BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded, isometric view of a mother liquid crystal panel according to a first embodiment of the present invention, the mother liquid crystal panel including a first mother substrate and a second mother substrate.
FIG. 2 is an isometric view of the first mother substrate of the mother liquid crystal panel of FIG. 1.
FIG. 3 is an enlarged, side cross-sectional view of the mother liquid crystal panel shown in FIG. 1, corresponding to line III-III thereof.
FIG. 4 is similar to FIG. 3, but showing the first and second mother substrates attached together.
FIG. 5 is an enlarged view of a circled portion V of FIG. 4.
FIG. 6 is similar to FIG. 2, but essentially showing a corresponding view in the case of a first mother substrate of a mother liquid crystal panel according to a second embodiment of the present invention.
FIG. 7 is similar to FIG. 2, but essentially showing a corresponding view in the case of a first mother substrate of a mother liquid crystal panel according to a third embodiment of the present invention.
FIG. 8 is similar to FIG. 2, but essentially showing a corresponding view in the case of a first mother substrate of a mother liquid crystal panel according to a fourth embodiment of the present invention.
FIG. 9 is an exploded, isometric view of a conventional mother liquid crystal panel, the mother liquid crystal panel including a first mother substrate and a second mother substrate.
FIG. 10 is an enlarged, side cross-sectional view of the mother liquid crystal panel shown in FIG. 9, corresponding to line X-X thereof.
FIG. 11 is similar to FIG. 10, but showing the first and second mother substrates attached together.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
Referring to FIGS. 1, 2 and 3, aspects of a mother liquid crystal panel 200 according to a first embodiment of the present invention are shown. The mother liquid crystal panel 200 includes a first mother substrate 210, a second mother substrate 220, sealant 230, and conductive adhesive 240. The first mother substrate 210 and the second mother substrate 220 are oriented opposite to each other.
The first mother substrate 210 includes a plurality of TFT substrates 211 incorporated therein and arranged in an array. The second mother substrate 220 includes a plurality of CF substrates 221 incorporated therein and arranged in an array. The CF substrates 221 correspond to the TFT substrates 211, respectively. The sealant 230 is discontinuously applied on the first mother substrate 210 at a periphery of each of the TFT substrates 211. Thereby a plurality of gaps 232 is defined in the sealant 230. The sealant 230 of all the TFT substrates 211 is used to adhere the first mother substrate 210 to the second mother substrate 220. The conductive adhesive 240 is filled in the gaps 232, and is used to electrically connect electrodes of each TFT substrate 211 with electrodes of the corresponding CF substrate 221. Thereby, the two substrates 211, 221 have the same electrical potential once they are bonded together. Each TFT substrate 211 together with the sealant 230 and the conductive adhesive 240 provided thereat defines a space 250 for accommodating liquid crystal material (not shown).
The sealant 230 can be made from at least one material selected from the group consisting of ultraviolet-curable sealant and heat-curable sealant, such as epoxy. Typically, the conductive adhesive 240 is formed by mixing metal beads in a sealant such as an ultraviolet-curable sealant or a heat-curable sealant. The metal beads can be made from material including any one or more items selected from the group consisting of silver, copper, and aluminum.
A method for fabricating the mother liquid crystal panel 200 includes the following steps.
First, a first mother substrate 210 and a second mother substrate 220 are provided. The first mother substrate 210 includes a plurality of TFT substrates 211 formed as parts thereof. The second mother substrate 220 includes a plurality of CF substrates 221 formed as parts thereof.
Second, sealant 230 is discontinuously applied at a periphery of each of the TFT substrates 211, thereby defining a plurality of gaps 232.
Third, conductive adhesive 240 is filled in the gaps 232. Thereby, a space 250 is cooperatively defined by each of the TFT substrates 211, the corresponding sealant 230, and the corresponding conductive adhesive 240. A size of each portion of the conductive adhesive 240 can be configured by configuring sizes of the gaps 232 accordingly. In general, when the size of a portion of the conductive adhesive 240 is large, the amount of metal beads in the conductive adhesive 240 needs to be relatively small. Thereby, an appropriate uniform degree of electrical conductivity across all portions of the conductive adhesive 240 can be attained.
Fourth, referring also to FIGS. 4 and 5, liquid crystal material (not shown) is dropped into each of the spaces 250. The second mother substrate 220 is loosely attached onto the first mother substrate 210, and is pressed. Because the conductive adhesive 240 is filled in the gaps 232 and is not located at outer peripheries of the sealant 230 at each liquid crystal panel, little or no conductive adhesive 240 expands transversely beyond outer boundaries of the sealant 230. That is, the conductive adhesive 240 located where two adjacent liquid crystal panels abut each other is apt to not spread across from either of the liquid crystal panels to the other liquid crystal panel. Unlike in conventional art, the conductive adhesive 240 of each two adjacent liquid crystal panels avoids getting adhered together.
Fifth and finally, ultraviolet light or heat is used to cure the sealant 230.
Unlike with the above-described conventional mother liquid crystal panel 100, the conductive adhesive 240 filled in the gaps 232 of the sealant 230 of each TFT substrate 211 avoids spreading to an adjacent TFT substrate 211 when the second mother substrate 220 is attached onto the first mother substrate 210 and pressed. As shown in FIG. 5, typically, only a minimal amount of conductive adhesive 240 expands beyond the outer boundary of the corresponding sealant 230. Therefore a subsequent step of cutting or splitting (shearing) the mother liquid crystal panel 200 into the individual liquid crystal panels is unencumbered by any unwanted collateral conductive adhesive 240 bonding. Moreover, because the sizes of the portions of the conductive adhesive 240 can be configured as desired, it is relatively easy to mix the metal beads in the sealant to prepare the conductive adhesive 240, and it is relatively easy to fill the conductive adhesive 240 in the gaps 232.
Further or alternative embodiments may include the following. In a second embodiment of the present invention, referring to FIG. 6, sealant 330 is continuously applied at a periphery of each of TFT substrates 311 of a first mother substrate 310. The sealant 330 has a plurality of vertical through holes 332 defined therein. Conductive adhesive 340 is filled in the through holes 332. In a third embodiment of the present invention, referring to FIG. 7, sealant 430 is continuously applied at a periphery of each of TFT substrates 411 of a first mother substrate 410. The sealant 330 has a plurality of cutouts 432 defined in an outer peripheral portion thereof. Conductive adhesive 440 is filled in the cutouts 432. In a fourth embodiment of the present invention, referring to FIG. 8, sealant 530 is applied at a periphery of each of TFT substrates 511 of a first mother substrate 510. The sealant 530 of each TFT substrate 511 includes one gap 532 therein. Conductive adhesive 540 is filled in the gap 532.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Patent Application
20070236644
