1. Technical Field
The present disclosure relates to a molding roller, an apparatus and a method for manufacturing the molding roller.
2. Description of Related Art
Optical films include a number of micro structures. One method for forming the micro structures is a roll forming process using a metallic roller. The metallic roller has a circumferential surface including molding patterns for forming the micro structures. However, the molding patterns are directly formed on the circumferential surface, therefore, when the molding patterns are destroyed, the metallic roller needs to be discarded. This results in a relatively high cost.
Therefore, it is desirable to provide a molding roller, an apparatus and a method for manufacturing the molding roller that can overcome the above-mentioned limitations.
Many aspects of the embodiments should be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The molding film 20 includes a molding surface 201 opposite to the main body 10. The molding surface 201 includes a number of molding patterns 202. In the first embodiment, the molding patterns 202 are micro-protrusions.
The molding film 20 is made of polymer material. The polymer material consists of polymer resin and a number of silica nanoparticles formed in polymer grids of the polymer resin. In the first embodiment, the polymer resin is polydimethylsiloxane (PDMS) resin, and the silica nanoparticles are formed by sol-gel method.
The mixing assembly 310 is used for mixing a PDMS base and a curing agent according to hardness requirement. The PDMS base 311 a chemically reacts with the curing agent 311b to harden the PDMS base 311a, and thus the polymer resin 311c (i.e. PDMS resin) having polymer grids is obtained. The weight ratio of the PDMS base 311a to the curing agent 311b is about 10:1.
The coating device 320 is used for uniformly coating the polymer resin 20b on the circumferential surface 101 of the main body 10. In the first embodiment, the coating device 320 includes a feeder 321 and a rotating shaft 322. The rotating shaft 322 is configured for driving the main body 10 to rotate. The feeder 321 includes a receiving chamber 321a and an opening 321b communicating with the receiving chamber 321a. The receiving chamber 321a is used for receiving the polymer resin 20b. The opening 321b faces the main body 10, and thus the polymer resin 20b can arrive at the circumferential surface 101 through the opening 321b. When the main body 10 rotates, the polymer resin 20b is uniformly distributed on the circumferential surface 101.
Because the diameter of the opening 321b is very small (such as a few millimeters), the volume of each drop of the polymer resin 20b is very little, and the polymer resin 20b is viscous, therefore, the polymer resin 20b can be attached on the main body 10 when the rotating speed of the main body 10 is slow. At the same time, because the length of the main body 10 along the axial direction thereof is long (such as a few meters), the feeder 321a needs to move along the axial direction of the main body 10 to make sure the polymer resin 20b is distributed more uniformly on the circumferential surface 101 of the main body 10.
The curing device 330 is used for curing the polymer resin 20b on the circumferential surface 101 to obtain a seamless ring-shaped resin film 20a. In this embodiment, the curing device 330 is an oven, and the curing temperature is about 65° C.
The film chemical treatment device 350 is used for forming the silica nanoparticles in the polymer grids of the resin film 20a to form a preprocessed molding film 20c. The preprocessed molding film 20c has a preprocessed molding surface 201c opposite to the main body 10. The film chemical treatment device 350 includes a receiving chamber 352 for receiving a reaction liquid 351. The reaction liquid 351 includes dibutyl tin diacetate (DBTDA) and tetraethoxy silane (TEOS). The main body 10 with the resin film 20a is immersed in the reaction liquid 351 for a first predetermined period until the reaction liquid 351 penetrates the resin film 20a. Then the resin film 20a is taken out from the receiving chamber 352, and is placed in the air for a second predetermined period. Thus, the DBTDA can be hydrolyzed to obtain acetic acid, and the acetic acid accelerates the reaction of the TEOS with the resin film 20a to form the silica nanoparticles in the polymer grids of the resin film 20a. In the second embodiment, the resin film 20a is made of PDMS resin.
The processing device 360 is used for forming molding patterns 202 on the preprocessed molding surface 201c to obtain the molding film 20. The molding film 20 and the main body 10 cooperate to form the molding roller 100. The processing device 360 can include a diamond knife or a laser knife.
In step S1, the PDMS base is mixed with the curing agent according to hardness requirement, the PDMS base 311a chemically reacts with the curing agent 311b to harden the PDMS base 311a, and thus the polymer resin 20b (i.e. PDMS resin) having polymer grid is obtained. In the third embodiment, the weight ratio of the PDMS base to the curing agent is about 10:1.
In step S2, the polymer resin 20b is uniformly distributed on the circumferential surface 101 of the main body 10 using the coating device 320.
In step S3, the curing device 330 cures the polymer resin 20b on the circumferential surface 101 of the main body 10, and thus to obtain a seamless ring-shaped resin film 20a. In the third embodiment, the curing device 330 is an oven, and the main body 10 with the polymer resin 20b is received in the oven.
In step S4, the main body 10 with the resin film 20a is received in the film chemical treatment device 350 to form a number of silica nanoparticles in the polymer grids of the resin film 20a, and thus the preprocessed molding film 20c is obtained. The preprocessed molding film 20c has the preprocessed molding surface 201c opposite to the main body 10.
In step S5, a number of molding patterns 202 are formed on the preprocessed molding surface 201c using the processing device 360, and thus the molding film 20 is obtained. The molding film 20 and the main body 10 cooperate to form the molding roller 100.
In step S21, a feeder 321 is provided, the feeder 321 receives the polymer resin 20b.
In step S22, the main body 10 is rotated using the rotating shaft 322.
In step S23, the feeder 321 faces the circumferential surface 101 of the main body 10, and thus the polymer resin 20b is uniformly distributed on the circumferential surface 101 of the main body 10 via the opening 321b.
In step S51, the reaction liquid 351 is provided and is received in the receiving chamber 352, and the reaction liquid 351 includes DBTDA and TEOS.
In step S52, the main body 10 with the resin film 20a is immersed in the reaction liquid 351 for the first predetermined period until the reaction liquid 330b penetrates the resin film 20a.
In step S53, the main body 10 with the resin film 20a is taken out from the receiving chamber 352, and is placed in the air for the second predetermined period, and thus the DBTDA is hydrolyzed to obtain acetic acid. The acetic acid can accelerate the reaction of the TEOS with the resin film 20a to form the silica nanoparticles in the polymer grids of the resin film 20a.
By employing the apparatus 300 and the above described method, the molding patterns 202 are formed on the molding film 20. Therefore, when the molding patterns 202 are destroyed, the molding film 20 can be removed from the main body 10, and another new molding film 20 can be formed on the main body 10 to form a new molding roller 100. Therefore, the main body 10 can be used more times, and the molding roller 100 has a relatively low cost.
It will be understood that the above particular embodiments are shown and described by way of illustration only. The principles and the features of the present disclosure may be employed in various and numerous embodiments thereof without departing from the scope of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.
Number | Date | Country | Kind |
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102102574 | Jan 2013 | TW | national |