The present invention relates generally to communication systems, and more particularly to receiver equalization circuitry utilized in such systems.
Many communication system receivers incorporate equalization circuitry. For example, equalization circuitry is commonly utilized in a receiver of a high-speed serializer/deserializer (SerDes) device to mitigate the effects of inter-symbol interference (ISI) caused by transmission over a bandwidth limited serial link. Such equalization circuitry may comprise a decision feedback equalizer (DFE), a linear equalizer (LEQ), or other type of equalizer, as well as combinations of multiple equalizers. Compared to a DFE, an LEQ typically exhibits reduced complexity, higher operating speed, lower power, and smaller circuit area.
It is known to make an LEQ tunable in order to accommodate various operating scenarios. An example of such an arrangement is disclosed in J. Choi et al., “A 0.18-m CMOS 3.5-Gb/s continuous-time adaptive cable equalizer using enhanced low frequency gain control method,” IEEE Journal of Solid-State Circuits, pp. 419-425, Vol. 39, No. 3, March 2004. However, in arrangements such as this, it may be necessary to manually set certain LEQ parameters in the factory, which requires additional testing and thereby increases the cost of the associated device. Also, the use of these pre-set parameters can lead to sub-optimal performance in the presence of typical variations in environmental conditions, such as voltage, temperature and link characteristics, that can arise when the device is deployed in the field.
Other examples of conventional LEQ arrangements are disclosed in U.S. Patent Application Publication No. 2007/0018694, entitled “High-Speed CML Circuit Design,” which is commonly assigned herewith and incorporated by reference herein, and J. Chen et al., “Electrical backplane equalization using programmable analog zeros and folded active inductors,” IEEE Transactions on Microwave Theory and Techniques, pp. 1459-1466, Vol. 55, No. 7, July 2007.
Known SerDes devices that incorporate adaptive LEQs include the HyperPHY™ and GigaBlaze™ families of SerDes devices commercially available from LSI Corporation of Milpitas, Calif., U.S.A.
Although equalization circuitry of the type mentioned above can provide significant ISI reduction in many practical applications, a need remains for further enhancements in the design of LEQs and other types of equalizers.
Illustrative embodiments of the present invention meet the above-noted need by providing techniques for multi-band gain adaptation in an LEQ using an approximate frequency separation approach.
In accordance with one aspect of the invention, a receiver includes equalization circuitry implementing at least first and second gain adaptation loops associated with respective first and second frequency bands. The equalization circuitry is operative to identify a pattern in a portion of a received serial data stream, and to perform gain adaptation for the receiver utilizing a particular one of the gain adaptation loops responsive to the identified pattern. For example, the gain adaptation may be performed utilizing a low frequency gain adaptation loop if the detected pattern is of a first type generally associated with a low frequency band, and may be performed utilizing a high frequency gain adaptation loop if the detected pattern is of a second type generally associated with a high frequency band.
In accordance with another aspect of the invention, the equalization circuitry comprises an equalizer configured to receive the serial data stream, a latch array having an input coupled to an output of the equalizer, first and second gain adaptation elements arranged within the respective first and second gain adaptation loops and coupled between an output of the latch array and respective control inputs of the equalizer, and selection circuitry configured to selectively activate at least one of the first and second gain adaptation elements responsive to a particular operating mode of the equalization circuitry.
For example, the equalization circuitry may be operable in a serial equalization mode in which the first and second gain adaptation elements are activated in a particular serial order. There may be at least two distinct serial equalization modes, including a first serial equalization mode in which the first gain adaptation element is activated to allow the first gain adaptation loop to perform gain adaptation for the first frequency band prior to the second gain activation element being activated to allow the second gain adaptation loop to perform gain adaptation for the second frequency band, and a second serial equalization mode in which the second gain adaptation element is activated to allow the second gain adaptation loop to perform gain adaptation for the second frequency band prior to the first gain activation element being activated to allow the first gain adaptation loop to perform gain adaptation for the first frequency band.
The equalization circuitry may also be operable in a parallel equalization mode in which the first gain adaptation element is activated to allow the first gain adaptation loop to perform gain adaptation for the first frequency band substantially simultaneously with the second gain activation element being activated to allow the second gain adaptation loop to perform gain adaptation for the second frequency band.
Other operating modes are possible. For example, the equalization circuitry may be further operable in a single-band equalization mode in which only a designated one of the first and second gain adaptation elements is activated to allow its corresponding gain adaptation loop to perform gain adaptation for the associated frequency band.
The first and second gain adaptation elements may comprise respective first and second gain adaptation state machines, portions of which may be implemented in the form of software stored in a memory and executed by a processor.
The gain adaptation performed by a given one of the first and second gain adaptation loops is responsive to detection of one or more designated patterns in the serial data stream. For example, the first and second gain equalization elements may apply respective first and second sets of pattern identification rules to one or more portions of the serial data stream as stored in the latch array in order to detect patterns associated with the respective first and second frequency bands. The first set of rules utilized by the first gain adaptation element to detect patterns associated with the first frequency band may include at least one of a low frequency exact rule and first and second low frequency approximate rules. Similarly, the second set of rules utilized by the second gain adaptation element to detect patterns associated with the second frequency band may include at least one of a high frequency exact rule and first and second high frequency approximate rules. Numerous other types of pattern identification rules may be used to provide approximate frequency separation between the first and second gain adaptation loops.
The illustrative embodiments provide improved receiver equalization relative to conventional approaches, while avoiding the costs and performance limitations commonly associated with manual tuning of LEQ parameters. For example, the self-adaptive equalization provided in the illustrative embodiments can allow a given SerDes or other communication device to operate at a higher data rate than would otherwise be possible.
The invention will be illustrated herein in conjunction with exemplary communication systems, receivers and equalization circuitry. It should be understood, however, that the invention is more generally applicable to other types of communication systems and receivers, and may be implemented using other arrangements of equalization circuitry. For example, the techniques disclosed herein can be adapted in a straightforward manner for use in any communication system comprising one or more serial links in which it is desirable to provide improved equalization so as to facilitate operation at high data rates.
The nodes 102 and 104 may be configured to communicate over serial link 105 in accordance with a known serial communication standard, such as Fibre Channel. Fibre Channel is an American National Standards Institute (ANSI) standard specifying a bidirectional serial data channel, structured for high performance capability. Physically, the Fibre Channel may be viewed as an interconnection of multiple communication points, called N_Ports, interconnected by a link comprising a switching network, called a fabric, or a point-to-point link. Fibre is a general term used to cover all physical media types supported by the Fibre Channel standard, such as optical fibre, twisted pair, and coaxial cable. Additional details regarding these and other aspects of Fibre Channel can be found in the ANSI Fibre Channel standard documents, including the FC-PH, FC-FS, FC-AL-2, FC-PI, FC-DA, FC-MI and FC-LS documents, all of which are incorporated by reference herein.
It is to be appreciated, however, that the present invention can be implemented in communication systems that include other types of serial links, including, for example, serial links configured in accordance with standards such as InfiniBand, IEEE 1394, PCI-Express, Ethernet, Serial Attached SCSI (SAS), Serial Advanced Technology Attachment (SATA), SONET/SDH, etc.
A given one of the nodes 102 or 104 may be configured to operate as a backplane in an illustrative embodiment of the invention. Such a backplane may be used, for example, to interconnect multiple switches, application-specific integrated circuits (ASICs), hard disk drives (HDDs) or other system elements.
The nodes 102, 104 may be viewed as examples of what are more generally referred to herein as communication devices. Such devices may comprise, for example, a SerDes device of the type previously mentioned herein.
A given node may comprise or be part of another type of communication device, such as a router, switch, computer, server, etc. Conventional aspects of such communication devices are well known and therefore not described in detail herein.
Although only two nodes are shown in
Also, a full duplex arrangement of the type illustrated in
As will be described in greater detail below, the receivers 102R and 104R in the
Also included in the receiver 102R or 104R is a processor 204 coupled to a memory 206. The processor 204 is coupled to the equalization circuitry 200. The memory 206 may be configured to store one or more parameters of the above-noted gain adaptation loops. Such loops and other portions of the equalization circuitry 200 may be operated at least in part under control of the processor. The memory 206 may therefore store program code that is executed by the processor to implement at least a portion of an equalization process carried out by the receiver. The memory is an example of what is more generally referred to herein as a computer-readable medium or other type of computer program product having computer program code embodied therein, and may comprise, for example, electronic memory such as RAM or ROM, magnetic memory, optical memory, or other types of storage devices in any combination. The processor 204 may comprise a microprocessor, CPU, ASIC, FPGA or other type of processing device, as well as portions or combinations of such devices. In other embodiments, at least a portion of the equalization circuitry may be implemented within the processor. Alternatively, the processor may implement at least a portion of the equalization circuitry. It should therefore be apparent that an equalization technique in accordance with the present invention may be implemented using various combinations of hardware, software and firmware.
The operation of the equalization circuitry 200 will now be described in greater detail with reference to
An illustrative dual-band embodiment of the equalization circuitry 200 of
The eye latch array 302 is assumed without limitation to utilize a 2-UI sampling arrangement, where UI denotes unit interval. In a so-called “bang-bang” type of eye latch array, an example of which is illustrated in
The equalization circuitry 200 further comprises a low frequency equalization (LFEQ) state machine 304L, a high frequency equalization (HFEQ) state machine 304H, a clock-and-data recovery (CDR) unit 306, and a decision feedback equalizer (DFE) 308. The LFEQ and HFEQ state machines 304L and 304H have respective enable switches 310L and 310H associated therewith. The switches 310L and 310H apply enable signals to respective enable inputs of the LFEQ and HFEQ state machines 310L and 310H, with each such switch being controlled responsive to a status signal generated by the opposite state machine. That is, the switch 310L is controlled by a status signal generated by the HFEQ state machine 310H, and the switch 310H is controlled by a status signal generated by the LFEQ state machine 310L.
The switches 310L and 310H may be viewed as examples of what is more generally referred to herein as “selection circuitry.” Such selection circuitry in other embodiments may be incorporated into other elements of the equalization circuitry 200, such as one or both of the state machines 304L and 304H.
The CDR 306 and DFE 308 may each be configured in a well-known conventional manner, and their operation will therefore not be described in detail herein. In one possible alternative embodiment, the DFE 308 may be eliminated, such that the equalization circuitry comprises only a single equalizer, namely, the LEQ 300.
The output of the eye latch array 302 is coupled to respective inputs of the LFEQ state machine 304L, the HFEQ state machine 304H, the CDR 306 and the DFE 308. The LFEQ and HFEQ state machines 304L and 304H are also referred to herein as simply the LFEQ and the HFEQ, respectively. The LFEQ and HFEQ are configured in the present embodiment to implement the above-noted approximate frequency separation approach. This approach utilizes pattern identification to separate a high frequency gain adaptation loop from a low frequency gain adaptation loop. The low frequency gain adaptation loop comprises the LEQ 300, the eye latch array 302 and the LFEQ 304L, with the LFEQ providing an n-bit control signal CNT1 to a first control input of the LEQ. The high frequency gain adaptation loop comprises the LEQ 300, the eye latch array 302 and the HFEQ 304H, with the HFEQ providing an m-bit control signal CNT2 to a second control input of the LEQ.
The two gain adaptation loops in the present embodiment are independent of each other, thus permitting at least four useful adaptation configurations, referred to herein as serial low frequency and high frequency adaptation (SLHA), serial high frequency and low frequency adaptation (SHLA), parallel adaptation (PA), and high frequency only adaptation (HA). The SLHA, SHLA, PA and HA configurations are illustrated in the respective flow diagrams of
It should be noted that the use of two separate gain adaptation frequency bands in the
It should also be appreciated that the particular arrangement of circuit elements shown in
The general operation of the SLHA, SHLA, PA and HA gain adaptation configurations of the
In step 402, the low frequency gain adaptation is performed using control signal CNT1 as described in greater detail in Section 4 below. Upon completion of the low frequency gain adaptation in step 402, or upon expiration of the LFEQ timer in step 404, the LFEQ portion of the process is determined to be complete in step 406, and the process then moves to step 408, where the LFEQ status is set to a logic one value, and an HFEQ timer is enabled.
In step 410, the high frequency gain adaptation is performed using control signal CNT2 as described in greater detail in Section 5 below. Upon completion of the high frequency gain adaptation in step 410, or upon expiration of the HFEQ timer in step 412, the HFEQ portion of the process is determined to be complete in step 414, and the process then moves to step 416, where the HFEQ status is set to a logic one value, and an LEQ status indicator is set to indicate that both the LFEQ and HFEQ portions of the process are complete.
In step 502, the high frequency gain adaptation is performed using control signal CNT2 as described in greater detail in Section 5 below. Upon completion of the high frequency gain adaptation in step 502, or upon expiration of the HFEQ timer in step 504, the HFEQ portion of the process is determined to be complete in step 506, and the process then moves to step 508, where the HFEQ status is set to a logic one value, and the LFEQ timer is enabled.
In step 510, the low frequency gain adaptation is performed using control signal CNT1 as described in greater detail in Section 4 below. Upon completion of the low frequency gain adaptation in step 510, or upon expiration of the LFEQ timer in step 512, the LFEQ portion of the process is determined to be complete in step 514, and the process then moves to step 516, where the LFEQ status is set to a logic one value, and the LEQ status indicator is set to indicate that both the LFEQ and HFEQ portions of the process are complete.
In step 602, the high frequency gain adaptation is performed using control signal CNT2 as described in greater detail in Section 5 below. Upon completion of the high frequency gain adaptation in step 602, or upon expiration of the HFEQ timer in step 604, the HFEQ portion of the process is determined to be complete in step 606, and the HFEQ portion of the process then moves to step 608, where the HFEQ status is set to a logic one value.
The low frequency gain adaptation in
In step 620, a determination is made as to whether or not both the HFEQ status and the LFEQ status are equal to the logic one value. If both the HFEQ and LFEQ status are equal to the logic one value, the LEQ status indicator is set in step 622 to indicate that both the LFEQ and HFEQ portions of the process are complete.
In step 702, the high frequency gain adaptation is performed using control signal CNT2 as described in greater detail in Section 5 below. Upon completion of the high frequency gain adaptation in step 702, or upon expiration of the HFEQ timer in step 704, the HFEQ portion of the process is determined to be complete in step 706. The process then moves to step 708, where the HFEQ status is set to a logic one value, and the LEQ status indicator is set to indicate that the HFEQ portion of the process is complete.
It is to be appreciated that the particular process steps shown in
Referring initially to
where VOUT=Voutp−Voutn, VIN=Vinp−Vinn, and
is the low frequency or DC gain of the LEQ and is tunable through the variable resistance element REQ. The capacitance CLOAD denotes a load capacitance of the LEQ as shown in
The LEQ 300 of
Conventional aspects of the operation of LEQs similar to those shown in
In each of the LEQs 300 of
The least significant bit of the control signal CNT1 controls the switch that is in parallel with the resistor having value R, and the most significant bit of the control signal CNT1 controls the switch that is in parallel with the resistor having value 2n-1R. More particularly, if a given one of the bits of the control signal CNT1 has a logic zero value, its inverted value is a logic one, such that the switch is closed and the corresponding resistor is shorted out, thereby reducing the value of the variable resistance element REQ. Accordingly, the minimum value of the variable resistance element is RMIN, when all switches of the resistor array are closed, and the maximum value of the variable resistance element is the sum of the individual resistor values, including RMIN, when all switches of the resistor array are open. Resistance values between these minimum and maximum resistance values are achieved by appropriate setting of the bits of the control signal CNT1.
The least significant bit of the control signal CNT2 controls the MOS transistor that is in series with the capacitor having value C, and the most significant bit of the control signal CNT2 controls the MOS transistor that is in series with the capacitor having value 2m-1C. More particularly, if a given one of the bits of the control signal CNT2 has a logic zero value, the associated N-type MOS transistor is off and the corresponding capacitor is open circuited, thereby reducing the value of the variable capacitance element CEQ. Accordingly, the minimum value of the variable capacitance element is CMIN, when all MOS transistors of the capacitor array are off, and the maximum value of the variable capacitance element is the sum of the individual capacitance values, including CMIN, when all MOS transistors of the capacitor array are on. Capacitance values between these minimum and maximum capacitance values are achieved by appropriate setting of the bits of the control signal CNT2.
It should be noted that the use of binary weighted control as illustrated in
It should be understood that the particular LEQ circuitry and associated control signal formats described above are examples only, and alternative embodiments may utilize other types of LEQ circuitry and control signal formats. For example, the LEQ 300 may be replaced with another type of analog equalizer. Alternative analog equalizers suitable for use in embodiments of the invention need not be linear, but will generally exhibit a monotonic response to one or more applied control signals.
Section 3. Approximate Frequency Separation through Pattern Identification
As noted previously, the equalization circuitry 300 in the illustrative embodiment is configured to achieve approximate frequency separation between low frequency and high frequency gain adaptation through the use of pattern identification. Such an approach is advantageous in that it avoids the need for costly circuit components such as low-pass and high-pass filters.
It is known that frequency information is embedded in a non-return-to-zero (NRZ) serial data stream in the form of signal transitions between logic one and zero values. For example, a high transition density data stream contains more high frequency content than a low transition density data stream. Similarly, a low transition density data stream contains more low frequency content than a high transition density data stream. See, for example, the compliance jitter tolerance (CJT) test patterns specified in the above-noted Fibre Channel standards.
The present embodiment utilizes pattern identification rules to approximately classify portions of a received data stream based on frequency content and to control selection of low frequency or high frequency gain adaptation for those portions.
The pattern identification rules in this embodiment include a high frequency pattern identification exact rule, two high frequency pattern identification approximate rules, a low frequency pattern identification exact rule, and two low frequency pattern identification approximate rules. These pattern identification rules are defined as follows:
High frequency pattern identification exact rule: A single pulse is a bit pattern with high frequency content. Signal transitions occur before and after the signaling bit. The bit pattern is matched to a bit sequence of one or more preceding bits of the same value, one signaling bit of the opposite value, and one or more succeeding bits of the same value as the preceding bits.
High frequency pattern identification approximate rule 1: A bit with the opposite value as one or more preceding bits is an approximate bit pattern with high frequency content. There is a signal transition at the leading edge of the signaling bit.
High frequency pattern identification approximate rule 2: A bit with the opposite value as one or more succeeding bits is an approximate bit pattern with high frequency content. There is a signal transition at the trailing edge of the signaling bit.
Low frequency pattern identification exact rule: A bit with the same value as one or more preceding bits and one or more succeeding bits is an exact bit pattern with low frequency content. There are no signal transitions at the leading edge and the trailing edge of the signaling bit.
Low frequency pattern identification approximate rule 1: A bit with the same value as one or more preceding bits is an approximate bit pattern with low frequency content. There is no signal transition at the leading edge of the signaling bit.
Low frequency pattern identification approximate rule 2: A bit with the same value as one or more succeeding bits is an approximate bit pattern with low frequency content. There is no signal transition at the trailing edge of the signaling bit.
In general, high or low frequency pattern identification approximate rule 1 has the simplest implementation since it only requires checking of the previously received bits.
Although these are the rules used to identify patterns for selection of low frequency or high frequency gain adaptation in the present embodiment, other embodiments may utilize only a subset of these rules, or one or more alternative rules. For example, it is possible to use just one of the three rules in each of the sets above.
It should be noted that a given signaling bit may satisfy both a low frequency approximate rule and a high frequency approximate rule. In such a situation, one may flexibly determine to apply both low and high frequency adaptation, either low or high frequency adaptation, or neither low nor high frequency adaptation. The latter approach is also referred to herein as “exclusion.”
The data latches D0 and D1 are used for the first and second UIs, respectively. Similarly, the transition latches T0 and T1 are also used for the respective first and second UIs. The data latches and transition latches have a zero-volt amplitude offset as indicated in the figure, and a given data latch is arranged 90 degrees apart in phase relative to its adjacent transition latches. Both the phase and amplitude offset of the roaming latch RL are adjustable to assist in eye capture. Data latch D2 represents a subsequent use of data latch D0 for another portion of the serial data stream and is therefore also identified as D0′ in the figure.
In a typical implementation, the latches of the latch array are interconnected in parallel, with the data input of each latch being connected to the output of the LEQ 300, and each latch being clocked by a clock signal having a different phase. More particularly, the clock signals applied to the various latches are separated in phase by 90 degrees relative to one another. Each latch therefore captures the same input signal but at different points in time. The term “latch array” as used herein is intended to be construed broadly so as to encompass such parallel arrangements of multiple data and transition latches, as well as other arrangements of latches.
Alternative embodiments of the eye latch array 302 may include different numbers of data, transition and roaming latches, as will be appreciated by those skilled in the art. For example, as mentioned previously herein, the eye latch array in the
An exemplary low frequency gain adaptation will now be described in greater detail with reference to the flow diagrams of
Referring now to
The difference between the preset value of the low frequency adaptation control signal CNT1 and the average roaming latch value Ravg is determined in step 1408. If this difference is within a specified range, the process moves to step 1410 to determine whether the direction is the same as previously set, initially a logic zero value. If the direction is the same, it is updated to the inverse of Ravg, and the control signal CNT1 is decremented by Ravg, as indicated in step 1412, and the process then returns to step 1402 to process additional data. If the direction is not the same, Ravg is checked in step 1414 and, if equal to −1, the direction is updated to Ravg and the control signal CNT1 is decremented by Ravg, as indicated in step 1416, and the status is then set to a logic one value in step 1418. If Ravg when checked in step 1414 is equal to +1, the status is set to a logic one value in step 1418, and the process ends. If the difference determined in step 1408 is outside of the specified range, the process moves directly to step 1418 to update the status as indicated.
The size variable in step 1406 refers to a maximum number of bits to be accumulated, and thus controls the feedback duration. It may be thought of as a type of timer. As indicated in step 1406, the roaming latch value RS can take on values of +1 or −1. Assume the size variable is set to 100, indicating that 100 bits are to be accumulated. If the number of +1 values and the number of −1 values are in balance, with 50 of each value, the average value will be zero. However, if the numbers of values are unbalanced, with for instance 70 of the +1 values and 30 of the −1 values, then the average value is +40. This represents an over-equalized condition, and the control signal applied to the LEQ 300 is adjusted accordingly to try to achieve a balance between the +1 and −1 values. Generally, a larger size increases measurement accuracy, but also slows down the update cycle.
The step variable in step 1406 provides a guard range for measurement values. It is a type of divide function and if limited to factors of two it can be implemented efficiently by simply shifting bits. By way of example, if step=4, measurements comprising values of +3, +1, −2 and so on will all yield an Ravg value of zero after dividing by the step, and will be considered to indicate proper equalization. However, if the measurement falls outside of the specified step range, the process will adjust the control signal accordingly.
The final gain reverse in steps 1414 and 1416 is optional and may be bypassed as indicated by the dashed line in the figure. This gain reverse is applied to ensure that the LEQ 300 does not introduce excessive high frequency gain.
As noted previously,
The sum of the preset value of the low frequency adaptation control signal CNT1 and the average roaming latch value Ravg is determined in step 1508. If this difference is within a specified range, the process moves to step 1510 to determine whether the direction is the same as previously set, initially a logic zero value. If the direction is the same, it is updated to the value of Ravg, and the control signal CNT1 is incremented by Ravg, as indicated in step 1512, and the process then returns to step 1502 to process additional data. If the direction is not the same, Ravg is checked in step 1514 and, if equal to +1, the direction is updated to the inverse of Ravg and the control signal CNT1 is incremented by Ravg, as indicated in step 1516, and the status is then set to a logic one value in step 1518. If Ravg when checked in step 1514 is equal to −1, the status is set to a logic one value in step 1518, and the process ends. If the difference determined in step 1508 is outside of the specified range, the process moves directly to step 1518 to update the status as indicated. As in the
The low frequency gain adaptation in
A given embodiment may involve performing both the PPF and the NPF. For example, these two processes may be performed in series. The difference in the gain control values from these two polarities may indicate a DC offset condition when a DC-balanced pattern is received for a sufficiently long observation window. This DC offset can be further optimized away until gain control values from both polarities agree with each other. Alternatively, an average of the two gain control values may be used.
It is also possible to perform the PPF and the NPF in parallel. This can be achieved by configuring the eye latch array 302 to include dual roaming latches (RL+ and RL−). Such an arrangement would generally provide faster convergence of the low frequency gain adaptation.
An exemplary high frequency gain adaptation will now be described in greater detail with reference to the flow diagram of
The high frequency gain adaptation process begins in step 1600 by setting direction and status variables to logic zero values. In step 1602, a determination is made as to whether a check of one or more of the above-noted high frequency pattern identification rules indicates the presence of high frequency content. Depending on which of the rules when checked indicates the presence of high frequency content, the process moves to either step 1604, step 1606 or step 1608, which correspond to the exact rule and the first and second approximate rules, respectively. A variable W is updated in a different way in each of these steps, depending on the contents of the data latch D1 and the transition latches T0 and T1. More specifically, in step 1604, W is set to +1 if the sign of T0 and T1 is not equal to that of D1, to −1 if the sign of T0 and T1 is equal to D1, and to 0 otherwise. In step 1606, W is set to +1 if the sign of T0 is not equal to that of D1, and to −1 if the sign of T0 is equal to that of D1. Similarly, in step 1608, W is set to +1 if the sign of T1 is not equal to that of D1, and to −1 if the sign of T1 is equal to that of D1. In step 1610, an average value Wavg is determined as the sign of the sum of W and a specified size, to the extent the sum is much greater than a specified step.
The sum of the preset value of the low frequency adaptation control signal CNT2 and the average value Wavg is determined in step 1612. If this difference is within a specified range, the process moves to step 1614 to determine whether the direction is the same as previously set, initially a logic zero value. If the direction is the same, it is updated to the value of Wavg, and the control signal CNT2 is incremented by Wavg, as indicated in step 1616, and the process then returns to step 1602 to process additional data. If the direction is not the same, Wavg is checked in step 1618 and, if equal to −1, the direction is updated to the inverse of Wavg and the control signal CNT2 is incremented by Wavg, as indicated in step 1620, and the status is then set to a logic one value in step 1622. If Wavg when checked in step 1618 is equal to +1, the status is set to a logic one value in step 1622, and the process ends. If the difference determined in step 1612 is outside of the specified range, the process moves directly to step 1622 to update the status as indicated. As in the
The high frequency gain adaptation in
Four exemplary use cases were tested to demonstrate the performance advantages of illustrative embodiments of the present invention. These cases are denoted Case 1 through Case 4 in the following description.
Each of these cases illustrates the eye diagram improvement attributable to use of an embodiment of the serial low frequency and high frequency adaptation (SLHA) of
Case 1 illustrates application of SLHA to an under-equalized input data signal having a partially-closed eye diagram.
Case 2 illustrates application of SLHA to an input data signal with an open eye diagram.
Case 3 illustrates application of SLHA to an under-equalized input data signal having a completely closed eye diagram.
Case 4 illustrates application of SLHA to an over-equalized input data signal.
Although the results above are illustrated for an SLHA embodiment, it is expected that similar improvements in data signal eye diagrams will be achieved in SHLA embodiments as well as other embodiments.
Illustrative embodiments of the invention as described above provide a number of significant advantages over conventional techniques. For example, these embodiments are self-adaptive and therefore avoid the costs and performance limitations commonly associated with use of manual tuning of LEQ parameters. The self-adaptive equalization provided in the illustrative embodiments can therefore allow a given SerDes or other communication device to operate at a higher data rate than would otherwise be possible. The use of approximate frequency separation based on pattern recognition is simpler and less costly than approaches that rely on separation of frequency bands by filtering. Also, the use of independent low frequency and high frequency gain adaptation loops provides a flexible implementation that can be readily implemented in a communication device integrated circuit.
A receiver with equalization circuitry in accordance with the invention may be implemented in the form of one or more integrated circuit devices suitable for installation on a board or card of an otherwise conventional communication device.
In a given such integrated circuit implementation, identical die are typically formed in a repeated pattern on a surface of a semiconductor wafer. Each die includes at least a portion of testing system as described herein, and may include other structures or circuits. The individual die are cut or diced from the wafer, then packaged as an integrated circuit. One skilled in the art would know how to dice wafers and package die to produce integrated circuits. Integrated circuits so manufactured are considered part of this invention.
It should again be emphasized that the particular exemplary receiver configurations shown in
These and numerous other alternative embodiments within the scope of the following claims will be readily apparent to those skilled in the art.