Patent Application
20240396219
The present disclosure relates to a multi-band antenna module, and more particularly, to a multi-band antenna module that is mounted on an electronic device that constitutes a home network.
As the wireless communication technology is recently advanced, the wireless communication technology is applied to fields close to life, and a home network is an example of the application.
The home network means an environment in which various home appliances within a home communicate with each other over the network and the home appliances within the home can communicate with the outside through the Internet. In this case, a multi-band antenna module is mounted on an electronic device belonging to the home network because the electronic device needs to be capable of communicating with another electronic device.
A conventional multi-band antenna module is constructed to include multiple antennas that resonate in different frequency bands. In the conventional multi-band antenna module, interference occurs between antennas having the same polarization. In the conventional multi-band antenna module, an instant communication cutoff phenomenon occurs because separation (or isolation) is reduced due to interference between the antennas.
The present disclosure has been proposed by considering the circumstances, and an object of the present disclosure is to provide a multi-band antenna module which prevents a reduction of separation (or isolation) attributable to interference between antennas by combining antennas having different polarization characteristics.
Furthermore, another object of the present disclosure is to provide a multi-band antenna module which improves the amount of transmission and a transfer rate by increasing a channel by combining antennas having different polarization characteristics and enables stable communication by preventing interference between antennas.
Furthermore, still another object of the present disclosure is to provide a multi-band antenna module which transmits and receives signals having frequency bands of 2.4 GHZ and 6E (5G to 7G) by combining antennas having different polarization characteristics.
In order to achieve the object, a multi-band antenna module according to a first embodiment of the present disclosure includes a circuit board and a patch antenna disposed on an upper surface of the circuit board and configured to transmit or receive a signal having a first frequency band. A first conductor pattern that transmits or receives a signal having a second frequency band while feeding power to the patch antenna is formed in the circuit board.
The patch antenna may include a dielectric, an upper patch disposed on an upper surface of the dielectric, a first lower patch having a first slot formed therein and disposed on a lower surface of the dielectric, and a second lower patch disposed on the lower surface of the dielectric and disposed so that the second lower patch is accommodated in a space that is formed by the first slot and the lower surface of the dielectric.
A first area that is an area in which the patch antenna is mounted, a second area that is remaining areas except the first area, and a first upper clearance area that is an area covering the first area and the second area may be defined on the upper surface of the circuit board.
The first upper clearance area may include a first clearance area that is formed in the first area and that overlaps the patch antenna and a second clearance area that is formed in the second area, that is combined with the first clearance area, and that has an opening formed on one side thereof.
The first conductor pattern may include a first pattern disposed to cover the first clearance area and the second clearance area and a second pattern that is disposed in the first clearance area and that overlaps the patch antenna. A first connection pad connected to a power feed part may be formed at a first end of the first pattern. The second pattern may be connected to a second end of the first pattern. In this case, the second pattern may form a power feed pad by being connected to the second lower patch, and the power feed pad may be connected to the upper patch by coupling in the state in which the power feed pad has been spaced apart from the upper patch. In this case, the circuit board may further include a matching circuit connected to the first pattern.
Meanwhile, a first lower clearance area symmetrical to the first upper clearance area may be further defined in a lower surface of the circuit board. The first conductor pattern may include a first pattern disposed in the first lower clearance area, and a second pattern that is disposed in a first clearance area of the first upper clearance area and that overlaps the patch antenna. A first connection pad connected to the power feed part may be formed at a first end of the first pattern. The second pattern may be connected to a second end of the first pattern through a via hole.
In order to achieve the object, a multi-band antenna module according to a second embodiment of the present disclosure includes a circuit board and a patch antenna disposed on an upper surface of the circuit board and configured to transmit or receive a signal having a first frequency band. A first conductor pattern and a second conductor pattern that transmit or receive a signal having a second frequency band while feeding power to the patch antenna are formed in the circuit board.
The patch antenna may include a dielectric, an upper patch disposed on an upper surface of the dielectric, a first lower patch having a first slot and a second slot formed therein and disposed on a lower surface of the dielectric, a second lower patch disposed on the lower surface of the dielectric and disposed so that the second lower patch is accommodated in a space that is formed by the first slot and the lower surface of the dielectric, and a third lower patch disposed on the lower surface of the dielectric and disposed so that the third lower patch is accommodated in a space that is formed by the second slot and the lower surface of the dielectric.
A first area that is an area in which the patch antenna is mounted, a second area that is remaining areas except the first area, a first upper clearance area that is an area covering the first area and the second area, and a second upper clearance area that is an area that is isolated from the first upper clearance area and that covers the first area and the second area may be defined on the upper surface of the circuit board.
The first upper clearance area may include a first clearance area that is formed in the first area and that overlaps the patch antenna, and a second clearance area that is formed in the second area, that is combined with the first clearance area, and that has an opening formed on one side thereof. The second upper clearance area may include a third clearance area that is formed in the first area, that is isolated from the first clearance area, and that overlaps the patch antenna, and a fourth clearance area that is formed in the second area, that is isolated from the second clearance area, that is combined with the third clearance area, and that has an opening formed on one side thereof.
The first conductor pattern may include a first pattern disposed to cover the first clearance area and the second clearance area and a second pattern that is disposed in the first clearance area and that overlaps the patch antenna. A first connection pad connected to the power feed part may be formed at a first end of the first pattern. The second pattern may be connected to a second end of the first pattern. The second conductor pattern may include a third pattern disposed to cover the third clearance area and the fourth clearance area and a fourth pattern that is disposed in the third clearance area and that overlaps the patch antenna. A second connection pad connected to a power feed part may be formed at a first end of the third pattern. The fourth pattern may be connected to a second end of the third pattern. In this case, the second pattern may form a power feed pad by being connected to the second lower patch. The fourth pattern may form another power feed pad by being connected to the third lower patch. The power feed pad and the another power feed pad may be spaced apart from each other, and may be connected to the upper patch by coupling in the state in which the power feed pad and the another power feed pad have been spaced apart from the upper patch.
The circuit board may further include a matching circuit connected to the first pattern and another matching circuit connected to the third pattern.
Meanwhile, a first lower clearance area symmetrical to the first upper clearance area and a second lower clearance area symmetrical to the second upper clearance area may be further defined on the lower surface of the circuit board. The first conductor pattern may include a first pattern disposed in the first lower clearance area, and a second pattern that is disposed in a first clearance area of the first upper clearance area and that overlaps the patch antenna. A first connection pad to which a power feed part is connected may be formed at a first end of the first pattern, and the second pattern is connected to a second end of the first pattern through a via hole. The second conductor pattern may include a third pattern disposed in the second lower clearance area, and a fourth pattern that is disposed in a third clearance area of the second upper clearance area and that overlaps the patch antenna. A second connection pad connected to a power feed part may be formed at a first end of the third pattern. The fourth pattern may be connected to a second end of the third pattern through a via hole. In this case, a first virtual straight line that connects the first pattern and the second pattern and a second virtual straight line that connects the third pattern and the fourth pattern may be orthogonal to each other.
According to the present disclosure, the multi-band antenna module has an effect in that it can receive signals having multiple bands by preventing the occurrence of interference between antennas while preventing a reduction of separation (or isolation), by combining antennas having different polarization characteristics.
Furthermore, the multi-band antenna module has an effect in that it can implement a multiple input multiple output (MIMO) antenna and/or a diversity antenna by forming two power feed lines that feed power to the patch antenna and constructing the two power feed lines as a radiator that resonates in a frequency band different from the frequency band of the patch antenna.
Furthermore, the multi-band antenna module has effects in that it can minimize a channel loss and interference by constructing the MIMO antenna and can increase a communication speed by increasing the amount of transmission along with a channel increase.
Furthermore, the multi-band antenna module has an effect in that it is capable of stable communication by minimizing a signal loss attributable to channel interference while increasing a data transmission capacity by constructing the diversity antenna.
Hereinafter, the most preferred embodiments of the present disclosure will be described with reference to the accompanying drawings in order to specifically describe the embodiments to the extent that a person having ordinary knowledge in the art to which the present disclosure pertains may easily implement the technical spirit of the present disclosure. First, in adding reference numerals to the components of each drawing, it should be noted that the same components have the same reference numerals as much as possible even if they are displayed in different drawings. Furthermore, in describing the present disclosure, when it is determined that the detailed description of the related well-known configuration or function may obscure the subject matter of the present disclosure, the detailed description thereof will be omitted.
Referring to
If the multi-band antenna module 100 includes antennas having similar polarization, separation (or isolation) is reduced because interference occurs between the antennas.
Accordingly, the multi-band antenna module 100 according to an embodiment of the present disclosure minimizes the occurrence of interference between antennas and thus minimizes a reduction of separation (or isolation) by providing a complex structure in which the directional patch antenna 200 and the non-directional monopole antenna having different types of polarization have been combined.
To this end, the multi-band antenna module 100 is constructed to include the patch antenna 200 and the circuit board 300. That is, the multi-band antenna module 100 is constructed in a form in which the patch antenna 200 having the directional radiation type has been mounted on the circuit board 300 in which a monopole pattern antenna, that is, a non-directional antenna, has been formed. In this case, an example in which the patch antenna 200 has a radiator for upward radiation is taken.
The patch antenna 200 operates as an antenna that resonates in a first frequency band. In this case, an example in which the first frequency band is a Wi-Fi frequency band of about 2.4 GHZ is taken.
Referring to
The base substrate 210 consists of a dielectric body having an upper surface, a lower surface, and a plurality of sides. An example in which the base substrate 210 consists of a dielectric substrate made of a ceramic material having characteristics, such as a high dielectric constant and a low coefficient of thermal expansion is taken. In this case, the lower surface of the base substrate 210 is a surface that comes into contact with an upper surface of the circuit board 300 while facing the upper surface when the patch antenna 200 is mounted on the circuit board 300. The upper surface of the base substrate 210 is a face that is opposite to the upper surface of the circuit board 300 with the lower surface of the base substrate 210 interposed therebetween.
The base substrate 210 may be made of a magnetic body having an upper surface, a lower surface, and a plurality of sides. An example in which the base substrate 210 consists of a magnetic material substrate made of a magnetic material, such as ferrite, is taken.
The upper patch 230 is disposed on the upper surface of the base substrate 210. The upper patch 230 consists of a thin plate made of a conductive material having high electric conductivity, such as copper, aluminum, gold, or silver. The upper patch 230 may be formed in various shapes, such as a square, a triangle, and an octagon, depending on a shape of the base substrate 210. The upper patch 230 may be deformed in various shapes through a process, such as frequency tuning.
The first lower patch 250 is disposed in the lower surface of the base substrate 210. The first lower patch 250 consists of a thin plate made of a conductive material having high electric conductivity, such as copper, aluminum, gold, or silver. The first lower patch 250 may be formed in various shapes, such as a square, a triangle, and an octagon, depending on a shape of the base substrate 210. In this case, an example in which the first lower patch 250 is a patch for ground GND is taken.
A first slot 252 that accommodates the second lower patch 270 is formed in the first lower patch 250. In this case, the first slot 252 is formed to include an area that overlaps a second pattern 322 of a first conductor pattern 320 that is formed in the circuit board 300, which will be described later. The first slot 252 is formed to have a wider area than the second lower patch 270 so that the first lower patch 250 is spaced apart from the second lower patch 270 at a predetermined interval when the first lower patch 250 and the second lower patch 270 are disposed on the lower surface of the base substrate 210.
The second lower patch 270 is disposed on the lower surface of the base substrate 210. The second lower patch 270 is accommodated in a space that is formed by the lower surface of the base substrate 210 and the first slot 252 of the first lower patch 250. The second lower patch 270 is disposed to be spaced apart from the first lower patch 250 at a predetermined interval on the lower surface of the base substrate 210.
The second lower patch 270 consists of a thin plate made of a conductive material having high electric conductivity, such as copper, aluminum, gold, or silver. As the patch antenna 200 is mounted on the circuit board 300, the second lower patch 270 is connected to the second pattern 322 of the first conductor pattern 320 that is formed in the circuit board 300, thus forming a power feed pad.
The upper patch 230 operates as an antenna that resonates in the first frequency band by being fed with power through electromagnetic coupling with a power feed pad (i.e., the second lower patch 270 and the second pattern 322) that is formed in the circuit board 300.
The upper patch 230 operates as a radiator that resonates to a signal having the first frequency band, that is, approximately 2.4 GHZ, by being fed with power through electromagnetic coupling (i.e., coupling) in the state in which the upper patch 230 has been spaced apart from the power feed pad at a predetermined interval without being directly connected to the power feed pad.
In this case, in
The circuit board 300 is a printed circuit board on which the patch antenna 200 is mounted. The circuit board 300 is a stack board on which a resin layer, a metal layer, a coverlay layer, etc. have been stacked.
Referring to
The first area A1 is an area in which the patch antenna 200 is mounted. In this case, one or more soldering points SP for connecting the patch antenna 200 by soldering may be formed in the first area A1. In this case, an example in which the soldering point SP is an area in which the metal layer has been exposed by removing the coverlay layer of the circuit board 300 is taken. In this case, the soldering point SP is connected to the first lower patch 250 of the patch antenna 200.
The second area A2 is an area of the circuit board 300 except the first area A1. That is, the second area A2 is the remaining area of the entire upper surface of the circuit board 300 disposed in the second area A2, except the first area A1 in which the patch antenna 200 is mounted.
An upper ground area 311 and a first upper clearance area 312 are defined in the upper surface of the circuit board 300. In this case, a lower ground area 313 and a first lower clearance area 314 may be defined in a lower surface of the circuit board 300. The first lower clearance area 314 is defined to be symmetrical to the first upper clearance area 312 with the resin layer of the circuit board 300 interposed therebetween.
The upper ground area 311 is an area of the circuit board 300, which operates as a ground. An example in which the upper ground area 311 is an area of the circuit board 300 on which the resin layer, the metal layer, and the coverlay layer have been stacked in the state in which the resin layer, the metal layer, the coverlay layer, etc. have not been removed is taken.
The first upper clearance area 312 is an area of the circuit board 300, which corresponds to a non-ground. The first upper clearance area 312 is an area from which the remaining layers (the metal layer, the coverlay layer, etc.) of the circuit board 300 except the resin layer have been removed. Accordingly, the first upper clearance area 312 is an area in which the resin layer has been exposed in the upper surface of the circuit board 300.
The first upper clearance area 312 includes a first clearance area 312a and a second clearance area 312b.
The first clearance area 312a is a clearance area that is formed in some area of the first area A1. The first clearance area 312a is formed in some area of the first area A1, and thus overlaps the patch antenna 200 mounted on the circuit board 300.
The second clearance area 312b is a clearance area that is formed in some area of the second area A2. The second clearance area 312b is formed in some area of the second area A2, and thus does not overlap the patch antenna 200 mounted on the circuit board 300. In this case, an example in which the second clearance area 312b has been formed to have a width of approximately 3 mm or more to 6 mm or less and a length of 10 mm or more is taken.
The second clearance area 312b is formed to adjoin one side of the first area A1. One side of the second clearance area 312b is formed to be disposed on the same line as one side of the circuit board 300, and forms an opening OP of the second clearance area 312b.
The first clearance area 312a and the second clearance area 312b are interconnected to form the first upper clearance area 312. Accordingly, the first upper clearance area 312 is defined as a structure that is disposed on the outside (i.e., the second area A2) on one side of the first area A1 and a part of the structure is inserted and disposed in the first area A1. In this case, a shape of the first upper clearance area 312 may be formed in various shapes in addition to the shape illustrated in the drawing.
The first conductor pattern 320 that operates as a micro-strip line antenna, that is, a non-directional radiation type, is formed in the circuit board 300. In this case, the first conductor pattern 320 operates as a power feed line of the patch antenna 200 while operating as the antenna having the non-directional radiation type.
The first conductor pattern 320 may be formed simultaneously with the forming of the first upper clearance area 312. That is, the first conductor pattern 320 may be formed by removing the metal layer and coverlay layer of areas except an area corresponding to the first conductor pattern 320 in a process of forming the first upper clearance area 312. In this case, the first conductor pattern 320 may be formed as an island pattern that is formed to be isolated from an outer circumference of the first upper clearance area 312 within the first upper clearance area 312.
The first conductor pattern 320 is constructed to include a first pattern 321 and the second pattern 322.
The first pattern 321 is disposed in the second clearance area 312b and connected to a power feed part (not illustrated) and the second pattern 322. A first end of the first pattern 321 is connected to the power feed part (not illustrated). A second end of the first pattern 321 is connected to the second pattern 322. In this case, a first connection pad 321a, that is, the metal layer exposed because the coverlay layer is removed for a connection with the power feed part (not illustrated), may be formed at the first end of the first pattern 321.
The second pattern 322 is disposed in the first clearance area 312a, and overlaps the patch antenna 200 mounted on the circuit board 300. The second pattern 322 is connected to the power feed part (not illustrated) through the first pattern 321. The second pattern 322 is connected to the second lower patch 270 of the patch antenna 200, thus forming the power feed pad that feeds power to the upper patch 230. The power feed pad feeds power to the upper patch 230 by being subjected to electromagnetic coupling with the upper patch 230 of the patch antenna 200. To this end, the second pattern 322 may be the metal layer that is exposed because the coverlay layer is removed in order to form the power feed pad by being connected to the second lower patch 270.
Meanwhile, a matching circuit 330 for impedance adjustment may be connected to the first pattern 321. The matching circuit 330 is disposed over the first pattern 321, and minimizes a reflection loss I by generating impedance close to 50 ohm impedance.
Referring to
The first pattern 321 may be formed simultaneously with the forming of the first lower clearance area 314. The second pattern 322 may be formed simultaneously with the forming of the first upper clearance area 312.
That is, the first pattern 321 is formed by removing the metal layer and coverlay layer of areas except an area corresponding to the first pattern 321 in a process of forming the first lower clearance area 314. The second pattern 322 is formed by removing the metal layer and coverlay layer of areas except an area corresponding to the second pattern 322 in a process of forming the first upper clearance area 312.
Accordingly, the first pattern 321 may be formed as an island pattern that is formed within the first lower clearance area 314 and that is spaced apart from an outer circumference of the first lower clearance area 314. The second pattern 322 may be formed as an island pattern that is formed within the first clearance area 312a of the first upper clearance area 312.
Referring to
A second slot 254 that accommodates the third lower patch 290 is further formed in the first lower patch 250. In this case, the second slot 254 is formed to include an area that overlaps a fourth pattern 342 of a second conductor pattern 340 that is formed in the circuit board 300, which will be described later.
The second slot 254 is disposed to be twisted with respect to the first slot 252 approximately 90 degrees. That is, a first virtual straight line that connects the first slot 252 and a central axis of the patch antenna and a second virtual straight line that connects the second slot 254 and the central axis of the patch antenna are orthogonal to each other.
The second slot 254 is formed to have a wider area than the third lower patch 290 so that the first lower patch 250 is spaced apart from the third lower patch 290 at a predetermined interval when the first lower patch 250 to the third lower patch 290 are disposed on the lower surface of the base substrate 210. Accordingly, the third lower patch 290 is spaced apart from the first lower patch 250 at a predetermined interval on the lower surface of the base substrate 210.
The third lower patch 290 is disposed on the lower surface of the base substrate 210. The third lower patch 290 is accommodated in a space that is formed by the lower surface of the base substrate 210 and the second slot 254 of the first lower patch 250.
A virtual straight line that connects the third lower patch 290 and the central axis of the patch antenna 200 and a virtual straight line that connects the lower patch 270 and the central axis of the patch antenna 200 are orthogonal to each other. Accordingly, the third lower patch 290 is disposed to be twisted approximately 90 degrees with respect to the second lower patch 270.
The third lower patch 290 consists of a thin plate made of a conductive material having high electric conductivity, such as copper, aluminum, gold, or silver. As the patch antenna 200 is mounted on the circuit board 300, the third lower patch 290 forms a power feed pad by being connected to the fourth pattern 342 of the second conductor pattern 340 formed in the circuit board 300.
The upper patch 230 operates as an MIMO antenna or a diversity antenna that resonates in the first frequency band by being fed with power through electromagnetic coupling with two power feed pads that are formed by the second lower patch 270 and the third lower patch 290. The upper patch 230 operates as a radiator that resonates to a signal having the first frequency band, that is, approximately 2.4 GHZ, by being fed with power through electromagnetic coupling (i.e., coupling) in the state in which the upper patch 230 has been spaced apart from the two power feed pads at a predetermined interval without being directly connected to the power feed pads.
In this case, in
Referring to
The second upper clearance area 315 is defined in the upper surface of the circuit board 300. The second lower clearance area 316 is defined in the lower surface of the circuit board 300. In this case, the second upper clearance area 315 and the second lower clearance area 316 may be defined to be symmetrical to each other with the resin layer of the circuit board 300 interposed therebetween.
The second upper clearance area 315 includes a third clearance area 315a and a fourth clearance area 315b.
The third clearance area 315a is a clearance area that is formed in some area of the first area A1. As the third clearance area 315a is formed in some area of the first area A1, the third clearance area 315a overlaps a part of the patch antenna 200 mounted on the circuit board 300.
The fourth clearance area 315b is a clearance area that is formed in some area of the second area A2. As the fourth clearance area 315b is formed in some area of the second area A2, the fourth clearance area 315b does not overlap the patch antenna 200 mounted on the circuit board 300. In this case, an example in which the fourth clearance area 315b has been formed to have a width of approximately 3 mm or more to 6 mm or less and a length of 10 mm or more is taken.
The fourth clearance area 315b is formed to adjoin one side of the first area A1. In this case, the fourth clearance area 315b is formed to adjoin the other side of the second area A2, which adjoins one side of the second area A2 in which the second clearance area 312b has been formed.
For example, it is assumed that the first area A1 is defined in the form of a quadrangle having a first side, a second side opposite to the first side, a third side connected to a first end of the first side and a first end of the second side, and a fourth side that is opposite to the third side and that is connected to a second end of the first side and a second end of the second side. If the second clearance area 312b is formed to adjoin the first side and the second side and the third side are disposed to adjoin an outer circumference of the circuit board 300, the fourth clearance area 315b is formed to adjoin the fourth side that adjoins the first side.
The fourth clearance area 315b is formed to adjoin one side of the circuit board 300. One side of the fourth clearance area 315b is disposed on the same line as one side of the circuit board 300, thus forming an opening OP of the fourth clearance area 315b.
The third clearance area 315a and the fourth clearance area 315b are interconnected to form the second upper clearance area 315. Accordingly, the second upper clearance area 315 is disposed on the outside (i.e., the second area A2) on one side of the first area A1, and a part of the second upper clearance area 315 is inserted and disposed in the first area A1. In this case, a shape of the second upper clearance area 315 may be formed in various shapes in addition to the shape illustrated in the drawing.
The second conductor pattern 340 that operates as a micro-strip line antenna, that is, a non-directional radiation type, may be further formed in the circuit board 300. In this case, the second conductor pattern 340 operates as the power feed line of the patch antenna 200 while operating as the antenna having the non-directional radiation type.
The second conductor pattern 340 operates as a micro-strip line antenna having polarization different from that of the first conductor pattern 320. To this end, the second conductor pattern 340 is disposed to be twisted approximately 90 degrees with respect to the first conductor pattern 320 in the circuit board 300.
The second conductor pattern 340 may be formed simultaneously with the forming of the second upper clearance area 315. That is, the second conductor pattern 340 is formed by removing the metal layer and coverlay layer of areas except an area corresponding to the second conductor pattern 340 in a process of forming the second upper clearance area 315. In this case, the second conductor pattern 340 may be formed as an island pattern that is formed within the second upper clearance area 315 and that is spaced apart from an outer circumference of the second upper clearance area 315.
The second conductor pattern 340 is constructed to include a third pattern 341 and the fourth pattern 342. In this case, a first virtual straight line that connects the first pattern 321 and second pattern 322 of the first conductor pattern 320 and a second virtual straight line that connects the third pattern 341 and fourth pattern 342 of the second conductor pattern 340 are orthogonal to each other so that the first conductor pattern 320 and the second conductor pattern 340 are twisted each other approximately 90 degrees.
The third pattern 341 is disposed in the fourth clearance area 315b and connected to a power feed part and the fourth pattern 342. A first end of the third pattern 341 is connected to the power feed part (not illustrated). A second end of the third pattern 341 is connected to the fourth pattern 342. In this case, a second connection pad 341a, that is, the metal layer exposed because the coverlay layer is removed for a connection with the power feed part (not illustrated), may be formed at the first end of the third pattern 341. In this case, the first conductor pattern 320 and the second conductor pattern 340 are connected to different power feed parts (not illustrated).
The fourth pattern 342 is disposed in the third clearance area 315a, and overlaps the patch antenna 200 mounted on the circuit board 300. The fourth pattern 342 is connected to the power feed part (not illustrated) through the third pattern 341. The fourth pattern 342 is connected to the third lower patch 290 of the patch antenna 200, thus forming a power feed pad that feeds power to the upper patch 230. The power feed pad feeds power to the upper patch 230 by being subjected to electromagnetic coupling with the upper patch 230 of the patch antenna 200. To this end, the fourth pattern 342 may be a metal layer exposed because the coverlay layer is removed in order to form the power feed pad by being connected to the third lower patch 290.
Meanwhile, the matching circuit 330 for impedance adjustment may be connected to the third pattern 341. The matching circuit 330 is disposed over the third pattern 341, and minimizes a reflection loss I by generating impedance close to 50 ohm impedance.
As described above, the multi-band antenna module 100 can implement a multiple input multiple output (MIMO) antenna and/or a diversity antenna by forming the two power feed lines that feed power to the patch antenna 200 and constructing the two power feed lines as the radiators that resonate in a frequency band different from that of the patch antenna 200.
Furthermore, the multi-band antenna module 100 can minimize a channel loss and interference by constructing the MIMO antenna, and can increase a communication speed by increasing the amount of transmission along with a channel increase.
Furthermore, the multi-band antenna module 100 enables stable communication by minimizing a signal loss attributable to channel interference while increasing a data transmission capacity by constructing the diversity antenna.
In Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 2.89 was measured in 2400.00 MHZ, the VSWR of approximately 2.00 was measured in 2442.50 MHZ, and the VSWR of approximately 1.53 was measured in 2485.00 MHz.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 2.90 was measured in 2400.00 MHZ, the VSWR of approximately 1.95 was measured in 2442.50 MHZ, and the VSWR of approximately 1.50 was measured in 2485.00 MHZ.
Meanwhile, in Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 1.11 was measured in 5150.00 MHZ, the VSWR of approximately 1.99 was measured in 5500.00 MHZ, and the VSWR of approximately 2.69 was measured in 5850.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 1.23 was measured in 5150.00 MHZ, the VSWR of approximately 1.47 was measured in 5500.00 MHZ, and the VSWR of approximately 3.07 was measured in 5850.00 MHZ.
As described above, it may be seen that the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have the VSWRs, that is, a criterion or less, in all of the VSWRs of Feed 1 and Feed 2 in the first frequency band (i.e., a 2.4 GHz band) and a second frequency band (i.e., a 5 GHZ to 7 GHZ band) and satisfies the VSWR that is required for the antenna for Wi-Fi.
The multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have an S parameter value of approximately-10.1 dB in 2400.00 MHZ, to have an S parameter value of approximately −10.2 dB in 2442.50 MHZ, and to have an S parameter value of approximately −10.3 dB in 2485.00 MHz.
Furthermore, the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have an S parameter value of approximately −16.6 dB in 5150.00 MHZ, to have an S parameter value of approximately −19.9 dB in 5500.00 MHZ, and to have an S parameter value of approximately −33.7 dB in 5850.00 MHZ.
As described above, it may be seen that the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have the S parameters values, that is, a criterion or less, in both the first frequency band (i.e., the 2.4 GHz band) and the second frequency band (i.e., the 5 GHZ band) and satisfies the isolation characteristic that is required for the antenna for Wi-Fi.
In Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the efficiency of approximately 52.38% was measured in 2400.00 MHZ, the efficiency of approximately 65.17% was measured in 2442.50 MHZ, and the efficiency of approximately 49.99% was measured in 2485.00 MHZ. In Feed 1 of the multi-band antenna module 100, the efficiency of approximately 68.05% was measured in 5150.00 MHZ, the efficiency of approximately 40.65% was measured in 5500.00 MHZ, and the efficiency of approximately 50.02% was measured in 5850.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the efficiency of approximately 45.26% was measured in 2400.00 MHZ, the efficiency of approximately 62.14% was measured in 2442.50 MHZ, and the efficiency of approximately 55.27% was measured in 2485.00 MHZ. In Feed 2 of the multi-band antenna module 100, the efficiency of approximately 76.98% was measured in 5150.00 MHZ, the efficiency of approximately 64.86% was measured in 5500.00 MHZ, and the efficiency of approximately 36.46% was measured in 5850.00 MHz.
Meanwhile, in Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the average gain of approximately −2.81 dB was measured in 2400.00 MHZ, the average gain of approximately −1.86 dB was measured in 2442.50 MHZ, and the average gain of approximately −3.01 dB was measured in 2485.00 MHZ. In Feed 1 of the multi-band antenna module 100, the average gain of approximately −1.67 dB was measured in 5150.00 MHZ, the average gain of approximately −3.91 dB was measured in 5500.00 MHZ, and the average gain of approximately −3.01 dB was measured in 5850.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the average gain of approximately −3.44 dB was measured in 2400.00 MHZ, the average gain of approximately −2.07 dB was measured in 2442.50 MHZ, and the average gain of approximately −2.58 dB was measured in 2485.00 MHZ. In Feed 2 of the multi-band antenna module 100, the average gain of approximately −1.14 dB was measured in 5150.00 MHZ, the average gain of approximately −1.88 dB was measured in 5500.00 MHZ, and the average gain of approximately −4.38 dB was measured in 5850.00 MHZ.
As described above, it may be seen that the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have the efficiency and the average gains, that is, a criterion or more, in both the first frequency band (i.e., the 2.4 GHz band) and the second frequency band (i.e., the 5 GHZ band) and satisfies an efficiency characteristic and an average gain characteristic that are required in the antenna for Wi-Fi.
As described above, the multi-band antenna module 100 according to an embodiment of the present disclosure satisfies all of antenna characteristics that are required for a common Wi-Fi antenna in the first frequency band and the second frequency band that were tested.
Referring to
In this case, the third pattern 341 may be formed simultaneously with the forming of the second lower clearance area 316. The fourth pattern 342 may be formed simultaneously with the forming of the second upper clearance area 315. That is, the third pattern 341 is formed by removing the metal layer and coverlay layer of areas except an area corresponding to the third pattern 341 in a process of forming the second lower clearance area 316. The fourth pattern 342 is formed by removing the metal layer and coverlay layer of areas except an area corresponding to the fourth pattern 342 in a process of forming the second upper clearance area 315.
Accordingly, the third pattern 341 may be formed as an island pattern within the second lower clearance area 316. The fourth pattern 342 may be formed as an island pattern within the third clearance area 315a of the second upper clearance area 315.
In Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 2.93 was measured in 2400.00 MHZ, the VSWR of approximately 2.26 was measured in 2442.50 MHZ, and the VSWR of approximately 1.80 was measured in 2485.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 2.33 was measured in 2400.00 MHZ, the VSWR of approximately 2.11 was measured in 2442.50 MHZ, and the VSWR of approximately 1.98 was measured in 2485.00 MHZ.
Meanwhile, in Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 1.56 was measured in 5150.00 MHZ, the VSWR of approximately 2.03 was measured in 5500.00 MHZ, and the VSWR of approximately 3.41 was measured in 5850.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the VSWR of approximately 1.89 was measured in 5150.00 MHZ, the VSWR of approximately 2.12 was measured in 5500.00 MHZ, and the VSWR of approximately 3.86 was measured in 5850.00 MHZ.
As described above, it may be seen that the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have the VSWRs, that is, a criterion or less, in all of the VSWRs of Feed 1 and Feed 2 in the first frequency band (i.e., the 2.4 GHz band) and the second frequency band (i.e., the 5 GHZ band) and satisfies the VSWR that is required for the antenna for Wi-Fi.
The multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have an S parameter value of approximately −10.1 dB in 2400.00 MHZ, to have an S parameter value of approximately −11.7 dB in 2442.50 MHZ, and to have an S parameter value of approximately −13 dB in 2485.00 MHZ.
Furthermore, the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have an S parameter value of approximately −18.4 dB in 5150.00 MHZ, to have an S parameter value of approximately −17.4 dB in 5500.00 MHZ, and to have an S parameter value of approximately −18.6 dB in 5850.00 MHZ.
As described above, it may be seen that the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have the S parameter values, that is, a criterion or less, in both the first frequency band (i.e., the 2.4 GHz band) and the second frequency band (i.e., the 5 GHZ band) and satisfies the isolation characteristic that is required for the antenna for Wi-Fi.
In Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the efficiency of approximately 46.51% was measured in 2400.00 MHZ, the efficiency of approximately 70.97% was measured in 2442.50 MHZ, and the efficiency of approximately 63.61% was measured in 2485.00 MHZ. In Feed 1 of the multi-band antenna module 100, the efficiency of approximately 72.46% was measured in 5150.00 MHZ, the efficiency of approximately 49.28% was measured in 5500.00 MHZ, and the efficiency of approximately 43.05% was measured in 5850.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the efficiency of approximately 36.40% was measured in 2400.00 MHZ, the efficiency of approximately 57.18% was measured in 2442.50 MHZ, and the efficiency of approximately 57.16% was measured in 2485.00 MHZ. In Feed 2 of the multi-band antenna module 100, the efficiency of approximately 74.89% was measured in 5150.00 MHZ, the efficiency of approximately 50.24% was measured in 5500.00 MHZ, and the efficiency of approximately 41.55% was measured in 5850.00 MHZ.
Meanwhile, in Feed 1 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the average gain of approximately −3.32 dB was measured in 2400.00 MHZ, the average gain of approximately −1.49 dB was measured in 2442.50 MHZ, and the average gain of approximately −1.96 dB was measured in 2485.00 MHZ. In Feed 1 of the multi-band antenna module 100, the average gain of approximately −1.40 dB was measured in 5150.00 MHZ, the average gain of approximately −3.07 dB was measured in 5500.00 MHZ, and the average gain of approximately −3.66 dB was measured in 5850.00 MHZ.
Furthermore, in Feed 2 of the multi-band antenna module 100 according to an embodiment of the present disclosure, the average gain of approximately −4.39 dB was measured in 2400.00 MHZ, the average gain of approximately −2.43 dB was measured in 2442.50 MHZ, and the average gain of approximately −2.43 dB was measured in 2485.00 MHZ. In Feed 2 of the multi-band antenna module 100, the average gain of approximately −1.26 dB was measured in 5150.00 MHZ, the average gain of approximately −2.99 dB was measured in 5500.00 MHZ, and the average gain of approximately −3.81 dB was measured in 5850.00 MHZ.
As described above, it may be seen that the multi-band antenna module 100 according to an embodiment of the present disclosure was measured to have the efficiency and the average gains, that is, a criterion or more, in both the first frequency band (i.e., the 2.4 GHz band) and the second frequency band (i.e., the 5 GHZ band) and satisfies the efficiency characteristic and the average gain characteristic that are required for the antenna for Wi-Fi.
As described above, the multi-band antenna module 100 according to an embodiment of the present disclosure satisfies all of antenna characteristics that are required for a common Wi-Fi antenna in the first frequency band and the second frequency band that were tested.
An example in which the multi-band antenna module 100 according to an embodiment of the present disclosure has been constructed by mounting the patch antenna 200 on the independent circuit board 300 has been described, but the present disclosure is not limited thereto and may be modified in various forms. For example, the multi-band antenna module 100 may be constructed by using the circuit board 300 of a wireless LAN card. That is, the circuit board 300 of the wireless LAN card is extended, and the circuit board 300 is constructed in an extended area. A manufacturer may manufacture, as a product, an assembly in which the circuit board 300 has been integrated with the wireless LAN card. In this case, a power feed line for the patch antenna 200 and the monopole antenna may be formed by further forming a clearance area in the ground area of the circuit board 300 and forming a power feed conductor in the clearance area.
A manufacturer may manufacture, as a product, an assembly in which a wireless LAN card and the multi-band antenna according to an embodiment of the present disclosure have been integrated by mounting the patch antenna 200 on the circuit board 300 formed in the wireless LAN card.
Furthermore, an example in which the multi-band antenna module 100 according to an embodiment of the present disclosure has the structure in which the circuit board 300 and the patch antenna 200 have been integrated has been described, but the present disclosure is not limited thereto and may be modified in various forms. For example, after manufacturers separately manufacture the circuit board 300 and the patch antenna 200 and then deliver the circuit board 300 and the patch antenna 200, the multi-band antenna module 100 may be generated by combining the circuit board 300 and the patch antenna 200. A manufacturer may generate the multi-band antenna module 100 in which the circuit board 300, the patch antenna 200, and a power feed cable have been manufactured as one assembly.
As described above, although the preferred embodiments according to the present disclosure have been described, it is understood that the present disclosure may be changed in various forms and a person having ordinary knowledge in the art to which the present disclosure pertains may practice variously modified examples and revised examples without departing from the claims of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2021-0109928 | Aug 2021 | KR | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/KR2022/012187 | 8/16/2022 | WO |
