Patent Application
20090269953
The present invention relates to a mounting structure of an interface jack, and more particularly to a mounting structure of an interface jack by using surface mount technology.
A printed circuit board (PCB) is an essential component of all every electronic device. The printed circuit board is used to mechanically support and electrically connect electronic components to form a functional circuit module.
By printing, electroplating or etching means, for example, conductor patterns or traces are formed on a copper clad laminate (CCL) substrate. After related electronic components are soldered on the printed circuit board, these electronic components are electrically connected with each other through the conductor patterns or traces so as to form a printed circuit board assembly (PCBA). An example of the PCBA includes a motherboard disposed within a host computer.
Conventionally, a through-hole technology (THT) is used to mount electronic components on the printed circuit board. In the through-hole construction, the electronic components are placed on one side (also referred as a component side) of the printed circuit board, and the pins of the electronic components are inserted in corresponding through-holes of the printed circuit board and then soldered on the other side (also referred as a solder side) of the printed circuit board. Since a plurality of through-holes corresponding to the pins of the electronic components are drilled in the printed circuit board and the solder joints between the electronic components and the electronic components are very large, the through-hole technology is usually applied to the relatively low-density integrated circuits. In addition, the through-hole construction is only suitable to fabricate a single layered circuit board.
With increasing progress of fabricating integrated circuits, the semiconductor packages are developed toward minimization and high integration. As a consequence, the requirement of increasing the pin density of the semiconductor packages on the printed circuit board becomes more important. Recently, a surface mount technology (SMT) is gradually used to construct relatively high-density integrated circuits on the printed circuit board. The printed circuit board usually has flat solder pads without holes. In the surface mount construction, the electronic components are placed on solder pads on the one or both surfaces of the printed circuit board, and then the pins of the electronic components are electrically and mechanically fixed to the solder pads with molten solder paste. Since the electronic components may be mounted on both sides of the printed circuit board, the space utilization of the printed circuit board is increased. In addition, the electronic components are usually made physically small and lightweight, thereby allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, so that the fabricating cost is also reduced.
As known, a serial advanced technology attachment (SATA) interface is a computer bus for transferring data between a computer and mass storage devices such as hard disc drives and optical disc drives.
Although the process of mounting the SATA interface jack 10 on the printed circuit board 105 is simple and time-saving, there are still some drawbacks. Since the contact area between the SATA interface jack 10 and the printed circuit board 105 is insufficient, the SATA interface jack 10 is often suffered from poor solderability. In a case that the SATA interface plug 120 is frequently plugged into or withdrawn from the SATA interface jack 10, the SATA interface jack 10 is readily disconnected from the printed circuit board 105 due to a strong impact.
Therefore, there is a need of providing an improved mounting structure of an interface jack to obviate the drawbacks encountered from the prior art.
The present invention provides a mounting structure of an interface jack by using the surface mount technology, in which the contact area between the interface jack and a printed circuit board is increased and thus the interface jack is firmly fixed on the printed circuit board.
In accordance with an aspect of the present invention, there is provided a mounting structure of an interface jack. The mounting structure includes an insulating housing, multiple electrical wires, a first metallic piece, a second metallic piece, and at least one third metallic piece. The insulating housing has an upper surface, a lower surface, a backside surface, a first lateral wall, a second lateral wall and an entrance. The entrance is communicated with a receptacle within the insulating housing. The backside surface is connected with the upper surface, the lower surface, the first lateral wall and the second lateral wall. The electrical wires are arranged inside the insulating housing and extended out of the backside surface of the insulating housing. The first metallic piece is attached on the bottom surface of the first lateral wall. The second metallic piece is attached on the bottom surface of the second lateral wall. The third metallic piece is attached on the lower surface.
In accordance with another aspect of the present invention, there is provided a SATA interface jack. The SATA interface jack includes an insulating housing, multiple electrical wires, a first metallic piece, a second metallic piece, and at least one third metallic piece. The insulating housing has an upper surface, a lower surface, a backside surface, a first lateral wall, a second lateral wall and an entrance. The entrance is communicated with a receptacle within the insulating housing. The backside surface is connected with the upper surface, the lower surface, the first lateral wall and the second lateral wall. The electrical wires are arranged inside the insulating housing and extended out of the backside surface of the insulating housing. The first metallic piece is attached on the bottom surface of the first lateral wall. The second metallic piece is attached on the bottom surface of the second lateral wall. The third metallic piece has a first connecting part to be embedded into a notch in the lower surface such that a second connecting part of the third metallic piece lies flat on the lower surface of the insulating housing.
In accordance with another aspect of the present invention, there is provided a SATA interface jack. The SATA interface jack includes an insulating housing, multiple electrical wires, a first metallic piece, a second metallic piece, and at least one third metallic piece. The insulating housing has an upper surface, a lower surface, a backside surface, a first lateral wall, a second lateral wall and an entrance. The entrance is communicated with a receptacle within the insulating housing. The backside surface is connected with the upper surface, the lower surface, the first lateral wall and the second lateral wall. The electrical wires are arranged inside the insulating housing and extended out of the backside surface of the insulating housing. The first metallic piece is attached on the bottom surface of the first lateral wall. The second metallic piece is attached on the bottom surface of the second lateral wall. The third metallic piece has a first connecting part embedded into a notch in the lower surface and an intermediate part sustained against the inner surface of the insulating housing such that a second connecting part of the third metallic piece lies flat on the lower surface of the insulating housing.
The above contents of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
In the above embodiments, the third metallic pieces 211 and 213 are attached on the lower surface 204 of the SATA interface jack 20 by embedding respective first connecting parts 2111 and 2131 into corresponding notches 212 and 214. Nevertheless, the third metallic pieces may be attached on the lower surface 204 of the SATA interface jack 20 by an insert molding process or by screwing.
From the above description, the use of the third metallic pieces may increase the solderable area of the SATA interface jack, so that the SATA interface jack of the present invention is capable of firmly fixed on the printed circuit board.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not to be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200810094850.7 | Apr 2008 | CN | national |
