1. Field of the Invention
The present invention relates to mounting apparatuses, and particularly to a mounting apparatus for readily and securely mounting a circuit board therein.
2. Description of the Related Art
During assembly of a typical personal computer, a motherboard must be fastened to a computer frame or chassis. The motherboard is conventionally mounted to the computer chassis using fasteners such as screws or bolts. However, when installing or removing the motherboard, using the fasteners is laborious and time-consuming. In addition, a tool such as a screwdriver or wrench is usually required. Moreover, the motherboard is prone to be damaged by possible impacts of the tool if the tool slips during manipulation of the fasteners.
Taiwan Patent Publication No. 551026 discloses a mounting apparatus for a motherboard. The motherboard is firstly secured to a support plate using fasteners such as clips. The clips engage in corresponding through holes of the support plate to secure the motherboard thereon. Then the combined motherboard and support plate is mounted to a computer chassis. A tool is not required when using the clips. However, the using of the clips increases the cost of the manufacturing. Because the clips are not conventional components, it is inconvenient to repair when clips are destroyed or missing.
Thus, an improved mounting apparatus for motherboards which overcomes the above-mentioned problems is desired.
Accordingly, an object of the present invention is to provide a mounting apparatus for readily and securely installing and removing circuit boards to and from any equipment such as a chassis of a computer.
To achieve the above object, a mounting apparatus for a motherboard defining a plurality of through holes, includes a panel, a support plate, and a clip mounted onto a bottom of the support plate. The panel includes a plurality of locking holes, a plurality of resilient fingers, and two protrusions protruding therefrom. The support plate for positioning the motherboard thereon includes a plurality of hooks extending downwardly and a plurality of conductors mounted thereto. The clip defines two apertures. In assembly, the hooks of the support plate engage in the locking holes of the panel, and the conductors electrically contact with the resilient fingers of the panel, the protrusions of the panel engage in the apertures of clip to secure the motherboard to the panel.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Referring to
The bottom panel 20 defines a recess 22 by being stamped downwardly therefrom. A plurality of guiding tabs 21 is stamped upwardly and perpendicularly to the bottom panel 20 at both opposite edges of the recess 22. A plurality of spaced locking holes 24 as first complementary securing means is defined in the bottom panel 20. A plurality of resilient fingers 26 is stamped from the bottom panel 20. Each finger 26 comprises an arm 262 connecting the bottom panel 20 and a cantilever 264. A pair of protrusions 28 as second complementary securing means protrudes upwardly from a bottom of the recess 22 at one side. A pair of avoiding holes 29 is defined adjacent to the protrusions 28.
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To remove the motherboard 10 from the chassis, the handle 42 of the clip 40 is lifted upwardly. The protrusions 28 of the bottom panel 20 are released from the apertures 48 of the clip 40. The hooks 34 of the support plate 30 are released from the locking holes 24 of the bottom panel 20 by pulling the handle 42 along the direction opposite to the above-mentioned pushing direction. The combined motherboard 10, support plate 30, clip 40 is then easily removed from the chassis.
In another embodiment, the support plate 30 can be made of metal, and the resilient fingers 26 can directly contact the support plate 30, whereby the conductors 50 can be omitted. The clip 40 can be formed directly and integrally on the support plate 30.
While the present invention has been illustrated by the description of the preferred embodiment thereof, and while the preferred embodiment has been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications within the spirit and scope of the present invention will readily appear to those skilled in the art. Therefore, the present invention is not limited to the specific details and illustrative examples shown and described.
| Number | Date | Country | Kind |
|---|---|---|---|
| 92220597 U | Nov 2003 | TW | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 5138529 | Colton et al. | Aug 1992 | A |
| 5398156 | Steffes et al. | Mar 1995 | A |
| 5452184 | Scholder et al. | Sep 1995 | A |
| 5519169 | Garrett et al. | May 1996 | A |
| 5687470 | Halttunen et al. | Nov 1997 | A |
| 5973926 | Sacherman et al. | Oct 1999 | A |
| 5978232 | Jo | Nov 1999 | A |
| 6233156 | Liao | May 2001 | B1 |
| 6295210 | Lanzone et al. | Sep 2001 | B1 |
| 20030168233 | Ennis et al. | Sep 2003 | A1 |
| Number | Date | Country |
|---|---|---|
| 551026 | Sep 2003 | TW |
| Number | Date | Country | |
|---|---|---|---|
| 20050111204 A1 | May 2005 | US |