Patent Application
20050089593
1. Field of Invention
This invention relates to a molding apparatus. More particularly, the present invention is related to a molding apparatus having a pressure sensor disposed at the ejection pin located in the mold chase.
2. Related Art
Integrated circuits (chip) packaging technology is becoming a limiting factor for the development in packaged integrated circuits of higher performance. Semiconductor package designers are struggling to keep pace with the increase in pin count, size limitations, low profile, and other evolving requirements for packaging and mounting integrated circuits. Nowadays, ball grid array package (BGA) and chip scale package (CSP) are wildly applied to chip package with high I/Os and assembly package for thermal enhance integrated circuits.
However, as above-mentioned ball grid array package, encapsulation plays an important role. Specifically, there is needed a stable molding or encapsulation flow in encapsulating the integrated circuits device so as to have the liquid encapsulation injected into the mold chase stably and distributed equally in the mold chase. In such a manner, the appearance of said package will be kept in a good condition after the integrated circuits device is encapsulated.
In general, the molding apparatus as shown in
Consequently, providing another molding apparatus to solve the mentioned-above disadvantages is the most important task in this invention.
In view of the above-mentioned problems, this invention is to provide a molding apparatus having a pressure sensor disposed at the ejection pin in the mold chase to directly measure the pressure applied to the ejection pin by the encapsulation left at the surface of the mold chase so as to get the viscosity of the encapsulation after mold chase is removed. Thus, all related characterization of encapsulation for reference will be caught so as to ensure the quality of the encapsulation utilized in packaging integrated circuits devices.
To achieve the above-mentioned, a molding apparatus is provided, wherein the molding apparatus mainly comprises a mold chase holder, a mold chase, a heater, an ejection pin and a pressure sensor. Therein, the mold chase has a mold cavity and a via, wherein the mold cavity has a mold-cavity surface and the via penetrates the mold-cavity surface; and the ejection pin is disposed in the via for ejecting the formed encapsulation from the mold chase. In addition, the mold chase holder is utilized to accommodate the mold chase, and the heater is disposed in the mold chase holder to heat the mold chase. To be noted, the pressure sensor is disposed at the ejection pin in the mold chase to measure the pressure applied to the ejection pin by the encapsulation left at the mold-cavity surface of the mold cavity.
As mentioned above, the pressure sensor is disposed at the ejection pin in the mold chase so that the viscosity (adhesion capability) of the instant molding flow located at the mold-cavity surface could be gotten. Thus, those who can get the viscosity of the encapsulation, after mold chase is removed, to catch all related characterization of encapsulation to ensure the quality of the encapsulation utilized in packaging integrated circuits devices.
The invention will become more fully understood from the detailed description given herein below illustrations only, and thus are not limitative of the present invention, and wherein:
The molding apparatus according to the preferred embodiment of this invention will be described herein below with reference to the accompanying drawings, wherein the same reference numbers refer to the same elements.
In accordance with a preferred embodiment as shown in
Referring to
As mentioned above, the pressure sensor 240 is disposed at the ejection pin 223 in the via 226 of the mold chase 220 so that the viscosity (adhesion capability) of the instant molding flow located at the mold-cavity surface 222 could be gotten. Thus, those who can take the actual data as reference to get the viscosity of the encapsulation, after mold chase is removed, to catch all related characterization of encapsulation to ensure the quality of the encapsulation utilized in packaging integrated circuits devices.
Although the invention has been described in considerable detail with reference to certain preferred embodiments, it will be appreciated and understood that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 092129690 | Oct 2003 | TW | national |
