Thermal or infrared imaging systems are widely used in a variety of commercial and military applications. These systems generally employ focal plane array (FPA) imaging sensors in which either cryogenically cooled materials (e.g., Indium-Antimonide, Mercury-Cadmium-Telluride) or room temperature devices (e.g., microbolometers) are used as detector pixel elements in a two dimensional array. Microbolometers have the advantage of operating at room temperature without the need for and complexity of cryogenic cooling. The two-dimensional focal plane array absorbs and measures incoming infrared radiation from a scene of interest into electrical signals that are applied to a readout integrated circuit (ROIC). After amplification, desired signal shaping and processing, the resulting signals can be further processed as desired to provide an image of the scene of interest.
In many applications it is desirable to capture infrared imagery in multiple spectral bands, for example in the short-wave infrared spectrum (from approximately 1.1 to 3 micrometers), mid-wave infrared spectrum (from approximately 3 to 7 micrometers), and long-wave infrared spectrum (from approximately 7 to 15 micrometers). Commercially available spectrally selective, band-pass filters may be used to “divide up” the incident infrared radiation into the spectral bands of interest. However, using such uncooled commercial filters with typical lower F-number optical systems may pose challenges as the filters only transmit over a certain spectral range (the band-pass), but reflect or emit radiation at all other regions of the spectrum. Therefore, if a band-pass filter is placed in front of an imaging sensor, the image is degraded by parasitic background radiation from both the emission of the filter and the reflection off of the filter. Accordingly, to obtain desired image quality and sensitivity, most conventional multi-spectral infrared imaging systems use cryogenically cooled FPA sensors, along with cooled individual optical band-pass filters or multiple filters in a cooled filter wheel. As a consequence, these systems have increased size, weight, power, and cost (SWAP-C), due to the need for a cooler and to provide thermal rejection paths.
Aspects and embodiments are directed to optical systems capable of providing collection of thermal infrared multispectral and/or polarimetric data using an uncooled, low size, weight, power, and cost (SWAP-C) sensor.
According to one embodiment, an infrared imaging system comprises imaging optics configured to receive and focus infrared radiation from a scene towards a focal plane of the infrared imaging system, an uncooled focal plane array sensor configured to receive the infrared radiation from the imaging optics, the uncooled focal plane array sensor including a two-dimensional array of microbolometer pixels and a corresponding two-dimensional filter array integrated and aligned with the two-dimensional array of microbolometer pixels such that each microbolometer pixel has a corresponding filter, the filter array being configured to filter the infrared radiation into at least two spectral bands or at least two polarizations, and a processor coupled to the uncooled focal plane array sensor and configured to receive and process image data received from the uncooled focal plane array sensor.
In one example, the filter array is arranged in a repeating pattern of super-pixels, each super-pixel corresponding to a 2×2 group of the microbolometer pixels. In one example, the filter array includes a polarimetric filter configured such that, for each super-pixel, the array of microbolometer pixels measures irradiance, linear +45° polarization, linear horizontal polarization, and circular polarization. In another example, the filter array is a spectral filter configured to filter the infrared radiation into three spectral bands, including an MWIR band, a first LWIR band, and a second LWIR band. In another example, each super-pixel includes two MWIR filters, one filter for the first LWIR band, and one filter for the second LWIR band. In another example, the filter array is a polarimetric filter configured to filter the infrared radiation into four polarizations, and wherein each super-pixel includes one filter for each of the four polarizations. The four polarizations may include 0°, 30°, 60°, and 90° linear polarizations, for example. In another example, the filter array includes a spectro-polarimetric filter configured to filter the infrared radiation both spectrally and polarimetrically into vertical and horizontal polarization and into the at least two spectral bands.
The infrared imaging system may further comprise an array of microlenses positioned between the imaging optics and the uncooled focal plane array sensor, the array of microlenses being configured to spread each ray of the infrared radiation over at least a 2×2 group of the microbolometer pixels.
In one example, the uncooled focal plane array sensor is disposed away from the focal plane such that the infrared radiation is defocused at the uncooled focal plane array sensor and each ray of the infrared radiation is spread over at least a 2×2 group of the microbolometer pixels.
The infrared imaging system may further comprise a display coupled to the processor, the display being configured to receive processed image data from the processor and to display a representation of the scene based on the processed image data.
Still other aspects, embodiments, and advantages of these exemplary aspects and embodiments are discussed in detail below. Embodiments disclosed herein may be combined with other embodiments in any manner consistent with at least one of the principles disclosed herein, and references to “an embodiment,” “some embodiments,” “an alternate embodiment,” “various embodiments,” “one embodiment” or the like are not necessarily mutually exclusive and are intended to indicate that a particular feature, structure, or characteristic described may be included in at least one embodiment. The appearances of such terms herein are not necessarily all referring to the same embodiment.
Various aspects of at least one embodiment are discussed below with reference to the accompanying figures, which are not intended to be drawn to scale. The figures are included to provide illustration and a further understanding of the various aspects and embodiments, and are incorporated in and constitute a part of this specification, but are not intended as a definition of the limits of the invention. In the figures, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every figure. In the figures:
Aspects and embodiments are directed to a multi-spectral and/or polarimetric infrared imaging system that combines integrated, pixel-level filtering and optical anti-aliasing techniques to provide collection of thermal infrared multispectral and/or polarimetric data using a low size, weight, power, and cost (SWAP-C) sensor. Techniques and systems discussed herein eliminate the need for the cryocooler assembly associated with many conventional thermal multi-spectral imaging systems, and enable sensors for applications where size, weight, power, and cost are significant limiting factors, such as man-portable applications, small unmanned aerial vehicles, commercial medical imaging, and the like. As discussed in more detail below, certain embodiments use mid-wave infrared (MWIR) and long-wave infrared (LWIR) spectral filter and/or polarimetric filters that are integrated into the microbolometer array, unlike conventional multi-spectral systems that use a single or interchangeable filter positioned in front of the detector array. Additionally, certain aspects and embodiments apply intentional defocusing, and/or use a microlens array associated with the microbolometer array, to prevent aliasing, and leverage image reconstruction algorithms previously used for visible-spectrum RGB (red, green, blue) demosaicing to produce high quality thermal infrared image data.
It is to be appreciated that embodiments of the methods and apparatuses discussed herein are not limited in application to the details of construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. The methods and apparatuses are capable of implementation in other embodiments and of being practiced or of being carried out in various ways. Examples of specific implementations are provided herein for illustrative purposes only and are not intended to be limiting. Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use herein of “including,” “comprising,” “having,” “containing,” “involving,” and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. References to “or” may be construed as inclusive so that any terms described using “or” may indicate any of a single, more than one, and all of the described terms.
Referring to
The imaging optics 110 direct incident electromagnetic radiation 150 radiated from a scene towards microbolometer array 120. The imaging optics 110 may include any of a variety of different types of lenses and/or reflective surfaces (e.g., minors) configured to focus and direct electromagnetic radiation from the scene towards the microbolometer array 120. The optical elements (e.g., minors and/or lenses) making up the imaging optics 110 may include or be made of materials suitable for operation of the system in at least a portion of the infrared spectrum, for example, in the MWIR and/or LWIR spectral bands. In certain examples, the imaging optics 110 have a low F-number, for example, an F-number of about 1. A processor 160 receives image data from the microbolometer array 120, and may perform various image processing functions to produce one or more images of the scene. The image data is then sent to a display 170 to generate an image representing the scene. The display 170 may comprise a dedicated display or a display of a computer, for example. The image may include a portion that represents a target object in the scene. The display 170 may be a “realtime” display that displays false color imagery of the scene to an operator. In certain examples, the display 170 may also display object detections or classifications (e.g., natural vs. man-made) overlaid with the imagery. This information (detections, classifications, etc.) may be computed by the processor 160 and provided to the display 170 with the image data.
In certain applications, the filter array arrangement illustrated in
Other embodiments may use other filter arrangements. The microbolometers in the microbolometer array may provide wide (e.g., approximately 2-20 μm) spectral sensitivity. Accordingly, in other embodiments, the filter array 130 may include short-wave infrared (SWIR) and/or multiple MWIR spectral bandpass filters. Such an arrangement may provide an imaging system that is sensitive to both solar reflected and thermal emitted light, for example.
According to one embodiment, standard image reconstruction algorithms may be used to apply “demosaicing” and produce complete images in each of the measured spectral bands. Due to the integrated filter array, each pixel in the sensor 200 measures only one spectral band. Accordingly, each image frame from the array 200 includes a “mosaic” of spatially separated regions corresponding to the different spectral bands that matches the filter array pattern. Referring to
The examples of
Other embodiments may use other filter array arrangements. For example, another embodiment, the filter array 130 may include all linear polarization filters, such as a 2×2 super-pixel array (similar to that shown in
As discussed above, in other embodiments, the filter array 130 may include a combination of polarimetric filters and spectral filters. For example, referring to
As discussed above, certain aspects and embodiments apply intentional defocusing, and/or use a microlens array associated with the microbolometer array, to prevent aliasing when interpolating the data between spatially separated pixels. Typically, it is desirable to have the image of a point of light be very tight or focused sharply on the focal plane array, so as to obtain a high resolution image. However, this feature may cause aliasing when demosaicing data from a focal plane array that includes an integrated pixelated filter array 130 according to embodiments discussed herein. For example, if a very small point of MWIR light falls only on a pixel with an LWIR 1 filter, the information contained in that point will be lost and cannot be recovered during the demosaicing process. Accordingly, to avoid aliasing errors during the demosaicing process (that interpolates the data between pixels), it is desirable to have a system with an optical sampling ratio, Q, equal to 2 (representing a system that Nyquist samples the optical information). However, typical microbolometer array systems have Q values of less than or equal to 1, as shown in the examples in Table 1 below. The Q of the system is defined by Equation (4):
In Equation (4), λ is the center wavelength in the spectral band of operation, and p is the pixel pitch.
To address this issue and avoid aliasing, embodiments of the imaging system may be configured to intentionally defocus the incoming electromagnetic radiation, so as to spread the radiation over multiple pixels in each array dimension. For example, referring to
Thus, aspects and embodiments may provide a multi-band imaging system that incorporates an uncooled microbolometer array with an integrated spectral, polarimetric, or spectro-polarimetric filter array to provide a SWAP-C sensor system. As discussed above, various techniques may be used to avoid aliasing that would otherwise result due to the presence of the integrated filter array. Demosaicing techniques and well established image processing algorithms may be used to separate and interpolate the spectral and/or polarimetric data to provide simultaneous multi-band images.
Having described above several aspects of at least one embodiment, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the scope of the invention. Accordingly, the foregoing description and drawings are by way of example only, and the scope of the invention should be determined from proper construction of the appended claims, and their equivalents.