The subject matter described herein relates in general to actuators and, more particularly, to shape memory material-based actuators.
Some motor vehicles have actuators in one or more portions of a vehicle seat. These actuators can provide a haptic effect to a seat occupant. Such an effect can provide support and/or comfort to a seat occupant.
In one respect, the present disclosure is directed to a system. The system can include an actuator. When activated, the actuator can be configured to morph into an activated configuration in which a dimension of the actuator increases. The actuator can include a shape memory material member. The system can include a sensor configured to acquire sensor data. A portion of the shape memory material member can operatively engage the sensor. The system can include one or more processors operatively connected to monitor a state of the shape memory material member based on the sensor data.
In another respect, the present disclosure is directed to a method of monitoring a state of a shape memory material member used in an actuator. A portion of the shape memory material member can operatively engage a sensor. The method can include causing the actuator to morph into an activated configuration. The method can include monitoring a state of the shape memory material member using sensor data acquired by the sensor. The method can include controlling an activated state of the actuator based on the acquired sensor data.
Some actuators used in vehicles used shape memory alloys for actuation. Shape memory alloys can be prone to overstress and/or overheating, which can lead to a reduced life and/or effectiveness of the actuators. Accordingly, arrangements described herein are directed to monitoring the state of a shape memory material member. Such monitoring can be based on sensor data from a sensor that is operatively engaged by the shape memory material member. The state of the shape memory material member can be controlled based on the sensor data.
Detailed embodiments are disclosed herein; however, it is to be understood that the disclosed embodiments are intended only as examples. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the aspects herein in virtually any appropriately detailed structure. Further, the terms and phrases used herein are not intended to be limiting but rather to provide an understandable description of possible implementations. Various embodiments are shown in
The actuator 110 can be a shape memory material based actuator. Thus, the actuator 110 can include a shape memory material member 120. When an activation input is provided to the memory material member 120, the memory material member 120 can contract, thereby causing the actuator to morph into an activated configuration in which a dimension height of the actuator increases. In some arrangements, the contracting member can be a shape memory material member, which can include shape memory alloys and shape memory polymer. As an example, the contracting member can be a shape memory alloy wire. Various non-limiting examples of suitable actuators are shown in
The phrase “shape memory material” includes materials that changes shape when an activation input is provided to the shape memory material and, when the activation input is discontinued, the material substantially returns to its original shape. Examples of shape memory materials include shape memory alloys (SMA) and shape memory polymers (SMP).
In one or more arrangements, the shape memory material members can be shape memory material wires. As an example, the shape memory material members can be shape memory alloy wires. Thus, when an activation input (i.e., heat) is provided to the shape memory alloy wire(s), the wire(s) can contract. Shape memory alloy wire(s) can be heated in any suitable manner, now known or later developed. For instance, shape memory alloy wire(s) can be heated by the Joule effect by passing electrical current through the wires. In some instances, arrangements can provide for cooling of the shape memory alloy wire(s), if desired, to facilitate the return of the wire(s) to a non-activated configuration. Of course, it will be appreciated that the activation input can be provided to the shape memory alloy wire(s) in other ways. For example, heated air can be blown on the shape memory alloy wire(s).
The wire(s) can have any suitable characteristics. For instance, the wire(s) can be high temperature wires with austenite finish temperatures from about 80 degrees Celsius to about 110 degrees Celsius. The wire(s) can have any suitable diameter. For instance, the wire(s) can be from about 0.2 millimeters (mm) to about 0.7 mm, from about 0.3 mm to about 0.5 mm, or from about 0.375 millimeters to about 0.5 millimeters in diameter. In some arrangements, the wire(s) can have a stiffness of up to about 70 gigapascals. The pulling force of SMA wire(s) can be from about 150 MPA to about 400 MPa. The wire(s) can be configured to provide an initial moment of from about 300 to about 600 N·mm, or greater than about 500 N·mm, where the unit of newton millimeter (N·mm) is a unit of torque (also called moment) in the SI system. One newton meter is equal to the torque resulting from a force of one newton applied perpendicularly to the end of a moment arm that is one meter long. In various aspects, the wire(s) can be configured to transform in phase, causing the shape memory material members to be moved from non-activated position to an activated position in about 3 seconds or less, about 2 seconds or less, about 1 second or less, or about 0.5 second or less.
The wire(s) can be made of any suitable shape memory material, now known or later developed. Different materials can be used to achieve various balances, characteristics, properties, and/or qualities. As an example, an SMA wire can include nickel-titanium (Ni—Ti, or nitinol). One example of a nickel-titanium shape memory alloy is FLEXINOL, which is available from Dynaolloy, Inc., Irvine, California. As a further example, the SMA wires can be made of Cu—Al—Ni, Fe—Mn—Si, or Cu—Zn—Al.
The SMA wire can be configured to increase or decrease in length upon changing phase, for example, by being heated to a phase transition temperature TSMA. Utilization of the intrinsic property of SMA wires can be accomplished by using heat, for example, via the passing of an electric current through the SMA wire in order provide heat generated by electrical resistance, in order to change a phase or crystal structure transformation (i.e., twinned martensite, detwinned martensite, and austenite) resulting in a lengthening or shortening the SMA wire. In some implementations, during the phase change, the SMA wire can experience a decrease in length of from about 2 to about 8 percent, or from about 3 percent to about 6 percent, and in certain aspects, about 3.5 percent, when heated from a temperature less than the TSMA to a temperature greater than the TSMA.
The SMA wire can have a critical temperature. Once the critical temperature is reached, the SMA wire cannot produce any more force. Thus, if the SMA wire is heated above the critical temperature, it cannot produce any more force. This inherent property of the SMA wire can be leveraged according to arrangements described herein.
Other active materials may be used in connection with the arrangements described herein. For example, other shape memory materials may be employed. Shape memory materials, a class of active materials, also sometimes referred to as smart materials, include materials or compositions that have the ability to remember their original shape, which can subsequently be recalled by applying an external stimulus, such as an activation signal.
While the shape memory material members are described, in some implementations, as being wires, it will be understood that the shape memory material members are not limited to being wires. Indeed, it is envisioned that suitable shape memory materials may be employed in a variety of other forms, such as sheets, plates, panels, strips, cables, tubes, or combinations thereof. In some arrangements, the shape memory material members may include an insulating coating.
In some arrangements, the actuator 110 can include a single shape memory material member 120. In some instances, one or more portions of the shape memory material member 120 can extend external to overall envelope of the actuator 110. For instance, the shape memory material member 120 can include a first external portion 121 and a second external portion 122. Further, a portion of the shape memory material member 120 can extend within the actuator 110. Thus, the shape memory material member 120 can include an internal portion 123.
One example of the routing of the shape memory material member 120 will now be described with respect to
The shape memory material member 120 can be activated and/or deactivated using any suitable form of energy and/or from any suitable source. For example, in some arrangements, the of the shape memory material member 120 can be operatively connected to a power source (e.g., the power source(s) 340 in
However, it will be appreciated that arrangements described herein are not limited to activating and/or deactivating the shape memory material member 120 based on electrical energy. Indeed, as an example, the shape memory material member 120 can be activated and/or by supplying hot air, such as from a heater or some other heat source, to the shape memory material member 120. The heater can be operatively positioned with respect to the shape memory material member 120.
The shape memory material member can have a plurality of mechanically isolated zones. Each of the mechanically isolated zones does not affect the other mechanically isolated zones. The shape memory material member can be electrically connected throughout its routing. However, if the shape memory material member contracts or expands, then such contraction or expansion occurs through all of the mechanically isolated zones.
The mechanically isolated zones can be defined by a plurality of isolation points. In the example shown in
The isolation points 130, 131, 132, 133 can create a plurality of mechanically isolated zones, including a first mechanically isolated zone 160, a second mechanically isolated zone 161, a third mechanically isolated zone 162, a fourth mechanically isolated zone 163, and a fifth mechanically isolated zone 164. Each of these mechanically isolated zones will be described in turn below.
The first mechanically isolated zone 160 can be defined by the first isolation point 130. The first mechanically isolated zone can include the first external portion 121 of the shape memory material member 120. The first isolation point 130 can be located at or near where the shape memory material member 120 enters the actuator.
The second mechanically isolated zone 161 can be defined between the first isolation point 130 and the second isolation point 131. The second mechanically isolated 161 zone can be largely, if not entirely, defined by the portion of the shape memory material member 120 routed within the actuator 110.
The third mechanically isolated zone 162 can be defined between the second isolation point 131 and the third isolation point 132. The third mechanically isolated zone 162 can be a free floating zone where the shape memory material member 120 does not engage another structure.
The fourth mechanically isolated zone 163 can be defined between the third isolation point 132 and the fourth isolation point 133. The fourth mechanically isolated zone 163 can be monitored by a sensors. The fourth mechanically isolated zone 163 can be where the shape memory material member 120 operatively engages the sensor 150. Additional details of this area will be described in greater detail with
The fifth mechanically isolated zone 164 can be define by the fourth isolation point 133 and beyond. The fifth mechanically isolated zone 164 can include the second external portion 122 of the shape memory material member 120. The fourth isolation point 133 can be located at or near where the shape memory material member 120 exits the actuator 110.
Referring to
As noted above, the sensor 150 can be a force sensitive resistive sensor 155. The force sensitive resistive sensor 155 can be a relatively thin and/or substantially flat structure. In one or more arrangements, the shape memory material member can be wrapped around the sensor 150. Thus, when the shape memory material member 120 contracts in response to an activation input (e.g., electrical energy), it can exert a force on the sensor 150. The force sensitive resistive sensor 155 can be a resistor that changes its resistance when a force, pressure, or mechanical stress is applied. The resistance depends on how much force, pressure, or mechanical stress is applied. The resistance is proportional to the force, pressure, or mechanical stress is applied being applied to it.
The shape memory material member 120 can be wrapped around the sensor 150 one or more times. Thus, the shape memory material members 120 can be coiled about the sensor 150 to form one or more coils 125.
In some arrangements, one or more structures can be used in connection with the sensor 150 to provide protection thereto. As an example, a first protective member 170 can be operatively connected to one side of the sensor 150. Alternatively or additionally, a second protective member 175 can be operatively connected to an opposite side of the sensor 150. The first protective member 170 and the second protective member 175 can be sized, shaped, and configured to protect the sensor 150 while not interfering with its operation.
Referring to
In addition to the actuator 110, the system 300 can include one or more processors 310, one or more data stores 320, one or more sensors 330, one or more power sources 340, one or more input interfaces 350, one or more output interfaces 360, and/or one or more control modules 370. Each of these elements will be described in turn below.
As noted above, the system 300 can include one or more processors 310. “Processor” means any component or group of components that are configured to execute any of the processes described herein or any form of instructions to carry out such processes or cause such processes to be performed. The processor(s) 310 may be implemented with one or more general-purpose and/or one or more special-purpose processors. Examples of suitable processors include microprocessors, microcontrollers, DSP processors, and other circuitry that can execute software. Further examples of suitable processors include, but are not limited to, a central processing unit (CPU), an array processor, a vector processor, a digital signal processor (DSP), a field-programmable gate array (FPGA), a programmable logic array (PLA), an application specific integrated circuit (ASIC), programmable logic circuitry, and a controller. The processor(s) 310 can include at least one hardware circuit (e.g., an integrated circuit) configured to carry out instructions contained in program code. In arrangements in which there is a plurality of processors 310, such processors can work independently from each other or one or more processors can work in combination with each other.
The system 300 can include one or more data stores 320 for storing one or more types of data. The data store(s) 320 can include volatile and/or non-volatile memory. Examples of suitable data stores 320 include RAM (Random Access Memory), flash memory, ROM (Read Only Memory), PROM (Programmable Read-Only Memory), EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), registers, magnetic disks, optical disks, hard drives, or any other suitable storage medium, or any combination thereof. The data store(s) 320 can be a component of the processor(s) 310, or the data store(s) 320 can be operatively connected to the processor(s) 310 for use thereby. The term “operatively connected,” as used throughout this description, can include direct or indirect connections, including connections without direct physical contact.
The system 300 can include one or more sensors 330. “Sensor” means any device, component and/or system that can detect, determine, assess, monitor, measure, quantify, acquire, and/or sense something. The one or more sensors can detect, determine, assess, monitor, measure, quantify, acquire, and/or sense in real-time. As used herein, the term “real-time” means a level of processing responsiveness that a user or system senses as sufficiently immediate for a particular process or determination to be made, or that enables the processor to keep up with some external process.
In arrangements in which the system 300 includes a plurality of sensors 330, the sensors can work independently from each other. Alternatively, two or more of the sensors can work in combination with each other. In such case, the two or more sensors can form a sensor network. The sensor(s) 330 can be operatively connected to the processor(s) 310, the data store(s) 320, and/or other elements of the system 300 (including any of the elements shown in
The sensor(s) 330 can include the sensor 150 (e.g., the force sensitive resistive sensor 155) described in connection with
As noted above, the system 300 can include one or more power sources 340. The power source(s) 340 can be any power source capable of and/or configured to energize the actuator 110, as will be described later. For example, the power source(s) 340 can include one or more batteries, one or more fuel cells, one or more generators, one or more alternators, one or more solar cells, and combinations thereof. The power source(s) 340 can be any suitable source of electrical energy.
The system 300 can include one or more input interfaces 350. An “input interface” includes any device, component, system, element or arrangement or groups thereof that enable information/data to be entered into a machine. The input interface(s) 350 can receive an input from a vehicle occupant (e.g., a driver or a passenger). Any suitable input interface 350 can be used, including, for example, a keypad, gesture recognition interface, voice recognition interface, display, touch screen, multi-touch screen, button, joystick, mouse, trackball, microphone and/or combinations thereof.
The system 300 can include one or more output interfaces 360. An “output interface” includes any device, component, system, element or arrangement or groups thereof that enable information/data to be presented to a vehicle occupant (e.g., a person, a vehicle occupant, etc.). The output interface(s) 360 can present information/data to a vehicle occupant. The output interface(s) 360 can include a display. Alternatively or in addition, the output interface(s) 360 may include an earphone and/or speaker. Some components of the system 300 may serve as both a component of the input interface(s) 350 and a component of the output interface(s) 360.
The system 300 can include one or more modules, at least some of which will be described herein. The modules can be implemented as computer readable program code that, when executed by a processor, implements one or more of the various processes described herein. One or more of the modules can be a component of the processor(s) 310, or one or more of the modules can be executed on and/or distributed among other processing systems to which the processor(s) 310 is operatively connected. The modules can include instructions (e.g., program logic) executable by one or more processor(s) 310. Alternatively or in addition, one or more data stores 320 may contain such instructions. In some arrangements, the module(s) can be located remote from the other elements of the system 300.
In one or more arrangements, the modules described herein can include artificial or computational intelligence elements, e.g., neural network, fuzzy logic or other machine learning algorithms. Further, in one or more arrangements, the modules can be distributed among a plurality of modules. In one or more arrangements, two or more of the modules described herein can be combined into a single module.
The system 300 can include one or more control modules 370. The control module(s) 370 can include profiles and logic for controlling the actuator 110. The control module(s) 370 can use profiles, parameters, or settings loaded into the control module(s) 370 and/or stored in the data store(s) 320, such as the actuation profiles. In some arrangements, the control module(s) 370 can be located remotely from the other elements of the system 300, such as on a remote server, a cloud-based server, or an edge server.
The control module(s) 370 can be configured to cause one or more of the actuators 110 to be activated or deactivated. As used herein, “cause” or “causing” means to make, force, compel, direct, command, instruct, and/or enable an event or action to occur or at least be in a state where such event or action may occur, either in a direct or indirect manner. For instance, the control module(s) 370 can cause the actuator 110 to be selectively activated or deactivated in any suitable manner. For instance, when the actuator 110 includes a shape memory material member 120, the shape memory material member 120 can be heated by the Joule effect by passing electrical current through the shape memory material member. To that end, the control module(s) 370 can be configured to selectively permit, restrict, adjust, alter, and/or prevent the flow of electrical energy from the power source(s) 340 to the shape memory material member 120 of the actuator 110. The control module(s) 370 can be configured to send control signals or commands over a communication network 390 to one or more elements of the system 300.
The control module(s) 370 can be configured to cause the actuator 110 to be activated or deactivated based on various events, conditions, inputs, or other factors. For instance, the control module(s) 370 can be configured to cause the actuator 110 to be activated or deactivated based on a user input. A user can provide an input on the input interface(s) 350.
In some arrangements, the control module(s) 370 can be configured to cause the actuator 110 to be activated or deactivated. In some instances, the control module(s) 370 can be configured to adjust the degree of activation of the actuator 110. For instance, the control module(s) 370 can be configured to cause the actuator 110 to be in an activated configuration that corresponds to its full activated position (e.g., extended to its maximum height). The control module(s) 370 can be configured to activate the actuator 110 to one or more activated configurations between the non-activated configuration and the full activated configuration, such as an extended position but less than its maximum height. The control module(s) 370 can be configured to maintain the activated configuration of the actuator 110. The control module(s) 370 can be configured to adjust the activated configuration of the actuator 110.
The control module(s) 370 can be configured to receive sensor data from the sensor 150. The control module(s) 370 can be configured to analyze the sensor data. For instance, when the sensor is a force sensitive resistive sensor 155, the control module(s) 370 can be configured to detect changes in the resistance of or measured by the force sensitive resistive sensor 155.
As noted above, the resistance of the force sensitive resistive sensor 155 will stop changing once the critical temperature is reached, even if the shape memory material member 120 is heated beyond the critical temperature. Thus, once the resistance of the force sensitive resistive sensor 155 stops changing, then the control module(s) 370 can recognize that the shape memory material member has reached its critical temperature and that the actuator 110 is at its maximum activated configuration.
The actual value of the resistance of the force sensitive resistive sensor 155 does not have to be known. Rather, the control module(s) 370 only needs to monitor the changes in electrical resistance. When the control module(s) 370 detect that the resistance is no longer changing, the control module(s) 370 can be configured to take one or more actions. For instance, the control module(s) 370 can discontinue the supply of electrical energy to the shape memory material member 120. Alternatively, the control module(s) 370 can maintain the current state of the actuator 110. Thus, additional power is not supplied to the shape memory material member 120. In this way, extra power is not supplied to the to the shape memory material member 120 and, therefore, is not wasted.
It will be appreciated that arrangements described herein are not limited to force sensitive resistive sensor or to monitoring changes in resistance. Indeed, arrangements described herein can be configured to monitor the state of the shape memory material member 120 based on any sensor data. Such monitoring can be based on any parameter, characteristic, or metric. The control module(s) 370 can be configured to determine when at least one metric is fulfilled based on feedback from one or more of the sensor(s) 150.
The various elements of the system 300 can be communicatively linked to one another or one or more other elements through one or more communication networks 390. As used herein, the term “communicatively linked” can include direct or indirect connections through a communication channel, bus, pathway or another component or system. A “communication network” means one or more components designed to transmit and/or receive information from one source to another. The data store(s) 320 and/or one or more other elements of the system 300 can include and/or execute suitable communication software, which enables the various elements to communicate with each other through the communication network and perform the functions disclosed herein.
The one or more communication networks 390 can be implemented as, or include, without limitation, a wide area network (WAN), a local area network (LAN), the Public Switched Telephone Network (PSTN), a wireless network, a mobile network, a Virtual Private Network (VPN), the Internet, a hardwired communication bus, and/or one or more intranets. The communication network 390 further can be implemented as or include one or more wireless networks, whether short range (e.g., a local wireless network built using a Bluetooth or one of the IEEE 802 wireless communication protocols, e.g., 802.11a/b/g/i, 802.15, 802.16, 802.20, Wi-Fi Protected Access (WPA), or WPA2) or long range (e.g., a mobile, cellular, and/or satellite-based wireless network; GSM, TDMA, CDMA, WCDMA networks or the like). The communication network 390 can include wired communication links and/or wireless communication links. The communication network 390 can include any combination of the above networks and/or other types of networks.
Now that the various potential systems, devices, elements and/or components of the system 300 have been described, various methods will now be described. Various possible steps of such methods will now be described. The methods described may be applicable to the arrangements described above, but it is understood that the methods can be carried out with other suitable systems and arrangements. Moreover, the methods may include other steps that are not shown here, and in fact, the methods are not limited to including every step shown. The blocks that are illustrated here as part of the methods are not limited to the particular chronological order. Indeed, some of the blocks may be performed in a different order than what is shown and/or at least some of the blocks shown can occur simultaneously.
Turning to
At block 420, a state of the shape memory material member 120 can be monitored. The monitoring can be performed by the control module(s) 370 and/or the processor(s) 310 based on sensor data acquired by the sensor 150 (e.g., the force sensitive resistive sensor 155). In one or more arrangements, the control module(s) 370 and/or the processor(s) 310 can monitor for changes in the resistance of and/or measured by the sensor 150. In one particular arrangement, the control module(s) 370 and/or the processor(s) 310 can monitor when the resistance of and/or measured by the sensor 150 stops changing. The method 400 can continue to block 430.
At block 430, the activated configuration of the actuator 110 can be controlled based on the monitored state of the shape memory material member 120. The controlling can be performed by the control module(s) 370 and/or the processor(s) 310. As an example, when the resistance of and/or measured by the sensor 150 stops changing, the control module(s) 370 and/or the processor(s) 310 can cause the supply of electrical energy to the shape memory material member 120 to be discontinued. As another example, when the resistance of and/or measured by the sensor 150 stops changing, the control module(s) 370 can maintain the current state of the actuator 110. Thus, the control module(s) 370 and/or the processor(s) 310 can cause the supply of electrical energy to the shape memory material member 120 to be maintained at the current level.
As noted above, the resistance of the force sensitive resistive sensor 155 will stop changing once the critical temperature is reached, even if the shape memory material member 120 is heated beyond the critical temperature. Thus, once the resistance of the force sensitive resistive sensor 155 stops changing, then the control module(s) 370 can recognize that the shape memory material member has reached its critical temperature and that the actuator 110 is at its maximum activated configuration.
The actual value of the resistance of the force sensitive resistive sensor 155 does not have to be known. Rather, the control module(s) 370 only needs to monitor the changes in electrical resistance. When the control module(s) 370 detects that the resistance is no longer changing, the control module(s) 370 can be configured to take one or more actions. For instance, the control module(s) 370 can discontinue the supply of electrical energy to the shape memory material member 120. Alternatively, the control module(s) 370 can maintain the current state of the actuator 110. Thus, additional power is not supplied to the shape memory material member 120. In this way, extra power is not supplied to the to the shape memory material member 120 and, therefore, is not wasted.
The method 400 can end. Alternatively, the method 400 can return to block 410 or to some other block. The method 400 can be repeated at any suitable point, such as at a suitable time or upon the occurrence of any suitable event or condition.
As noted above, arrangements described herein can be used in connection there can be a plurality of actuators. The actuators can be substantially identical to each other. Alternatively, one or more of the actuators can be different from the other actuators in one or more respects.
The actuator 500 is depicted here with an outer skin 510, hinge assemblies 520, and an input-responsive element 530. The actuator 600 can have a first dimension 540 and a second dimension 550.
The input-responsive element 530 can include one or more elements capable of transitioning from a first configuration to a second configuration. The transition of the input-responsive element 530 from the first configuration to the second configuration displaces the hinge assemblies 520 with respect to the outer skin 510 and causes a change in confirmation of the outer skin 510. In some implementations, the input-responsive element 530 can include a SMM wire 532. The SMM wire 532 can be a shape memory alloy.
The actuator 600 can include a first endcap 610 and a second endcap 620. The first endcap 610 and the second endcap 620 can be spaced apart. The actuator 600 can include a first outer member 640 and a second outer member 650. The first outer member 640 and the second outer member 650 can have a bowed shape.
The actuator 600 can include one or more shape memory material members 680. The shape memory material members 680 can be operatively connected to the first endcap 610 and the second endcap 620. The phrase “shape memory material” includes materials that changes shape when an activation input is provided to the shape memory material and, when the activation input is discontinued, the material substantially returns to its original shape. Examples of shape memory materials include shape memory alloys (SMA) and shape memory polymers (SMP).
In one or more arrangements, the shape memory material members 680 can be shape memory material wires. As an example, the shape memory material members 680 can be shape memory alloy wires. Thus, when an activation input (i.e., heat) is provided to the shape memory alloy wire(s), the wire(s) can contract. Shape memory alloy wire(s) can be heated in any suitable manner, now known or later developed. For instance, shape memory alloy wire(s) can be heated by the Joule effect by passing electrical current through the wires. In some instances, arrangements can provide for cooling of the shape memory alloy wire(s), if desired, to facilitate the return of the wire(s) to a non-activated configuration.
As noted above,
Consequently, the ends of the first outer member 640 can be drawn toward each other in a direction that corresponds to the first dimension 690, and the ends of the second outer member 650 can be drawn toward each other in a direction that corresponds to the first dimension 690. As a result, the first outer member 640 and the second outer member 650 can bow outward and away from each other in a direction that corresponds to the second dimension 695. It will be appreciated that the first dimension 690 (i.e., the width) of the actuator 600 can decrease, and the second dimension 695 (i.e., the height) of the actuator 600 can increase.
The actuator 700 can include a first outer body member 710, a second outer body member 730, a first endcap 760, a second endcap 770, and a shape memory material member 780. The first outer body member 710 can include a first portion 712 and a second portion 714. The first portion 712 and the second portion 714 can be operatively connected to each other such that the first portion 712 and the second portion 714 can move relative to each other. In one or more arrangements, the first portion 712 and the second portion 714 can be pivotably connected to each other. For example, the first portion 712 and the second portion 714 can be pivotably connected to each other by one or more hinges. The first portion 712 and the second portion 714 can be angled relative to each other. As a result, the first outer body member 710 can have a generally V-shape.
The second outer body member 730 can include a first portion 732, a second portion 734, and a base 736. In one or more arrangements, each of the first portion 732 and the second portion 734 can be pivotably connected to the base 736. For example, the first portion 732 can be pivotably connected to the base 736 by one or more hinges, and the second portion 734 can be pivotably connected to the base 736 by one or more hinges. The first portion 732 and the second portion 734 can be located on opposite sides of the base 736.
The actuator 700 can include a first endcap 760 and a second endcap 770. The first endcap 760 and the second endcap 770 can be spaced apart. The actuator 700 can include one or more shape memory material members 780. The shape memory material member(s) 780 can extend between the first endcap 760 and the second endcap 770 in any suitable manner. The shape memory material member(s) 780 can be operatively connected to the first endcap 760 and the second endcap 770.
The actuator 800 can include a first outer body member 810, a second outer body member 830, and one or more shape memory material members 880. The actuator 800 includes a first endcap 860 and a second endcap 870. The first endcap 860 and the second endcap 870 shown in
The various examples of actuators shown in
Arrangements described herein can be used in any application in which shape memory material-based actuators are used. For instance, arrangements described herein can be used in connection with seat actuators or other actuators in a vehicle. “Vehicle” means any form of transport, including motorized or powered transport. In one or more implementations, the vehicle can be an automobile. While arrangements will be described herein with respect to automobiles, it will be understood that embodiments are not limited to automobiles. In some implementations, the vehicle may be a watercraft, an aircraft, spacecraft, or any other form of transport. However, it will be appreciated that arrangements described herein are not limited to vehicular applications. For instance, arrangements described herein can be used in connection with an office chair, a chair, a massage chair, a gaming chair, a recliner, or any other seat structure, now known or later developed. Of course, arrangements are not limited to seat applications.
It will be appreciated that arrangements described herein can provide numerous benefits, including one or more of the benefits mentioned herein. For example, arrangements described herein can enable indirect measurement of the maximum actuated state of a shape memory material member. Arrangements described herein can enable such indirect measurement using inexpensive sensors. Arrangements described herein do not require calibration. Arrangements described herein can protect shape memory material members from overheating and/or overstressing. Arrangements described herein can help to maximize the useful life of a shape memory material member. Arrangements described herein can facilitate improved actuator performance.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments. In this regard, each block in the flowcharts or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.
The systems, components and/or processes described above can be realized in hardware or a combination of hardware and software and can be realized in a centralized fashion in one processing system or in a distributed fashion where different elements are spread across several interconnected processing systems. Any kind of processing system or other apparatus adapted for carrying out the methods described herein is suited. A typical combination of hardware and software can be a processing system with computer-usable program code that, when being loaded and executed, controls the processing system such that it carries out the methods described herein. The systems, components and/or processes also can be embedded in a computer-readable storage, such as a computer program product or other data programs storage device, readable by a machine, tangibly embodying a program of instructions executable by the machine to perform methods and processes described herein. These elements also can be embedded in an application product which comprises all the features enabling the implementation of the methods described herein and, which when loaded in a processing system, is able to carry out these methods.
Furthermore, arrangements described herein may take the form of a computer program product embodied in one or more computer-readable media having computer-readable program code embodied, e.g., stored, thereon. Any combination of one or more computer-readable media may be utilized. The computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. The phrase “computer-readable storage medium” means a non-transitory storage medium. A computer-readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk drive (HDD), a solid state drive (SSD), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer-readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device.
The terms “a” and “an,” as used herein, are defined as one or more than one. The term “plurality,” as used herein, is defined as two or more than two. The term “another,” as used herein, is defined as at least a second or more. The terms “including” and/or “having,” as used herein, are defined as comprising (i.e., open language). The term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” The phrase “at least one of . . . and . . . ” as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. As an example, the phrase “at least one of A, B and C” includes A only, B only, C only, or any combination thereof (e.g., AB, AC, BC or ABC). As used herein, the term “substantially” or “about” includes exactly the term it modifies and slight variations therefrom. Thus, the term “substantially parallel” means exactly parallel and slight variations therefrom. “Slight variations therefrom” can include within 15 degrees/percent/units or less, within 14 degrees/percent/units or less, within 13 degrees/percent/units or less, within 12 degrees/percent/units or less, within 11 degrees/percent/units or less, within 10 degrees/percent/units or less, within 9 degrees/percent/units or less, within 8 degrees/percent/units or less, within 7 degrees/percent/units or less, within 6 degrees/percent/units or less, within 5 degrees/percent/units or less, within 4 degrees/percent/units or less, within 3 degrees/percent/units or less, within 2 degrees/percent/units or less, or within 1 degree/percent/unit or less. In some instances, “substantially” can include being within normal manufacturing tolerances.
Aspects herein can be embodied in other forms without departing from the spirit or essential attributes thereof. Accordingly, reference should be made to the following claims, rather than to the foregoing specification, as indicating the scope hereof.
Number | Name | Date | Kind |
---|---|---|---|
1658669 | Cohn et al. | Feb 1928 | A |
2322755 | Voorhies | Jun 1943 | A |
2588706 | Davis | Mar 1952 | A |
3394631 | Thompson | Jul 1968 | A |
3706102 | Grenier | Dec 1972 | A |
4063826 | Riepe | Dec 1977 | A |
4244140 | Kim | Jan 1981 | A |
4396220 | Dieckmann et al. | Aug 1983 | A |
4498851 | Kolm et al. | Feb 1985 | A |
4522447 | Snyder et al. | Jun 1985 | A |
4541885 | Caudill, Jr. | Sep 1985 | A |
4544988 | Hochstein | Oct 1985 | A |
4553393 | Ruoff | Nov 1985 | A |
4595338 | Kolm et al. | Jun 1986 | A |
4779852 | Wassell | Oct 1988 | A |
4780062 | Yamada et al. | Oct 1988 | A |
4806815 | Homma | Feb 1989 | A |
4811564 | Palmer | Mar 1989 | A |
4834619 | Walton | May 1989 | A |
4898426 | Schulz et al. | Feb 1990 | A |
4923000 | Nelson | May 1990 | A |
4944755 | Hennequin et al. | Jul 1990 | A |
4955196 | Lin et al. | Sep 1990 | A |
4964402 | Grim et al. | Oct 1990 | A |
5069219 | Knoblich | Dec 1991 | A |
5088115 | Napolitano | Feb 1992 | A |
5129753 | Wesley et al. | Jul 1992 | A |
5250167 | Adolf et al. | Oct 1993 | A |
5255390 | Gross et al. | Oct 1993 | A |
5279123 | Wechsler et al. | Jan 1994 | A |
5482351 | Young et al. | Jan 1996 | A |
5488255 | Sato et al. | Jan 1996 | A |
5522712 | Winn | Jun 1996 | A |
5583844 | Wolf et al. | Dec 1996 | A |
5619177 | Johnson et al. | Apr 1997 | A |
5622482 | Lee | Apr 1997 | A |
5662376 | Breuer et al. | Sep 1997 | A |
5678247 | Vickers | Oct 1997 | A |
5686003 | Ingram et al. | Nov 1997 | A |
5747140 | Heerklotz | May 1998 | A |
5771742 | Bokaie et al. | Jun 1998 | A |
5846629 | Gwinn | Dec 1998 | A |
5853005 | Scanlon | Dec 1998 | A |
5861703 | Losinski | Jan 1999 | A |
6043978 | Mody et al. | Mar 2000 | A |
6053553 | Hespelt | Apr 2000 | A |
6093910 | McClintock et al. | Jul 2000 | A |
6116257 | Yokota et al. | Sep 2000 | A |
6142563 | Townsend et al. | Nov 2000 | A |
6155716 | Okamura | Dec 2000 | A |
6186047 | Baruffaldi | Feb 2001 | B1 |
6227515 | Broyles | May 2001 | B1 |
6379393 | Mavroidis et al. | Apr 2002 | B1 |
6394001 | Giesey et al. | May 2002 | B1 |
6404098 | Kayama et al. | Jun 2002 | B1 |
6422010 | Julien | Jul 2002 | B1 |
6443524 | Yu | Sep 2002 | B1 |
6481799 | Whalen | Nov 2002 | B1 |
6508437 | Davis et al. | Jan 2003 | B1 |
6530217 | Yokota et al. | Mar 2003 | B1 |
6546806 | Varma | Apr 2003 | B1 |
6591188 | Ohler | Jul 2003 | B1 |
6628522 | Trautman et al. | Sep 2003 | B2 |
6664718 | Perline et al. | Dec 2003 | B2 |
6719694 | Weng et al. | Apr 2004 | B2 |
6740994 | Lee et al. | May 2004 | B2 |
6773535 | Wetzel | Aug 2004 | B1 |
6809462 | Pelrine et al. | Oct 2004 | B2 |
6896324 | Kull et al. | May 2005 | B1 |
6910714 | Browne et al. | Jun 2005 | B2 |
6912748 | VanSickle | Jul 2005 | B2 |
6943653 | Hanke et al. | Sep 2005 | B2 |
6972659 | von Behrens et al. | Dec 2005 | B2 |
6998546 | Schmidt et al. | Feb 2006 | B1 |
7017345 | Von Behrens et al. | Mar 2006 | B2 |
7086322 | Schulz | Aug 2006 | B2 |
7093903 | O'Connor et al. | Aug 2006 | B2 |
7100990 | Kimura et al. | Sep 2006 | B2 |
7108316 | Barvosa-Carter et al. | Sep 2006 | B2 |
7117673 | Szilagyi | Oct 2006 | B2 |
7125077 | Frank | Oct 2006 | B2 |
7204472 | Jones et al. | Apr 2007 | B2 |
7237847 | Hancock et al. | Jul 2007 | B2 |
7256518 | Gummin | Aug 2007 | B2 |
7293836 | Browne et al. | Nov 2007 | B2 |
7306187 | Lavan | Dec 2007 | B2 |
7309104 | Browne et al. | Dec 2007 | B2 |
7331616 | Brei et al. | Feb 2008 | B2 |
7336486 | Mongia | Feb 2008 | B2 |
7350851 | Barvosa-Carter et al. | Apr 2008 | B2 |
7364211 | Niskanen et al. | Apr 2008 | B2 |
7371052 | Koeneman | May 2008 | B2 |
7446450 | Boland et al. | Nov 2008 | B2 |
7448678 | Browne et al. | Nov 2008 | B2 |
7476224 | Petrakis | Jan 2009 | B2 |
7478845 | Mankame et al. | Jan 2009 | B2 |
7484735 | Verbrugge et al. | Feb 2009 | B2 |
7501607 | Camm et al. | Mar 2009 | B2 |
7506937 | Bequet | Mar 2009 | B2 |
7511402 | Ito et al. | Mar 2009 | B2 |
7527312 | Cucknell et al. | May 2009 | B1 |
7556313 | Browne et al. | Jul 2009 | B2 |
7578661 | Koeneman | Aug 2009 | B2 |
7594697 | Browne et al. | Sep 2009 | B2 |
7619894 | Wang et al. | Nov 2009 | B2 |
7661764 | Ali et al. | Feb 2010 | B2 |
7709995 | Hanlon et al. | May 2010 | B2 |
7717520 | Boren et al. | May 2010 | B2 |
7729828 | Gandhi | Jun 2010 | B2 |
7731279 | Asada et al. | Jun 2010 | B2 |
7735940 | Chiu | Jun 2010 | B2 |
7756246 | Mikami et al. | Jul 2010 | B2 |
7758121 | Browne et al. | Jul 2010 | B2 |
7766423 | Alexander et al. | Aug 2010 | B2 |
7770391 | Melz et al. | Aug 2010 | B2 |
7814810 | Mitteer | Oct 2010 | B2 |
7823382 | Ukpai et al. | Nov 2010 | B2 |
7823972 | Browne | Nov 2010 | B2 |
7834527 | Rivera et al. | Nov 2010 | B2 |
7878459 | Mabe et al. | Feb 2011 | B2 |
7883148 | Alexander et al. | Feb 2011 | B2 |
7892630 | McKnight et al. | Feb 2011 | B1 |
7901524 | McKnight et al. | Mar 2011 | B1 |
7905538 | Ukpai et al. | Mar 2011 | B2 |
7905547 | Lawall et al. | Mar 2011 | B2 |
7909403 | Lawall et al. | Mar 2011 | B2 |
7964290 | Mullner et al. | Jun 2011 | B2 |
7965509 | Campbell et al. | Jun 2011 | B2 |
7971296 | Jansen | Jul 2011 | B2 |
7971939 | Fujita et al. | Jul 2011 | B2 |
8016952 | Ishida et al. | Sep 2011 | B2 |
8038215 | Di Giusto et al. | Oct 2011 | B2 |
8052112 | Lawall et al. | Nov 2011 | B2 |
8056335 | Brown | Nov 2011 | B1 |
8100471 | Lawall et al. | Jan 2012 | B2 |
8109567 | Alexander et al. | Feb 2012 | B2 |
8126615 | McMillen et al. | Feb 2012 | B2 |
8172458 | Petrakis | May 2012 | B2 |
8240677 | Browne et al. | Aug 2012 | B2 |
8313108 | Ac et al. | Nov 2012 | B2 |
8362882 | Heubel et al. | Jan 2013 | B2 |
8366057 | Vos et al. | Feb 2013 | B2 |
8414366 | Browne et al. | Apr 2013 | B2 |
8446475 | Topliss et al. | May 2013 | B2 |
8448435 | Gregory et al. | May 2013 | B2 |
8510924 | Mankame et al. | Aug 2013 | B2 |
8584456 | McKnight | Nov 2013 | B1 |
8585456 | Canon | Nov 2013 | B2 |
8593568 | Topliss et al. | Nov 2013 | B2 |
8649242 | Martin et al. | Feb 2014 | B2 |
8681496 | Dede | Mar 2014 | B2 |
8695334 | Lewis et al. | Apr 2014 | B2 |
8702120 | Kalisz et al. | Apr 2014 | B2 |
8721557 | Chen et al. | May 2014 | B2 |
8741076 | Gao et al. | Jun 2014 | B2 |
8756933 | Topliss | Jun 2014 | B2 |
8793821 | Fowkes et al. | Aug 2014 | B2 |
8827709 | Gurule et al. | Sep 2014 | B1 |
8830335 | Topliss et al. | Sep 2014 | B2 |
8853916 | Browne et al. | Oct 2014 | B2 |
8880141 | Chen | Nov 2014 | B2 |
8881347 | Feinstein | Nov 2014 | B2 |
8894142 | Alexander et al. | Nov 2014 | B2 |
8912709 | Pollock et al. | Dec 2014 | B2 |
8991769 | Gandhi | Mar 2015 | B2 |
8998320 | Mankame et al. | Apr 2015 | B2 |
9068561 | Gondo | Jun 2015 | B2 |
9086069 | Dede | Jul 2015 | B2 |
9140243 | Gandhi et al. | Sep 2015 | B2 |
9168814 | Gandhi | Oct 2015 | B2 |
9171686 | Alacqua et al. | Oct 2015 | B2 |
9180525 | Park et al. | Nov 2015 | B2 |
9267495 | Kopfer et al. | Feb 2016 | B2 |
9298207 | Li | Mar 2016 | B2 |
9347609 | Pinto, IV et al. | May 2016 | B2 |
9428088 | Rajasingham | Aug 2016 | B1 |
9457813 | Hoerwick et al. | Oct 2016 | B2 |
9457887 | Roe et al. | Oct 2016 | B2 |
9495875 | Dowdall et al. | Nov 2016 | B2 |
9512829 | Alacqua et al. | Dec 2016 | B2 |
9550466 | Gandhi | Jan 2017 | B2 |
9588020 | Browne et al. | Mar 2017 | B2 |
9662197 | Yun et al. | May 2017 | B2 |
9664182 | Nicolini et al. | May 2017 | B2 |
9664210 | Ou et al. | May 2017 | B2 |
9684183 | Brown et al. | Jun 2017 | B2 |
9696175 | Hansen et al. | Jul 2017 | B2 |
9697708 | Adrezin et al. | Jul 2017 | B2 |
9714460 | Merideth | Jul 2017 | B2 |
9719534 | Shevchenko et al. | Aug 2017 | B2 |
9731828 | Lichota | Aug 2017 | B2 |
9764220 | Keating et al. | Sep 2017 | B2 |
9784249 | Li et al. | Oct 2017 | B2 |
9784590 | Englehardt et al. | Oct 2017 | B2 |
9827888 | Patrick et al. | Nov 2017 | B2 |
9848814 | Benson et al. | Dec 2017 | B2 |
9943437 | Lowe et al. | Apr 2018 | B2 |
9945490 | Dankbaar et al. | Apr 2018 | B2 |
9981421 | Macroe et al. | May 2018 | B2 |
9994136 | Nakada | Jun 2018 | B2 |
10007263 | Fields et al. | Jun 2018 | B1 |
10029618 | Perez Astudillo et al. | Jul 2018 | B2 |
10059334 | Zhu et al. | Aug 2018 | B1 |
10061350 | Magi | Aug 2018 | B2 |
10066829 | Wong et al. | Sep 2018 | B2 |
10168782 | Tchon et al. | Jan 2019 | B1 |
10191550 | Nussbaum et al. | Jan 2019 | B1 |
10208823 | Kashani | Feb 2019 | B2 |
10299520 | Shaffer et al. | May 2019 | B1 |
10302586 | Sun et al. | May 2019 | B2 |
10315771 | Rao et al. | Jun 2019 | B1 |
10330144 | Alqasimi et al. | Jun 2019 | B1 |
10330400 | Dede | Jun 2019 | B2 |
10335044 | Banet et al. | Jul 2019 | B2 |
10349543 | Sreetharan et al. | Jul 2019 | B2 |
10355624 | Majdi et al. | Jul 2019 | B2 |
10371229 | Gandhi et al. | Aug 2019 | B2 |
10371299 | Leffler | Aug 2019 | B2 |
10377278 | Ketels et al. | Aug 2019 | B2 |
10427634 | Gandhi et al. | Oct 2019 | B2 |
10434973 | Gandhi et al. | Oct 2019 | B2 |
10441491 | Wyatt et al. | Oct 2019 | B2 |
10459475 | Gandhi et al. | Oct 2019 | B2 |
10479246 | Meingast et al. | Nov 2019 | B2 |
10532672 | Pinkelman et al. | Jan 2020 | B1 |
10583757 | Ketels et al. | Mar 2020 | B2 |
10591078 | Oehler et al. | Mar 2020 | B2 |
10647237 | Song | May 2020 | B2 |
10677310 | Gandhi et al. | Jun 2020 | B2 |
10682931 | Rowe et al. | Jun 2020 | B2 |
10759320 | Mochizuki | Sep 2020 | B2 |
10773487 | Frigerio et al. | Sep 2020 | B2 |
10781800 | Brown et al. | Sep 2020 | B2 |
10814514 | Aihara | Oct 2020 | B2 |
10843611 | Caruss et al. | Nov 2020 | B2 |
10933974 | Tsuruta et al. | Mar 2021 | B2 |
10960793 | Gandhi et al. | Mar 2021 | B2 |
10965172 | Dede et al. | Mar 2021 | B2 |
10993526 | Vandewall et al. | May 2021 | B2 |
10995779 | Keplinger et al. | May 2021 | B2 |
11048329 | Lee et al. | Jun 2021 | B1 |
11091060 | Pinkelman et al. | Aug 2021 | B2 |
11125248 | Joshi et al. | Sep 2021 | B2 |
11137045 | Gandhi et al. | Oct 2021 | B2 |
11180052 | Severgnini et al. | Nov 2021 | B2 |
11241842 | Gandhi et al. | Feb 2022 | B2 |
11247584 | Breitweg et al. | Feb 2022 | B2 |
11248592 | Tsuruta et al. | Feb 2022 | B1 |
11269891 | Frank et al. | Mar 2022 | B2 |
11285844 | Gandhi et al. | Mar 2022 | B2 |
11353009 | Rowe et al. | Jun 2022 | B1 |
11356255 | Emelyanov et al. | Jun 2022 | B1 |
11370330 | Gandhi et al. | Jun 2022 | B2 |
11372481 | Leroy et al. | Jun 2022 | B2 |
11377007 | Samain et al. | Jul 2022 | B2 |
11458874 | Nagai et al. | Oct 2022 | B2 |
11460009 | Tsuruta et al. | Oct 2022 | B1 |
11460010 | Tsuruta et al. | Oct 2022 | B1 |
11467669 | Liu et al. | Oct 2022 | B2 |
11472325 | Tsuruta et al. | Oct 2022 | B1 |
11486421 | Keplinger et al. | Nov 2022 | B2 |
11536255 | Rowe | Dec 2022 | B1 |
11542925 | Rowe et al. | Jan 2023 | B1 |
11577471 | Gandhi et al. | Feb 2023 | B2 |
11591076 | Song et al. | Feb 2023 | B2 |
11592010 | Panwar et al. | Feb 2023 | B1 |
11592037 | Rowe et al. | Feb 2023 | B1 |
11603153 | Trager et al. | Mar 2023 | B1 |
11603828 | Gummin et al. | Mar 2023 | B2 |
11624376 | Rowe et al. | Apr 2023 | B2 |
11628898 | Trager et al. | Apr 2023 | B1 |
11642083 | Severgnini et al. | May 2023 | B2 |
11649808 | Tsuruta et al. | May 2023 | B2 |
11668287 | Naly et al. | Jun 2023 | B2 |
11702015 | Pinkelman et al. | Jul 2023 | B2 |
11732735 | Song et al. | Aug 2023 | B2 |
11750115 | Saneyoshi et al. | Sep 2023 | B2 |
11752901 | Gandhi et al. | Sep 2023 | B2 |
11795924 | Rowe | Oct 2023 | B2 |
11840161 | Schmalenberg et al. | Dec 2023 | B2 |
11841008 | Panwar et al. | Dec 2023 | B1 |
11885428 | Panwar et al. | Jan 2024 | B2 |
11897379 | Tsuruta et al. | Feb 2024 | B2 |
11913436 | Easton et al. | Feb 2024 | B2 |
11927206 | Rowe et al. | Mar 2024 | B2 |
20020130754 | Alacqua et al. | Sep 2002 | A1 |
20020179663 | Moore et al. | Dec 2002 | A1 |
20030000605 | Homma | Jan 2003 | A1 |
20030182041 | Watson | Sep 2003 | A1 |
20040035108 | Szilagyi | Feb 2004 | A1 |
20040041998 | Haddad | Mar 2004 | A1 |
20040104580 | Spiessl et al. | Jun 2004 | A1 |
20040118854 | Kutun | Jun 2004 | A1 |
20040145230 | Fujita et al. | Jul 2004 | A1 |
20040195888 | Frye | Oct 2004 | A1 |
20040256920 | Gummin et al. | Dec 2004 | A1 |
20040261411 | MacGregor | Dec 2004 | A1 |
20050023086 | Szilagyi | Feb 2005 | A1 |
20050082897 | Ropp et al. | Apr 2005 | A1 |
20050066810 | Schulz | May 2005 | A1 |
20050111177 | Kwitek | May 2005 | A1 |
20050146147 | Niskanen et al. | Jul 2005 | A1 |
20050198904 | Browne et al. | Sep 2005 | A1 |
20050199455 | Browne et al. | Sep 2005 | A1 |
20050199845 | Jones et al. | Sep 2005 | A1 |
20050206096 | Browne et al. | Sep 2005 | A1 |
20050210874 | Browne et al. | Sep 2005 | A1 |
20050211198 | Froeschle et al. | Sep 2005 | A1 |
20050227607 | Stevenson et al. | Oct 2005 | A1 |
20050253425 | Asada et al. | Nov 2005 | A1 |
20060033312 | Barvosa-Carter et al. | Feb 2006 | A1 |
20060038643 | Xu et al. | Feb 2006 | A1 |
20060038745 | Naksen et al. | Feb 2006 | A1 |
20060074325 | Karo et al. | Apr 2006 | A1 |
20060201149 | Biggs et al. | Sep 2006 | A1 |
20060223637 | Rosenberg | Oct 2006 | A1 |
20060226013 | Decre et al. | Oct 2006 | A1 |
20060244293 | Buffa | Nov 2006 | A1 |
20060265965 | Butera et al. | Nov 2006 | A1 |
20070025575 | Oser et al. | Feb 2007 | A1 |
20070046074 | Satta et al. | Mar 2007 | A1 |
20070063566 | Browne et al. | Mar 2007 | A1 |
20070084220 | Asada et al. | Apr 2007 | A1 |
20070188004 | Browne et al. | Aug 2007 | A1 |
20070205853 | Taya et al. | Sep 2007 | A1 |
20070236071 | Fujita et al. | Oct 2007 | A1 |
20070246285 | Browne et al. | Oct 2007 | A1 |
20070246898 | Keefe et al. | Oct 2007 | A1 |
20070246979 | Browne et al. | Oct 2007 | A1 |
20070271939 | Ichigaya | Nov 2007 | A1 |
20070277877 | Ghorbal et al. | Dec 2007 | A1 |
20080006353 | Elzey et al. | Jan 2008 | A1 |
20080018198 | Sohn et al. | Jan 2008 | A1 |
20080085436 | Langan et al. | Apr 2008 | A1 |
20080100118 | Young et al. | May 2008 | A1 |
20080114218 | Suyama et al. | May 2008 | A1 |
20080219501 | Matsumoto | Sep 2008 | A1 |
20080267770 | Webster et al. | Oct 2008 | A1 |
20080271559 | Garscha et al. | Nov 2008 | A1 |
20080272259 | Zavattieri et al. | Nov 2008 | A1 |
20080307786 | Hafez et al. | Dec 2008 | A1 |
20090008973 | Browne | Jan 2009 | A1 |
20090009656 | Honda et al. | Jan 2009 | A1 |
20090030576 | Periot et al. | Jan 2009 | A1 |
20090041085 | Petrakis | Feb 2009 | A1 |
20090108607 | Browne et al. | Apr 2009 | A1 |
20090115284 | Liang et al. | May 2009 | A1 |
20090131752 | Park | May 2009 | A1 |
20090143730 | De Polo et al. | Jun 2009 | A1 |
20090173305 | Alexander et al. | Jul 2009 | A1 |
20090212158 | Mabe et al. | Aug 2009 | A1 |
20090218858 | Lawall et al. | Sep 2009 | A1 |
20090224584 | Lawall et al. | Sep 2009 | A1 |
20090224587 | Lawall et al. | Sep 2009 | A1 |
20090241537 | Browne et al. | Oct 2009 | A1 |
20090242285 | Whetstone, Jr. | Oct 2009 | A1 |
20090283643 | Sar et al. | Nov 2009 | A1 |
20090284059 | Gupta et al. | Nov 2009 | A1 |
20100001568 | Trybus et al. | Jan 2010 | A1 |
20100027119 | Kollar et al. | Feb 2010 | A1 |
20100031525 | Allezy et al. | Feb 2010 | A1 |
20100036567 | Gandhi | Feb 2010 | A1 |
20100066142 | Gross et al. | Mar 2010 | A1 |
20100117663 | Herrera et al. | May 2010 | A1 |
20100192567 | Butera | Aug 2010 | A1 |
20100212312 | Rudduck | Aug 2010 | A1 |
20100221124 | Ikushima et al. | Sep 2010 | A1 |
20100244505 | Demick et al. | Sep 2010 | A1 |
20100275592 | Topliss et al. | Nov 2010 | A1 |
20100282902 | Rajasingham | Nov 2010 | A1 |
20100287965 | Bryant | Nov 2010 | A1 |
20100294476 | Gomi et al. | Nov 2010 | A1 |
20100308689 | Rahman et al. | Dec 2010 | A1 |
20100326070 | Hao et al. | Dec 2010 | A1 |
20110021932 | Kim et al. | Jan 2011 | A1 |
20110030380 | Widdle, Jr. et al. | Feb 2011 | A1 |
20110038727 | Vos et al. | Feb 2011 | A1 |
20110111839 | Lesley et al. | May 2011 | A1 |
20110120119 | Alexander et al. | May 2011 | A1 |
20110150669 | Frayne et al. | Jun 2011 | A1 |
20110179790 | Pretorius | Jul 2011 | A1 |
20110217031 | Eromaki | Sep 2011 | A1 |
20110300358 | Blohowiak et al. | Dec 2011 | A1 |
20120019216 | Lewis et al. | Jan 2012 | A1 |
20120049095 | Yamasaki | Mar 2012 | A1 |
20120056459 | Harden | Mar 2012 | A1 |
20120081337 | Camp, Jr. et al. | Apr 2012 | A1 |
20120109025 | Weinberg et al. | May 2012 | A1 |
20120136126 | Rousseau | May 2012 | A1 |
20120181896 | Kornbluh et al. | Jul 2012 | A1 |
20120232783 | Calkins et al. | Sep 2012 | A1 |
20120237309 | Park et al. | Sep 2012 | A1 |
20120239183 | Mankame et al. | Sep 2012 | A1 |
20120267928 | Mankame et al. | Oct 2012 | A1 |
20120276807 | Cabrera | Nov 2012 | A1 |
20120292155 | Gunter | Nov 2012 | A1 |
20120297763 | Mankame et al. | Nov 2012 | A1 |
20120319445 | Zolno et al. | Dec 2012 | A1 |
20130005442 | Erickson et al. | Jan 2013 | A1 |
20130011806 | Gao et al. | Jan 2013 | A1 |
20130043354 | Shome et al. | Feb 2013 | A1 |
20130075210 | Langbein et al. | Mar 2013 | A1 |
20130098029 | Pinto, IV et al. | Apr 2013 | A1 |
20130188313 | Dede | Jul 2013 | A1 |
20130205770 | Browne et al. | Aug 2013 | A1 |
20130227943 | Mance et al. | Sep 2013 | A1 |
20140130491 | Gandhi et al. | May 2014 | A1 |
20140168894 | Dede | Jun 2014 | A1 |
20140196633 | Shaw | Jul 2014 | A1 |
20140207333 | Vandivier et al. | Jul 2014 | A1 |
20140217792 | Meyer | Aug 2014 | A1 |
20140239677 | Laib et al. | Aug 2014 | A1 |
20140243939 | Lowe | Aug 2014 | A1 |
20140250881 | Yamamoto | Sep 2014 | A1 |
20140265468 | Greenhill et al. | Sep 2014 | A1 |
20140265479 | Bennett | Sep 2014 | A1 |
20140277739 | Kornbluh et al. | Sep 2014 | A1 |
20140298794 | Flaschentrager et al. | Oct 2014 | A1 |
20140314976 | Niiyama et al. | Oct 2014 | A1 |
20140316269 | Zhang et al. | Oct 2014 | A1 |
20140333088 | Lang et al. | Nov 2014 | A1 |
20140338324 | Jasklowski | Nov 2014 | A1 |
20150016968 | Grabowska et al. | Jan 2015 | A1 |
20150130220 | Preisler et al. | May 2015 | A1 |
20150185764 | Magi | Jul 2015 | A1 |
20150197173 | Hulway | Jul 2015 | A1 |
20150202993 | Mankame | Jul 2015 | A1 |
20150274078 | Alacqua et al. | Oct 2015 | A1 |
20150289994 | Engeberg et al. | Oct 2015 | A1 |
20150290015 | Elahinia et al. | Oct 2015 | A1 |
20150331488 | Grant et al. | Nov 2015 | A1 |
20150366350 | DiCenso et al. | Dec 2015 | A1 |
20160004298 | Mazed et al. | Jan 2016 | A1 |
20160032997 | Seepersad et al. | Feb 2016 | A1 |
20160061345 | Jackson, Jr. | Mar 2016 | A1 |
20160082984 | Schmidt | Mar 2016 | A1 |
20160084665 | Englehardt et al. | Mar 2016 | A1 |
20160123793 | Kolich et al. | May 2016 | A1 |
20160221475 | Sugiyama | Aug 2016 | A1 |
20160246374 | Carter et al. | Aug 2016 | A1 |
20160278459 | Hilty | Sep 2016 | A1 |
20160325837 | Erhel et al. | Nov 2016 | A1 |
20160345088 | Vilermo et al. | Nov 2016 | A1 |
20160375835 | Murray et al. | Dec 2016 | A1 |
20170116792 | Jelinek et al. | Apr 2017 | A1 |
20170121068 | Foshansky et al. | May 2017 | A1 |
20170123499 | Eid | May 2017 | A1 |
20170148102 | Franke et al. | May 2017 | A1 |
20170153707 | Subramanian et al. | Jun 2017 | A1 |
20170158104 | Le et al. | Jun 2017 | A1 |
20170166222 | James | Jun 2017 | A1 |
20170174236 | Worden et al. | Jun 2017 | A1 |
20170203432 | Andrianesis | Jul 2017 | A1 |
20170240075 | McCoy et al. | Aug 2017 | A1 |
20170252260 | Gummin et al. | Sep 2017 | A1 |
20170328384 | Goto et al. | Nov 2017 | A1 |
20170355288 | Barbat et al. | Dec 2017 | A1 |
20180001113 | Streeter | Jan 2018 | A1 |
20180012433 | Ricci | Jan 2018 | A1 |
20180036198 | Mergl et al. | Feb 2018 | A1 |
20180073491 | Gissen et al. | Mar 2018 | A1 |
20180084915 | Norman et al. | Mar 2018 | A1 |
20180115260 | Chiba et al. | Apr 2018 | A1 |
20180130347 | Ricci et al. | May 2018 | A1 |
20180132825 | Tachibana | May 2018 | A1 |
20180134191 | Ketels et al. | May 2018 | A1 |
20180141562 | Singhal | May 2018 | A1 |
20180149141 | Cullen et al. | May 2018 | A1 |
20180151035 | Maalouf et al. | May 2018 | A1 |
20180178808 | Zhao et al. | Jun 2018 | A1 |
20180249772 | Koo et al. | Sep 2018 | A1 |
20180251234 | Wang | Sep 2018 | A1 |
20180264975 | Bonk et al. | Sep 2018 | A1 |
20180281621 | Kaku et al. | Oct 2018 | A1 |
20180286189 | Motamedi et al. | Oct 2018 | A1 |
20180321703 | Gandhi et al. | Nov 2018 | A1 |
20180345841 | Prokhorov et al. | Dec 2018 | A1 |
20180348759 | Freeman et al. | Dec 2018 | A1 |
20180355991 | Pfahler | Dec 2018 | A1 |
20190005272 | Gault et al. | Jan 2019 | A1 |
20190023161 | Sullivan et al. | Jan 2019 | A1 |
20190039525 | Hu | Feb 2019 | A1 |
20190041986 | Rihn et al. | Feb 2019 | A1 |
20190042857 | Endo et al. | Feb 2019 | A1 |
20190059608 | Yan et al. | Feb 2019 | A1 |
20190061307 | Chen et al. | Feb 2019 | A1 |
20190083022 | Huang | Mar 2019 | A1 |
20190135150 | Gao et al. | May 2019 | A1 |
20190143869 | Sequi et al. | May 2019 | A1 |
20190154122 | Lima et al. | May 2019 | A1 |
20190197842 | Long et al. | Jun 2019 | A1 |
20190232842 | Boccuccia et al. | Aug 2019 | A1 |
20190291649 | Ito | Sep 2019 | A1 |
20200010001 | Pinkelman et al. | Jan 2020 | A1 |
20200015493 | Ergun et al. | Jan 2020 | A1 |
20200015593 | Norman et al. | Jan 2020 | A1 |
20200032822 | Keplinger et al. | Jan 2020 | A1 |
20200088175 | Li et al. | Mar 2020 | A1 |
20200112269 | Taghavi et al. | Apr 2020 | A1 |
20200179168 | Kelleher et al. | Jun 2020 | A1 |
20200197250 | Wyatt et al. | Jun 2020 | A1 |
20200223325 | Pinkelman et al. | Jul 2020 | A1 |
20200238854 | Gandhi et al. | Jul 2020 | A1 |
20200247274 | Gandhi | Aug 2020 | A1 |
20200276971 | Takeda et al. | Sep 2020 | A1 |
20200282878 | Gandhi et al. | Sep 2020 | A1 |
20200298732 | Gandhi et al. | Sep 2020 | A1 |
20200307416 | Gandhi et al. | Oct 2020 | A1 |
20200309102 | Henderson et al. | Oct 2020 | A1 |
20200339242 | Tsuruta et al. | Oct 2020 | A1 |
20200377036 | Lee et al. | Dec 2020 | A1 |
20200378370 | Kopfer et al. | Dec 2020 | A1 |
20210095646 | Blecha et al. | Apr 2021 | A1 |
20210118597 | Pinkelman et al. | Apr 2021 | A1 |
20210132396 | Shin et al. | May 2021 | A1 |
20210153754 | Ozawa et al. | May 2021 | A1 |
20210162457 | Eberfors | Jun 2021 | A1 |
20210221269 | Baranowski et al. | Jul 2021 | A1 |
20210236061 | Severgnini et al. | Aug 2021 | A1 |
20210237809 | Rowe et al. | Aug 2021 | A1 |
20210265922 | Nakagawa | Aug 2021 | A1 |
20220001530 | Sameoto et al. | Jan 2022 | A1 |
20220012458 | Uetabira | Jan 2022 | A1 |
20220031178 | Brulet et al. | Feb 2022 | A1 |
20220106941 | Easton | Apr 2022 | A1 |
20220119202 | Morrissey et al. | Apr 2022 | A1 |
20220154703 | Shin et al. | May 2022 | A1 |
20220164079 | Severgnini et al. | May 2022 | A1 |
20220196109 | Gandhi et al. | Jun 2022 | A1 |
20220242328 | Pinkelman et al. | Aug 2022 | A1 |
20220258656 | Little | Aug 2022 | A1 |
20220299016 | Tsuruta et al. | Sep 2022 | A1 |
20220307485 | Gummin et al. | Sep 2022 | A1 |
20220314857 | Tsuruta et al. | Oct 2022 | A1 |
20220316458 | Tsuruta et al. | Oct 2022 | A1 |
20220412325 | Kopfer et al. | Dec 2022 | A1 |
20230078040 | Rowe et al. | Mar 2023 | A1 |
20230088911 | Song et al. | Mar 2023 | A1 |
20230119407 | Sugiyama et al. | Apr 2023 | A1 |
20230120436 | Tsuruta et al. | Apr 2023 | A1 |
20230124526 | Tsuruta et al. | Apr 2023 | A1 |
20230136197 | Gilmore et al. | May 2023 | A1 |
20230179122 | Palaniswamy et al. | Jun 2023 | A1 |
20230191953 | Panwar et al. | Jun 2023 | A1 |
20230193929 | Rowe et al. | Jun 2023 | A1 |
20230287871 | Rowe | Sep 2023 | A1 |
20230312109 | Joshi et al. | Oct 2023 | A1 |
20230331371 | Gupta et al. | Oct 2023 | A1 |
20230331372 | Gupta et al. | Oct 2023 | A1 |
20230337827 | Pinkelman et al. | Oct 2023 | A1 |
20240060480 | Panwar et al. | Feb 2024 | A1 |
Number | Date | Country |
---|---|---|
201037277 | Mar 2008 | CN |
101367433 | Feb 2009 | CN |
101417152 | Apr 2009 | CN |
102333504 | Jan 2012 | CN |
102152309 | Nov 2012 | CN |
103038094 | Apr 2013 | CN |
103147511 | Jun 2013 | CN |
102026842 | Jul 2013 | CN |
103935495 | Jul 2014 | CN |
102765354 | Nov 2014 | CN |
104290617 | Jan 2015 | CN |
204774820 | Nov 2015 | CN |
105517664 | Apr 2016 | CN |
106168523 | Nov 2016 | CN |
107111473 | Jan 2017 | CN |
206029888 | Mar 2017 | CN |
105946515 | Apr 2018 | CN |
108100228 | Jun 2018 | CN |
108819806 | Nov 2018 | CN |
106014897 | Dec 2018 | CN |
106956254 | Mar 2019 | CN |
109572966 | Apr 2019 | CN |
209010975 | Jun 2019 | CN |
105003405 | Jul 2019 | CN |
107485536 | Jan 2020 | CN |
112411375 | Feb 2021 | CN |
115706489 | Feb 2023 | CN |
10155119 | May 2003 | DE |
20309196 | Nov 2003 | DE |
10222022 | Dec 2003 | DE |
102010021902 | Dec 2011 | DE |
102016210214 | Dec 2017 | DE |
102019204866 | Oct 2020 | DE |
102008021679 | Jan 2021 | DE |
1420094 | May 2004 | EP |
1519055 | Mar 2005 | EP |
1904337 | Oct 2010 | EP |
2723069 | Apr 2014 | EP |
3196484 | Jul 2017 | EP |
3058108 | May 2018 | FR |
S5870892 | May 1983 | JP |
S61277898 | Dec 1986 | JP |
H03276698 | Dec 1991 | JP |
H06033895 | Jun 1994 | JP |
09-133069 | May 1997 | JP |
H09168285 | Jun 1997 | JP |
H10337061 | Dec 1998 | JP |
2003276698 | Oct 2003 | JP |
3706899 | Oct 2005 | JP |
2006000347 | Jan 2006 | JP |
2006006581 | Jan 2006 | JP |
2006248456 | Sep 2006 | JP |
2008014470 | Jan 2008 | JP |
2008138558 | Jun 2008 | JP |
2008154447 | Jul 2008 | JP |
4273902 | Jun 2009 | JP |
2009162233 | Jul 2009 | JP |
2010117457 | May 2010 | JP |
4576281 | Nov 2010 | JP |
5760241 | Aug 2015 | JP |
2017175155 | Sep 2017 | JP |
2018188035 | Nov 2018 | JP |
2019094789 | Jun 2019 | JP |
2019101988 | Jun 2019 | JP |
20200090181 | Jun 2020 | JP |
2021107221 | Jul 2021 | JP |
19980044089 | Sep 1998 | KR |
20050056526 | Jun 2005 | KR |
1020130005989 | Jan 2013 | KR |
101395364 | May 2014 | KR |
101861620 | Apr 2018 | KR |
1020180074003 | Jul 2018 | KR |
101931791 | Dec 2018 | KR |
20210052091 | May 2021 | KR |
20210086518 | Jul 2021 | KR |
102298464 | Sep 2021 | KR |
02011648 | Feb 2002 | WO |
2005004321 | Jan 2005 | WO |
2009079668 | Jun 2009 | WO |
2009111362 | Sep 2009 | WO |
2011017071 | Feb 2011 | WO |
2011111769 | Sep 2011 | WO |
2014145018 | Sep 2014 | WO |
2014172320 | Oct 2014 | WO |
2015037600 | Mar 2015 | WO |
2016017057 | Feb 2016 | WO |
2016130719 | Aug 2016 | WO |
2017077541 | May 2017 | WO |
2019043599 | Mar 2019 | WO |
2019097437 | May 2019 | WO |
2019173227 | Sep 2019 | WO |
2020110091 | Jun 2020 | WO |
2020183360 | Sep 2020 | WO |
2021118185 | Jun 2021 | WO |
Entry |
---|
Zhu et al., U.S. Appl. No. 18/172,637, filed Feb. 22, 2023. |
Rowe et al., U.S. Appl. No. 18/329,217, filed Jun. 5, 2023. |
Pinkelman et al., U.S. Appl. No. 18/452,343, filed Aug. 18, 2023. |
Pinkelman et al., U.S. Appl. No. 18/452,376, filed Aug. 18, 2023. |
Rowe et al., U.S. Appl. No. 18/453,395, filed Aug. 22, 2023. |
Rowe et al., U.S. Appl. No. 18/452,734, filed Aug. 21, 2023. |
Jani et al., “A review of shape memory alloy research, applications, and opportunities”, Elsevier, 2014, pp. 1078-1113 (36 pages). |
Tiseo et al., “A Shape Memory Alloy Based Tuneable Dynamic Vibration Absorber for Vibration Tonal Control”, Journal of Theoretical and Applied Mechanics, 2010, pp. 135-153 (19 pages). |
Williams et al., “Dynamic modelling of a shape memory alloy adaptive tuned vibration absorber”, Elsevier, Journal of Vibration and Sound, 2005, pp. 211-234 (24 pages). |
Araki et al., “Integrated mechanical and material design of quasi-zero-stiffness vibration isolator with superelastic Cu—Al—Mn shape memory alloy bars”, Journal of Sound and Vibration, 2015 (34 pages). |
Casciati et al., “Performance of a base isolator with shape memory alloy bars”, Earthquake Engineering and Engineering Vibration, Dec. 2007 (8 pages). |
Correa et al., “Mechanical Design of Negative Stiffness Honeycomb Materials”, Integrating Materials and Manufacturing Innovation, 4:10, pp. 1-11, 2015 (11 pages). |
Ferguson-Pell, “Seat Cushion Selection”, J. Rehab. Res. Dev., Special Supplement #2, 23(3), pp. 49-73, 1986 (25 pages). |
Miga Motor Company, “Miga Adrenaline—A Space Age Wire,” retrieved from the Internet: <https://migamotors.com/index.php?main_page=product_info&cPath=1&products_id=37>, [retrieved Mar. 26, 2021] (1 page). |
Furukawa Techno Material, “Shape Memory Alloys & Super-elastic Alloys,” retrieved from the Internet: <https://www.furukawa-ftm.com/english/nt-e/product.htm>, [retrieved Mar. 26, 2021] (3 pages). |
Endragon Technology Corporation, “What is Electrostatic Chuck?” retrieved from the Internet: <https://edragoncorp.weebly.com/what-is-electrostatic-chuck.html>, 2014 (8 pages). |
Strittmatter et al., “Intelligent materials in modern production—Current trends for thermal shape memory alloys,” Procedia Manufacturing, vol. 30, pp. 347-356, 2019 (10 pages). |
Shunk, “GM awarded DOE money to research Shape Memory Alloy heat engines,” dated Nov. 2, 2009, retrieved from the Internet: <https://www.autoblog.com/2009/11/02/gm-awarded-doe-money-to-research-shape-memory-alloy-heat-engines/>, [retrieved Mar. 26, 2021] (2 pages). |
Gummin, “Shape Memory Alloy Massage for Seating Surfaces,” dated Jun. 15, 2018, retrieved from the Internet: <https://contest.techbriefs.com/2018/entries/consumer-products/8871> (3 pages). |
Stoeckel, “Shape Memory Actuators for Automotive Applications,” Materials & Design. Vol. 11, No. 6, pp. 302-307, Dec. 1990 (6 pages). |
Katayama et al., “Shape Memory Alloy Wire Actuated Hinge Mechanism for Deploying Segmented Plates,” Bulletin of Osaka Prefecture University, Series A, vol. 45, No. 2, 1996, pp. 119-124 (8 pages). |
Rowe et al., U.S. Appl. No. 63/485,398, filed Feb. 16, 2023. |
Pinkelman et al., U.S. Appl. No. 17/729,522, filed Apr. 26, 2022. |
Barbarino et al., “A review on shape memory alloys with applications to morphing aircraft”, Smart Materials and Structures, Apr. 2014 (19 pages). |
“HapWRAP: Soft Growing Wearable Haptic Device”, retrieved from the Internet: <https://smartdevicess.createdsites.com>, dated May 27, 2019 (18 pages). |
Yilmaz et al., “Detecting Vital Signs with Wearable Wireless Sensors”, Sensors, Dec. 2010 (26 pages). |
Choi et al. “Highly conductive, stretchable, and biocompatible Ag—Au core-sheath nanowire composite for wearable and implantable bioelectronics”, Nature Nanotechnology 13, No. 11, 2018 (36 pages). |
Gao et al., “Wearable Microfluidic Diaphragm Pressure Sensor for Health and Tactile Touch Monitoring”, Advanced Materials, Oct. 2017 (15 pages). |
Kweon et al., “Wearable high-performance pressure sensors based on three-dimensional electrospun conductive nanofibers”, NPG Asia Materials 2018 (12 pages). |
Wang et al. “Monitoring of the central blood pressure waveform via a conformal ultrasonic device”, Nat Biomed Eng, Sep. 2018 (22 pages). |
Agharese et al. “hapWRAP: Soft Growing Wearable Haptic Device”, 2018 IEEE International Conference on Robotics and Automation (ICRA), May 2018 (7 pages). |
Gao et al., “Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis”, Nature, Jan. 2016 (30 pages). |
Jitosho et al. “Exploiting Bistability for High Force Density Reflexive Gripping”, 2019 International Conference on Robotics and Automation (ICRA), May 2019 (7 pages). |
Wikipedia, “Slap bracelet”, retrieved from the Internet: <https://en.wikipedia.org/wiki/Slap_bracelet>, [retrieved Mar. 12, 2021] (2 pages). |
Maffiodo et al. “Three-Fingered Gripper with Flexure Hinges Actuated by Shape Memory Alloy Wires”, Int. J. of Automation Technology, vol. 11, No. 3, pp. 355-360, 2017 (6 pages). |
Buckner et al. “Roboticizing fabric by integrating functional fibers”, Proceedings of the National Academy of Sciences, Oct. 2020 (10 pages). |
Blain, “Refrigerants not required: Flexible metal cooling prototype demonstrates extreme efficiency”, retrieved from the Internet: <https://newatlas.com/shape-memory-alloy-nitinol-heating-cooling/58837/> [retrieved Apr. 1, 2024], dated Mar. 13, 2019 (13 pages). |
Taniguchi, “Flexible Artificial Muscle Actuator Using Coiled Shape Memory Alloy Wires”, APCBEE Procedia 7, pp. 54-59, May 2013 (6 pages). |
Acome et al., “Hydraulically amplified self-healing electrostatic actuators with muscle-like performance”, Science 359, pp. 61-65, 2018 (5 pages). |
Wang et al., “Recent Progress in Artificial Muscles for Interactive Soft Robotics”, Advanced Materials, vol. 33, Issue 19, published Oct. 27, 2020 (48 pages). |
Liang et al., “Comparative study of robotic artificial actuators and biological muscle”, Advances in Mechanical Engineering, 2020 (25 pages). |
El-Atab et al., “Soft Actuators for Soft Robotic Applications: A Review”, Advanced Intelligent Systems 2020 (37 pages). |
Pagoli et al., “Review of soft fluidic actuators: classification and materials modeling analysis”, Smart Materials and Structures, vol. 31, 2021 (31 pages). |
Park et al., “A Novel Fabric Muscle Based on Shape Memory Alloy Springs”, Soft Robotics, vol. 7, No. 3, 2020 (11 pages). |
Ebay, “Cardboard Dividers 5 Sets 7.5″ X 10.5″ X 4″ High 12 cell”, retrieved from the Internet: <https://www.ebay.comitm/175101454003var=0&mkevt=1&mkcid=1&mkrid=711-53200-19255-0&campid=5337076261&toolid=10049&customid=ACF63RFK9J675c23041e8b13f9c32042ed51988cf3> [retrieved Jan. 20, 2022](1 page). |
Cazottes et al., “Bistable Buckled Beam: Modeling of Actuating Force and Experimental Validations”, Journal of Mechanical Design, 2009 (10 pages). |
Cazottes et al., “Design of Actuation for Bistable Structures Using Smart Materials,” Advances in Science and Technology, vol. 54, pp. 287-292, 2008 (1st Page/Abstract only). |
Cazottes et al., “Actuation of bistable buckled beams with Macro-Fiber Composites,” IEEE/RSJ International Conference on Intelligent Robots and Systems, pp. 564-569, 2008 (7 pages). |
Haines et al., “New Twist on Artificial Muscles,” Proceedings of the National Academy of Sciences, vol. 113, No. 42, pp. 11709-11716, Oct. 18, 2016 (9 pages). |
Inoue et al., “High-performance structure of a coil-shaped soft-actuator consisting of polymer threads and carbon nanotube yarns,” AIP Advances 8, 2018, (8 pages). |
Abbas et al., “A Physics Based Model for Twisted and Coiled Actuator” 2017 IEEE International Conference on Robotics and Automation (ICRA), pp. 6121-6126, 2017 (6 pages). |
Haines et al., “Artificial Muscles from Fishing Line and Sewing Thread” (Supplementary Materials) Science 343, 868, 2014 (36 pages). |
Yip et al., “On the Control and Properties of Supercoiled Polymer Artificial Muscles,” IEEE Transactions on Robotics 2017 (11 pages). |
alibaba.com, “Hangzhou Phase Change Technology Co., Ltd”, Retrieved from the Internet: <https://hzfeijie.en.alibaba.com/product/1448845650-220286736/phase_change_material_PCM_balls.html#!>, [Retrieved May 2, 2017] (3 pages). |
Goodfellow Corporation, “New to Our Range: A Magnetic Shape Memory Alloy that Converts Magnetic Field Energy into Kinetic Energy,” <retrieved from the Internet: http://www.goodfellowusa.com/corporate/news/US/June-2011/us.htm> [retrieved Jan. 23, 2012] (2 pages). |
Goodfellow Corporation, “Magnetic Shape Memory Material”, <retrieved from the Internet: http://www.goodfellowusa.com/larger-quantities/alloys/magnetic-shape-memory-material/> [retrieved Jan. 23, 2012] (3 pages). |
Sherrit et al., “Planar Rotary Motor using Ultrasonic Horns”, Proc. SPIE 7981, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011, 79810O, Apr. 13, 2011 (8 pages). |
Henry, “Dynamic Actuation Properties of Ni—Mn—Ga Ferromagnetic Shape Memory Alloys”, submitted to the Massachusetts Institute of Technology Department of Materials Science and Engineering on May 22, 2002, images on pp. 64-66 (202 pages). |
Zhu et al., U.S. Appl. No. 18/433,896, filed Feb. 6, 2024. |
Rowe et al., U.S. Appl. No. 18/468,029, filed Sep. 15, 2023. |
Zhu et al., U.S. Appl. No. 18/399,075, filed Dec. 28, 2023. |
Rowe et al., U.S. Appl. No. 18/178,302, filed Mar. 3, 2023. |
Rowe et al., U.S. Appl. No. 18/399,026, filed Dec. 28, 2023. |
Ou et al., “jamSheets: Thin Interfaces with Tunable Stiffness Enabled by Layer Jamming,” Proceedings of the 8th International Conference on Tangible, Embedded, and Embodied Interaction, 2014 (8 pages). |
Ou et al., “aeroMorph—Heat-sealing Inflatable Shape-change Materials for Interaction Design,” Proceedings of the 29th Annual Symposium on User Interface Software and Technology (2016) pp. 121-132 (10 pages). |
Song et al., “Resistance Modelling of SMA Wire Actuators”, Canadian Institute for NDE, International Workshop: Smart Materials, Structures & NDT in Aerospace Conference, Nov. 2011 (10 pages). |
Rowe et al., U.S. Appl. No. 18/452,602, filed Aug. 21, 2023. |
Motzki, “Efficient SMA Actuation—Design and Control Concepts”, Proceedings, vol. 64, No. 1, MDPI, 2020 (9 pages). |
Arduino Documentation, “Secrets of Arduino PWM”, last revision May 27, 2024, retrieved from the Internet: <https://docs.arduino.cc/tutorials/generic/secrets-of-arduino-pwm/>, [retrieved Jun. 1, 2024] (13 pages). |
Spiess, “#321 7 Sensors tested: Measuring Current with Microcontrollers (Arduino, ESP32, ESP8266)”, uploaded on Apr. 5, 2020 by user “Andreas Spiess” accessible via the Internet: <https://www.youtube.com/watch?v=cG8moaufmQs>. |
International Search Authorithy, International Search Report and Written Opinion for International Application No. PCT/US2024/042739 mailed on Nov. 28, 2024, 2024 (12 pages). |