck 300 undergoes lapping and a final surface finishing. In lapping the puck 539, the surface is made smooth, and in a preferred embodiment reaches a surface finish standard level of at least B-1 according to Society of the Plastics Industry (SPI) standards with a waviness height of no more than about 0.004 inches, and in an alternative embodiment a waviness height of no more than about 0.01 inches. There are multiple processes available to achieve this level of finish, but in a preferred embodiment, the following process is used: 1) installing an 18 micrometer diamond disc on lapping machine and ensuring there is adequate coolant available, wherein the coolant is preferably a 6:1 mixture of VASCO 6000. 2) Loading pucks into the lapping machine. 3) Mounting the fixture and puck assembly onto the lapper lower puck. 4) Lapping for 2 minutes, 30 seconds with the disc set to 600 revolutions per minute and the gears for each puck set to 10 revolutions per minute. 5) Repeating for other side of pucks and then removing pucks from fixtures. 6) Installing a 6 micrometer diamond disc on lapping machine and ensuring there is adequate coolant available. 7) Loading pucks into the lapping machine. 8) Mounting the fixture and puck assembly onto the lapper lower puck. 9) Lapping for 5 minutes with the disc set to 600 revolutions per minute and the gears for each puck set to 10 revolutions per minute. 10) Repeating for other side of pucks and then removing pucks from fixtures. After lapping, the final thickness of the puck 300 is achieved. In a preferred embodiment, the thickness of the puck 300 after lapping is between about 0.980 inches and 1.005 inches, or in an alternative embodiment the thickness of the puck 300 after lapping is between about 0.95 inches and about 1.01 inches, or in yet another embodiment the thickness of the puck 300 after lapping is between about 0.75 inches and about 1.5 inches.
In washing the puck 541, the puck is not submerged in water. In one embodiment, washing the puck 541 occurs with dish soap and hot tap water, and the puck is not completely submerged in water. After washing of the puck, the puck undergoes final inspection and testing 543. In one embodiment, inspection and testing of the puck includes, but is not limited to, tactile feel, surface cleanliness, surface finish, verification that final outside diameter is between about 2.995 inches and about 3.020 inches, or in an alternative embodiment is between about 2.95 inches and about 3.05 inches, or in yet another embodiment is between about 2.5 inches and about 3.5 inches, verifying that the thickness of the puck is between about 0.980 inches and 1.005 inches, or in an alternative embodiment is between about 0.95 inches and about 1.01 inches, or in yet another embodiment is between about 0.75 inches and about 1.5 inches, verifying that the weight of the puck is between about 5.5 and about 6.0 ounces, or in an alternative embodiment is between about 5.0 ounces and 7.0 ounces, or in an alternative embodiment is between about 3.0 ounces and 16.0 ounces, and ensuring functionality of all electronic components.
In summary, embodiments of the present technology relate to a hockey puck, comprising: first and second subcomponents including complementary features operable to mate with each other, the first and second subcomponents together defining a central void interior to the first and second subcomponents together; a capsule sized and shaped to fit within the central void of the first and second subcomponents, the capsule including a central space interior to the capsule; and a signal transmitter sized and shaped to fit within the central space of the capsule, the signal transmitter operable to emit electromagnetic radiation to enable detection of an instantaneous position of the hockey puck.
In further embodiments, the present technology relates to a hockey puck, comprising: first and second subcomponents including complementary features operable to mate with each other, the first and second subcomponents together defining a central void interior to the first and second subcomponents together; and a signal transmitter sized and shaped to fit within the central void of the first and second subcomponents, the signal transmitter operable to emit electromagnetic radiation to enable detection of an instantaneous position of the hockey puck; wherein the first and second subcomponents comprise a first set of materials, the first set of materials absorbing a greater amount of energy than a second set of materials used in a second hockey puck having a solid core without the signal transmitter.
In other embodiments, the present technology relates to a hockey puck, comprising: first and second subcomponents including complementary features operable to mate with each other, the first and second subcomponents together defining a central void interior to the first and second subcomponents together; and a signal transmitter sized and shaped to fit within the central void of the first and second subcomponents, the signal transmitter operable to emit electromagnetic radiation in a wavelength band to enable detection of an instantaneous position of the hockey puck; wherein the first and second subcomponents comprise materials that are transparent to the wavelength band at which the electromagnetic radiation is emitted.
Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims. It is intended that the scope of the invention be defined by the claims appended hereto.
This application is related to and claims priority from the following U.S. patents and patent applications. This application is a continuation of U.S. application Ser. No. 16/879,366, filed May 20, 2020, which is a continuation-in-part of U.S. application Ser. No. 16/503,061, filed Jul. 3, 2019, which is a continuation of U.S. application Ser. No. 16/027,594, filed Jul. 5, 2018, which is a continuation of U.S. application Ser. No. 15/260,122, now U.S. Pat. No. 10,016,669, filed Sep. 8, 2016, each of which is incorporated herein by reference in its entirety.
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