1. Field of the Invention
The present invention relates to a multi-beam scanning apparatus used for a laser beam printer, digital copying machine, and the like.
2. Related Background Art
In recent years, multi-beam scanning apparatuses for simultaneously writing a plurality of lines using a plurality of laser beams are being developed in electrophotographic apparatuses such as a laser beam printer.
The multi-beam scanning apparatus simultaneously scans a plurality of laser beams apart from each other. As shown in
The two laser beams P1 and P2 are incident on the reflecting surface 103a of the rotary polygon mirror 103, scanned in the main scanning direction, and form an electrostatic latent image on the photosensitive member along with main scanning by rotation of the rotary polygon mirror 103 and subscanning by rotation of the rotary drum 105.
The cylindrical lens 102 linearly focuses the laser beams P1 and P2 on the reflecting surface 103a of the rotary polygon mirror 103. The cylindrical lens 102 has a function of preventing a point image formed on the photosensitive member in the above manner from being distorted due to surface tilt of the rotary polygon mirror 103. The imaging lens 104 is made up of a spherical lens and toric lens. The imaging lens 104 has a function of preventing distortion of a point image on the photosensitive member, similar to the cylindrical lens 102, and a correction function of scanning the point image on the photosensitive member in the main scanning direction at a constant speed.
The two laser beams P1 and P2 are respectively split by a detection mirror 106 at the end of the main scanning plane (X-Y plane), guided to a photosensor 107 on an opposite side to the main scanning plane, and converted into write start signals in a controller (not shown) to be transmitted to the multi-beam semiconductor laser 111. The multi-beam semiconductor laser 111 receives the write start signals to start write modulation of the two laser beams P1 and P2.
By adjusting the write modulation timings of the two laser beams P1 and P2, the write start (write) position of an electrostatic latent image formed on the photosensitive member on the rotary drum 105 is controlled.
The cylindrical lens 102, rotary polygon mirror 103, imaging lens 104, and the like are mounted on the bottom wall of an optical box 108. After the respective optical components are mounted in the optical box 108, the upper opening of the optical box 108 is closed with a lid (not shown).
As described above, the multi-beam semiconductor laser 111 simultaneously emits the laser beams P1 and P2. The multi-beam semiconductor laser 111 is integrated via a laser holder 111a with a lens barrel 112a incorporating the collimator lens 112, and the integral unit is mounted on a sidewall 108a of the optical box 108 together with a laser driving circuit board 113.
In mounting the multi-beam light source unit 101, the laser holder 111a holding the multi-beam semiconductor laser 111 is inserted into an opening 108b formed in the sidewall 108a of the optical box 108. The laser holder 111a is fitted in the lens barrel 112a of the collimator lens 112, the focal point and optical axis of the collimator lens 112 are adjusted, and the lens barrel 112a is adhered to the laser holder 111a. As shown in
In the prior art, however, when the multi-beam light source unit is to be fixed to the optical box, the whole multi-beam light source unit is rotated through the predetermined angle θ together with the laser driving circuit board, thereby obtaining the line interval T. To realize this, a space enough to rotate the large-area laser driving circuit board must be prepared outside the optical box, which interferes with downsizing of the whole apparatus.
Further, an error allowable value for adjustment of the line interval T is as strict as several μm or less. If the angular adjustment range in assembling the multi-beam light source unit to the optical box is wide, high-precision adjustment is difficult to complete within a short time. The multi-beam light source unit cannot be assembled with high working efficiency and high reliability.
The present invention has been made to eliminate the conventional drawbacks, and has as its object to provide a multi-beam scanning apparatus which can be downsized and allows adjusting of the beam interval within a short time with high precision.
To achieve the above object, according to the present invention, there is provided a multi-beam scanning apparatus comprising a multi-beam light source unit having a multi-beam semiconductor laser and a laser holder holding the multi-beam semiconductor laser, scanning imaging means for scanning a plurality of laser beams emitted by the multi-beam semiconductor laser to form an image on a surface to be scanned, and a housing supporting the scanning imaging means and the multi-beam light source unit. The multi-beam semiconductor laser is fixed to the laser holder with an inclination at or near a predetermined rotational angle for adjusting a beam interval between the plurality of laser beams.
In the multi-beam scanning apparatus, the multi-beam semiconductor laser preferably has a laser array fixed with an inclination with respect to a reference surface of the laser holder.
The multi-beam semiconductor laser preferably has a plurality of aligned emission points.
The multi-beam semiconductor laser preferably has a plurality of two-dimensionally arrayed emission points.
The laser holder is preferably integrated with a lens barrel holding a collimator lens.
In mounting the laser holder in the housing after the multi-beam semiconductor laser is fixed to the laser holder, the whole multi-beam light source unit is inclined (rotated) to adjust the beam interval. In this arrangement, however, angular adjustment is difficult to perform precisely, and takes a long time. In addition, an extra space is required to incline the large-area laser driving circuit board mounted on the multi-beam light source unit. To avoid this, in a unit assembly step of assembling the multi-beam semiconductor laser to the laser holder, the multi-beam semiconductor laser is rotated (inclined) through an angle necessary for adjusting the beam interval or an angle approximate to the necessary angle. In this state, the multi-beam semiconductor laser is fixed to the laser holder into a unit.
In mounting the multi-beam light source unit in the housing, the whole multi-beam light source unit is rotated through a small angle in order to finally adjust a small error arising from the component precision and the like.
Since final angular adjustment in mounting the multi-beam light source unit in the housing is done within a small angular range, the angle can be quickly adjusted with high precision.
Since the large-area laser driving circuit board need not be greatly inclined, the whole apparatus can be downsized.
The present invention has been made to eliminate the conventional drawbacks, and has as its object to provide a low-cost, high-performance multi-beam scanning apparatus which can easily ensure the installation positional precision of the multi-beam light source unit in terms of the structure, can improve the adjustment precision of the multi-beam line interval, can efficiently mount the multi-beam light source unit, and can maintain high image quality without generating any error upon mounting.
To achieve the above object, according to the present invention, there is provided a multi-beam scanning apparatus comprising a multi-beam light source unit having a multi-beam semiconductor laser and a laser holder holding the multi-beam semiconductor, scanning imaging means for scanning a plurality of laser beams emitted by the multi-beam semiconductor laser to form an image on a surface to be scanned, a housing supporting the scanning imaging means and the multi-beam light source unit, and fixing means for fixing the multi-beam light source unit to the housing after the rotational angle of the multi-beam light source unit is adjusted, the fixing means having a plurality of fixing portions. The center of the rotation of the multi-beam light source unit and a plurality of emission points of the multi-beam semiconductor laser are located on a straight line connecting two of the plurality of fixing portions or a planar region defined by straight lines connecting all the plurality of fixing portions.
The fixing means preferably has at least three fixing portions.
The fixing means preferably has a fixing portion fastened by a screw.
The fixing means preferably has a fixing portion adhered with an adhesive.
The multi-beam semiconductor laser preferably has a plurality of aligned emission points.
The multi-beam semiconductor laser preferably has a plurality of two-dimensionally arrayed emission points.
The laser holder is preferably integrated with a lens barrel holding a collimator lens.
In mounting the multi-beam semiconductor laser in the housing, the whole multi-beam light source unit is rotated to adjust the line interval. Thereafter, screws or the like are tightened to fix the multi-beam light source unit to the housing.
A plurality of fixing portions by screws or the like are set. The emission points of laser beams and the center of rotation of the multi-beam light source unit are located on a straight line connecting two of the fixing portions or a planar region defined by straight lines connecting all the fixing portions. Accordingly, the multi-beam light source unit can be very firmly, stably fixed to the housing.
Hence, no rotational shift occurs in the multi-beam light source unit due to shock or the like after the multi-beam light source unit is fixed to the housing.
Trouble such as a shift of the rotational angle of the multi-beam light source unit due to free running during screw tightening operation does not occur. Thus, the assembly efficiency and precision can be improved.
Embodiments of the present invention will be described below with reference to the accompanying drawings.
The two laser beams P1 and P2 are incident on the reflecting surface 3a of the rotary polygon mirror 3, scanned in the main scanning direction, and form an electrostatic latent image on the photosensitive member along with main scanning by rotation of the rotary polygon mirror 3 and subscanning by rotation of the rotary drum 5.
The cylindrical lens 2 linearly focuses the laser beams P1 and P2 on the reflecting surface 3a of the rotary polygon mirror 3. The cylindrical lens 2 has a function of preventing a point image formed on the photosensitive member in the above manner from being distorted due to surface tilt of the rotary polygon mirror 3. The imaging lens 4 is made up of a spherical lens and toric lens. The imaging lens 4 has a function of preventing distortion of a point image on the photosensitive member, similar to the cylindrical lens 2, and a correction function of scanning the point image on the photosensitive member in the main scanning direction at a constant speed.
The two laser beams P1 and P2 are respectively split by a detection mirror 6 at the end of the main scanning plane (X-Y plane), guided to a photosensor 7 on an opposite side to the main scanning plane, and converted into write start signals in a controller (not shown) to be transmitted to the multi-beam semiconductor laser 11. The multi-beam semiconductor laser 11 receives the write start signals to start write modulation of the two laser beams P1 and P2.
By adjusting the write modulation timings of the two laser beams P1 and P2, the write start (write) position of an electrostatic latent image formed on the photosensitive member on the rotary drum 5 is controlled.
The cylindrical lens 2, rotary polygon mirror 3, imaging lens 4, and the like are mounted on the bottom wall of an optical box 8 serving as a housing. After the respective optical components are mounted in the optical box 8, the upper opening of the optical box 8 is closed with a lid (not shown).
As described above, the multi-beam semiconductor laser 11 simultaneously emits the laser beams P1 and P2. The multi-beam semiconductor laser 11 is integrated via a laser holder 11a with a lens barrel 12a incorporating the collimator lens 12, and the integral unit is mounted on a sidewall 8a of the optical box 8 together with a laser driving circuit board 13.
In mounting the multi-beam light source unit 1, the laser holder 11a holding the multi-beam semiconductor laser 11 is inserted into an opening 8b formed in the sidewall 8a of the optical box 8. The laser holder 11a is fitted in the lens barrel 12a of the collimator lens 12, three-dimensional adjustment such as focus adjustment and optical axis adjustment of the collimator lens 12 is done, and the lens barrel 12a is adhered to the laser holder 11a.
As shown in
In a unit assembly step of mounting the multi-beam semiconductor laser 11 in the laser holder 11a, the multi-beam semiconductor laser 11 is rotated through a predetermined rotational angle θ or angle approximate to the angle θ with respect to a reference surface V of the laser holder 11a, as shown in
After the lens barrel 12a of the collimator lens 12 is adhered to the laser holder 11a, as described above, the laser holder 11a is temporarily fixed to the sidewall 8a of the optical box 8 with screws 11b fitted in slots of the laser holder 11a, as shown in
The line interval T on the rotary drum must be adjusted with submicron-order precision. In the first embodiment, when the multi-beam semiconductor laser is mounted in the laser holder, the laser array N is roughly adjusted to or near to the predetermined inclination angle θ. When the laser holder is mounted in the optical box together with the laser driving circuit board, the angle is finally slightly adjusted to correct an assembly error and the like. Therefore, the final line interval adjustment precision is very high, and the adjustment time can be greatly shortened compared to the conventional wide-range angular adjustment on the optical box. In addition, the large-area laser driving circuit board need not be rotated outside the optical box, and the apparatus can be downsized.
As a result, this embodiment can realize a small-size, high-precision multi-beam scanning apparatus with low assembly cost.
Note that this embodiment uses the laser chip with two emission points. However, the number of emission points, i.e., laser beams can be arbitrarily changed. The assembly procedure of the laser driving circuit board, lens barrel, collimator lens, and the like can also be arbitrarily changed. The laser holder can be fixed to the optical box not only with a fastening means such as a screw, but also by another method such as adhesion.
As shown in
The edge-emission-type multi-beam semiconductor lasers 11 and 31 on each of which a plurality of emission points are aligned may be replaced with a multi-beam semiconductor laser 41 having a surface-emission-type laser chip 42 on which a plurality of emission points 42a to 42d are two-dimensionally arrayed, as shown in
The surface-emission-type laser can increase the degree of freedom for the positions of the emission points to facilitate distribution of the mounting tolerance.
As described above, in the multi-beam scanning apparatus of the present invention, the two laser beams P1 and P2 emitted by the multi-beam semiconductor laser 11 are scanned by the rotary polygon mirror inside the optical box 8, and form an image on the photosensitive member on the rotary drum via the imaging lens. To adjust the line interval T and the like on the photosensitive member, when the multi-beam semiconductor laser 11 is to be mounted in the laser holder 11a, the multi-beam semiconductor laser 11 is rotated to incline the laser array N at the predetermined inclination angle θ. Then, the multi-beam semiconductor laser 11 is fixed to the laser holder 11a. In mounting the multi-beam light source unit 1 in the optical box 8, the whole multi-beam light source unit 1 is only slightly inclined to compensate for the component precision and the like.
With this arrangement, the present invention exhibits the following effects.
The beam interval between a plurality of laser beams emitted by the multi-beam semiconductor laser can be adjusted within a short time with high precision. Accordingly, the apparatus can attain high resolution, the assembly cost can be greatly reduced, and the whole apparatus can be downsized.
The fourth embodiment of the present invention will be described below.
As shown in
This adjustment is to adjust the beam interval between the two laser beams P1 and P2 emitted by the multi-beam semiconductor laser 11, i.e., to make the pitch S between imaging points A1 and A2 on a rotary drum 5 in the main scanning direction, and a pitch, i.e., line interval T in the subscanning direction coincide with design values.
After the angular adjustment, the screws 14 are tightened to fix the laser holder 11a to the optical box 8.
In this adjustment, the laser holder 11a is rotated while the spot positions, i.e., imaging points A1 and A2 of the two laser beams P1 and P2 that displace in submicron order are monitored with a CCD camera or the like.
As shown in
The laser holder 11a has a cylindrical boss 11c. As shown in
With this layout, the emission points of the two laser beams P1 and P2 always fall within the range defined by lengths obtained by converting the intervals between the fixing portions 14a to 14c into main scanning and subscanning components. The wide range including the center O of rotation can be firmly fixed to effectively prevent vertical and horizontal tilt of the multi-beam light source unit 1.
Particularly, when the screws 14 are used as fixing means, the laser holder 11a and the sidewall 8a of the optical box 8 are pressed against each other via a fastening surface M. A clearance K is set as an adjustment margin for angular adjustment rotation. The laser holder 11a is moved within this range.
The fastening surface M at the fixing portions 14a to 14c of the screws 14 provides the highest fastening reliability and high stability because the laser holder 11a and sidewall 8a contact each other at fastening pressure generation positions. Note that if the fastening surface M does not completely coincide with the positions of the screws 14, the same effects can be obtained so long as they are close to each other. The position and shape of the fastening surface M and the number of fastening surfaces M need not be limited.
The fourth embodiment adopts the screws as fixing means, but may adopt an adhesion means with an ultraviolet-curing adhesive or the like. The number of emission points is not limited and may be arbitrarily set to two or more.
The collimator lens is adhered to the lens barrel preferably with the ultraviolet-curing adhesive, but may be adhered with another adhesive.
According to the fourth embodiment, the multi-beam light source unit is fastened to the sidewall of the optical box with screws at three or more fixing portions. The center of rotation of the multi-beam light source unit and the emission points of respective laser beams locate on straight lines connecting the fixing portions or within the planar region defined by straight lines connecting all the fixing portions. Thus, the multi-beam light source unit can be stably, firmly mounted in the optical box.
The fourth embodiment can realize a low-cost, high-performance multi-beam scanning apparatus capable of effectively avoiding troubles such as a rotational shift of the multi-beam light source unit upon high-precision line interval adjustment, and free running during fastening upon adjustment.
The adjustment member 15 is relatively moved together with the multi-beam semiconductor laser 11 with respect to the laser holder 11a to adjust a laser array connecting laser beams P1 and P2 so as to pass through the center O of rotation. Then, the adjustment member 15 is fastened to the laser holder 11a with the screws 16.
Even if the positional precision of emission points varies in the component, the adjustment member 15 can adjust the positions of the emission points to locate them on straight lines L1 to L3 connecting fixing portions 14a to 14c or within the planar region N defined by all the straight lines L1 to L3, as shown in
The package shape of the multi-beam semiconductor laser can advantageously be selected from a wide range.
The edge-emission-type multi-beam semiconductor laser 11 on which a plurality of emission points are aligned may be replaced with a multi-beam semiconductor laser 41 having a surface-emission-type laser chip 42 on which a plurality of emission points 42a to 42d are two-dimensionally arrayed, as shown in
The surface-emission-type laser can increase the degree of freedom for the positions of the emission points to facilitate distribution of the mounting tolerance.
As described above, in the multi-beam scanning apparatus of the present invention, the two laser beams P1 and P2 emitted by the multi-beam semiconductor laser are scanned by the rotary polygon mirror inside the optical box 8, and form an image on the photosensitive member on the rotary drum via the imaging lens. To adjust the line interval and the like on the photosensitive member, the laser holder 11a is fixed to the sidewall 8a of the optical box 8 after rotation through a predetermined angle. The fixing portions 14a to 14c are set to locate the emission points of the laser beams P1 and P2 and the center O of rotation on straight lines connecting the fixing portions 14a to 14c by the screws 14 or within the planar region N defined by these lines. The laser holder 11a is firmly, stably mounted with high positional precision.
With this arrangement, the present invention exhibits the following effects.
The line interval between a plurality of laser beams emitted by the multi-beam semiconductor laser can be adjusted with high precision, and the laser holder can be firmly, stably mounted.
The present invention can realize a low-cost, high-performance multi-beam scanning apparatus free from any multi-beam line interval error.
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10-279352 | Sep 1998 | JP | national |
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