MOLDING DIE FOR MOLDING GLASS AND REPRODUCING METHOD THEREOF

Abstract

A molding die for molding glass includes a base material, a first intermediate layer on the base material, and a protective film on the first intermediate layer. The first intermediate layer is made of titanium or other materials that is not easy to be attacked, and the protective film is made of molybdenum alloy. A method of reproducing the molding die of the present invention includes removing the protective film but keeping the first intermediate layer and the base material still, and then coating a new protective layer on the first intermediate layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first preferred embodiment of the present invention;

FIG. 2 is a perspective view of a second preferred embodiment of the present invention; and

FIG. 3 is a flow chart of the reproducing method of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

As shown in FIG. 1, a molding die 10 for molding glass of the first preferred embodiment of the present invention mainly includes a base material 12 made of wolfram carbide alloy, a first intermediate layer 14, which is made of titanium, tantalum, titanium alloy, or tantalum alloy with a thickness of 0.1 micrometer to 0.25 micrometer, coated on the base material 12 by sputtering, and a protective film 16 with a thickness of 0.1 micrometer to 1.0 micrometer coated on the first intermediate layer 14. The protective film 16 is made of molybdenum and ruthenium alloy, and molybdenum takes 35% to 70%. The protective film 16 has a molding surface 22, which is a slot, to mold glass. The first intermediate layer 14 may enhance the adhesion of protective film 16 and the base material 12 to prolong the life of the molding die 10.

Table 1 shows different metals coated on the wolfram carbide base material attacked by cerium ammonium nitrite solution. In Table 1, [Ce] is (NH₄)₂Ce(NO₃)₆, HNO₃ is nitric acid, and HAc is acetic acid solution.

The result shows that the protective films made of Mo, Re, Ni and Cr will be attacked by (NH₄)₂Ce(NO₃)₆ solution, and the wolfram carbide base material under the protective film will be attacked as well. Ru has stronger resistance to the solution. 0.2 micrometer Ru will be totally attacked in 30 minutes. Ti and Ta have the strongest resistance that they are not attacked over 30 minutes. Therefore, we choose Ti and Ta to be the first intermediate layer 14 to protect the wolfram carbide base material 12.

Table 2 shows the attack condition of the molding die, in which Mo—Ru protective film with Cr or Ni intermediate layer will be attacked and the wolfram carbide base material will be attacked as well, and the attack action will not stop. The reason of this result is that Mo—Ru alloy protective film, which structure includes Ru, Mo₅Ru₃ and Mo phases. As described above, Ru has stronger resistance than Mo, Cr, and Ni, so that the attack path goes through the Mo contained phase to attack the first intermediate layer. Because the first intermediate layer be easily attacked, so that the wolfram carbide base material will be badly damaged by the solution before the protective film 16 is out. In the results of No. 25 to No. 27, they show Ti first intermediate layer may isolate the solution from the wolfram carbide base material and maintain smooth surface.

As shown in FIG. 2, a molding die 30 of the second preferred embodiment of the present invention, which is similar to the molding die 10 of the first embodiment, except that there is a second intermediate layer 36 between a first intermediate layer 32 and a protective film 34. The second intermediate layer 36, which thickness is about 0.1 micrometer to 0.2 micrometer, is made of chromium, molybdenum, rhenium, nickel or alloy with at least one of above that the second intermediate layer 36 will be easy to be attacked.

Table 3 shows the attack condition of the molding die with two intermediate layers.

As shown in FIG. 3, a method of reproducing the molding die 10 of the first embodiment of the present invention includes removing the protective film 16 of the molding die 10 but keeping the first intermediate layer 14 and the base material 12 still, and then coating a new protective film 16 on the first intermediate layer 14 by sputtering to reproduce the molding die 10 of the first embodiment.

To reproduce the molding die 30 of the second embodiment of the present invention, it includes removing the protective film 34 and the second intermediate layer 36 but keeping the first intermediate layer 32 and the base material 38 still, and then coating a new protective film 34 and the second intermediate layer 36 by sputtering to reproduce the molding die 30 of the second embodiment.

In conclusion, the present invention has advantages of lower manufacture cost and high precision for molding glass lenses that fits the requirements of mass production and competition.

The description above is a few preferred embodiments of the present invention and the equivalence of the present invention is still in the scope of the claim of the present invention.

	TABLE 1
	Protective		Result
	film	Attacking solution		Attacking	Attacking
	Thickness	(%)*		protective	base
	Constituents	μm	[Ce]	HNO3	HAc	Time	film	material
No. 1	Mo	0.24	6	6		2	min.	yes	yes
No. 2	Mo	0.24	6		8	3	min.	yes	yes
No. 3	Re	0.16	6	6		2	min.	yes	yes
No. 4	Re	0.18	6		8	4	min.	yes	yes
No. 5	Ni	0.29	9	2		15	min.	yes	yes
No. 6	Ni	0.28	12	6		5	min.	yes	yes
No. 7	Cr	0.19	9		4	20	min.	yes	yes
No. 8	Ru	0.21	6	6		20/30	min.	no/yes	no/yes
No. 9	Ru	0.20	6	2		20/30	min.	no/yes	no/yes
No. 10	Ru	0.20	6		8	30	min.	no	no
No. 11	Ti	0.12	12	6		30	min.	no	no
No. 12	Ti	0.13	12		8	30	min.	no	no
No. 13	Ta	0.23	12	6		30	min.	no	no
No. 14	Ta	0.23	12		8	30	min.	no	no

	TABLE 2
		Second	First	Attacking
	Protective	intermediate	intermediate	solution (%)
	film	layer	layer	Cerium
		Thickness		Thickness		Thickness	ammonium	Nitric	Acetic
	Constituents	μm	Constituents	μm	Constituents	μm	nitrite	acid	acid
No. 31	Mo—Ru	0.18	Cr	0.1	Ti	0.1	12		8
No. 32	Mo—Ru	0.19	Cr	0.1	Ti	0.1	6	6
No. 33	Mo—Ru	0.20	Cr	0.1	Ti	0.1	12	6
No. 34	Mo—Re	0.50	Cr	0.1	Ti	0.1	12		8
No. 35	Mo—Re	0.50	Cr	0.1	Ti	0.1	12	6
No. 36	Mo—Ru	0.79	Cr	0.12	Ta	0.23	12	6
No. 37	Mo—Ru	0.81	Cr	0.12	Ta	0.23	12		8
	Result
						Attacking	Attacking
			Roughness	Roughness	Attacking	second	first	Attacking
		Time	before	after	protective	intermediate	intermediate	base
		Min.	test Å	test Å	film	layer	layer	material
	No. 31	7	21	27	yes	yes	no	no
	No. 32	5	27	25	yes	yes	no	no
	No. 33	2	25	23	yes	yes	no	no
	No. 34	7	29	25	yes	yes	no	no
	No. 35	6	29	33	yes	yes	no	no
	No. 36	8	22	26	yes	yes	no	no
	No. 37	15	22	23	yes	yes	no	no

	TABLE 3
		Second	First	Attacking
	Protective	intermediate	intermediate	solution (%)
	film	layer	layer	Cerium
		Thickness		Thickness		Thickness	ammonium	Nitric	Acetic
	Constituents	μm	Constituents	μm	Constituents	μm	nitrite	acid	acid
No. 31	Mo—Ru	0.18	Cr	0.1	Ti	0.1	12		8
No. 32	Mo—Ru	0.19	Cr	0.1	Ti	0.1	6	6
No. 33	Mo—Ru	0.20	Cr	0.1	Ti	0.1	12	6
No. 34	Mo—Re	0.50	Cr	0.1	Ti	0.1	12		8
No. 35	Mo—Re	0.50	Cr	0.1	Ti	0.1	12	6
No. 36	Mo—Ru	0.79	Cr	0.12	Ta	0.23	12	6
No. 37	Mo—Ru	0.81	Cr	0.12	Ta	0.23	12		8
	Result
						Attacking	Attacking
			Roughness	Roughness	Attacking	second	first	Attacking
		Time	before	after	protective	intermediate	intermediate	base
		Min.	test Å	test Å	film	layer	layer	material
	No. 31	7	21	27	yes	yes	no	no
	No. 32	5	27	25	yes	yes	no	no
	No. 33	2	25	23	yes	yes	no	no
	No. 34	7	29	25	yes	yes	no	no
	No. 35	6	29	33	yes	yes	no	no
	No. 36	8	22	26	yes	yes	no	no
	No. 37	15	22	23	yes	yes	no	no

Claims

1. A molding die for molding glass, comprising: a base material;a first intermediate layer, which is made of titanium or other materials that is not easy to be attacked, on the base material; anda protective film, which is made of molybdenum alloy, on the first intermediate layer.

2. The molding die as defined in claim 1, wherein the base material is made of wolfram carbide alloy.

3. The molding die as defined in claim 1, wherein a thickness of the first intermediate layer is in a range between 0.1 micrometer and 0.25 micrometer.

4. The molding die as defined in claim 1, wherein the protective film further includes ruthenium, or rhenium or both.

5. The molding die as defined in claim 4, wherein there are 35% to 70% molybdenum in the protective film.

6. The molding die as defined in claim 1, wherein a thickness of the protective film is in a range between 0.1 micrometer and 1.0 micrometer.

7. The molding die as defined in claim 1, wherein the first intermediate layer is made of titanium, tantalum, titanium alloy or tantalum alloy.

8. The molding die as defined in claim 1, further comprising a second intermediate layer, which is made of chromium or other material that is easy to be attacked, between first intermediate layer and the protective layer.

9. The molding die as defined in claim 8, wherein the second intermediate layer includes chromium, molybdenum, rhenium, nickel or an alloy with at least one of above.

10. The molding die as defined in claim 8, wherein a thickness of the second intermediate layer is in a range between 0.1 micrometer and 0.2 micrometer.

11. A method of reproducing the molding die as defined in claim 1, comprising the steps of attacking the protective film to remove the protective film but keep the first intermediate layer and the base material still, and then coating a new protective layer on the first intermediate layer.

12. The method as defined in claim 11, wherein an attacking solution is utilized in removing the protective film.

13. The method as defined in claim 12, wherein the attacking solution includes (NH4)2Ce(NO3)6.

14. The method as defined in claim 13, wherein the attacking solution is acetic acid or nitric acid.

15. A method of reproducing the molding die as defined in claim 8, comprising the steps of attacking the protective film and the second intermediate layer to remove the protective film and the second intermediate layer but keep the first intermediate layer and the base material still, and then coating a new second intermediate layer on the first intermediate layer and a new protective layer on the second intermediate layer.

16. The method as defined in claim 15, wherein an attacking solution is utilized in removing the protective film.

17. The method as defined in claim 16, wherein the attacking solution includes (NH4)2Ce(NO3)6.

18. The method as defined in claim 17, wherein the attacking solution is acetic acid or nitric acid.