1. Field of the Invention
The present invention relates to a mounting sheet, a polishing apparatus and a method for making the same. Particularly, the invention relates to a mounting sheet with different mounting areas, a polishing apparatus and a method for making the same.
2. Description of the Related Art
Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing, which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the polishing workpiece repeatedly with a regular motion. The polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel. During the polishing process, a mounting sheet must be used for carrying and mounting the polishing workpiece, and the quality of the mounting sheet directly influences the polishing effect of the polishing workpiece.
The operation mode of the polishing device 1 is as follows. First, the polishing workpiece 13 is mounted on the mounting sheet 12, and then both the upper and lower base plates 14 and 11 are rotated and the upper base plate 14 is simultaneously moved downward, such that the polishing pad 15 contacts the surface of the polishing workpiece 13, and a polishing operation for the polishing workpiece 13 may be performed by continuously supplementing the slurry 16 and using the effect of the polishing pad 15.
In order to effectively mount and secure the polishing workpiece in the polishing process, a mounting force of the conventional mounting sheet is usually great. Furthermore, a material of a mounting surface of the mounting sheet for mounting the polishing workpiece is usually foamed polyurethane comprising a plurality of foam pores. Air in the foam pores may be removed to form a low-pressure environment by extruding during the polishing process, and the mounting force is further enhanced. After completing the polishing process, the polishing workpiece 13 must be unloaded from the mounting sheet 12. The great mounting force causes resistance in the unloading process. Parts of the polishing workpiece mounted by a peripheral area of the mounting sheet are easily unloaded because machining is easily applied thereon, and a greater moment of force is achieved when applying a constant force. However, parts of the polishing workpiece mounted by an area closer to a center of the mounting sheet are difficultly unloaded because machining is hardly applied thereon, and a less moment of force is achieved when applying a constant force. If the polishing workpiece is a thin panel with a large area such as an optical glass, the duration of the unloading process is extended, and difficulty of the unloading process is high. The polishing workpiece is very easily broken because of uncarefully processing and efficiency of polishing process is lowered with increasing cost.
Therefore, it is needed to provide a novel and improved mounting sheet, a polishing apparatus and a method for making the same to resolve the problems mentioned above.
The present invention provides a mounting sheet; wherein a mounting layer has different mounting areas, so that the requirements of a sufficient mounting force when polishing and easy unloading when completing polishing can be both met.
The present invention provides a mounting sheet, comprising a mounting layer; wherein the mounting layer comprises a mounting surface for mounting the substrate, and the mounting surface comprises:
a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area.
The present invention also provides a polishing apparatus comprising:
The present invention further provides a method for producing the mounting sheet as mentioned above, comprising:
The present invention provides a mounting sheet, comprising a mounting layer; wherein the mounting layer comprises a mounting surface for mounting the substrate, and the mounting surface comprises:
a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area.
The “mounting sheet” as used herein refers to a structure for mounting, carrying and securing a substrate in the process of chemical mechanical polishing. Preferably, the mounting sheet comprises a mounting layer and the mounting layer comprises a mounting surface for mounting the substrate. The mounting sheet is preferably a sheet and able to be adhered to a polishing apparatus.
In one embodiment of the invention, a material of the mounting sheet is a polymer; preferably a foamed polymer. The material of the mounting layer may include different polymers as needed. In order to mount and secure the substrate, the material is exampled as polyurethane resin, polyvinyl chloride resin, polystyrene resin, polyethylene resin, polyamide resin, acrylic resin, or ethylene-vinyl acetate resin. Such polymers can be used independently or in combinations. Preferably, the material of the mounting layer is a foamed resin of the resin mentioned above.
The “substrate” as used herein refers to a polishing workpiece to be polished, preferably a panel. In one embodiment of the invention, the substrate is semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel.
The mounting surface according to the invention comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The corresponding alignment of the first mounting area and the second mounting area may be predetermined or random.
Referring to
In one preferred embodiment of the invention, the mounting surface 221 further comprises a third mounting area 224, and the mounting force of the second mounting area 223 is stronger than a mounting force of the third mounting area 224. The combination of the first mounting area 222, second mounting area 223 and third mounting area 224 provides a more divergent and flexible alignment of mounting force; especially for a large-sized substrate, the process is more easily. The corresponding alignment of the first mounting area 222, the second mounting area 223, and the third mounting area 224 may be predetermined or random. Preferably, the second mounting area 223 surrounds the third mounting area 224; more preferably, the second mounting area 223 completely surrounds the third mounting area 224.
A shape of the first mounting area 222 or the second mounting area 223 may be random. Preferably, the shape of the first mounting area 222 or the second mounting area 223 is the same to that of the substrate. In one preferred embodiment of the invention, the shape of the first mounting area 222 or the second mounting area 223 is a square, circle or polygon. In other aspect, the first mounting area 222 and the second mounting area 223 are concentric.
Referring to
Referring to
Difference of the mounting forces of the first mounting area and the second mounting area can be adjusted by artisans skilled in this field. In one preferred embodiment of the invention, the difference of the mounting forces of the first mounting area and the second mounting area is adjusted by adjusting flatness of the first mounting area and the second mounting area; wherein flatness of the first mounting area differs to flatness of the second mounting area.
Preferably, in order to meet the requirements of a sufficient mounting force when polishing and easy unloading when completing polishing, the mounting force of the first mounting area is greater than about 0.8 kg/cm2 and the mounting force of the second mounting area is less than about 0.5 kg/cm2. More preferably, the mounting force is from about 0.05 kg/cm2 to about 1.3 kg/cm2.
The mounting sheet of the invention preferably further comprises a buffer layer. The buffer layer comprises a plurality of continuous pores and positioned under the mount layer to provide a buffer effect of the mounting sheet when polishing. Preferably, the material of the buffer layer is exampled as polyurethane resin, polyvinyl chloride resin, polystyrene resin, polyethylene resin, polyamide resin, acrylic resin, or ethylene-vinyl acetate resin.
The present invention also provides a polishing apparatus comprising:
The operation mode of the polishing device 5 is as follows. First, the substrate 53 is mounted on the mounting sheet 52, and then both the upper and lower base plates 54 and 51 are rotated and the upper base plate 54 is simultaneously moved downward, such that the polishing pad 55 contacts the surface of the substrate 53, and a polishing operation for the substrate 53 may be performed by continuously supplementing the slurry 56 and using the effect of the polishing pad 55.
The present invention further provides a method for producing the sheet as mentioned above, comprising:
The method according to the invention, the step (a) is to provide a polymer sheet to form the mounting layer. A material of the polymer is as mentioned above.
The method according to the invention, the step (b) is using the mold to form the different flatness of the first mounting area and the second mounting area and further to provide the different mounting forces. The mold may be chosen by artisans skilled in this field, such as an ironing wheel or glossy paper. The mold comprises a first bump area and a second bump area, and the first bump area corresponds to the first mounting area and the second bump area corresponds to the second mounting area.
The method according to the invention, the step (c) is transfer printing the polymer sheet with the mold to produce the mounting sheet.
The manner of transfer printing may be chosen by artisans skilled in this field according to the mold. Preferably, the transfer printing is performed with heat.
In one preferred embodiment of the invention, when the mold is the ironing wheel, the temperature of transfer printing is from about 150° C. to about 180° C.
In one preferred embodiment of the invention, when the mold is the glossy paper, the temperature of transfer printing is from about 100° C. to about 130° C.
The following Examples are given for the purpose of illustration only and are not intended to limit the scope of the present invention.
A polymer sheet is transfer printed at 180° C. with a ironing wheel with different flatness on the surface formed by blasting. Because the different flatness of the surface of the ironing wheel, a first mounting area with a mounting force of 1.1 kg/cm2 and a second mounting area with a mounting force of 0.3 kg/cm2 of a mounting sheet are formed. In the 500 mm×500 mm mounting sheet, the second mounting area with a mounting force of 0.3 kg/cm2 is 400 mm×400 mm, and the first mounting area with a mounting force of 1.1 kg/cm2 surrounds the second mounting area. Therefore, the mounting sheet with two different mounting areas are provided.
By using a conventional mounting sheet, an average duration for replacing a substrate is about 45 seconds. On the other hand, by using the mounting sheet according to the invention, an average duration for changing a substrate is decreased to about 25 seconds. The duration is shorten for about 20 seconds, i.e. a decrease of approximately 44.4% of the replacing duration.
While embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by persons skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention is not limited to the particular forms as illustrated, and that all the modifications not departing from the spirit and scope of the present invention are within the scope as defined in the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
101136439 | Oct 2012 | TW | national |