(a) Field of the Invention
The present invention relates to an improved movable air duct device, and more particularly to a movable air duct device that can function in coordination with CPUs (central processor units) disposed at different positions on different motherboards.
(b) Description of the Prior Art
A conventional heat sink device primarily comprises fins and a fan, wherein the fan is positioned on top of the fins. Wind power from the fan is used to expel heat produced by the CPU (central processor unit). However, the hot air produced by the CPU and peripheral chips circulates within the space interior of a computer case and is unable to be completely expelled. Hence, operators have installed an air duct on a side panel of the computer case. The air duct connects to the CPU disposed on a motherboard, and air from an outer side of the air duct is used to reduce the amount of hot air produced by the CPU. However, air ducts currently on the market are all fixed, unmovable devices, and, because the CPU is disposed at a different position in each personal computer depending on the motherboard used, thus, a fixed type air duct is unable to be used.
The main objective of the present invention is to provide an air duct that is movable on a venthole of a side panel of a computer case, thereby enabling the air duct to function in coordination with CPUs (central processor units) disposed at different positions on different motherboards.
To enable a further understanding of said objectives and the technological methods of the invention herein, brief description of the drawings is provided below followed by detailed description of the preferred embodiments.
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The air duct 20 is movable on the venthole 11, thereby enabling the air duct 20 to function in coordination with CPUs (central processor units) disposed at different positions on different motherboards. The movable air duct device of the present invention comprises an outer frame 30, two inner frames 40, 50 and a duct base 60 having the air duct 20 connected thereto. The outer frame 30 is positioned on an outer side of the side panel 10. Two through holes 31, 32 are defined in the outer frame 30 corresponding to the ventholes 11, 12 of the side panel 10 respectively. A plurality of insert pieces 33 and hooks 34 are configured on the outer frame 30. The insert pieces 33 and the hooks 34 penetrate a plurality of insert holes 13 and hook holes 14 defined in the side panel 10 respectively. A plurality of insert holes 41, 51 and hook holes 42, 52 are defined in the inner frames 40, 50 respectively, which provide for the insert pieces 33 and the hooks 34 of the outer frame 30 to insert and secure position therein.
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In conclusion, the movable air duct device of the present invention provides an air duct 20 that is able to change position depending on position of the CPU disposed on a motherboard, and is thus applicable for use on CPUs disposed at different positions on different motherboards. Moreover, the air duct 20 can be lengthened and shortened according to height of the CPU.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.