The invention relates generally to multi-block circuit multichannel heat exchangers.
Heat exchangers are used in heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems. Multichannel heat exchangers generally include multichannel tubes for flowing refrigerant through the heat exchanger. Each multichannel tube may contain several individual flow channels. Fins may be positioned between the tubes to facilitate heat transfer between refrigerant contained within the tube flow channels and external air passing over the tubes. Multichannel heat exchangers may be used in small tonnage systems, such as residential systems, or in large tonnage systems, such as industrial chiller systems.
In general, heat exchangers transfer heat by circulating a refrigerant through a cycle of evaporation and condensation. In some systems, one heat exchanger may contain multiple coil circuits for circulating two or more fluids in order to provide cooling or heating to different parts of a system. In other systems, one heat exchanger may contain multiple coil circuits for circulating the same fluid through the heat exchanger more than once in order to provide increased heating or cooling.
The location of a coil circuit within the heat exchanger may impact the rate of heat transfer because environmental conditions may vary depending on a tube's position within the heat exchanger. For example, in a heat exchanger containing horizontal tubes, the bottom tubes may receive less airflow than the top tubes, resulting in a lower rate of heat transfer between the bottom tubes and the environment. In a heat exchanger containing vertical tubes, the outer tubes may receive less airflow based on proximity to other equipment or an outer wall. In a multiple heat exchanger configuration, the outer heat exchanger coils may receive more airflow, resulting in a higher rate of heat transfer between these tubes and the environment.
Furthermore, the type of fluid within a coil circuit may be used to configure the location of the circuit within the heat exchanger slab. For example, it may be desirable to locate a condenser circuit containing a lower temperature fluid within a section of the heat exchanger that receives less airflow because less heat transfer is generally needed between the lower temperature fluid and the environment. In some applications, the lower temperature fluid may be a refrigerant requiring subcooling or an electrical coolant used to cool an electrical power circuit. Conversely, it may be desirable to locate a fluid undergoing a phase change in a section of the heat exchanger that receives more airflow.
In accordance with aspects of the invention, a heat exchanger is presented that includes four groups of multichannel tubes disposed adjacent to one another. Group A is configured to receive a flow of a first fluid to be cooled or heated. Group B is configured to receive the flow of the first fluid from group A. Group C is configured to receive a flow of a second fluid to be cooled or heated. Group D is configured to receive the flow of the second fluid from group C.
In accordance with further aspects of the invention, a heat exchanger and a system including a heat exchanger are presented. The heat exchanger includes a first manifold, a second manifold, a first multi-pass circulating block in fluid communication with the manifolds, and a second multi-pass circulating block in fluid communication with the manifolds. The first block includes two groups, group A and group B, of multichannel tubes disposed adjacent to one another. Group A is configured to receive a flow of a first fluid to be cooled or heated, and group B is configured to receive the flow of the first fluid from group A. The second block includes two other groups, group C and group D, of multichannel tubes disposed adjacent to one another. Group C is configured to receive a flow of a second fluid to be cooled or heated, and group D is configured to receive the flow of the second fluid from group C.
When the system shown in
The outdoor unit draws in environmental air through sides as indicated by the arrows directed to the sides of unit OU, forces the air through the outer unit coil by a means of a fan (not shown) and expels the air as indicated by the arrows above the outdoor unit. When operating as an air conditioner, the air is heated by the condenser coil within the outdoor unit and exits the top of the unit at a temperature higher than it entered the sides. Air is blown over indoor coil IC, and is then circulated through the residence by means of ductwork D, as indicated by the arrows in
When the unit in
Chiller CH, which includes heat exchangers for both evaporating and condensing a refrigerant as described above, cools water that is circulated to the air handlers. Air blown over additional coils that receive the water in the air handlers causes the water to increase in temperature and the circulated air to decrease in temperature. The cooled air is then routed to various locations in the building via additional ductwork. Ultimately, distribution of the air is routed to diffusers that deliver the cooled air to offices, apartments, hallways, and any other interior spaces within the building. In many applications, thermostats or other command devices (not shown in
System 10 cools an environment by cycling refrigerant within closed refrigeration loop 12 through condenser 16, compressor 18, expansion device 20, and evaporator 22. The refrigerant enters condenser 16 as a high pressure and temperature vapor and flows through the multichannel tubes of condenser 16. A fan 24, which is driven by a motor 26, draws air across the multichannel tubes. Fan 24 may push or pull air across the tubes. Heat transfers from the refrigerant vapor to the air producing heated air 28 and causing the refrigerant vapor to condense into a liquid. The liquid refrigerant then flows into an expansion device 20 where the refrigerant expands to become a low pressure and temperature liquid. Typically, expansion device 20 will be a thermal expansion valve (TXV); however, in other embodiments, the expansion device may be an orifice or a capillary tube. After the refrigerant exits the expansion device, some vapor refrigerant may be present in addition to the liquid refrigerant.
From expansion device 20, the refrigerant enters evaporator 22 and flows through the evaporator multichannel tubes. A fan 30, which is driven by a motor 32, draws air across the multichannel tubes. Heat transfers from the air to the refrigerant liquid producing cooled air 34 and causing the refrigerant liquid to boil into a vapor. In some embodiments, the fan may be replaced by a pump that draws fluid across the multichannel tubes.
The refrigerant then flows to compressor 18 as a low pressure and temperature vapor. Compressor 18 reduces the volume available for the refrigerant vapor, consequently, increasing the pressure and temperature of the vapor refrigerant. The compressor may be any suitable compressor such as a screw compressor, reciprocating compressor, rotary compressor, swing link compressor, scroll compressor, or turbine compressor. Compressor 18 is driven by a motor 36 that receives power from a variable speed drive (VSD) or a direct AC or DC power source. In one embodiment, motor 36 receives fixed line voltage and frequency from an AC power source although in some applications the motor may be driven by a variable voltage or frequency drive. The motor may be a switched reluctance (SR) motor, an induction motor, an electronically commutated permanent magnet motor (ECM), or any other suitable motor type. The refrigerant exits compressor 18 as a high temperature and pressure vapor that is ready to enter the condenser and begin the refrigeration cycle again.
The operation of the refrigeration cycle is governed by control devices 14 that include control circuitry 38, an input device 40, and a temperature sensor 42. Control circuitry 38 is coupled to motors 26, 32, and 36 that drive condenser fan 24, evaporator fan 30, and compressor 18, respectively. The control circuitry uses information received from input device 40 and sensor 42 to determine when to operate motors 26, 32, and 36 that drive the air conditioning system. In some applications, the input device may be a conventional thermostat. However, the input device is not limited to thermostats, and more generally, any source of a fixed or changing set point may be employed. These may include local or remote command devices, computer systems and processors, and mechanical, electrical, and electromechanical devices that manually or automatically set a temperature-related signal that the system receives. For example, in a residential air conditioning system, the input device may be a programmable 24-volt thermostat that provides a temperature set point to the control circuitry. Sensor 42 determines the ambient air temperature and provides the temperature to control circuitry 38. Control circuitry 38 then compares the temperature received from the sensor to the temperature set point received from the input device. If the temperature is higher than the set point, control circuitry 38 may turn on motors 26, 32, and 36 to run air conditioning system 10. The control circuitry may execute hardware or software control algorithms to regulate the air conditioning system. In some embodiments, the control circuitry may include an analog to digital (A/D) converter, a microprocessor, a non-volatile memory, and an interface board. Other devices may, of course, be included in the system, such as additional pressure and/or temperature transducers or switches that sense temperatures and pressures of the refrigerant, the heat exchangers, the inlet and outlet air, and so forth.
Heat pump system 44 includes an outside coil 50 and an inside coil 52 that both operate as heat exchangers. The coils may function either as an evaporator or as a condenser depending on the heat pump operation mode. For example, when heat pump system 44 is operating in cooling (or “AC”) mode, outside coil 50 functions as a condenser, releasing heat to the outside air, while inside coil 52 functions as an evaporator, absorbing heat from the inside air. When heat pump system 44 is operating in heating mode, outside coil 50 functions as an evaporator, absorbing heat from the outside air, while inside coil 52 functions as a condenser, releasing heat to the inside air. A reversing valve 54 is positioned on reversible loop 46 between the coils to control the direction of refrigerant flow and thereby to switch the heat pump between heating mode and cooling mode.
Heat pump system 44 also includes two metering devices 56 and 58 for decreasing the pressure and temperature of the refrigerant before it enters the evaporator. The metering device also acts to regulate refrigerant flow into the evaporator so that the amount of refrigerant entering the evaporator equals the amount of refrigerant exiting the evaporator. The metering device used depends on the heat pump operation mode. For example, when heat pump system 44 is operating in cooling mode, refrigerant bypasses metering device 56 and flows through metering device 58 before entering the inside coil 52, which acts as an evaporator. In another example, when heat pump system 44 is operating in heating mode, refrigerant bypasses metering device 58 and flows through metering device 56 before entering outside coil 50, which acts as an evaporator. In other embodiments, a single metering device may be used for both heating mode and cooling mode. The metering devices typically are thermal expansion valves (TXV), but also may be orifices or capillary tubes.
The refrigerant enters the evaporator, which is outside coil 50 in heating mode and inside coil 52 in cooling mode, as a low temperature and pressure liquid. Some vapor refrigerant also may be present as a result of the expansion process that occurs in metering device 56 or 58. The refrigerant flows through multichannel tubes in the evaporator and absorbs heat from the air changing the refrigerant into a vapor. In cooling mode, the indoor air passing over the multichannel tubes also may be dehumidified. The moisture from the air may condense on the outer surface of the multichannel tubes and consequently be removed from the air.
After exiting the evaporator, the refrigerant passes through reversing valve 54 and into compressor 60. Compressor 60 decreases the volume of the refrigerant vapor, thereby, increasing the temperature and pressure of the vapor. The compressor may be any suitable compressor such as a screw compressor, reciprocating compressor, rotary compressor, swing link compressor, scroll compressor, or turbine compressor.
From the compressor, the increased temperature and pressure vapor refrigerant flows into a condenser, the location of which is determined by the heat pump mode. In cooling mode, the refrigerant flows into outside coil 50 (acting as a condenser). A fan 62, which is powered by a motor 64, draws air over the multichannel tubes containing refrigerant vapor. In some embodiments, the fan may be replaced by a pump that draws fluid across the multichannel tubes. The heat from the refrigerant is transferred to the outside air causing the refrigerant to condense into a liquid. In heating mode, the refrigerant flows into inside coil 52 (acting as a condenser). A fan 66, which is powered by a motor 68, draws air over the multichannel tubes containing refrigerant vapor. The heat from the refrigerant is transferred to the inside air causing the refrigerant to condense into a liquid.
After exiting the condenser, the refrigerant flows through the metering device (56 in heating mode and 58 in cooling mode) and returns to the evaporator (outside coil 50 in heating mode and inside coil 52 in cooling mode) where the process begins again.
In both heating and cooling modes, a motor 70 drives compressor 60 and circulates refrigerant through reversible refrigeration/heating loop 46. The motor may receive power either directly from an AC or DC power source or from a variable speed drive (VSD). The motor may be a switched reluctance (SR) motor, an induction motor, an electronically commutated permanent magnet motor (ECM), or any other suitable motor type.
The operation of motor 70 is controlled by control circuitry 72. Control circuitry 72 receives information from an input device 74 and sensors 76, 78, and 80 and uses the information to control the operation of heat pump system 44 in both cooling mode and heating mode. For example, in cooling mode, input device 74 provides a temperature set point to control circuitry 72. Sensor 80 measures the ambient indoor air temperature and provides it to control circuitry 72. Control circuitry 72 then compares the air temperature to the temperature set point and engages compressor motor 70 and fan motors 64 and 68 to run the cooling system if the air temperature is above the temperature set point. In heating mode, control circuitry 72 compares the air temperature from sensor 80 to the temperature set point from input device 74 and engages motors 64, 68, and 70 to run the heating system if the air temperature is below the temperature set point.
Control circuitry 72 also uses information received from input device 74 to switch heat pump system 44 between heating mode and cooling mode. For example, if input device 74 is set to cooling mode, control circuitry 72 will send a signal to a solenoid 82 to place reversing valve 54 in air conditioning position 84. Consequently, the refrigerant will flow through reversible loop 46 as follows: the refrigerant exits compressor 60, is condensed in outside coil 50, is expanded by metering device 58, and is evaporated by inside coil 52. If the input device is set to heating mode, control circuitry 72 will send a signal to solenoid 82 to place reversing valve 54 in heat pump position 86. Consequently, the refrigerant will flow through the reversible loop 46 as follows: the refrigerant exits compressor 60, is condensed in inside coil 52, is expanded by metering device 56, and is evaporated by outside coil 50.
The control circuitry may execute hardware or software control algorithms to regulate the heat pump system 44. In some embodiments, the control circuitry may include an analog to digital (A/D) converter, a microprocessor, a non-volatile memory, and an interface board.
The control circuitry also may initiate a defrost cycle when the system is operating in heating mode. When the outdoor temperature approaches freezing, moisture in the outside air that is directed over outside coil 50 may condense and freeze on the coil. Sensor 76 measures the outside air temperature, and sensor 78 measures the temperature of outside coil 50. These sensors provide the temperature information to the control circuitry which determines when to initiate a defrost cycle. For example, if either of sensors 76 or 78 provides a temperature below freezing to the control circuitry, system 44 may be placed in defrost mode. In defrost mode, solenoid 82 is actuated to place reversing valve 54 in air conditioning position 84, and motor 64 is shut off to discontinue air flow over the multichannels. System 44 then operates in cooling mode until the increased temperature and pressure refrigerant flowing through outside coil 50 defrosts the coil. Once sensor 78 detects that coil 50 is defrosted, control circuitry 72 returns the reversing valve 54 to heat pump position 86. As will be appreciated by those skilled in the art, the defrost cycle can be set to occur at many different time and temperature combinations.
Fins 96 are located between the multichannel tubes 94 to promote the transfer of heat between the tubes 94 and the environment. In one embodiment, the fins are constructed of aluminum, brazed or otherwise joined to the tubes, and disposed generally perpendicular to the flow of refrigerant. However, in other embodiments the fins may be made of other materials that facilitate heat transfer and may extend parallel or at varying angles with respect to the flow of the refrigerant. The fins may be louvered fins, corrugated fins, or any other suitable type of fin.
Baffles 98, 100, 102, and 104 separate the multichannel tubes 94 into two coil circuits containing four groups of tubes. The four groups of tubes are disposed adjacent to one another to form a single slab heat exchanger 88. Each individual group of tubes contains several tubes disposed adjacent to one another. The baffles direct the flow of refrigerant between manifolds 90 and 92. Baffles 98, 100, and 102 divide top manifold 90 into four separate sections corresponding to the four groups of tubes, while baffle 104 divides bottom manifold 92 into two separate sections corresponding to two coil circuits. The baffles may be composed of any material which acts as a barrier to the flow of refrigerant. For example, in some embodiments, the baffles may be made from aluminum. In other embodiments, the baffles may be made from material having a low thermal conductivity in order to provide insulation between the groups of the tubes and the coil circuits.
Baffles 98 and 100 divide top manifold 90 into a tube group A 106 and a tube group B 108. Baffle 100 directs the flow of refrigerant from top manifold 90 down to bottom manifold 92 through the multichannel tubes of group A 106. The fluid then returns to the top manifold 90 through the multichannel tubes of group B 108. Baffle 98 prevents the fluid that has returned to top manifold 90 from entering the tubes of tube group C 110.
Baffles 98 and 102 divide top manifold 90 into a tube group C 110 and a tube group D 112. Baffle 102 directs the flow of refrigerant from top manifold 90 down to bottom manifold 92 through the multichannel tubes of group C 110. The refrigerant then returns to top manifold 90 through the multichannel tubes of group D 112.
Baffles 98 and 104 divide the heat exchanger into two independent coil circuits. Baffle 98 divides top manifold 90 in order to prevent the fluid flowing within tube group B 108 from contacting the fluid flowing within tube group C 110. Baffle 104 divides bottom manifold 92 to prevent the fluid flowing within tube group B 108 from contacting the fluid flowing within tube group C 110. Consequently, the refrigerant that flows within the tubes of group A and group B does not contact the refrigerant that flows within the tubes of group C and group D.
Each independent coil circuit has its own inlet and outlet. The first coil circuit containing multichannel tubes of group A 106 and group B 108 includes inlet 114 and outlet 116. Consequently, the refrigerant flows through the first coil circuit as follows: the refrigerant enters top manifold 90 through inlet 114, flows through the group A 106 multichannel tubes to bottom manifold 92, returns to top manifold 90 through the group B 108 multichannel tubes, and exits the heat exchanger through outlet 116. Baffle 100 directs the flow of refrigerant from top manifold 90 to bottom manifold 92 while baffles 98 and 104 separate the first coil circuit from the second coil circuit.
The second coil circuit containing multichannel tubes of group C 110 and group D 112 has an inlet 118 and an outlet 120. Consequently, the refrigerant flows through the second coil circuit as follows: the refrigerant enters the top manifold 90 through inlet 118, flows through the group C 110 multichannel tubes to bottom manifold 92, returns to top manifold 90 through the group D 112 multichannel tubes, and exits the heat exchanger through outlet 120. Baffle 102 directs the flow of refrigerant from top manifold 90 to bottom manifold 92 while baffles 98 and 104 separate the second coil circuit from the first coil circuit.
The fluid that flows through the first coil circuit containing group A and B tubes may be the same type of fluid or different type of fluid than the fluid that flows through the second coil circuit containing group C and D tubes. In some embodiments, the fluid flowing through the first coil circuit may be the same fluid that flows through the second coil circuit, only at different stages in the heating and cooling process. For example, the second coil circuit may be used to provide a second pass for heating and cooling of the refrigerant. In other embodiments, the fluid flowing through the second coil circuit may be an independent fluid used to cool a separate part of the system such as a compressor or an electronic power circuit.
The number of tubes within each group may vary. For example, tube group A and tube group B may contain twenty tubes each while tube group C and tube group D contain thirty tubes each. In another example, tube group A may contain twenty tubes while tube group B contains fifteen tubes. Variations in the number of tubes may be used to improve heat transfer in each tube group by accounting for factors such as the phase of the refrigerant and the tube group location within the heat exchanger.
In other embodiments, the heat exchanger may be inclined at an angle or rotated 90 degrees so the fluid flows horizontally through the multichannel tubes instead of vertically. In the rotated embodiment, the manifolds may be positioned vertically on the sides of the heat exchanger. The coil circuiting concepts shown in
The coil circuiting configurations described herein may find application in a variety of heat exchangers and HVAC&R systems containing heat exchangers. However, the configurations are particularly well-suited to heat exchangers functioning as evaporators and condensers within chillers, air conditioners, and heat pumps. The coil circuiting configurations are intended to improve the overall efficiency of a heat exchanger by allowing tube groups to be positioned in a location of a heat exchanger that is tailored to the heat transfer properties of the tube group.
It should be noted that the present discussion makes use of the term “multichannel” tubes or “multichannel heat exchanger” to refer to arrangements in which heat transfer tubes include a plurality of flow paths between manifolds that distribute flow to and collect flow from the tubes. A number of other terms may be used in the art for similar arrangements. Such alternative terms might include “microchannel” and “microport.” The term “microchannel” sometimes carries the connotation of tubes having fluid passages on the order of a micrometer and less. However, in the present context such terms are not intended to have any particular higher or lower dimensional threshold. Rather, the term “multichannel” used to describe and claim embodiments herein is intended to cover all such sizes. Other terms sometimes used in the art include “parallel flow” and “brazed aluminum.” However, all such arrangements and structures are intended to be included within the scope of the term “multichannel.” In general, such “multichannel” tubes will include flow paths disposed along the width or in a plane of a generally flat, planar tube, although, again, the invention is not intended to be limited to any particular geometry unless otherwise specified in the appended claims.
While only certain features of the invention have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation specific decisions must be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
This application claims priority from and the benefit of U.S. Provisional Application Ser. No. 60/867,043, entitled MICROCHANNEL HEAT EXCHANGER APPLICATIONS, filed Nov. 22, 2006, and U.S. Provisional Application Ser. No. 60/882,033, entitled MICROCHANNEL HEAT EXCHANGER APPLICATIONS, filed Dec. 27, 2006, which are hereby incorporated by reference.
Number | Date | Country | |
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60882033 | Dec 2006 | US | |
60867043 | Nov 2006 | US |
Number | Date | Country | |
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Parent | PCT/US07/85297 | Nov 2007 | US |
Child | 12040764 | US |