Patent Application
20130240944
1. Field of the Invention
The present invention relates to a mounting device for a light emitting diode, and more particularly to a mounting device for securely mounting a light emitting diode on a conductor.
2. Description of the Prior Arts
Light emitting diodes (LEDs) have low temperature and low power consumption properties and thus are widely used for electronic products such as lighting or the indicator lights. A Light emitting diode has a die encapsulated inside a transparent silicone rubber and electrode pins extending downwardly. The conventional LEDs are connected to two circuit boards with spot-welded structures.
With reference to
However, the solder 33 needs a period of time for solidifying. If the LED 30 is not stably positioned by the welding spot within this period, the position of the LED 30 is easily shifted. In order to avoid the shifting of the LED 30, the LEDs 30 have to be connected to the circuit boards 32 one by one and until the solders 33 of a previous LED 30 have been solidified. However, this is time-consuming and is hard to ensure that, during the welding time, the shifting of the LED 30 will not occur.
To overcome the shortcomings, the present invention provides a mounting device to mitigate or obviate the aforementioned problems.
Given that the aforesaid drawbacks of the prior art such as spot-welded structures will cause the shifting of the LED, the present invention mainly provides a mounting device for securely mounting an LED on a conductor.
The mounting device in accordance with the present invention comprises: an LED and a conductor connecting to the LED.
The LED comprises two electrode leads, wherein the two electrode leads are bent outward relative to each other and each electrode lead has a distal end. A protrusion is formed from the bottom surface of the distal end.
The conductor comprises two electrode boards. A mounting leadframe is formed and protrudes from the surface of each electrode board and corresponds to one of the electrode leads of the LED. A mounting hole is formed in each electrode board at a position corresponding to one of the protrusions. The distal end of each electrode lead is inserted respectively into one of the mounting leadframes and each protrusion is engaged in the corresponding mounting hole, and then the distal end is mounted on the conductor with the corresponding mounting leadframe.
According to the aforementioned structure, the present invention is to insert each electrode lead of the LED into the corresponding mounting leadframe respectively and in the meanwhile to engage each protrusion of the electrode leads with the corresponding mounting hole on the conductor, and to mount each electrode lead on the conductor by the corresponding mounting leadframe. Thus the LED is stably mounted on the conductor. With the two mounting holes in the conductor that are previously formed in the conductor, the LED can be precisely located on the conductor. Moreover, after connecting the LED to the mounting leadframes on the conductor, a punching process is applied to the mounting leadframes along a direction from the mounting leadframes toward the electrode leads to clamp the LED more tightly to the conductor, thus avoiding the shifting of the LED. Consequently, this method is more timesaving and convenient compared to the method of welding.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
The present invention provides a mounting device for securely and stably mounting a light emitting diode on a conductor.
With reference to
The light emitting diode 10 comprises two electrode leads 11 serving respectively as positive and negative electrodes, wherein the two electrode leads 11 are bent outward relative to each other, and each electrode lead 11 has a distal end. A protrusion 12 is formed downward from the bottom surface of the distal end. In the present embodiment, the distal end of each electrode lead 11 is plate-shaped, and the protrusions 12 are hemispherical. Each protrusion 12 is formed with a punching process along a direction from a top surface to the bottom surface of the distal end. Thus, a hemispherically shaped recess 13 is formed in the top surface of the distal end of each electrode lead 11 at a position corresponding to the protrusion 12.
The conductor 20 comprises two electrode boards 21 serving respectively as positive and negative electrodes. A mounting hole 23 is formed in each electrode board at a position corresponding to one of the protrusions 12 of the light emitting diode 10. Furthermore, a mounting leadframe 22 protrudes from the surface of each electrode board 21, is formed over the mounting hole 23 in the electrode board 21 and corresponds to one of the electrode leads 11. The two electrode leads 11 of the light emitting diode 10 are respectively inserted into the mounting leadframes 22 of the two electrode boards 21 and the two protrusions 12 on the electrode leads 11 are respectively engaged in the mounting holes 23 on the electrode boards 21. In the present embodiment, the lengths of the mounting leadframes 22 match the widths of the plate-shaped distal ends of the electrode leads 11 of the light emitting diode 10. Additionally, the mounting holes 23 are round holes so as to fit and engage the hemispherically shaped protrusions 12. Furthermore, the mounting holes 23 and the mounting leadframes 22 are formed together by a punching process along a direction from the bottom face to the top face of the conductor 20, thus each mounting hole 23 aligns with the corresponding mounting leadframe 22.
With reference to
With reference to
In the present embodiment, each mounting leadframe 22′ of the electrode boards 21′ on the conductor 20′ comprises two bent sheets 221 disposed on the two sides of a corresponding electrode lead 11 of the light emitting diode 10 in order to clamp the corresponding electrode lead 11 between the two bent sheets 221. The bent sheets 221 are formed on the conductor 20′ with a punching process. With reference to
In conclusion, with the engagement between the protrusions 12 of the two electrode leads 11 and the two mounting holes 23 in the conductor 20 that are previously formed in the conductor 20, the light emitting diode 10 can be precisely located on the conductor 20 to prevent the light emitting diode 10 from shifting. In addition, the mounting leadframes 22,22′ can hold the electrode leads 11 of the light emitting diode 10 in position because the mounting leadframes 22,22′ are either formed by punching process as in the first embodiment or composed of two bent sheets 221 as in the second embodiment. Accordingly, the light emitting diode 10 can be stably mounted on the conductor 20,20′ and the method for assembling the light emitting diode 10 onto the conductor 20,20′ is more timesaving and convenient.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
